EPF81500ARC240-2A - 16K-Gate FLEX 8000 FPGA | Intel (Altera) | 240-RQFP
N.º da peça: EPF81500ARC240-2A ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $65 | $65,00 |
| 10 | $58.5 | $585,00 |
| 100 | $52 | $5.200,00 |
| 250 | $47.85 | $11.962,50 |
| 500 | $44.2 | $22.100,00 |
EPF81500ARC240-2A Visão geral
A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement custom digital logic. FPGAs sit within the broader semiconductor hierarchy as reconfigurable logic -> programmable logic device (PLD) -> logic IC -> integrated circuit. The FLEX 8000 family was designed to integrate multiple 32-bit buses into a single device, making it suitable for glue-logic, bus-bridging, and high-density state-machine implementations in telecom, industrial, and computing systems.
Key features of the EPF81500ARC240-2A include 1,296 logic elements (LEs), 181 user I/O pins, and system-level support for in-circuit reconfigurability through industry-standard parallel EPROM or Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441). Operating from a 5V supply, the device achieves a typical internal performance of approximately 125 MHz. The 240-pin BFQFP package with exposed pad provides a robust thermal path for high-density designs.
The architecture combines a fine-grained logic element array with continuous FastTrack interconnect routing, enabling predictable timing and high logic utilization. Multiple Logic Array Blocks (LABs) are interconnected via row and column channels, and each LE contains a 4-input look-up table (LUT), a programmable register, and dedicated carry and cascade chains for arithmetic and wide functions.
Typical applications include telecommunications bridging, industrial control glue logic, high-density state machines, and legacy system upgrades where multiple TTL/CMOS devices can be consolidated into a single FLEX 8000 FPGA. The high pin count and exposed pad also suit high-pin-count applications such as multi-bus integration.
When designing with this device, ensure correct configuration mode (serial vs parallel) and proper power-up sequencing of VCCINT and VCCIO rails. The exposed pad of the 240-RQFP must be soldered to a sufficiently large copper pour for thermal dissipation, especially when many I/O are switching simultaneously.
This page synthesizes distributor availability, parametric data, and drop-in alternatives to assist with sourcing and replacement decisions not available on a single datasheet.
Alternativas drop-in para EPF81500ARC240-2A — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF81500ARC240-2A (mesmo formato e footprint) — diferindo em Package, Configuration Method, Process Technology, In-Circuit Reconfigurability, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF81500ARC240-2
✅ Drop-In✓ Em estoque
$61.75 / unidade
Ver ficha técnica →EPF81500AQC240-2
✅ Drop-In✓ Em estoque
$61.4 / unidade
Ver ficha técnica →EPF81500AQC240-3
✅ Drop-In✓ Em estoque
$21.75 / unidade
Ver ficha técnica →EPF81500AQC240-4
✅ Drop-In✓ Em estoque
$18.25 / unidade
Ver ficha técnica →EPF81500ARC240-2A Classificações máximas e características elétricas
| Family | FLEX 8000 |
| Usable Gates | 16,000 |
| Logic Elements (LEs) | 1,296 |
| Logic Registers / Cells | 1,500 |
| Maximum User I/O | 181 |
| Operating Frequency (max) | 125 MHz |
| Process Technology | 0.42 um CMOS SRAM |
| Supply Voltage (VCCINT) | 5 V |
| Configuration Method | Serial or Parallel EPROM, Altera EPC1/EPC1064/EPC1213/EPC1441 |
| In-Circuit Reconfigurability | Yes (ICR) |
| Encapsulamento | 240-BFQFP (RQFP) Exposed Pad |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EPF81500ARC240-2A
| Pino 1 | I/O — User I/O (bank-dependent function per pin table) |
| Pino 2 | I/O — User I/O |
| Pino 3 | I/O — User I/O |
| Pino 4 | I/O — User I/O |
| Pino 5 | I/O — User I/O |
| Pino 6 | I/O — User I/O |
| Pino 7 | I/O — User I/O |
| Pino 8 | GND — Ground |
| Pino 9 | I/O — User I/O |
| Pino 10 | I/O — User I/O |
| Pino 11 | I/O — User I/O |
| Pino 12 | I/O — User I/O |
| Pino 13 | VCCINT — Core 5V supply |
| Pino 14 | I/O — User I/O |
| Pino 15 | I/O — User I/O |
| Pino 16 | I/O — User I/O |
| Pino 17 | I/O — User I/O |
| Pino 18 | I/O — User I/O |
| Pino 19 | I/O — User I/O |
| Pino 20 | I/O — User I/O |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O |
| Pino 23 | I/O — User I/O |
| Pino 24 | I/O — User I/O |
| Pino 25 | I/O — User I/O |
| Pino 26 | VCCIO — I/O bank supply voltage |
| Pino 27 | I/O — User I/O |
| Pino 28 | I/O — User I/O |
| Pino 29 | I/O — User I/O |
| Pino 30 | I/O — User I/O |
| Pino 31 | I/O — User I/O |
| Pino 32 | I/O — User I/O |
| Pino 33 | I/O — User I/O |
| Pino 34 | GND — Ground |
| Pino 35 | I/O — User I/O |
| Pino 36 | I/O — User I/O |
| Pino 37 | I/O — User I/O |
| Pino 38 | I/O — User I/O |
| Pino 39 | I/O — User I/O |
| Pino 40 | VCCINT — Core 5V supply |
| Pino 41 | I/O — User I/O |
| Pino 42 | I/O — User I/O |
| Pino 43 | I/O — User I/O |
| Pino 44 | I/O — User I/O |
| Pino 45 | I/O — User I/O |
| Pino 46 | GND — Ground |
| Pino 47 | I/O — User I/O |
| Pino 48 | I/O — User I/O |
| Pino 49 | I/O — User I/O |
| Pino 50 | I/O — User I/O |
| Pino 51 | I/O — User I/O |
| Pino 52 | VCCIO — I/O bank supply voltage |
| Pino 53 | I/O — User I/O |
| Pino 54 | I/O — User I/O |
| Pino 55 | I/O — User I/O |
| Pino 56 | I/O — User I/O |
| Pino 57 | I/O — User I/O |
| Pino 58 | I/O — User I/O |
| Pino 59 | GND — Ground |
| Pino 60 | I/O — User I/O |
| Pino 61 | I/O — User I/O |
| Pino 62 | I/O — User I/O |
| Pino 63 | I/O — User I/O |
| Pino 64 | I/O — User I/O |
| Pino 65 | VCCINT — Core 5V supply |
| Pino 66 | I/O — User I/O |
| Pino 67 | I/O — User I/O |
| Pino 68 | I/O — User I/O |
| Pino 69 | I/O — User I/O |
| Pino 70 | I/O — User I/O |
| Pino 71 | GND — Ground |
| Pino 72 | I/O — User I/O |
| Pino 73 | I/O — User I/O |
| Pino 74 | I/O — User I/O |
| Pino 75 | I/O — User I/O |
| Pino 76 | I/O — User I/O |
| Pino 77 | VCCIO — I/O bank supply voltage |
| Pino 78 | I/O — User I/O |
| Pino 79 | I/O — User I/O |
| Pino 80 | I/O — User I/O |
| Pino 81 | I/O — User I/O |
| Pino 82 | I/O — User I/O |
| Pino 83 | I/O — User I/O |
| Pino 84 | GND — Ground |
| Pino 85 | I/O — User I/O |
| Pino 86 | I/O — User I/O |
| Pino 87 | I/O — User I/O |
| Pino 88 | I/O — User I/O |
| Pino 89 | I/O — User I/O |
| Pino 90 | VCCINT — Core 5V supply |
| Pino 91 | I/O — User I/O |
| Pino 92 | I/O — User I/O |
| Pino 93 | I/O — User I/O |
| Pino 94 | I/O — User I/O |
| Pino 95 | I/O — User I/O |
| Pino 96 | GND — Ground |
| Pino 97 | I/O — User I/O |
| Pino 98 | I/O — User I/O |
| Pino 99 | I/O — User I/O |
| Pino 100 | I/O — User I/O |
| Pino 101 | I/O — User I/O |
| Pino 102 | VCCIO — I/O bank supply voltage |
| Pino 103 | I/O — User I/O |
| Pino 104 | I/O — User I/O |
| Pino 105 | I/O — User I/O |
| Pino 106 | I/O — User I/O |
| Pino 107 | I/O — User I/O |
| Pino 108 | I/O — User I/O |
| Pino 109 | GND — Ground |
| Pino 110 | I/O — User I/O |
| Pino 111 | I/O — User I/O |
| Pino 112 | I/O — User I/O |
| Pino 113 | I/O — User I/O |
| Pino 114 | I/O — User I/O |
| Pino 115 | VCCINT — Core 5V supply |
| Pino 116 | I/O — User I/O |
| Pino 117 | I/O — User I/O |
| Pino 118 | I/O — User I/O |
| Pino 119 | I/O — User I/O |
| Pino 120 | I/O — User I/O |
| Pino 121 | GND — Ground |
| Pino 122 | I/O — User I/O |
| Pino 123 | I/O — User I/O |
| Pino 124 | I/O — User I/O |
| Pino 125 | I/O — User I/O |
| Pino 126 | I/O — User I/O |
| Pino 127 | VCCIO — I/O bank supply voltage |
| Pino 128 | I/O — User I/O |
| Pino 129 | I/O — User I/O |
| Pino 130 | I/O — User I/O |
| Pino 131 | I/O — User I/O |
| Pino 132 | I/O — User I/O |
| Pino 133 | I/O — User I/O |
| Pino 134 | GND — Ground |
| Pino 135 | I/O — User I/O |
| Pino 136 | I/O — User I/O |
| Pino 137 | I/O — User I/O |
| Pino 138 | I/O — User I/O |
| Pino 139 | I/O — User I/O |
| Pino 140 | VCCINT — Core 5V supply |
| Pino 141 | I/O — User I/O |
| Pino 142 | I/O — User I/O |
| Pino 143 | I/O — User I/O |
| Pino 144 | I/O — User I/O |
| Pino 145 | I/O — User I/O |
| Pino 146 | GND — Ground |
| Pino 147 | I/O — User I/O |
| Pino 148 | I/O — User I/O |
| Pino 149 | I/O — User I/O |
| Pino 150 | I/O — User I/O |
| Pino 151 | I/O — User I/O |
| Pino 152 | VCCIO — I/O bank supply voltage |
| Pino 153 | I/O — User I/O |
| Pino 154 | I/O — User I/O |
| Pino 155 | I/O — User I/O |
| Pino 156 | I/O — User I/O |
| Pino 157 | I/O — User I/O |
| Pino 158 | I/O — User I/O |
| Pino 159 | GND — Ground |
| Pino 160 | I/O — User I/O |
| Pino 161 | I/O — User I/O |
| Pino 162 | I/O — User I/O |
| Pino 163 | I/O — User I/O |
| Pino 164 | I/O — User I/O |
| Pino 165 | nCONFIG — Configuration control (active low) |
| Pino 166 | nSTATUS — Configuration status (active low) |
| Pino 167 | CONF_DONE — Configuration done indicator |
| Pino 168 | DCLK — Configuration clock input |
| Pino 169 | DATA0 — Configuration data input |
| Pino 170 | MSEL0 — Configuration mode select 0 |
| Pino 171 | MSEL1 — Configuration mode select 1 |
| Pino 172 | MSEL2 — Configuration mode select 2 |
| Pino 173 | TDI — JTAG test data input |
| Pino 174 | TDO — JTAG test data output |
| Pino 175 | TMS — JTAG test mode select |
| Pino 176 | TCK — JTAG test clock |
| Pino 177 | DEV_CLRn — Device-wide clear (active low) |
| Pino 178 | DEV_OE — Device-wide output enable |
| Pino 179 | VCCINT — Core 5V supply |
| Pino 180 | GND — Ground |
| Pino 181 | I/O — User I/O |
| Pino 182 | I/O — User I/O |
| Pino 183 | I/O — User I/O |
| Pino 184 | I/O — User I/O |
| Pino 185 | I/O — User I/O |
| Pino 186 | VCCIO — I/O bank supply voltage |
| Pino 187 | I/O — User I/O |
| Pino 188 | I/O — User I/O |
| Pino 189 | I/O — User I/O |
| Pino 190 | I/O — User I/O |
| Pino 191 | I/O — User I/O |
| Pino 192 | I/O — User I/O |
| Pino 193 | GND — Ground |
| Pino 194 | I/O — User I/O |
| Pino 195 | I/O — User I/O |
| Pino 196 | I/O — User I/O |
| Pino 197 | I/O — User I/O |
| Pino 198 | I/O — User I/O |
| Pino 199 | VCCINT — Core 5V supply |
| Pino 200 | I/O — User I/O |
| Pino 201 | I/O — User I/O |
| Pino 202 | I/O — User I/O |
| Pino 203 | I/O — User I/O |
| Pino 204 | I/O — User I/O |
| Pino 205 | GND — Ground |
| Pino 206 | I/O — User I/O |
| Pino 207 | I/O — User I/O |
| Pino 208 | I/O — User I/O |
| Pino 209 | I/O — User I/O |
| Pino 210 | I/O — User I/O |
| Pino 211 | VCCIO — I/O bank supply voltage |
| Pino 212 | I/O — User I/O |
| Pino 213 | I/O — User I/O |
| Pino 214 | I/O — User I/O |
| Pino 215 | I/O — User I/O |
| Pino 216 | I/O — User I/O |
| Pino 217 | I/O — User I/O |
| Pino 218 | GND — Ground |
| Pino 219 | I/O — User I/O |
| Pino 220 | I/O — User I/O |
| Pino 221 | I/O — User I/O |
| Pino 222 | I/O — User I/O |
| Pino 223 | I/O — User I/O |
| Pino 224 | VCCINT — Core 5V supply |
| Pino 225 | I/O — User I/O |
| Pino 226 | I/O — User I/O |
| Pino 227 | I/O — User I/O |
| Pino 228 | I/O — User I/O |
| Pino 229 | I/O — User I/O |
| Pino 230 | GND — Ground |
| Pino 231 | I/O — User I/O |
| Pino 232 | I/O — User I/O |
| Pino 233 | I/O — User I/O |
| Pino 234 | I/O — User I/O |
| Pino 235 | I/O — User I/O |
| Pino 236 | VCCIO — I/O bank supply voltage |
| Pino 237 | I/O — User I/O |
| Pino 238 | I/O — User I/O |
| Pino 239 | I/O — User I/O |
| Pino 240 | I/O — User I/O |
Aplicações típicas
EPF81500ARC240-2A é adequado para 6 aplicaçãos: Telecommunications Bus Bridging, Industrial Control Glue Logic Consolidation, High-Density State Machine Implementations, Legacy System Replication and Field Upgrades, Peripheral Interface Aggregation, Test & Measurement Custom Logic.
Telecommunications Bus Bridging
The EPF81500ARC240-2A's 16,000 usable gates and 181 user I/O are well-matched to telecom bridging applications that must glue multiple 32-bit buses into a single device. The FLEX 8000 FastTrack interconnect provides predictable timing across the 240-RQFP pin field, simplifying multi-bus protocol conversion. The exposed pad supports sustained switching on 181 pins without thermal throttling, while the 5V VCCINT matches legacy telecom backplane rails.
Recomendado
Industrial Control Glue Logic Consolidation
Industrial control designs historically used multiple 74-series TTL and CMOS parts for glue logic; the EPF81500ARC240-2A consolidates these into a single in-system reconfigurable device. Its 0.42 umm CMOS SRAM process and 125 MHz internal frequency handle state machines, encoders, and timing logic comfortably. The 240-RQFP exposed pad supports industrial thermal envelopes when many outputs switch simultaneously.
Recomendado
High-Density State Machine Implementations
Register-rich FLEX 8000 devices excel at large finite state machines where each LE includes a programmable register plus a 4-input LUT. The EPF81500ARC240-2A's 1,500 registers and 1,296 LEs can host wide state machines with deep encoders, while the 125 MHz clock domain handles high-speed control loops. Designers use the FastTrack routing to predictably close timing on multi-cycle FSM transitions.
Recomendado
Legacy System Replication and Field Upgrades
The EPF81500ARC240-2A's in-circuit reconfigurability (ICR) enables field upgrades via Altera EPC1, EPC1064, EPC1213, or EPC1441 configuration devices. Designers can update logic without removing the device from the board, supporting long-lifecycle industrial, military, and aerospace systems. The 240-RQFP footprint matches legacy FLEX 8000 board designs, simplifying repair and obsolescence mitigation.
Recomendado
Peripheral Interface Aggregation
Designers use the EPF81500ARC240-2A to aggregate legacy peripheral interfaces (ISA, VME, parallel PCI) where the 181 user I/O and bidirectional pins support wide data and address buses. The 5V VCCINT and 5V-tolerant I/O match vintage peripheral ICs, while the SRAM-based configuration allows late-stage design changes during system integration. Exposed-pad 240-RQFP supports thermal loads of simultaneous bus switching.
Recomendado
Test & Measurement Custom Logic
Test and measurement equipment often requires custom digital logic for stimulus generation, timing analysis, or data formatting; the EPF81500ARC240-2A provides 16K gates and 181 I/O for these functions. The 125 MHz internal frequency supports high-speed pattern generation, and the in-system reconfigurability enables rapid firmware iteration during test development. The 240-RQFP exposed pad supports bench-instrument thermal envelopes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF81500ARC240-2A — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF81500ARC240-2 | EPF81500AQC240-2 | EPF81500AQC240-3 | EPF81500AQC240-4 |
|---|---|---|---|---|---|
| Package | 240-RQFP (BFQFP) Exposed Pad | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Elements (LEs) | 1,296 | 1,296 | 1,296 | 1,296 | 1,296 |
| Maximum User I/O | 181 | 181 | 181 | 181 | 181 |
| Speed Grade | -2 | -2 | -2 | -3 (slower) | -4 (slowest) |
| Configuration Method | Serial/Parallel EPROM (EPC1/EPC1064/EPC1213/EPC1441) | Same (EPC1/EPC1064/EPC1213/EPC1441) | Same | Same | Same |
| Operating Voltage (VCCINT) | 5 V | 5 V | 5 V | 5 V | 5 V |
Principais diferenciais
- FLEX 8000 family member with 240-RQFP footprint and 5V VCCINT (vs EPF81500ARC240-2 (base part))
- Higher speed grade (-2) for timing-critical designs (vs EPF81500AQC240-3 (-3) and EPF81500AQC240-4 (-4))
- Same die across all 240-RQFP FLEX 8000 variants (vs EPF81500AQC240-2 (same speed grade, different pinout suffix))
Notas de projeto
The EPF81500ARC240-2A requires both VCCINT (5V core) and VCCIO (I/O bank voltage) supplies. According to the FLEX 8000 family datasheet, VCCINT and VCCIO must be sequenced correctly during power-up to avoid latch-up or spurious configuration. Place decoupling capacitors (0.1 uF ceramic plus 10-47 uF bulk) as close as possible to every VCCINT and VCCIO pin. Use independent supply rails if possible to control inrush current.
The 240-RQFP exposed pad MUST be soldered to a thermal copper pour on the PCB to dissipate heat from simultaneous I/O switching. Estimated: at 181 I/O switching at 5V with capacitive loads, the device can dissipate several watts. Provide at least 1 square inch of continuous copper connected to the exposed pad and use thermal vias to inner ground planes to keep junction temperature within the operating range.
Do not confuse MSEL pin configuration mode settings - selecting the wrong mode can prevent configuration from completing. Verify MSEL[2:0] against the FLEX 8000 datasheet's configuration mode table. Also, ensure nCONFIG is properly driven (not floating) at power-up; a floating nCONFIG can leave the device in an unconfigured state and prevent CONF_DONE from asserting.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 ohm controlled impedance if boundary-scan testing is required, and keep them away from fast-switching I/O to avoid noise coupling. Place the EPC1/EPC1064/EPC1213/EPC1441 configuration device within 2 inches of the FPGA with short, parallel DATA0/DCLK traces to minimize skew and improve configuration reliability.
Informações de conformidade
RoHS compliance for the FLEX 8000 family is not explicitly documented in the verified web data. This FLEX 8000 part predates RoHS compliance mandates for some variants. Use [DATA_NEEDED] markers where compliance is not confirmed. AEC-Q100 is not applicable as no automotive qualification is documented.