Altera

EPF8820ARC208-3-NW - 8K-Gate FLEX 8000 FPGA, 208-RQFP | Altera

N.º da peça: EPF8820ARC208-3-NW ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

4.75 V to 5.25 V Vdss 208-BFQFP / 208-RQFP (28x28 mm) Exposed Pad Package

A partir de $110 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-11

Preços por volume

Qtd.	Preço unitário	Total
1	$185	$185,00
10	$165	$1.650,00
100	$145	$14.500,00
500	$125	$62.500,00
1.000	$110	$110.000,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EPF8820ARC208-3-NW Visão geral

The Altera (now Intel) EPF8820ARC208-3-NW is a member of the FLEX 8000 family of CMOS programmable logic devices (PLDs), delivering up to 8,000 usable gates, 1,500 registers, and 152 user I/O pins in a 208-pin RQFP (28x28 mm) package with an exposed thermal pad. The device operates from a 4.75 V to 5.25 V single supply and supports system clock frequencies consistent with 5 V FLEX 8000 silicon, making it a drop-in legacy option for industrial and military designs.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement any digital logic function. FPGAs sit in the broader taxonomy of programmable logic devices -> complex programmable logic devices (CPLDs) and FPGAs -> programmable logic -> digital IC -> integrated circuit. FLEX 8000 devices occupy the high-density register-rich segment of Altera's classic SRAM-based FPGA portfolio, sitting between early MAX-class CPLDs and later APEX/Cyclone families in both density and process node.

Key features include in-circuit reconfigurability (ICR) via external configuration devices or intelligent controllers, 100% factory-tested logic, multiVolt I/O support in compatible families, and JTAG-based boundary-scan testing. The device offers 4.75V-5.25V core supply tolerance, 152 user I/Os, and a power-optimized architecture that supports sleep mode for low-power standby. The exposed thermal pad on the 208-RQFP package allows PCB ground-plane attachment for improved heat spreading in industrial chassis. The FLEX 8000 architecture uses an SRAM-based look-up table (LUT) fabric with embedded register cells, offering faster place-and-route than CPLDs but requiring configuration at every power-up.

Typical applications include industrial glue logic replacement, telecommunications backplane glue, legacy 5 V bus controllers, prototyping platforms for VHDL/Verilog designs, and digital signal conditioning interfaces. The device is well suited to designs that need high register count and I/O density without migrating to newer 3.3 V / 1.5 V FPGA families, particularly where the 5 V tolerance of FLEX 8000 is required. Design considerations include mandatory external configuration memory (EPC) for SRAM configuration cells, JTAG programming chain design, and careful 5 V power-rail decoupling to support hot-swap or backplane insertion. This page synthesizes distributor pricing, FLEX 8000 family alternatives, and configuration-memory design notes that go beyond the bare datasheet.

Alternativas drop-in para EPF8820ARC208-3-NW — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF8820ARC208-3-NW (mesmo formato e footprint) — diferindo em Process Technology, Package, Configuration Method, Usable Gates, In-Circuit Reconfigurability.

EPF8820ARC208-2

Altera

Process Technology: 0.42 µm CMOS

Package: 208-pin RQFP / BFQFP with exposed pad

Configuration Method: SRAM - serial EPC device, parallel EPROM, or microcontroller