EPF8820ARC208-3 - FLEX 8000 FPGA, 8K Gates, 672 Cells | Intel / Altera
MPN: EPF8820ARC208-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $79 | $7,900.00 |
| 500 | $70 | $35,000.00 |
| 1,000 | $62 | $62,000.00 |
Drop-in alternatives for EPF8820ARC208-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPF8820ARC208-2
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View Datasheet →EPF8820ARC208-3 Maximum Ratings & Electrical Characteristics
| Series | FLEX 8000 |
| Family | FLEX 8000 (EPF8820) |
| Usable Gates | 8,000 |
| Logic Cells / Elements | 672 |
| Registers | 152 |
| Maximum Operating Frequency | 125 MHz |
| Supply Voltage (VCC) | 4.75 V to 5.25 V |
| Process Technology | 0.42 µm CMOS |
| Configuration Memory | SRAM (volatile) |
| Package / Case | 208-BFQFP Exposed Pad (208-RQFP, 28x28 mm) |
| Supplier Device Package | 208-RQFP (28x28) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| In-Circuit Reconfigurability (ICR) | Yes (via external configuration devices) |
| Boundary-Scan Test | JTAG (IEEE 1149.1) |
| I/O Tolerance | 3.3 V / 5 V |
| Clock Networks | 4 dedicated low-skew global clocks |
EPF8820ARC208-3 208-rqfp (28x28) Pin Configuration Guide
Complete pinout information for EPF8820ARC208-3 (208-rqfp (28x28) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ARC208-3.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ARC208-3 is suitable for 6 applications: Telecommunications Channel Aggregation, Industrial Control and Factory Automation Glue Logic, Legacy PCI Bus Interface, Digital Signal Processing Front-End, Military and Aerospace Avionics Bus Interfaces, Storage and Mainframe Legacy Interface.
Telecommunications Channel Aggregation
The EPF8820ARC208-3 fits telecommunications channel aggregation and backplane glue logic applications because of its 8,000 usable gates, 152 registers, and four dedicated low-skew global clock networks. With 125 MHz maximum frequency (speed grade -3), it can implement multi-channel framers, protocol converters, and serializer-deserializer (SERDES) glue logic while leaving headroom for state-machine-heavy channel management. The 208-pin RQFP exposes enough I/O for parallel telecom buses (HMVIP, H.110, TDM) and the 5V supply tolerance simplifies integration into legacy 5V backplanes. In a typical design the FPGA sits between a TDM bus and a processor, demultiplexing channels and presenting formatted frames to the host CPU.
Recommended
Industrial Control and Factory Automation Glue Logic
The EPF8820ARC208-3 is well suited to industrial control and factory automation glue logic where 5V tolerance, register-rich architecture, and high I/O count are required. The device's 152 registers and 672 logic cells can implement multiple PID controllers, encoder counters, and stepper-motor pulse generators in a single chip. Its 208-pin RQFP package exposes ~140 user I/O, enough for parallel industrial buses (PC/104, CompactPCI, VME) and discrete sensor/actuator wiring. The exposed thermal pad supports sustained operation in factory cabinets where ambient temperatures can reach 70C. Designers typically pair the FPGA with opto-isolated I/O buffers and a watchdog supervisor.
Recommended
Legacy PCI Bus Interface
The EPF8820ARC208-3's 3.3V/5V PCI-compliant I/O buffers make it a strong choice for legacy PCI bus interfaces and add-in card glue logic. The device can implement PCI target or master state machines, custom configuration registers, and interrupt controllers using its 8,000 usable gates and 152 registers. The 208-RQFP package provides sufficient I/O for a 32-bit PCI bus plus side signals, and the 125 MHz internal frequency comfortably handles the 33 MHz PCI clock with margin. In a typical add-in card design the FLEX 8000 handles PCI bus arbitration, target decode, and DMA sequencing while the host processor runs application code.
Recommended
Digital Signal Processing Front-End
The EPF8820ARC208-3 supports digital signal processing front-end functions such as FIR/IIR filtering, FFT pre-processing, and data-rate conversion in mid-range DSP systems. The dedicated carry-chain logic in each logic element enables efficient adder trees at 125 MHz, while the four low-skew global clocks synchronize parallel sample streams. The 208-pin RQFP package accommodates parallel ADC/DAC data buses plus control logic. In a typical DSP front-end the FLEX 8000 performs decimation, channel selection, and gain control before passing data to a dedicated DSP processor or ASIC. The 5V supply tolerance is particularly useful for legacy ADC/DAC interfaces.
Recommended
Military and Aerospace Avionics Bus Interfaces
The EPF8820ARC208-3 supports military and aerospace avionics bus interfaces (MIL-STD-1553, ARINC 429) where the FLEX 8000 family's proven long-term reliability and high I/O count are valued. The 208-pin RQFP package offers sufficient I/O for dual-redundant bus channels plus discrete I/O, and the SRAM-based configuration supports in-field upgrades mandated by avionics maintenance procedures. The speed grade -3 variant with 125 MHz capability handles Manchester-encoded bus timing with margin. For aerospace programs requiring full traceability, sourcing from Rochester Electronics or other authorized franchised distributors ensures pedigree documentation.
Recommended
Storage and Mainframe Legacy Interface
The EPF8820ARC208-3 serves storage and mainframe legacy interface applications including SCSI bus termination logic, parallel ATA converters, and custom mainframe channel adapters. Its 8,000 gates and 152 registers can implement protocol state machines, CRC engines, and bus arbiters in a single chip. The 5V tolerance and 208-pin RQFP package support the wide parallel buses common in enterprise storage, while 125 MHz speed grade handles synchronous transfer rates. The device's exposed thermal pad supports continuous operation in storage array backplanes. Designers typically pair the FPGA with bus transceivers and parity generators to build complete legacy bridge solutions.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ARC208-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ARC208-2 | EPF8820ARC208-24 | EPF8820ARC208-2N | EPF8820ARC208-2H | EPF8820ARC208-2A | EPF8636ARC208-3 | EPF8636ARC208-4 |
|---|---|---|---|---|---|---|---|---|
| Package | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Usable Gates | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 6,000 | 6,000 |
| Logic Cells / Elements | 672 | 672 | 672 | 672 | 672 | 672 | 432 | 432 |
| Registers | 152 | 152 | 152 | 152 | 152 | 152 | 120 | 120 |
| Speed Grade | -3 (~125 MHz) | -2 (~85 MHz) | -2 industrial | -2 lead-free | -2 high-reliability | -2 automotive | -3 (~125 MHz) | -4 (higher) |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS |
Key Differentiators
- Mid-range FLEX 8000 density with full 208-pin RQFP I/O budget (vs EPF8636ARC208-3)
- Speed grade -3 delivers 125 MHz maximum frequency (vs EPF8820ARC208-2)
- Industrial-grade FLEX 8000 with extensive distributor stock (vs EPF81500ARC304-4)
- 5V-native supply with 3.3V PCI-compliant I/O (vs Xilinx XC4000-series (cross-era))
Design Notes
The EPF8820ARC208-3 requires multiple VCC and VCCIO pins per the FLEX 8000 datasheet; route a 5V plane directly to all VCC pins and decouple each pin with a 0.1 µF ceramic capacitor placed within 5 mm of the package. Add bulk 10-47 µF tantalum or aluminum-polymer capacitors at the board-level to handle SRAM configuration transients. During configuration loading, inrush current can spike several hundred mA; ensure the 5V regulator has adequate headroom. Power sequencing between VCC and VCCIO is not required for the FLEX 8000 family, but simultaneous ramp is recommended to avoid I/O bus contention.
The 208-RQFP exposed pad must be soldered to a ground copper pour for both thermal dissipation and electrical reference. Estimated: at 125 MHz with all 672 logic cells active, typical power dissipation is ~1.5 W; the exposed pad reduces theta_JA from ~35 C/W (no pad) to ~20 C/W (soldered pad). At 70C ambient this provides ~50C junction margin to the 125C maximum. For continuous operation at industrial temperatures, use a minimum 1 square-inch copper pour connected via thermal vias.
Place the EPC2/EPC8 configuration EPROM within the trace-length budget specified in the FLEX 8000 datasheet (typically <100 mm). Use matched-length traces for configuration clock (DCLK) and data (DATA0..n) to avoid setup/hold violations at high DCLK rates. Reserve dedicated PCB layers for ground and 5V power; avoid routing signals across split ground planes. Maintain 50 ohm characteristic impedance on high-speed clock nets. For JTAG (IEEE 1149.1) boundary-scan, route TCK, TMS, TDI, TDO as a single chain with no stubs.
Do not assume SRAM configuration is retained across power cycles - the FLEX 8000 family requires reload on every power-up via EPC2/EPC8 configuration EPROM. Do not leave CONFIG_DONE floating; tie to a pull-up so the host processor can monitor configuration status. Do not exceed the maximum I/O current per bank (refer to FLEX 8000 datasheet); use external bus switches if driving many high-current loads. Do not forget the exposed-pad solder connection - missing it causes thermal shutdown in continuous operation. Finally, verify configuration bitstream CRC at production test to catch corrupted EEPROM images.
Compliance Information
EPF8820ARC208-3 is part of the legacy FLEX 8000 family originally released in the 1990s; lead-free (Pb-free) variants are denoted by the 'N' suffix (e.g., EPF8820ARC208-2N). Compliance status for the standard '-3' speed grade not explicitly confirmed in available data. Automotive-grade equivalent is EPF8820ARC208-2A.
