GX36220-DNT - 2x64Gb/s Linear TIA Die | Renesas | 400G Coherent
N.º da peça: GX36220-DNT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $444.44 | $444,44 |
| 10 | $422.22 | $4.222,20 |
| 100 | $400 | $40.000,00 |
| 500 | $378 | $189.000,00 |
| 1.000 | $355.55 | $355.550,00 |
GX36220-DNT Visão geral
A transimpedance amplifier is a type of current-to-voltage converter that sits directly behind a photodiode in an optical receiver, converting the photodiode's weak photocurrent into a usable differential voltage while adding minimal noise. Within the optical signal chain hierarchy, the TIA is the first gain stage after the photodetector and directly determines receiver sensitivity, overload behavior, and linearity - the latter being essential for coherent systems that rely on DSP equalization rather than hard limiting.
Key characteristics include dual-channel integration (I and Q), a 32Gb/s per-channel data rate, and linear (non-limiting) output operation, which preserves signal amplitude information for the downstream coherent DSP. Linear TIAs are critical in coherent optical transceivers where limiting amplifiers would destroy the phase and amplitude modulation content of the received signal.
The DNT suffix identifies the die-sale ordering option: parts are sold as known-good die from wafer processing, allowing integration into hermetically sealed or hybrid optical sub-assembly packages, butterfly packages, or custom ROSA modules. This delivery format minimizes package parasitics and supports the compact form factors demanded by 400G and beyond coherent transceiver designs.
Typical applications include 400G coherent ROSA I/Q channel amplification, coherent DWDM receiver front ends, telecom datacenter-interconnect optical receivers, and hybrid photonic integrated receiver assemblies. Each 32Gb/s channel handles one quadrature of the coherent signal, so a single GX36220 supports a complete dual-quadrature receiver front end.
Design consideration: because this part is supplied as bare die, assembly requires die-attach and wire-bond or flip-chip processes with controlled bond-length inductance; pinout and die mechanical drawings must be taken from the manufacturer datasheet and die-spec documentation before hybrid layout begins.
This page synthesizes distributor pricing, availability, die-ordering details, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para GX36220-DNT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com GX36220-DNT (mesmo formato e footprint) — diferindo em Number of Channels, Package, Target Application, Aggregate Data Rate, Data Rate per Channel.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
GX36220-F-DNT
✅ Drop-In✓ Em estoque
$308.36 / unidade
Ver ficha técnica →GX36420
✅ Drop-In✓ Em estoque
$92.4 / unidade
Ver ficha técnica →GX36220-DNT Especificações
| Product Type | Linear Transimpedance Amplifier (TIA) |
| Number of Channels | 2 (I and Q) |
| Data Rate per Channel | 32 Gb/s |
| Aggregate Data Rate | 64 Gb/s (2 x 32 Gb/s) |
| Tipo de saída | Linear (non-limiting) |
| Target Application | 400G Coherent Receiver Optical Sub-Assembly (ROSA) |
| Delivery Format | Die Sale (Price in Good Die) - Wafer |
| Encapsulamento | Bare Die (DNT die-sale option) |
| Tipo de montagem | Surface Mount (die attach in hybrid/ROSA assembly) |
| Category Subtype | Telecom IC Amplifier Die |
| Status RoHS | unknown |
Guia de Configuração de Pinos do GX36220-DNT bare die (dnt die-sale option)
Configuração de pinos para GX36220-DNT (pacote bare die (dnt die-sale option)). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para GX36220-DNT.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
GX36220-DNT é adequado para 6 aplicaçãos: 400G Coherent ROSA I/Q Amplification, Coherent DWDM Receiver Front Ends, Hybrid Photonic Integrated Receivers, Datacenter Interconnect Coherent Transceivers, Test and Measurement Optical Receivers, Telecom Broadcast/Video Distribution Optical Links.
400G Coherent ROSA I/Q Amplification
The primary application of the GX36220-DNT is dual-channel linear amplification of the I and Q photocurrents in 400G coherent Receiver Optical Sub-Assemblies. The photodiode array in a coherent ROSA produces weak quadrature photocurrents that must be converted to voltage with high linearity so the downstream coherent DSP can perform phase recovery and equalization. The GX36220 integrates both 32Gb/s TIA paths on one die, halving channel-to-channel mismatch risk versus two single-channel TIAs and simplifying I/Q gain/phase tracking. Because it is delivered as bare die, it can be co-packaged with the photodiode in a hermetic butterfly or compact ROSA housing, minimizing interconnect parasitics that would erode the 32Gb/s channel bandwidth.
Recomendado
Coherent DWDM Receiver Front Ends
In dense wavelength-division-multiplexing (DWDM) coherent line-card receivers, the optical front end must convert 100+Gb/s-per-wavelength quadrature signals with minimal added noise and distortion. The GX36220-DNT's linear transfer characteristic preserves the amplitude modulation content carried by DP-QPSK and 16QAM waveforms, which a limiting amplifier would destroy. Its dual-channel architecture maps directly onto the I and Q arms of a 90-degree hybrid receiver, and the die-sale format allows integration directly onto the receiver hybrid substrate next to the balanced photodiode pair. Channel bandwidth of 32Gb/s per path supports 400G-per-wavelength signaling with typical coherent DSP oversampling margins.
Recomendado
Hybrid Photonic Integrated Receivers
Hybrid photonic integration bonds a bare-die TIA directly onto a silicon-photonics or InP photonic substrate containing the photodetectors and 90-degree optical hybrid. The GX36220-DNT's bare-die delivery makes it well suited to this assembly flow: known-good die from wafer-level test can be die-attached and wire-bonded or flip-chipped adjacent to the photodiodes, keeping electrical interconnects under a millimeter. Short interconnects are essential at 32Gb/s because bond-wire inductance in the TIA input path forms a parasitic pole that reduces bandwidth and peaking. The dual-channel integration also keeps the I and Q signal paths thermally and electrically matched on the same die.
Recomendado
Datacenter Interconnect Coherent Transceivers
As datacenter interconnects move to 400G and 800G coherent optics (e.g., 400ZR-class modules), receiver sensitivity and linearity become the dominant link-budget constraints. The GX36220-DNT provides the low-noise, linear first-stage gain needed to meet the tight OSNR budgets of coherent pluggable modules. Its two 32Gb/s channels cover the I/Q quadratures of a coherent receiver in a footprint compatible with compact QSFP-DD and OSFP module ROSAs. The die-sale format supports the miniaturized optical engines used in these modules, where a packaged TIA would consume excessive height and add excessive bond length to the photodiode interface.
Recomendado
Test and Measurement Optical Receivers
Optical test instruments - bit-error-ratio testers, optical modulation analyzers, and coherent-lightwave receivers - require linear TIAs with known, flat frequency response so measurement results are not corrupted by amplifier nonlinearity. The GX36220-DNT's linear 32Gb/s channels make it suitable as the front-end converter in 400G-class optical test receivers. Bare-die delivery lets instrument builders integrate the TIA on a controlled-impedance RF hybrid with calibrated response, and dual-channel integration ensures the I and Q measurement paths share identical die-level characteristics, improving quadrature balance in polarization-diverse measurement setups.
Recomendado
Telecom Broadcast/Video Distribution Optical Links
Renesas groups the GX36220 with GX36420, GX39220, GX76476, and GX79472 parts in product-change notice PLC250030 covering video distribution and broadcast optical applications. In wideband analog/digital optical distribution links, linear amplification behind the photodiode preserves signal fidelity for multi-channel video transport. The GX36220-DNT's dual linear TIA channels suit receivers handling two parallel signal streams, and the die format integrates into the compact optical receiver hybrids used in headend and distribution equipment. Engineers maintaining these platforms should track the PLC250030 last-time-buy window when planning long-term availability.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para GX36220-DNT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | GX36220-F-DNT | GX36420 |
|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Automotive Grade | No | No | No |
Principais diferenciais
- Dual-channel integration on one die (vs GX36220-F-DNT (single-variant comparison))
- Linear (non-limiting) output (vs Limiting TIAs in the telecom amplifier category)
- Bare-die delivery format (vs Packaged TIA alternatives)
Notas de projeto
At 32Gb/s per channel, every millimeter of TIA input interconnect matters. Minimize the photodiode-to-die bond wire length; a typical 1-2 mm gold bond wire adds roughly 1-2 nH of series inductance, which forms a low-pass pole with the photodiode capacitance and can degrade channel bandwidth and add peaking. Use twin-ribbon bonds or flip-chip for the TIA input path where possible, and keep the two I-channel (and two Q-channel) bonds symmetric to preserve balanced-input noise rejection.
For hybrid substrates, route TIA differential outputs as 50-ohm (single-ended) or 100-ohm differential controlled-impedance lines with a solid ground reference plane directly beneath. Provide separate low-inductance supply return paths for each TIA channel to prevent I/Q crosstalk through shared supply impedance. Place decoupling capacitors within 1-2 mm of the die supply pads. Because this is bare die, thermal expansion mismatch between die attach and substrate should be reviewed for the operating temperature profile of the ROSA.
The most common die-sale pitfall is designing the hybrid footprint before obtaining the die-spec pad map. The GX36220-DNT has no conventional package pinout - pad coordinates come from the Renesas die-specification document, which may be supplied under NDA. Additionally, verify the die revision/grade (base vs. GX36220-F variant) against your qualification data, and track Renesas product-change notice PLC250030 covering GX36220-family parts with a last-time-buy window before committing production volumes.
Informações de conformidade
Compliance data for this bare-die telecom product was not stated in the verified sources; RoHS/REACH status must be confirmed with Renesas for the specific wafer lot.
