H5CG46AGBDX015 - DDR5 SDRAM 16Gb 5600Mbps | SK Hynix
N.º da peça: H5CG46AGBDX015 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.45 | $64,50 |
| 100 | $5.85 | $585,00 |
| 500 | $5.35 | $2.675,00 |
| 1.000 | $4.95 | $4.950,00 |
H5CG46AGBDX015 Visão geral
DDR5 SDRAM is the fifth generation of double-data-rate synchronous dynamic random-access memory, a class of volatile semiconductor memory that stores each bit in a capacitor-based cell refreshed at intervals. In the memory hierarchy of a computing system, DRAM sits as the main-system memory layer between CPU caches (SRAM) and non-volatile storage such as NAND flash, and belongs to the broader category of memory ICs and data storage components.
Key features of the H5CG46AGBDX family include the doubled bank structure versus DDR4, which improves effective bandwidth through higher interleaving, on-die ECC (error correction code) for improved reliability at advanced process nodes, and a lower operating VDD architecture versus DDR4 that reduces system power per bit transferred. The 16Gb density in a x16 organization supports wide-bus memory subsystems with modest chip counts.
Technically, the device implements the JEDEC DDR5 interface with programmable termination, decision-feedback equalization on the DQ mesh, and an on-package power delivery path (in module-level designs using PMIC). Data is transferred on both clock edges, doubling the effective rate relative to the clock frequency, with burst lengths optimized for the 5600 Mbps speed grade.
Typical applications include desktop and server memory modules (UDIMM, SODIMM, RDIMM), industrial controllers requiring main memory, computing modules and edge AI accelerators, and embedded logging or firmware boot platforms where high-bandwidth volatile memory is required.
Designers must follow the SK Hynix datasheet for VDD/VDDQ voltage rails, termination (RTT_NOM/PARK/DQ) programming, ZQ calibration requirements, and address/command bus fly-through layout rules. Power Integrity (PDN impedance) and Signal Integrity (length matching, eye-mask compliance) are critical at 5600 Mbps.
This page adds value beyond the datasheet by consolidating distributor stock signals, drop-in alternatives within the SK Hynix DDR5 16Gb family, pricing tiers, and practical design notes not found on the manufacturer site.
Alternativas drop-in para H5CG46AGBDX015 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com H5CG46AGBDX015 (mesmo formato e footprint) — diferindo em Package, Data Rate, Interface, Organization, Density.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
H5CG46AGBDX017N
✅ Drop-In✓ Em estoque
$91.73 / unidade
Ver ficha técnica →H5CG46AGBDX017
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$92.1 / unidade
Ver ficha técnica →H5CG48AGBDX014N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$70 / unidade
Ver ficha técnica →H5CG48AGBDX014
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$86 / unidade
Ver ficha técnica →H5CG48AGBDX018N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$87.42 / unidade
Ver ficha técnica →H5CG48AGBDX018
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$63.9844 / unidade
Ver ficha técnica →H5CG46AGBDX015 Classificações máximas e características elétricas
| Tipo de memória | DDR5 SDRAM |
| Density | 16 Gb |
| Organização da memória | 1G x 16 |
| Taxa de dados | 5600 Mbps/pin |
| Interface | DDR5 (JEDEC DDR5 SDRAM) |
| On-Die ECC | Yes (DDR5 standard feature) |
| Package Type | FBGA (fine-pitch BGA) |
| Tipo de montagem | Surface Mount |
| Manufacturer | SK Hynix |
| Application | Computing modules, industrial controllers, data storage |
Guia de Configuração de Pinos do H5CG46AGBDX015 fbga (fine-pitch bga)
Configuração de pinos para H5CG46AGBDX015 (pacote fbga (fine-pitch bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para H5CG46AGBDX015.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
H5CG46AGBDX015 é adequado para 6 aplicaçãos: Desktop and Server Memory Modules, Industrial Controllers and Automation, Computing Modules (COM/SoM), Embedded Logging and Data Acquisition, Network Appliances and Routers, Edge AI Accelerators and Vision Systems.
Desktop and Server Memory Modules
The H5CG46AGBDX015 is a core building block for DDR5 UDIMMs, SODIMMs, and RDIMMs used in desktop, workstation, and server platforms. Its 16Gb density organized as 1G x 16 lets a module reach 8GB with four x16 dies or 16GB with eight, while the 5600 Mbps data rate matches mainstream DDR5-5600 JEDEC speed bins used by current-generation Intel and AMD memory controllers. On-die ECC improves module-level reliability without consuming bus bandwidth. Placed on a multi-layer module PCB with fly-through address/command routing and per-die VDDQ decoupling, the die meets the DDR5-5600 eye mask; designers should validate read/write training across temperature with the exact suffix selected.
Recomendado
Industrial Controllers and Automation
Industrial controllers running embedded Linux require robust main memory, and the H5CG46AGBDX015 fits this role with 16Gb of DDR5 bandwidth at up to 5600 Mbps. Distributor product overviews explicitly position the H5CG46AGBDX family for industrial controllers and computing modules. On-die ECC corrects single-bit cell errors internally, reducing field failure rates in electrically noisy factory environments, while the lower DDR5 operating voltage versus DDR4 reduces controller thermal load. The die is typically soldered directly to the controller board rather than socketed, so confirm the industrial temperature grade of the chosen suffix in the SK Hynix ordering table and derate the data rate if the platform operates at the temperature limit.
Recomendado
Computing Modules (COM/SoM)
Computer-on-modules and system-on-modules integrate the H5CG46AGBDX015 directly under or beside the processor package to provide main memory within a very small footprint. The 16Gb (1G x 16) die in a fine-pitch FBGA supports compact stacked or side-by-side memory topologies common in SoM designs, and DDR5-5600 bandwidth feeds modern SoC memory controllers without becoming the bottleneck for edge computing workloads. Because module memory is not upgradeable, designers should dual-source footprint-compatible suffixes across the H5CG46 family and validate DDR training margins over the full operating range. On-die ECC further protects data integrity in unattended deployments such as network appliances and gateways.
Recomendado
Embedded Logging and Data Acquisition
Embedded logging systems, data recorders, and acquisition platforms buffer large data streams in RAM before committing to non-volatile storage. The H5CG46AGBDX015 provides 16Gb of high-bandwidth DDR5 buffering at 5600 Mbps per pin, enough to absorb bursts from multi-channel sensors, industrial cameras, or network packet capture without dropping samples. On-die ECC protects buffered data against soft errors during long recording sessions. The low DDR5 operating voltage also reduces system power in fanless sealed enclosures. Designers pair the die with SPI NOR flash for boot code and verify sustained DMA bandwidth across the memory controller meets the aggregated sensor data rate with margin.
Recomendado
Network Appliances and Routers
Enterprise routers, switches, and security appliances use DDR5 main memory for packet buffers, flow tables, and control-plane software. The H5CG46AGBDX015 offers 16Gb density at DDR5-5600, delivering the bandwidth needed to keep deep packet buffers responsive under line-rate traffic, while 1G x 16 organization allows wide 64-bit or 128-bit memory buses with multiple dies. On-die ECC is essential in always-on networking equipment where accumulated soft errors would otherwise corrupt flow state. Thermal design matters in 1U chassis with limited airflow: verify junction temperature margins with the enclosure airflow profile and consider a lower speed bin suffix if sustained ambient temperatures are high.
Recomendado
Edge AI Accelerators and Vision Systems
Edge AI modules and smart-camera platforms stream neural-network activations and video frames through DDR5 main memory. The H5CG46AGBDX015 supplies 16Gb of working memory at 5600 Mbps, sufficient for mid-size CNN inference buffers and multi-stream video frame queues. The 1G x 16 organization supports the wide buses typical of edge AI SoCs, and DDR5 on-die ECC protects long-running inference sessions from silent data corruption. Signal integrity at 5600 Mbps requires careful length matching and reference-plane continuity under the memory, so module designers should follow the SK Hynix DDR5 design guide and re-validate training whenever memory die placement or suffix grade changes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para H5CG46AGBDX015 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | H5CG46AGBDX017N | H5CG46AGBDX017 | H5CG48AGBDX014N |
|---|---|---|---|---|
| Package | FBGA | FBGA - same family | FBGA - same family | FBGA - same technology |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| On-Die ECC | Yes (DDR5 standard) | Yes | Yes | Yes |
| Distributor Stock Signal | Via RFQ | ~33k-48k pcs (Aug/Sep 2026) | Via RFQ | Via RFQ |
Principais diferenciais
- DDR5 generation with on-die ECC (vs H5ANAG8NCJR-XNC (DDR4 die))
- Healthy alternate-grade availability (vs H5CG46AGBDX017N)
- 16Gb density balance (vs H5CG48AGBDX018N (higher density family))
Notas de projeto
DDR5-5600 routing demands strict length matching: keep DQ/DM/DQS traces within a byte lane matched to within the tolerance in the SK Hynix DDR5 design guide, and match address/command (fly-through) nets per group. Maintain solid reference planes under all memory nets, avoid splitting references under DQ routing, and use 3W spacing on critical high-speed nets to control crosstalk. Compute impedance targets (single-ended and differential for CK/DQS) with your stackup tool before routing, not after.
DDR5 runs at a lower VDD/VDDQ than DDR4; check the exact rail values in the H5CG46AGBDX015 datasheet and design the PDN for low impedance across the DC to hundreds of MHz range. Place bulk capacitance near the PMIC/VDD entry and high-frequency ceramics at each DRAM ball group. Estimated: budget per-die VDDQ current as roughly the data-rate-proportional IO current plus termination current; verify against the datasheet IDD specifications for the 5600 speed bin rather than reusing DDR4 figures.
Do not assume suffix interchangeability within the H5CG46AGBDX family: the 015 vs 017N digits encode speed/termination/revision bins. Verify both ordering codes in the SK Hynix ordering-information table before qualifying a substitution, and re-run DDR controller read/write training (and eye-margin characterization) after any memory die change. Also confirm temperature grade - commercial and industrial grades are encoded in the suffix and affect derating at elevated ambient.
Informações de conformidade
Compliance status for this exact MPN was not stated in the provided web data; request compliance certificates (RoHS/REACH declarations) from SK Hynix or the distributor with the RFQ.
