H5CG48AGBDX014N - SK Hynix DDR5 16Gb DRAM Chip
MPN: H5CG48AGBDX014N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $87.42 | $87.42 |
| 10 | $83.05 | $830.50 |
| 100 | $78.68 | $7,868.00 |
| 500 | $74.3 | $37,150.00 |
| 1,000 | $70 | $70,000.00 |
Drop-in alternatives for H5CG48AGBDX014N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5CG48AGBDX014
✅ Drop-In✓ In Stock
$86 / Unit
View Datasheet →H5CG48AGBDX018N
✅ Drop-In✓ In Stock
$87.42 / Unit
View Datasheet →H5CG48AGBDX018
✅ Drop-In✓ In Stock
$70 / Unit
View Datasheet →H5CG48MEBDX014N
✅ Drop-In✓ In Stock
$41.68 / Unit
View Datasheet →H5CG48AGBDX014N Maximum Ratings & Electrical Characteristics
| Manufacturer | SK Hynix |
| Product Type | DDR5 SDRAM |
| Density | 16 Gb (2G x 8) |
| Organization | x8 (2G x 8) |
| Memory Family | DDR5 (H5CG A-die generation) |
| Package | 78-ball FBGA |
| Mounting Type | Surface Mount |
| Interface | DDR5, 2 independent 8-bit sub-channels |
| ECC | On-die ECC (ODE) |
| On-Die Termination | Yes (ODT) |
| Bank Groups | 8 (DDR5 architecture) |
| RoHS Status | unknown |
| Lifecycle Status | Active |
H5CG48AGBDX014N 78-ball fbga Pin Configuration Guide
Complete pinout information for H5CG48AGBDX014N (78-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5CG48AGBDX014N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5CG48AGBDX014N is suitable for 6 applications: Server Main Memory (RDIMM/LRDIMM), Desktop DDR5 UDIMM, Embedded Computing and Industrial Controllers, FPGA-Based Compute and Prototyping Platforms, Networking and Communication Line Cards, Mobile-Adjacent Consumer and Client Devices.
Server Main Memory (RDIMM/LRDIMM)
DDR5 16Gb x8 components like the SK Hynix H5CG48AGBDX014N are the fundamental density building blocks of registered and load-reduced DIMMs for data center servers. The 2G x 8 organization allows 16 chips to populate a 16 GB rank at 64 data bits plus 8 ECC bits, and the DDR5 sub-channel architecture doubles effective concurrent command streams versus DDR4. On-die ECC (ODE) adds an internal correction layer that reduces uncorrected-bit risk across large fleet deployments. Placed on a module behind an SPD hub and PMIC (e.g., a RA88 series PMIC on RDIMMs), the chip runs at the controller-trained data rate; for the 018N sibling that reaches 5600 Mbps, delivering roughly 44.8 GB/s per 64-bit channel. Design trade-off: higher data rates demand stricter PCB length matching and DFE training support in the host CPU memory controller.
Recommended
Desktop DDR5 UDIMM
Consumer and workstation platforms based on Intel Core 12th-gen-and-later or AMD Ryzen 7000-and-later memory controllers use x8 16Gb DDR5 components like the H5CG48AGBDX014N on unbuffered DIMMs. The 78-ball FBGA footprint keeps the same land pattern across A-die and M-die sourcing, allowing module makers to dual-source without PCB respin. The dual 8-bit sub-channels let a desktop controller service two threads with fewer command conflicts, improving average latency in gaming and content-creation workloads. With two of these chips per 32-bit sub-channel group, a standard 16 GB UDIMM is built from sixteen 16Gb components. XMP/EXPO overclock profiles above JEDEC speed bins require the faster 018 variants; the 014 bin is suited to standard JEDEC-profile provisioning where cost and availability take priority.
Recommended
Embedded Computing and Industrial Controllers
Solder-down DDR5 deployments in industrial PCs, edge AI gateways, and networking appliances mount the H5CG48AGBDX014N directly beside the processor or SoC. The x8 organization maps cleanly to 64-bit controllers with ECC, and DDR5's lower 1.1 V-class rail reduces memory subsystem power versus DDR4 at equivalent bandwidth. Industrial benefit comes from the identical 78-ball FBGA footprint across the A-die (AGB) and M-die (MEB) generations: a validated solder stencil, reflow profile, and fly-by CA routing survive die migration and allocation-driven second sourcing without hardware change. Design care is required for length-matched DQ/DQS fly-by topology and VDDQ/VDDCA decoupling (typically 0.1 uF per two balls plus bulk capacitance); confirm operating temperature range from the datasheet for extended-temperature industrial builds.
Recommended
FPGA-Based Compute and Prototyping Platforms
FPGA memory controllers supporting DDR5 use 16Gb x8 components such as the H5CG48AGBDX014N for validation boards and high-bandwidth acceleration cards. DDR5 calibration in modern FPGA hard memory controllers handles CA training, write leveling, and read DQS gate training automatically, and the 78-ball x8 footprint aligns with standard DDR4 x8 FPGA board layouts upgraded for DDR5 routing rules. The dual sub-channel interface can be driven independently, letting one FPGA implement two simple controllers or one dual-channel controller. Practical consideration: FPGA I/O banks must meet DDR5 VDDQ signaling; verify the speed bin (014 vs 5600 Mbps 018) against the FPGA soft/hard PHY timing closure, since the 014 bin relaxes timing budgets for slower PHY implementations. On-die ECC runs transparently without host intervention.
Recommended
Networking and Communication Line Cards
Routers, switches, and 5G infrastructure line cards use soldered DDR5 components like the H5CG48AGBDX014N for packet buffers, flow tables, and control-plane memory. The DDR5 sub-channel architecture provides two independent command streams, which suits the alternating read/write access patterns of packet buffering and reduces turnaround penalties versus DDR4 single-channel operation. x8 organization with on-die ECC protects long-lifetime flow state in carrier-grade systems. The standard 78-ball FBGA footprint permits board-level dual sourcing between the A-die H5CG48AGBDX014N and the pin-identical M-die H5CG48MEBDX014N, a documented mitigation for the DDR5 allocation cycles affecting network OEMs. Verify the 014 speed bin meets line-rate buffering bandwidth (e.g., 4800 MT/s class yields ~38.4 GB/s per 64-bit channel) against your pipeline budget.
Recommended
Mobile-Adjacent Consumer and Client Devices
Client computing, set-top, gaming, and smart-display platforms that adopt socketed or soldered DDR5 main memory use 16Gb x8 DRAM such as the H5CG48AGBDX014N where bandwidth per watt matters more than ultra-low standby power of LPDDR families. The DDR5 1.1 V-class operation and on-die termination reduce idle power, and the standard discrete-DDR5 footprint is compatible with the broad ecosystem of host memory controllers. For designs where the 018 sibling's 5600 Mbps is unnecessary, the 014 speed bin lowers qualification cost while keeping the same PCB footprint, giving product managers an upgrade path to faster bins without respin. Reference designs pair these components with DDR5-qualified PMICs and SPD hubs; confirm suffix-specific JEDEC timing tables from the official SK Hynix datasheet during bring-up.
Recommended
Recommended Products Summary
Engineering reference data for H5CG48AGBDX014N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5CG48AGBDX014 | H5CG48AGBDX018N | H5CG48AGBDX018 | H5CG48MEBDX014N |
|---|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same (identical ballout per cross-ref guide) |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gb (2G x 8) | 16 Gb (2G x 8) | 16 Gb (2G x 8) | 16 Gb (2G x 8) | 16 Gb (2G x 8) |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Data Rate | [DATA_NEEDED] | [DATA_NEEDED] | 5600 Mbps | 5600 Mbps | 4800 MT/s class |
| Die Generation | A-die (AGB) | A-die (AGB) | A-die (AGB) | A-die (AGB) | M-die (MEB) |
| Organization | x8 (2G x 8) | x8 (2G x 8) | x8 (2G x 8) | x8 (2G x 8) | x8 (2G x 8) |
| On-Die ECC | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Lower speed bin reduces cost while keeping identical footprint (vs H5CG48AGBDX018N)
- A-die generation with established ecosystem support (vs H5CG48MEBDX014N)
- Trade-off: not the fastest bin in the family (vs H5CG48AGBDX018N)
Design Notes
DDR5 routing at the H5CG48AGBDX014N speed class requires length-matched fly-by CA routing and tightly matched DQ/DQS groups per nibble. Maintain controlled impedance (40 ohm single-ended for DQ is a common starting point; follow your stackup tool). The dual 8-bit sub-channel architecture means CA and CK routing must serve both sub-channels; verify eye diagrams at the exact data rate bin (014 vs 5600 Mbps 018) with the host controller's DFE/equalization settings. Because the 78-ball FBGA footprint is shared across the A-die and M-die siblings, layout rules validated on one die carry to the other without change.
DDR5 moves the PMIC to the module or board, so plan a dedicated DDR5 PMIC (5 V in to 1.1 V VDD class rails for VDD, VDDQ, VDDCA) with proper sequencing relative to the host. Estimated: a 16Gb x8 DDR5 component draws on the order of 0.5-1 W under sustained traffic at the 4800-5600 Mbps class; budget decoupling of 0.1 uF ceramic per pair of power balls plus local bulk capacitance near the PMIC. These are engineering estimates, not datasheet figures - confirm IDD currents from the SK Hynix datasheet for your specific traffic model and junction temperature target.
The most common DDR5 sourcing pitfall is substituting across speed-grade suffixes without controller validation. H5CG48AGBDX018N (verified 5600 Mbps) and the 014 bin share the identical package and pinout, but a controller trained at the faster bin profile may fail training or violate timing on the slower part. Always re-run memory training and confirm the suffix-specific JEDEC timing table from the official datasheet. Second pitfall: 'N' vs non-N suffixes are packaging-region variants, not electrical variants - do not respin a BOM for the suffix alone; verify availability instead.
Compliance Information
Compliance data not explicitly stated in verified web data. Request SK Hynix Green Data sheet / compliance certificates with RFQ.
