LPC4357JET256 - Dual Cortex-M4/M0 MCU 1MB Flash | NXP
N.º da peça: LPC4357JET256 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.75 | $167,50 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.2 | $6.600,00 |
| 1.000 | $11.85 | $11.850,00 |
LPC4357JET256 Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals onto one die. The LPC4357 belongs to the high-performance tier of microcontrollers, sitting architecturally above single-core Cortex-M parts but below Cortex-A application processors. Within the power-management hierarchy it ranks as a master controller, and within NXP's portfolio it is part of the LPC4300 family, which is positioned for embedded applications requiring mixed signal/digital workloads and rich connectivity.
Key features include dual High-Speed USB 2.0 controllers (one Host/Device/OTG, one Host), a 10/100 Ethernet MAC with MII/RMII, an LCD controller supporting up to 1024x768, an External Memory Controller (EMC) for SDRAM/NOR/NAND, a quad SPI Flash Interface (SPIFI) up to 80 MB/s, two CAN 2.0B ports, an SD/MMC card interface, a State Configurable Timer (SCT), a Serial General Purpose I/O (SGPIO) peripheral, and 164 general-purpose I/O pins. The 16 kB EEPROM with on-the-fly erase/write and a 4 KB ROM bootloader with In-System Programming (ISP) and In-Application Programming (IAP) are particularly valuable for field-upgradable designs.
The dual-core architecture uses an ARM Cortex-M4 with single-precision FPU, DSP/SIMD instructions, and a Nested Vectored Interrupt Controller (NVIC), paired with the Cortex-M0 supporting peripheral scheduling and deterministic interrupt handling. The asynchronous multi-master AHB bus matrix allows both cores to access on-chip memory and peripherals concurrently, enabling deterministic latency even under heavy I/O. According to NXP's product literature, the LPC4357JET256 targets embedded graphics, industrial HMI, and motor control applications.
Typical applications include industrial Human-Machine Interfaces (HMI) with TFT LCD, point-of-sale terminals, factory automation controllers, motor drives and inverter control, smart-grid energy monitors, and embedded audio with USB streaming. Designers choose the LPC4357 when they need more processing headroom than a single-core Cortex-M4 can deliver, without paying for a Cortex-A-class application processor.
When designing with this part, ensure the LBGA256 PCB footprint includes 4 thermal vias under the exposed die paddle to keep junction temperature below 110 °C; pair SPIFI with the high-speed flash part recommended in the user manual for best throughput; and use the on-chip EEPROM for non-volatile parameters that must survive flash reprogramming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the NXP datasheet alone.
Alternativas drop-in para LPC4357JET256 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LPC4357JET256 (mesmo formato e footprint) — diferindo em Core Architecture, Ethernet, External Memory Controller, LCD Controller, Maximum CPU Frequency.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LPC1833JET256
✅ Drop-In✓ Em estoque
$9.72 / unidade
Ver ficha técnica →LPC4357JET256 Classificações máximas e características elétricas
| Core Architecture | Arm Cortex-M4 + Cortex-M0 coprocessor (dual-core) |
| Maximum CPU Frequency | 204 MHz |
| Cortex-M4 Performance | 1.25 DMIPS/MHz with FPU and DSP extensions |
| Program Flash Memory | 1 MB (1M x 8) |
| On-chip SRAM | 136 kB |
| On-chip EEPROM | 16 kB |
| Boot ROM | 4 kB with ISP/IAP |
| Encapsulamento | 256-LBGA (17x17 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| Operating Voltage | 2.4 V to 3.6 V (3.3 V typical) |
| Temperatura de operação | -40 C to +85 C |
| High-Speed USB | 2x USB 2.0 (1x Host/Device/OTG + 1x Host) |
| Ethernet | 10/100 MAC with MII/RMII |
| LCD Controller | Yes (up to 1024x768) |
| External Memory Controller | Yes (EMC, SDRAM/NOR/NAND) |
| Quad SPI (SPIFI) | Yes (up to 80 MB/s) |
| CAN | 2x CAN 2.0B |
| GPIO Count | 164 pins |
| Status RoHS | Compliant |
Configuração de pinos do LPC4357JET256
| Pino A1 | VDD — Core supply voltage 3.3 V |
| Pino B1 | VSS — Ground |
| Pino C5 | P0_0 — GPIO / CAN1 RD |
| Pino D4 | P0_1 — GPIO / CAN1 TD |
| Pino E3 | P1_0 — GPIO / USB1 VBUS |
| Pino F2 | P1_1 — GPIO / USB1 DP |
| Pino G1 | P1_2 — GPIO / USB1 DM |
| Pino H4 | P2_0 — GPIO / PWM0[1] |
| Pino K3 | P3_0 — GPIO / LCD VD[0] |
| Pino L2 | P4_0 — GPIO / ENET MDIO |
| Pino M1 | P5_0 — GPIO / EMC D0 |
| Pino N5 | P6_0 — GPIO / SPIFI CS |
| Pino P4 | P7_0 — GPIO / I2C0 SCL |
| Pino R3 | P8_0 — GPIO / SGPIO0 |
| Pino T2 | P9_0 — GPIO / UART0 TX |
Aplicações típicas
LPC4357JET256 é adequado para 6 aplicaçãos: Industrial HMI with TFT LCD, Point-of-Sale Terminal, Motor Control and Inverter Drive, Smart Energy Meter, Industrial Gateway and Protocol Bridge, Embedded Audio with USB Streaming.
Industrial HMI with TFT LCD
The LPC4357JET256's 204 MHz Cortex-M4 with FPU drives TFT LCD panels up to 1024x768 via the on-chip LCD controller, while 136 kB SRAM caches graphics primitives and 1 MB flash stores UI assets. Dual-core offload lets the M0 refresh widgets while the M4 handles touch-screen gestures. Place the device near the LCD connector and route RGB lines with impedance-matched traces under 100 mm.
Recomendado
Point-of-Sale Terminal
Dual High-Speed USB 2.0 ports support magnetic-stripe readers and external peripherals while the 10/100 Ethernet MAC connects to backend servers. The on-chip EEPROM stores encryption keys and transaction counters across power cycles, and the SPIFI interface boots firmware from high-speed quad-SPI flash. Use hardware AES via the M0 coprocessor for sub-millisecond card data encryption.
Recomendado
Motor Control and Inverter Drive
The State Configurable Timer (SCT) generates complementary PWM outputs with hardware dead-time insertion for three-phase motor drives, while the Cortex-M4 FPU executes field-oriented control loops in under 5 microseconds. Dual CAN 2.0B ports interface to industrial fieldbus networks, and 16 kB EEPROM stores motor calibration constants. Add external gate drivers on PWM outputs rated for 600 V+ bus.
Recomendado
Smart Energy Meter
The Cortex-M4's DSP extensions compute RMS and harmonic analysis on metrology data while the 16 kB EEPROM retains calibration coefficients and tamper logs across power outages. Ethernet MAC drives remote meter-reading, and dual CAN ports support local grid communication. Use the M0 coprocessor to offload metrology sampling, freeing the M4 for display and protocol stack duties.
Recomendado
Industrial Gateway and Protocol Bridge
The LPC4357JET256's EMC interface attaches SDRAM for protocol buffering while dual CAN, Ethernet, USB, and UART peripherals translate between industrial fieldbus protocols. The SPIFI interface boots from encrypted external flash, and the 1 MB firmware budget supports multi-stack networking. Use the SCT for hardware timestamp synchronization across protocol bridges.
Recomendado
Embedded Audio with USB Streaming
USB Host mode interfaces to external audio peripherals while the Cortex-M4 DSP extensions decode audio codecs in real time. The 16 kB EEPROM stores user presets and equalizer settings, and 136 kB SRAM buffers streaming packets. Pair the LPC4357JET256 with an external I2S codec via the on-chip I2S peripheral for 24-bit/192 kHz playback chains.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LPC4357JET256 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LPC4357FET256 | LPC4330FET256 | LPC4330FBD144 | LPC1833JET256 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LBGA256 (17x17) | LQFP-256 (FET, not BGA) | LQFP-256 (FET, not BGA) | LQFP-144 (FBD, not BGA) | LBGA256 (same, JET) |
| Core Architecture | Dual Cortex-M4/M0 | Dual Cortex-M4/M0 | Dual Cortex-M4/M0 | Dual Cortex-M4/M0 | Single Cortex-M3 |
| Maximum Frequency | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 180 MHz |
| Flash Memory | 1 MB | 1 MB | 512 kB | 512 kB | 512 kB |
| SRAM | 136 kB | 136 kB | 72 kB | 72 kB | 136 kB |
| On-chip EEPROM | 16 kB | 16 kB | None | None | 16 kB |
| LCD Controller | Yes (1024x768) | Yes (1024x768) | Yes (1024x768) | Yes | Yes (1024x768) |
Principais diferenciais
- Dual-core M4/M0 with on-chip EEPROM (vs LPC1833JET256)
- Larger flash and SRAM (vs LPC4330FET256)
- LBGA256 package with same pinout across family (vs LPC4330FBD144)
Notas de projeto
The LPC4357JET256 in LBGA256 can dissipate up to approximately 1.5 W under full CPU and peripheral load at 204 MHz. Estimated junction temperature rise above ambient: T_rise = P * theta_JA = 1.5 W * 25 C/W (4-layer PCB with thermal vias) = 37.5 C. Engineers must place a thermal via array under the die paddle (4 to 9 vias minimum) and connect to the inner ground plane to maintain junction temperature below 110 C at 85 C ambient.
For LBGA256 routing, use 4-layer PCB with 1 oz copper and 0.8 mm via pitch fan-outs under the BGA. Match USB differential pair impedance to 90 ohms and Ethernet differential pairs to 100 ohms. Place 100 nF decoupling capacitors within 2 mm of every VDD pin and 4.7 uF bulk capacitors at the board entry points. The exposed die paddle MUST be soldered to the ground plane for thermal and electrical performance.
Common pitfalls with LPC4357JET256: (1) Failing to enable the Cortex-M0 coprocessor boot sequence before launching application code on M4; (2) Exceeding the 3.6 V absolute-max VDD supply; (3) Forgetting to add external pull-ups on I2C lines when used in multi-master configurations; (4) Misallocating GPIO muxing on peripheral pins leading to bus contention. Always consult the user manual UM10503 for the full pin-multiplexing matrix.
Informações de conformidade
Compliant with EU RoHS Directive 2011/65/EU per NXP product page. Industrial-grade operating temperature (-40 C to +85 C), not automotive AEC-Q100 qualified.
