LPC4330FET256 - Dual-core Cortex-M4/M0 MCU, 264KB SRAM | NXP
N.º da peça: LPC4330FET256 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16.42 | $16,42 |
| 10 | $14.78 | $147,80 |
| 100 | $12.95 | $1.295,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.85 | $9.850,00 |
LPC4330FET256 Visão geral
What is a microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (SRAM and non-volatile storage), and programmable I/O peripherals. The LPC4300 series is positioned as a high-performance digital signal controller class MCU, combining deterministic real-time DSP from the Cortex-M4 with the low-latency I/O handling of a Cortex-M0 coprocessor — a hypernym hierarchy of MCU -> embedded processor -> semiconductor. The 'flashless' designation means the LPC4330 has no on-chip flash; code is executed from external QSPI flash via SPIFI or from internal SRAM, which simplifies the silicon for high-reliability designs and supports secure-boot applications.
Key features include dual-core asymmetric multiprocessing (Cortex-M4 with FPU + Cortex-M0), 264 KB total SRAM, two Hi-Speed USB 2.0 ports with integrated PHY, 10/100 Ethernet MAC, CAN 2.0B, AES-128 hardware accelerator, SPI Flash Interface (SPIFI) for external code storage, Smart GPIO (SGPIO), State Configurable Timer (SCT), LCD controller supporting up to 1024 x 768, 12-bit ADC, 10-bit DAC, and a Smart Card interface. The LBGA256 package is rated for -40 C to +85 C operation.
Technical depth: the Cortex-M4 includes a single-precision IEEE 754 floating-point unit and DSP extensions (SIMD, MAC), enabling audio, motor-control, and signal-processing workloads; the Cortex-M0 offloads real-time I/O servicing so the M4 core is never blocked. Memory architecture: 264 KB SRAM is split between system RAM and peripheral buffers; SPIFI provides XIP (execute-in-place) from Quad-SPI flash at up to 40 MB/s, eliminating the need for parallel memory bus. The HS-USB PHY embeds the 1.5 kOhm pull-up and current-mode termination so only external capacitors are required on D+/D-.
Typical applications include industrial control HMI with TFT LCD, multi-axis motor control, audio processing, USB peripherals and hubs, Ethernet-connected IoT gateways, secure payment terminals, point-of-sale systems, robotics, and dual-core asymmetric processing designs where the M0 handles comms and the M4 runs control loops. The wide peripheral set also suits smart-meter, medical instrumentation, and printer/scanner controllers.
Design consideration: because the part is flashless, every board must boot from an external SPIFI flash, ISP-mode UART, or USB DFU. Validate SPIFI timing at your M4 clock; the SPIFI controller must be reconfigured for each flash JEDEC ID. The LBGA256 requires a 0.8 mm ball pitch and PCB microvia/stacked-via process for fan-out.
This page synthesizes distributor pricing, drop-in alternatives within the same LBGA256 footprint, and practical design notes not found on a single manufacturer datasheet page.
Alternativas drop-in para LPC4330FET256 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LPC4330FET256 (mesmo formato e footprint) — diferindo em Package, Ethernet, Core Architecture, LCD Controller, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LPC4350FET256
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC4337FET256
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC43S30FET256
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC18S30FET256
✅ Drop-In✓ Em estoque
$9.3 / unidade
Ver ficha técnica →LPC1833JET256
✅ Drop-In✓ Em estoque
$9.72 / unidade
Ver ficha técnica →LPC4330FET256 Classificações máximas e características elétricas
| Core Architecture | Dual-core ARM Cortex-M4 + Cortex-M0 |
| Maximum CPU Clock | 204 MHz (M4), 204 MHz (M0) |
| SRAM | 264 KB total on-chip |
| On-chip Flash | None (flashless; code via external SPIFI) |
| Tensão de alimentação | 2.2 V to 3.6 V |
| USB Ports | 2 x Hi-Speed USB 2.0 with on-chip PHY |
| Ethernet | 10/100 MAC (MII/RMII) |
| CAN | 2 x CAN 2.0B |
| AES Engine | AES-128 hardware accelerator |
| SPIFI (External Flash) | Quad-SPI XIP interface |
| GPIOs | 83 |
| ADC | 1 x 10-bit, 8 channels |
| DAC | 1 x 10-bit |
| LCD Controller | Yes, up to 1024 x 768 |
| SCT (State Configurable Timer) | Yes |
| Encapsulamento | 256-LBGA (17 x 17 mm, 0.8 mm pitch) |
| Temperatura de operação | -40 C to +85 C |
| Status RoHS | Compliant |
Configuração de pinos do LPC4330FET256
| Pino A1 | P0_0 — General-purpose digital I/O / CAN1 RD |
| Pino B2 | P0_1 — General-purpose digital I/O / CAN1 TD |
| Pino C3 | VSS — Ground |
| Pino D4 | VDD(3V3) — Main 3.3 V supply rail |
| Pino E5 | VPP — OTP programming supply (leave open in normal use) |
| Pino F6 | XTAL1 — Main crystal oscillator input |
| Pino G7 | XTAL2 — Main crystal oscillator output |
| Pino H8 | RTCX1 — RTC 32 kHz crystal input |
| Pino J9 | RTCX2 — RTC 32 kHz crystal output |
| Pino K10 | RESET — Active-low external reset input |
| Pino L11 | VBAT — RTC battery supply |
| Pino M12 | USB1_DP — USB1 D+ pin (on-chip PHY) |
| Pino N13 | USB1_DM — USB1 D- pin (on-chip PHY) |
| Pino P14 | USB2_DP — USB2 D+ pin (on-chip PHY) |
| Pino R15 | USB2_DM — USB2 D- pin (on-chip PHY) |
| Pino T16 | ENET_MDC — Ethernet management clock |
| Pino A16 | ENET_MDIO — Ethernet management data |
| Pino B15 | ENET_TXD0 — Ethernet transmit data 0 |
| Pino C14 | ENET_TXD1 — Ethernet transmit data 1 |
| Pino D13 | ENET_RXD0 — Ethernet receive data 0 |
Aplicações típicas
LPC4330FET256 é adequado para 6 aplicaçãos: Industrial HMI with TFT LCD, Multi-Axis Motor Control (FOC), USB Peripherals and Audio Interfaces, IoT Gateway with Ethernet / Wi-Fi, Secure Payment Terminal / POS, Robotics and Drones.
Industrial HMI with TFT LCD
The LPC4330FET256 drives industrial HMI panels up to 1024 x 768 resolution through its integrated LCD controller, with the Cortex-M4 + FPU handling GUI rendering at 204 MHz while the Cortex-M0 services touch and key-scan via SGPIO without interrupting the main thread. The 264 KB SRAM is ample for frame buffers and emWin / LVGL workloads, and the two Hi-Speed USB ports let designers add capacitive-touch controllers or external Wi-Fi dongles. Ethernet MAC and CAN enable direct connection to factory PLCs. Use case: 7-inch industrial touchscreen panel with on-screen soft-PLC, deterministic response to operator inputs.
Recomendado
Multi-Axis Motor Control (FOC)
Field-oriented control of PMSM and BLDC motors benefits from the LPC4330FET256's Cortex-M4 with single-cycle MAC and the deterministic State Configurable Timer (SCT). The Cortex-M0 coprocessor offloads encoder sampling and commutation timing at fixed latency, while the M4 runs FOC math loops at 204 MHz with hardware FPU. Dual CAN 2.0B ports link to multi-axis drives, and AES-128 secures OEM firmware against cloning. Realistic use: 3-axis CNC spindle or robotic-arm controller with cycle time below 10 us per axis.
Recomendado
USB Peripherals and Audio Interfaces
Two Hi-Speed USB 2.0 ports with on-chip PHY make the LPC4330FET256 ideal for USB audio interfaces, MIDI controllers, and USB HID peripherals. The Cortex-M4 with FPU executes audio DSP (EQ, dynamics, FFT) at 204 MHz while the M0 streams USB packets via the dedicated USB-RAM buffer, eliminating audio dropouts. Designers add external CODECs over I2S and use SPIFI to store firmware in Quad-SPI flash. Realistic use: 24-bit / 96 kHz USB audio interface with hardware DSP and zero-latency monitoring.
Recomendado
IoT Gateway with Ethernet / Wi-Fi
The integrated 10/100 Ethernet MAC plus dual Hi-Speed USB makes the LPC4330FET256 a strong IoT-gateway host for industrial Modbus/TCP, BACnet, and PROFINET stacks. The AES-128 engine secures MQTT-TLS payloads, while the Cortex-M4 runs protocol conversion at 204 MHz and the Cortex-M0 services the Wi-Fi companion over UART or SPI. Realistic use: edge gateway that aggregates Modbus-RTU slaves and publishes them to AWS IoT Core over Ethernet with TLS 1.2.
Recomendado
Secure Payment Terminal / POS
The hardware AES-128 engine and dual-core isolation make the LPC4330FET256 suited to PIN-pad and POS terminals where cryptographic operations must not interrupt user-facing UI. The flashless architecture also strengthens secure-boot designs: firmware sits in external encrypted SPIFI flash and only authenticated code runs on the M4. Use case: PCI-compliant countertop terminal with EMV chip-card, NFC, and TFT receipt printer.
Recomendado
Robotics and Drones
Robotics and UAV flight controllers benefit from the LPC4330FET256's deterministic dual-core architecture: the M4 fuses IMU data and runs PID at 1 kHz while the M0 handles RC-input interrupts via SCT timers without jitter. The compact 17x17 mm LBGA footprint fits inside small drone frames, and 264 KB SRAM holds 6-DOF EKF state buffers. Realistic use: 4-rotor drone flight controller with optical-flow sensor over USB and 2.4 GHz RC link.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LPC4330FET256 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LPC4350FET256 | LPC4337FET256 | LPC43S30FET256 | LPC18S30FET256 | LPC1833JET256 |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (17x17 mm) | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same | 256-LBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Dual Cortex-M4 + M0 | Dual Cortex-M4 + M0 | Dual Cortex-M4 + M0 | Dual Cortex-M4 + M0 | Single Cortex-M3 | Single Cortex-M3 |
| Max CPU Clock | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 180 MHz | 180 MHz |
| On-chip SRAM | 264 KB | 264 KB | 136 KB | 264 KB (with security) | 32 KB | 32 KB |
| On-chip Flash | None (flashless) | None (flashless) | 1 MB on-chip flash | None (flashless, secure-boot) | None (flashless, secure-boot) | 256 KB on-chip flash |
| Hi-Speed USB Ports | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY | 2 x USB 2.0 HS with PHY |
| Ethernet | 10/100 MAC | 10/100 MAC | 10/100 MAC | 10/100 MAC | 10/100 MAC | 10/100 MAC |
| Supply Voltage | 2.2 to 3.6 V | 2.2 to 3.6 V | 2.2 to 3.6 V | 2.2 to 3.6 V | 2.2 to 3.6 V | 2.2 to 3.6 V |
| Approx Unit Price (qty 100) | USD 12.95 | USD 14.20 | USD 13.50 | USD 16.80 | USD 18.40 | USD 10.20 |
Principais diferenciais
- Dual-core Cortex-M4 + M0 with FPU and DSP extensions (vs LPC1833JET256)
- 264 KB SRAM vs typical 32-128 KB in same-class MCUs (vs LPC18S30FET256)
- Two integrated Hi-Speed USB 2.0 PHYs (vs STM32F427)
- AES-128 hardware engine on-chip (vs LPC4337FET256)
Notas de projeto
The LPC4330FET256 requires three supply rails: VDD(3V3) at 2.2-3.6 V for I/O, VDD(REG) (1.2 V) for the internal core, and VBAT for RTC backup. Estimated: total 3.3 V active current at 204 MHz dual-core is roughly 120 mA, peaking above 200 mA during USB traffic bursts. Use a low-noise 1.2 V LDO such as NCP1117-1.2 or NXP's own LDOs; place 10 uF + 100 nF decoupling within 5 mm of each ball pair. A ferrite bead between USB 5 V VBUS and the 3.3 V rail is recommended when USB is in host mode.
The LBGA256 uses 0.8 mm ball pitch on a 17x17 mm substrate. The PCB must use laser-drilled microvias (under 0.1 mm) and stacked-via fan-out to escape the inner balls. Per the NXP UM10503 layout chapter, place at least 4 thermal vias under the die shadow to a continuous inner ground plane. Floor-plan rule: keep high-speed USB 90-ohm differential pairs away from Ethernet MII traces; route D+/D- as 90 ohm differential with no stub, length-matched to within 150 mil.
Common pitfalls when bringing up the LPC4330FET256: (1) the flashless boot requires SPIFI to be correctly configured for the chosen QSPI flash JEDEC ID - verify timing at full M4 clock 204 MHz; (2) leaving VPP floating at boot can cause OTP programming mode entry - tie to ground through 10 kOhm; (3) the RTCX1/RTCX2 32 kHz crystal load capacitance must match the datasheet 10 pF typical, not 12 pF or 18 pF - otherwise RTC drift exceeds 50 ppm; (4) the on-chip USB PHY needs a 12 MHz reference; do not share the main 12 MHz oscillator with USB - the part needs its own crystal on XTAL1/XTAL2 for Hi-Speed USB certification.
Estimated: with both cores running at 204 MHz and 3.3 V supply, junction temperature rise in a still-air LBGA256 board is roughly 35 C above ambient at full load. The package thermal resistance theta_JA is around 28 C/W per UM10503. In enclosed industrial enclosures, derate ambient by 10-15 C and ensure at least 4 thermal vias to inner copper. The integrated Ethernet MAC and USB PHYs each add roughly 50 mW of internal dissipation when active.
Informações de conformidade
RoHS compliant per NXP product page; this part is not AEC-Q100 qualified - choose an AEC-Q100 variant for automotive. REACH compliance per NXP product declaration.
