LPC5526JBD64K - 150MHz Cortex-M33 MCU, 256KB Flash | NXP
N.º da peça: LPC5526JBD64K ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.4 | $5,40 |
| 10 | $4.86 | $48,60 |
| 100 | $4.32 | $432,00 |
| 500 | $3.9 | $1.950,00 |
| 1.000 | $3.52 | $3.520,00 |
LPC5526JBD64K Visão geral
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals into one chip, forming the lowest tier of the embedded processing hierarchy: MCU -> microcontroller -> embedded processor -> semiconductor device. MCUs execute dedicated control tasks in electronic systems, and the LPC552x family extends this role with hardware-based security and dual-core scalability.
Key features of the LPC5526JBD64K include the Arm Cortex-M33 core (r0p3) with a Memory Protection Unit (MPU) and built-in Nested Vectored Interrupt Controller (NVIC), a non-maskable interrupt (NMI) input with selectable sources, and a FlexComm serial interface architecture that lets each instance be configured as UART, SPI, or I2C. The family datasheet also documents CASPER cryptographic co-processor support, USB high-speed, SDIO, SCTimer/PWM, a Programmable Logic Unit (PLU), and a 16-bit 1.0 Msamples/sec ADC across the LPC552x/S2x series.
Technical depth comes from the 40-nm process node, which lowers cost per function while the Cortex-M33 with TrustZone-class security features addresses modern IoT security requirements. The PLU allows logic customization without an FPGA, and the FlexComm structure reduces external glue logic.
Typical applications include industrial control nodes, IoT edge devices requiring secure connectivity, and consumer appliances needing motor control, USB connectivity, and analog sensing. The 1.0 Msps ADC and SCTimer/PWM directly serve these use cases.
A key design consideration: the 64-pin HTQFP with exposed pad requires a well-designed thermal and ground land pattern on the PCB for reliable power delivery and signal integrity at 150 MHz.
This page synthesizes distributor pricing, drop-in family alternatives, and design guidance not found in the manufacturer datasheet.
Alternativas drop-in para LPC5526JBD64K — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LPC5526JBD64K (mesmo formato e footprint) — diferindo em Package, Flash Memory, Core Processor, Interrupt Controller, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LPC55S26JBD64
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LPC5528JBD64K
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.3 / unidade
Ver ficha técnica →LPC55S28JBD64K
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.6 / unidade
Ver ficha técnica →LPC5516JBD64K
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LPC55S16JBD64K
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LPC5526JBD64K Classificações máximas e características elétricas
| Core Processor | Arm Cortex-M33 (r0p3) |
| Core Size | 32-Bit |
| Frequência máxima de clock | 150 MHz |
| Flash Memory | 256 KB (256K x 8) |
| Tensão de alimentação | 3.3 V |
| Encapsulamento | 64-HTQFP (10x10 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Memory Protection Unit (MPU) | Yes |
| Interrupt Controller | NVIC (Nested Vectored Interrupt Controller) |
| NMI Input | Yes, with selectable sources |
| Serial Interfaces | FlexComm (UART/SPI/I2C), USB HS, SDIO (family features) |
| ADC | 16-bit, 1.0 Msamples/sec (family feature) |
| Timer/Counter | 32-bit counter/timers, SCTimer/PWM (family feature) |
| Logic Expansion | Programmable Logic Unit (PLU) (family feature) |
| Process Technology | 40-nm NVM |
| Status do ciclo de vida | Active |
Guia de Configuração de Pinos do LPC5526JBD64K 64-htqfp (10x10 mm) with exposed pad
Configuração de pinos para LPC5526JBD64K (pacote 64-htqfp (10x10 mm) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LPC5526JBD64K.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LPC5526JBD64K é adequado para 6 aplicaçãos: Industrial Control Nodes, IoT Edge Devices with Security, Consumer Appliance Motor Control, USB Peripheral Products, Portable Data Acquisition, Smart Home and Building Automation.
Industrial Control Nodes
The LPC5526JBD64K fits industrial control nodes because its 150 MHz Cortex-M33 core delivers the deterministic headroom needed for PLC I/O scanning, sensor fusion, and closed-loop control, while the SCTimer/PWM supports precise PWM generation for actuators and motor drivers. Its FlexComm serial architecture provides multiple UART/SPI/I2C ports to talk to sensors, industrial transceivers, and HMI panels without external glue logic. The 64-pin HTQFP package offers enough GPIO count for relay drivers, limit switches, and status LEDs on a single controller. The exposed-pad package aids thermal dissipation in enclosed control cabinets, and the 16-bit 1.0 Msps ADC (family feature) handles analog sensor inputs such as 4-20 mA conditioned signals directly.
Recomendado
IoT Edge Devices with Security
For IoT edge nodes, the LPC5526JBD64K combines a 150 MHz Cortex-M33 with TrustZone-class security architecture on a 40-nm process, enabling encrypted communication and protected firmware on cost-sensitive connected devices. The family's CASPER cryptographic co-processor support accelerates public-key operations, and the LPC55S26 secure sibling allows a security-upgrade path on the identical footprint. USB high-speed and FlexComm interfaces connect to cellular, Wi-Fi, or Ethernet modules, while the PLU implements custom glue logic in hardware, reducing the external component count. The 256 KB flash accommodates TLS stacks and OTA bootloader schemes; teams needing larger images can populate the pin-compatible LPC5528JBD64K without a PCB change.
Recomendado
Consumer Appliance Motor Control
In appliances such as fans, pumps, and small drives, the LPC5526JBD64K's SCTimer/PWM generates the complementary PWM waveforms required for BLDC and PMSM control, while the 150 MHz core executes FOC (field-oriented control) math with ample cycle margin. The 16-bit 1.0 Msamples/sec ADC (family feature) samples phase currents and bus voltage for closed-loop current control at the rates these algorithms need. FlexComm ports interface to Hall sensors, encoders, or UART-based capacitive touch controllers, and the 64-pin HTQFP package supplies the GPIO count for user interfaces and protection inputs such as over-temperature and over-current latching. The exposed pad simplifies thermal design inside sealed appliance housings.
Recomendado
USB Peripheral Products
The LPC5526JBD64K suits USB peripherals because the LPC552x family integrates a high-speed USB controller, letting the 150 MHz Cortex-M33 sustain bulk and isochronous transfers without a dedicated USB bridge chip. Typical products include data-acquisition dongles, debug probes, and human-interface devices where the 1.0 Msps 16-bit ADC streams sensor data over USB. FlexComm ports manage auxiliary SPI/I2C devices such as external flash or sensors, and the PLU can implement trigger logic in hardware with microsecond latency. Designers should plan the PCB land pattern for the exposed-pad 64-HTQFP to maintain signal integrity on the high-speed USB pair, keeping stubs short and reference planes continuous under the differential routing.
Recomendado
Portable Data Acquisition
Battery-powered data loggers benefit from the LPC5526JBD64K's combination of a 16-bit 1.0 Msamples/sec ADC (family feature), 150 MHz processing for real-time digital filtering, and a single 3.3 V supply that simplifies power tree design. FlexComm channels capture data from SPI/I2C sensors while the internal flash stores configuration and calibration constants; external SPI flash such as the W25Q128 family extends logging capacity. The PLU offloads threshold detection so the core can sleep between events, reducing average current. The 64-pin HTQFP 10x10 mm package balances GPIO availability for multiplexed analog front-ends against a footprint that still fits compact handheld enclosures, and the exposed pad supports heat spreading under continuous acquisition loads.
Recomendado
Smart Home and Building Automation
Smart home controllers, thermostats, and building sensor hubs use the LPC5526JBD64K for its 150 MHz Cortex-M33 that runs communication stacks (wireless module AT handling via FlexComm UART, and wired buses via SPI/I2C) alongside local control logic. The hardware security features address growing requirements for device authentication and encrypted firmware updates in connected building products. The 64-pin HTQFP provides enough GPIO to drive displays, keypads, and multiple relay or dimmer outputs, while the 16-bit ADC reads temperature, humidity, and current sensors directly. Designers targeting certified installations often select the pin-compatible LPC55S26JBD64K secure variant to satisfy root-of-trust provisioning without any PCB redesign.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LPC5526JBD64K — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LPC55S26JBD64 | LPC5528JBD64K | LPC55S28JBD64K | LPC5516JBD64K |
|---|---|---|---|---|---|
| Package | 64-HTQFP (10x10 mm) EP | 64-HTQFP (10x10 mm) EP - same | 64-HTQFP (10x10 mm) EP - same | 64-HTQFP (10x10 mm) EP - same | 64-HTQFP (10x10 mm) EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Frequency | Arm Cortex-M33, 150 MHz | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz |
| Flash Memory | 256 KB | 256 KB | Larger than 256 KB (LPC5528 tier) | Larger than 256 KB (LPC5528 tier) | Smaller tier than 256 KB |
| Security Features | Standard (Cortex-M33 security architecture) | Enhanced secure variant (S-series) | Standard | Enhanced secure variant (S-series) | Standard |
| Family Pin/Software Compatibility | Yes (LPC552x/S2x) | Yes - pin-, software-, peripheral-compatible | Yes - pin-, software-, peripheral-compatible | Yes - pin-, software-, peripheral-compatible | Yes - pin-compatible, verify peripheral set |
| Lifecycle Status | Active | Active | Active | Active | Active |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Principais diferenciais
- Balanced memory/cost point in the LPC55xx family (vs LPC5528JBD64K)
- Security-upgrade path without redesign (vs LPC55S26JBD64)
- Cortex-M33 security architecture at mainstream MCU cost (vs LPC5516JBD64K)
Notas de projeto
The LPC5526JBD64K comes in a 64-pin HTQFP 10x10 mm with exposed pad. Solder the exposed pad to a grounded copper pour with an array of thermal vias - this is both the primary ground return and the thermal path for the die. Follow NXP's recommended land pattern for HTQFP-64: use 0.5 mm pitch fan-out with controlled trace widths, and keep the decoupling network (100 nF ceramic per supply pin plus bulk capacitance) within a few millimeters of the supply balls to minimize loop inductance at 150 MHz switching speeds.
The LPC552x family operates from a 3.3 V supply with internal LDO-based core regulation (per the family datasheet architecture). Budget the 3.3 V rail for the MCU plus attached peripherals and follow the datasheet power-up sequencing/reset guidance: hold reset until the supply is stable, and use the on-chip bootloader or a supervisor if your supply ramps slowly. When migrating from other 5 V-tolerant MCUs, note Cortex-M33 LPC55xx IO are not 5 V tolerant - add level shifting on 5 V signal interfaces.
If using the USB high-speed interface (family feature), route the D+/D- pair as a 90-ohm differential with length matching and a continuous reference plane; keep the pair away from the 150 MHz clock traces and switching regulator nodes. Assign FlexComm pins using the datasheet pin mux table early in layout to avoid last-minute rework - several FlexComm instances share pins on the 64-pin package, so pin budget conflicts are a common pitfall on this package size.
Informações de conformidade
Compliance details are listed under the 'Environmental Quality' section of the NXP LPC5526JBD64 product page; exact RoHS/REACH statuses were not stated in the retrieved data and must be confirmed from NXP.
