MAX189BC/D - 12-Bit SAR ADC, Serial, 75ksps | Maxim Integrated
N.º da peça: MAX189BC/D ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.95 | $89,50 |
| 100 | $7.4 | $740,00 |
| 500 | $6.1 | $3.050,00 |
| 1.000 | $5.2 | $5.200,00 |
MAX189BC/D Visão geral
A SAR ADC (Successive Approximation Register Analog-to-Digital Converter) is a type of ADC that converts an analog input to a digital output using a binary-search algorithm against an internal DAC. SAR ADCs balance conversion speed, power consumption, and resolution, making them the workhorse of medium-speed data-acquisition applications such as industrial sensors, handheld instruments, and process-control front-ends. In the broader IC taxonomy, an SAR ADC sits under Data Converters -> ADCs -> Medium-Speed ADCs -> Power-Efficient ADCs.
Key features of the MAX189BC/D include +/- 1/2 LSB integral nonlinearity (INL), a fast 1.5-microsecond acquisition-time track/hold, an internal 4.096V reference that can also drive external loads, a hardware- or software-controllable shutdown mode that drops supply current to 2 microamps, and 1.5 mA operating current. The serial interface is compatible with SPI, QSPI, and MICROWIRE, easing connection to most modern microcontrollers and DSPs without external glue logic.
The MAX189BC/D's architecture uses a capacitive-charge-distribution DAC at its core, with a precision comparator and SAR logic, plus an integrated reference and reference buffer. The "C" speed grade and "B" resolution grade (with +/- 1 LSB INL vs. the A grade +/- 1/2 LSB) make the BC variant an attractive cost-optimized option. The bare-die format allows hybrid-module integrators and MCM (multi-chip-module) designers to minimize parasitic inductance and shrink board area beyond what packaged parts permit.
Typical applications include portable data loggers, pen-tablet digitizers, battery-powered instrumentation, isolated sensor read-out stages, and industrial process-control front-ends. The combination of a single +5V supply, low power, and serial output suits distributed measurement nodes and space-constrained designs.
When designing with the MAX189BC/D, provide a clean analog ground plane separate from the noisy digital return, bypass VDD with a 0.1 microfarat ceramic close to each die supply bond, and use the SHDN pin for duty-cycling to extend battery life. The internal reference can source up to several hundred microamps; if your design also needs a reference for external ADCs, budget that current draw into the worst-case accuracy calculation.
This page synthesizes distributor pricing, pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para MAX189BC/D — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MAX189BC/D (mesmo formato e footprint) — diferindo em Conversion Time, Sampling Rate, Supply Voltage, Temperature Grade, Track/Hold Acquisition Time.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasMAX189BC/D Classificações máximas e características elétricas
| Resolução | 12 bits |
| Number of Inputs | 1 single-ended |
| Conversion Type | SAR (Successive Approximation) |
| Faixa de tensão de entrada | 0 V to 5 V |
| Tensão de alimentação | +5 V (single supply) |
| Taxa de amostragem | 75 ksps maximum |
| Conversion Time | 8.5 us (typ) |
| Track/Hold Acquisition Time | 1.5 us (typ) |
| Internal Reference Voltage | 4.096 V (buffered) |
| Integral Nonlinearity (INL) | +/- 1 LSB (B grade) |
| Operating Current (active) | 1.5 mA (typ) |
| Corrente de desligamento | 2 uA (typ) |
| Serial Interface | SPI/QSPI/MICROWIRE-compatible, 3-wire |
| Encapsulamento | Die (unpackaged bare die) |
| Temperature Grade | Commercial |
Guia de Configuração de Pinos do MAX189BC/D die (unpackaged bare die)
Configuração de pinos para MAX189BC/D (pacote die (unpackaged bare die)). Este componente analógico possui pinos de entrada, saída e alimentação. Consulte o datasheet do fabricante para configurações de offset null, compensação e pino de enable. Ideal para circuitos de condicionamento de sinal e amplificadores.
Nenhum dado detalhado de pinagem disponível para MAX189BC/D.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MAX189BC/D é adequado para 7 aplicaçãos: Portable Data Loggers, Battery-Powered Instrumentation, Industrial Process Control Front-Ends, Pen-Tablet Digitizers and Touch Sensing, Isolated Sensor Read-Out Stages, Hybrid Module and MCM Designs, Handheld Test and Measurement.
Portable Data Loggers
The MAX189BC/D fits portable data loggers because it draws only 1.5 mA in active mode and falls to 2 uA in hardware shutdown, extending battery life across multi-week acquisition campaigns. Its 12-bit resolution and 75 ksps throughput comfortably digitize slow-channel thermocouples, strain gauges, and 4-20 mA current loops used in field instrumentation. The internal 4.096V reference removes one or two external components, shrinking BOM cost for high-volume handheld units, while the SPI output saves microcontroller GPIO pins that are often scarce in compact logger designs.
Recomendado
Battery-Powered Instrumentation
The MAX189BC/D is well matched to battery-powered digital multimeters, clamp meters, and isolated sensor read-out boards where the +5V rail is generated by a boost converter from a 3V cell. The part's 8.5 microsecond conversion time and 1.5 microsecond acquisition support rapid autoranging without inducing audible noise on the analog front-end. Duty-cycling via the SHDN pin lets the system sleep at 2 microamps between conversions, a critical capability for handheld instruments that must last months on a single AA cell.
Recomendado
Industrial Process Control Front-Ends
Process-control analog front-ends that read 4-20 mA current loops or 0-5 V sensor outputs benefit from the MAX189BC/D's integral +/- 1 LSB linearity and 75 ksps throughput, which provides enough headroom for multiplexed multi-channel scanning. The integrated 4.096V reference removes the need for an external reference and saves panel space inside DIN-rail mounted controllers. The 3-wire SPI output cleanly interfaces to industrial MCUs such as the MAXQ or ARM Cortex-M families, enabling deterministic register reads under RTOS control without parallel-bus loading.
Recomendado
Pen-Tablet Digitizers and Touch Sensing
The MAX189BC/D's 75 ksps sampling rate and 12-bit resolution capture stylus-tip pressure and position at human-handwriting speeds without aliasing, making it suitable for pen-tablet digitizers and consumer touch-control peripherals. The serial interface keeps the flex-cable count to three (CS, SCLK, DOUT), allowing clean routing between the sensor matrix and the host MCU. The 2-microamp shutdown mode lets the digitizer sleep between pen-down events, extending battery life in wireless tablets.
Recomendado
Isolated Sensor Read-Out Stages
Isolated analog front-ends using digital isolators and a single isolated +5V rail pair cleanly with the MAX189BC/D, which presents only three digital signals to the isolator (CS, SCLK, DOUT). Compared with parallel-output ADCs, the MAX189BC/D's SPI interface cuts isolator channel count - and therefore BOM cost - by an order of magnitude. The internal 4.096V reference tolerates the warm-up drift common in isolated modules, and the 1.5 mA active current keeps the isolated-side supply budget under 10 mW even at full 75 ksps throughput.
Recomendado
Hybrid Module and MCM Designs
Because the MAX189BC/D ships as a bare die, it integrates naturally into hybrid modules and multi-chip modules (MCMs) where space and parasitic inductance are at a premium. Designs targeting medical imaging probes, downhole oil-drilling sensors, and aerospace instrumentation place the MAX189BC/D die alongside an op-amp die and reference die in a single ceramic substrate, eliminating the bond-wire inductance of a packaged part. Designers working in this space will value the matched 4.096V reference and SPI-compatible serial output, both of which simplify cross-die interconnections on the substrate.
Recomendado
Handheld Test and Measurement
The MAX189BC/D's combination of 12-bit resolution, 75 ksps sampling, and 1.5 mA active current suits handheld oscilloscope-style probes and signal-conditioner modules where low weight and long battery life are mandatory. The integrated track/hold and 4.096V reference simplify the analog signal chain to a resistor-divider, op-amp buffer, and the ADC itself, which keeps the front-end BOM under a dozen components. Designers targeting portable test instruments can use the SPI interface to stream captured samples to an OLED display and on-board memory without taxing the host microcontroller.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MAX189BC/D — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MAX189CC/D | MAX189AC/D | MAX187BC/D | MAX187BCPA |
|---|---|---|---|---|---|
| Brand | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Package | Die (bare die) | Die (bare die) - same | Die (bare die) - same | Die (bare die) - same | 8-pin PDIP - same family, packaged |
| Resolution | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits |
| Sampling Rate | 75 ksps | 75 ksps | 75 ksps | 75 ksps | 75 ksps |
| Integral Nonlinearity | +/- 1 LSB (B grade) | +/- 1 LSB (C grade) | +/- 1/2 LSB (A grade) | +/- 1 LSB | +/- 1 LSB |
| Output Interface | Serial (SPI) | Serial (SPI) | Serial (SPI) | Parallel (12-bit) | Parallel (12-bit) |
| Internal Reference | 4.096 V buffered | 4.096 V buffered | 4.096 V buffered | 4.096 V buffered | 4.096 V buffered |
| Supply Voltage | +5 V | +5 V | +5 V | +5 V | +5 V |
Principais diferenciais
- Bare-die format enables hybrid and MCM integration (vs MAX187BCPA)
- Lower-cost +/-1 LSB INL versus A-grade precision (vs MAX189AC/D)
- SPI serial output minimizes isolator channel count (vs MAX187BC/D)
Notas de projeto
Decouple VDD with a 0.1 uF ceramic capacitor placed within 2 mm of the die bond pad, and add a 10 uF bulk capacitor at the supply entry to the MCM or hybrid substrate. The MAX189BC/D draws 1.5 mA active and 2 uA in shutdown, so the bulk capacitor value is set by the worst-case burst-conversion current rather than the average. Estimated: at 75 ksps with 8.5 us per conversion, the maximum RMS ripple on the supply stays under 5 mV if the bulk capacitor is mounted within 5 mm of the VDD pad.
Separate the analog ground (AGND) and digital ground (DGND) on the substrate and tie them together at a single point near the GND bond pad. Keep digital traces (CS, SCLK, DOUT) routed away from the AIN and REF pads to avoid capacitive coupling that appears as input-sampling kickback. For die-level assembly, minimize bond-wire length on the AIN node to keep track/hold acquisition accurate at 1.5 us.
Do not drive SHDN faster than the data-sheet maximum slew rate, otherwise the internal bias recovery may corrupt the first conversion. Always issue a dummy conversion after wake-up from shutdown before reading a meaningful sample. The internal reference requires the REF cap pin to be bypassed with at least 4.7 uF; reducing this capacitor degrades reference stability and ADC linearity.
When using long PCB or flex-cable runs, place a 100 ohm series resistor at the SCLK and DOUT drivers near the source to dampen transmission-line ringing. The MAX189BC/D's SPI inputs are not 5V tolerant if the controller runs at 3.3 V, so confirm the Vih threshold against the controller's VOH. Estimated: with a 100 ohm series resistor and 10 pF load, the SCLK edge rate stays below 5 ns/V into the ADC pin.
Informações de conformidade
RoHS and lead-free per Maxim product page. Not AEC-Q100 qualified - the MAX189 is commercial temperature grade. Bare-die parts are typically not halogen-free tested in the same way as packaged parts; consult factory for specific requirements.
