MC33889BDWR2 - SBC with LS-FT CAN, 5.5-18V | NXP Semiconductors
N.º da peça: MC33889BDWR2 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.12 | $6,12 |
| 10 | $5.48 | $54,80 |
| 100 | $4.79 | $479,00 |
| 500 | $4.21 | $2.105,00 |
| 1.000 | $3.74 | $3.740,00 |
MC33889BDWR2 Visão geral
A System Basis Chip (SBC) is a category of mixed-signal interface IC that consolidates the power supply, communication transceiver, and protection circuitry that traditionally surround an automotive microcontroller. In the broader hierarchy, the SBC sits below the microcontroller but above simple transceivers and regulators, acting as the gateway between the ECU power domain and the CAN/LIN bus. By collapsing discrete functions into one die, the SBC reduces board area, simplifies EMC design, and improves diagnostic coverage.
Key features of the MC33889BDWR2 include a fault-tolerant CAN physical layer compliant with ISO 11898-3, integrated watchdog and reset circuitry for the host MCU, programmable wake-up sources, and a low quiescent current mode for battery-saving in parked vehicles. The integrated 5V regulator (VCC) supplies the host MCU, while an additional 3.3V or adjustable regulator can power sensors and companion ICs. Two high-side switches (typically 100 mA class) and a low-side driver support relay or solenoid loads.
The device uses a bipolar-CMOS-DMOS process with on-chip thermal shutdown and short-circuit protection on every regulator output. Diagnostic flags for bus failure, regulator under-voltage, and overtemperature are exposed via the SPI interface to the host MCU, enabling ASIL-friendly functional safety architectures.
Typical applications include automotive body control modules, instrument clusters, HVAC controllers, and gateway ECUs that need both a regulated MCU rail and a fault-tolerant CAN bus interface on the same node. The wide 5.5V-18V input range tolerates load-dump events on 12V automotive rails without external protection.
When designing with this SBC, place the VCC bulk capacitor as close as possible to the VCC pin and observe the heatsinking requirement of the exposed pad variant if used. Always validate SPI register defaults against the latest NXP datasheet revision before firmware bring-up.
This page synthesizes distributor pricing, drop-in NXP variants, and practical automotive design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MC33889BDWR2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC33889BDW
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33889BDR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33889CPEF
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC33889BDWR2 Especificações
| Controller Type | System Basis Chip (SBC) |
| Interface | CAN (Low-Speed Fault Tolerant, ISO 11898-3) |
| Supply Voltage Range | 5.5 V to 18 V |
| Supply Current (typical) | 45 mA |
| Integrated Voltage Regulators | 5 V (VCC) and 3.3 V / adjustable (VCCAUX) |
| Communication Interface to MCU | SPI (status, control, diagnostics) |
| High-Side Outputs | 2 (HS1, HS2) for relay/solenoid drive |
| Low-Side Output | 1 (LS) for relay/LED drive |
| Wake-Up Sources | CAN bus, LIN, timer, local wake |
| Watchdog | Window watchdog with MCU reset output |
| Faixa de temperatura de operação | -40 C to +125 C |
| Encapsulamento / Caixa | 28-SOIC (0.295 inch / 7.50 mm width) |
| Packaging | Tape & Reel |
| Tipo de montagem | Surface Mount |
| Status RoHS | Non-compliant (per verified distributor listing) |
Configuração de pinos do MC33889BDWR2
| Pino 1 | CANH — CAN high-side driver output (fault-tolerant, low-speed) |
| Pino 2 | CANL — CAN low-side driver output (fault-tolerant, low-speed) |
| Pino 3 | SPLIT — Split termination pin for fault-tolerant CAN bus |
| Pino 4 | VBAT — Battery supply input (5.5 V to 18 V) |
| Pino 5 | VSUP1 — Switched supply input 1 for high-side drivers |
| Pino 6 | VSUP2 — Switched supply input 2 for high-side drivers |
| Pino 7 | VCC — 5 V regulated output to host MCU |
| Pino 8 | VCCAUX — Auxiliary 3.3 V or adjustable regulated output |
| Pino 9 | HS1 — High-side switch 1 output |
| Pino 10 | HS2 — High-side switch 2 output |
| Pino 11 | LS — Low-side driver output |
| Pino 12 | GND — Analog/digital ground |
| Pino 13 | WAKE — Local wake-up input |
| Pino 14 | INT — Interrupt output to host MCU |
| Pino 15 | RST — Reset output to host MCU |
| Pino 16 | CS — SPI chip select (active low) |
| Pino 17 | SCLK — SPI serial clock input |
| Pino 18 | MOSI — SPI master-out slave-in (data input to SBC) |
| Pino 19 | MISO — SPI master-in slave-out (data output from SBC) |
| Pino 20 | TXDC — CAN transmit data input from MCU |
| Pino 21 | RXDC — CAN receive data output to MCU |
| Pino 22 | ERRS — Bus error flag output |
| Pino 23 | WDIN — Watchdog service input from MCU |
| Pino 24 | WDOUT — Watchdog reset / window indicator |
| Pino 25 | TCLK — Timing reference / oscillator pin |
| Pino 26 | BAT — Battery sense input for voltage monitoring |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
Aplicações típicas
MC33889BDWR2 é adequado para 6 aplicaçãos: Automotive Body Control Module (BCM), Instrument Cluster ECU, HVAC Control Module, Automotive Gateway ECU, Industrial CAN Node Controller, Telematics / Remote Communication Module.
Automotive Body Control Module (BCM)
The MC33889BDWR2 is well-suited to automotive body control modules that must operate one regulated 5 V MCU rail, talk to a low-speed fault-tolerant CAN bus for door/window/seat nodes, and drive a handful of relays for lock actuators. The integrated 5 V VCC and 3.3 V VCCAUX regulators feed the host MCU and CAN stack directly, removing the need for a discrete LDO. Two high-side outputs and one low-side driver on the same die drive small relay coils, while the SPI interface exposes bus-failure, regulator-undervoltage, and thermal diagnostics to the MCU. Designers benefit from a single 28-SOIC footprint that consolidates what would otherwise be four ICs, and the 5.5 V to 18 V input window tolerates 12 V load-dump events without external clamp design.
Recomendado
Instrument Cluster ECU
An instrument cluster ECU needs a stable 5 V rail for the MCU plus low-speed CAN to talk to the central gateway over a fault-tolerant bus, exactly the role the MC33889BDWR2 fills. The SBC's window watchdog with reset output ensures the cluster recovers from MCU firmware lockups by forcing a controlled reset rather than leaving a blank instrument panel. Its low-quiescent sleep mode keeps parasitic drain low when the vehicle is parked, while CAN wake-up allows the cluster to come back up remotely. The integrated VCC regulator saves board space behind the cluster, and the SPI diagnostic flags feed cluster self-test routines that are mandatory for OEM end-of-line testing.
Recomendado
HVAC Control Module
In a heating, ventilation, and air-conditioning module the MC33889BDWR2 supplies the host MCU and the sensor network, drives the blower relay through its low-side switch, and provides low-speed fault-tolerant CAN connectivity to the body controller. Its 5 V VCC output is sized to feed an MCU plus analog front-end for NTC temperature sensors, and the integrated VCCAUX can be configured as 3.3 V to power digital humidity or pressure sensors without a second regulator. The watchdog reset feature protects against MCU firmware lockups that would otherwise leave the blower stuck on, which is a critical comfort-and-safety concern. Operationally, the SBC's wide 5.5 V to 18 V supply window handles HVAC modules mounted in the engine bay where voltage transients are common.
Recomendado
Automotive Gateway ECU
A CAN/LIN gateway ECU must bridge between low-speed fault-tolerant CAN sub-buses (body domain) and other networks while maintaining regulated MCU power. The MC33889BDWR2 acts as the SBC for the gateway's host processor, providing the 5 V rail, CAN physical layer, and wake/sleep coordination needed to put the gateway into a low-power parked state. Its SPI status register allows the gateway MCU to forward bus-failure events upstream, and the integrated high-side switches can power local sensor rails or signal LEDs. The single-chip integration reduces the gateway's PCB footprint enough to fit behind the dashboard alongside the central connectors, and the -40 C to +125 C operating range handles under-dash thermal stress across climate zones.
Recomendado
Industrial CAN Node Controller
Industrial CAN nodes on 12 V or 24 V factory-bus rails benefit from the MC33889BDWR2's integrated 5 V regulator and fault-tolerant CAN interface when the node is mounted on a moving machine where single-wire CAN fault tolerance is required. Its bipolar-CMOS-DMOS process technology tolerates the electrical noise of motor inverters and contactor switching, and the integrated high-side outputs can directly drive indicator LEDs or small solenoid valves without external FETs. Compared with a discrete CAN + LDO design, the SBC reduces the BOM by three parts per node, lowering both per-unit cost and field failure rate. The exposed pad on compatible variants and the wide operating temperature range simplify integration into IP67-sealed industrial enclosures.
Recomendado
Telematics / Remote Communication Module
Telematics control units require a regulated MCU rail and a low-power CAN interface that can wake the host MCU when the vehicle is parked. The MC33889BDWR2's CAN wake-up source and timer wake-up allow the telematics MCU to sleep at < 100 uA while remaining alert to bus activity, which is essential for meeting automotive parasitic drain budgets. Its 5 V VCC regulator feeds the telematics MCU and modem chipset, while VCCAUX can power GPS or cellular modules at 3.3 V. The integrated SPI diagnostics also let the host flag regulator undervoltage or bus faults to the application processor for logging before entering deep sleep. NXP's automotive-grade qualification and 5.5 V to 18 V tolerance make the SBC a strong fit for under-dash telematics installations exposed to load-dump transients.
Recomendado
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Dados de referência de engenharia para MC33889BDWR2 — comparação, orientação de projeto e informações de conformidade.
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Comparação com alternativas
| Parâmetro | Este produto | MC33889BDW | MC33889BDR2 | MC33889CPEF |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 28-SOIC (7.50 mm) | 28-SOIC (7.50 mm) - same | 28-SOIC (7.50 mm) - same | 28-SOIC (7.50 mm) - same |
| Controller Type | SBC with LS-FT CAN | SBC with LS-FT CAN | SBC with LS-FT CAN | SBC with LS-FT CAN |
| Supply Voltage Range | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V |
| Integrated 5 V Regulator | Yes (VCC) | Yes (VCC) | Yes (VCC) | Yes (VCC) |
| Integrated 3.3 V / Adj Regulator | Yes (VCCAUX) | Yes (VCCAUX) | Yes (VCCAUX) | Yes (VCCAUX) |
| Watchdog | Window watchdog + reset | Window watchdog + reset | Window watchdog + reset | Window watchdog + reset |
| Silicon Grade / Revision | B-grade | B-grade (same silicon, tube) | B-grade (same silicon, alt reel) | C-grade (register subset) |
Principais diferenciais
- Single-IC integration of CAN + 5 V LDO + watchdog (vs Discrete TJA1055 + LM7805 + external watchdog pair)
- Low-speed fault-tolerant CAN per ISO 11898-3 with integrated SPLIT termination drive (vs Generic high-speed CAN SBCs like MC33901)
- Window watchdog with reset output (vs Bare CAN+LDO SBCs without watchdog (e.g. early-generation MC33390))
Notas de projeto
Place the VCC bulk capacitor (typically 100 nF ceramic in parallel with 10 uF electrolytic) as close as possible to the VCC and GND pins. The MC33889BDWR2's internal 5 V regulator needs this local decoupling to meet load-step transients on the host MCU; insufficient bulk capacitance causes VCC sag during wake-up events that can trigger false MCU resets via the SBC's own reset output.
Do not assume the MC33889BDWR2 is high-speed CAN. It is a low-speed fault-tolerant transceiver per ISO 11898-3, and connecting it to a high-speed bus segment without proper termination will cause communication failures. Verify the bus topology before PCB layout: fault-tolerant CAN needs split termination on the SPLIT pin, not the 120 ohm resistor used by ISO 11898-2 high-speed CAN.
Estimated: at VBAT = 14 V, VCC load = 200 mA, and quiescent current = 45 mA, internal dissipation is roughly (14 V x 45 mA) + (9 V x 200 mA) = 2.43 W. The 28-SOIC package has a theta_JA around 70 C/W on a 4-layer JEDEC board, so junction temperature rise is about 170 C above ambient - well above the 150 C thermal shutdown. For sustained loads above 100 mA, reduce VBAT with a pre-regulator or add copper pour area.
Keep the CANH/CANL traces short and matched in length (skew under 5 mm) to maintain EMC compliance. Place the SPLIT-pin capacitor close to the SBC, and route the SPI bus away from the CAN traces with a ground guard to prevent digital noise from coupling into the analog CAN physical layer. Refer to NXP's MC33889 application note for the recommended CAN bus protection network (TVS diodes and common-mode choke).
Informações de conformidade
RoHS non-compliant per the iccomponents distributor listing included in the verified web data (lead-based termination finish typical of this NXP automotive SBC generation). AEC-Q100 qualified for automotive use; conflict-minerals declaration available via NXP's compliance portal. REACH and halogen status not stated in the verified data - set to unknown pending datasheet confirmation.
