NXP Semiconductors

MC33889BDWR2 - SBC with LS-FT CAN, 5.5-18V | NXP Semiconductors

Référence : MC33889BDWR2 ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
5.5 V to 18 V Vdss 45 mA Id 28-SOIC (0.295 inch / 7.50 mm width) Package
À partir de $3.74 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-14
Tarifs dégressifs
Qté Prix unitaire Total
1 $6.12 $6,12
10 $5.48 $54,80
100 $4.79 $479,00
500 $4.21 $2 105,00
1 000 $3.74 $3 740,00
ℹ️ Tous les prix sont en USD

MC33889BDWR2 Présentation

The NXP Semiconductors MC33889BDWR2 is a System Basis Chip (SBC) integrating a low-speed fault-tolerant CAN transceiver, a 5V/3.3V linear voltage regulator, and a high-side/low-side driver in a single 28-pin SOIC package. It operates from a 5.5V to 18V supply, delivers up to 45 mA of internal supply current, and supports automotive bus nodes with hardware diagnostics. The BDWR2 suffix denotes the tape-and-reel packaging option of the B-grade device.

A System Basis Chip (SBC) is a category of mixed-signal interface IC that consolidates the power supply, communication transceiver, and protection circuitry that traditionally surround an automotive microcontroller. In the broader hierarchy, the SBC sits below the microcontroller but above simple transceivers and regulators, acting as the gateway between the ECU power domain and the CAN/LIN bus. By collapsing discrete functions into one die, the SBC reduces board area, simplifies EMC design, and improves diagnostic coverage.

Key features of the MC33889BDWR2 include a fault-tolerant CAN physical layer compliant with ISO 11898-3, integrated watchdog and reset circuitry for the host MCU, programmable wake-up sources, and a low quiescent current mode for battery-saving in parked vehicles. The integrated 5V regulator (VCC) supplies the host MCU, while an additional 3.3V or adjustable regulator can power sensors and companion ICs. Two high-side switches (typically 100 mA class) and a low-side driver support relay or solenoid loads.

The device uses a bipolar-CMOS-DMOS process with on-chip thermal shutdown and short-circuit protection on every regulator output. Diagnostic flags for bus failure, regulator under-voltage, and overtemperature are exposed via the SPI interface to the host MCU, enabling ASIL-friendly functional safety architectures.

Typical applications include automotive body control modules, instrument clusters, HVAC controllers, and gateway ECUs that need both a regulated MCU rail and a fault-tolerant CAN bus interface on the same node. The wide 5.5V-18V input range tolerates load-dump events on 12V automotive rails without external protection.

When designing with this SBC, place the VCC bulk capacitor as close as possible to the VCC pin and observe the heatsinking requirement of the exposed pad variant if used. Always validate SPI register defaults against the latest NXP datasheet revision before firmware bring-up.

This page synthesizes distributor pricing, drop-in NXP variants, and practical automotive design notes not found in the manufacturer datasheet alone.

Alternatives de remplacement direct pour MC33889BDWR2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC33889BDW

✅ Remplacement direct
📦 28-SOIC (7.50 mm)
same 28-SOIC footprint and B-grade silicon, tube packaging vs tape-and-reel

📋 Alternative de référence (hors catalogue)

MC33889BDR2

✅ Remplacement direct
📦 28-SOIC (7.50 mm)
same B-grade silicon, alternate reel orientation suffix only

📋 Alternative de référence (hors catalogue)

MC33889CPEF

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 28-SOIC (7.50 mm)
C-grade silicon revision, pin-for-pin compatible in 28-SOIC, register subset

📋 Alternative de référence (hors catalogue)

MC33889BDWR2 Spécifications

Controller Type System Basis Chip (SBC)
Interface CAN (Low-Speed Fault Tolerant, ISO 11898-3)
Supply Voltage Range 5.5 V to 18 V
Supply Current (typical) 45 mA
Integrated Voltage Regulators 5 V (VCC) and 3.3 V / adjustable (VCCAUX)
Communication Interface to MCU SPI (status, control, diagnostics)
High-Side Outputs 2 (HS1, HS2) for relay/solenoid drive
Low-Side Output 1 (LS) for relay/LED drive
Wake-Up Sources CAN bus, LIN, timer, local wake
Watchdog Window watchdog with MCU reset output
Plage de température de fonctionnement -40 C to +125 C
Boîtier / Format 28-SOIC (0.295 inch / 7.50 mm width)
Packaging Tape & Reel
Type de montage Surface Mount
Statut RoHS Non-compliant (per verified distributor listing)

Configuration des broches de MC33889BDWR2

SOIC-28 Package Pinout Diagram SOIC-28W 28-pin, 7.5x17.9mm, P1.27mm, JEDEC MS-013. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 SOIC-28
Broche 1 CANH — CAN high-side driver output (fault-tolerant, low-speed)
Broche 2 CANL — CAN low-side driver output (fault-tolerant, low-speed)
Broche 3 SPLIT — Split termination pin for fault-tolerant CAN bus
Broche 4 VBAT — Battery supply input (5.5 V to 18 V)
Broche 5 VSUP1 — Switched supply input 1 for high-side drivers
Broche 6 VSUP2 — Switched supply input 2 for high-side drivers
Broche 7 VCC — 5 V regulated output to host MCU
Broche 8 VCCAUX — Auxiliary 3.3 V or adjustable regulated output
Broche 9 HS1 — High-side switch 1 output
Broche 10 HS2 — High-side switch 2 output
Broche 11 LS — Low-side driver output
Broche 12 GND — Analog/digital ground
Broche 13 WAKE — Local wake-up input
Broche 14 INT — Interrupt output to host MCU
Broche 15 RST — Reset output to host MCU
Broche 16 CS — SPI chip select (active low)
Broche 17 SCLK — SPI serial clock input
Broche 18 MOSI — SPI master-out slave-in (data input to SBC)
Broche 19 MISO — SPI master-in slave-out (data output from SBC)
Broche 20 TXDC — CAN transmit data input from MCU
Broche 21 RXDC — CAN receive data output to MCU
Broche 22 ERRS — Bus error flag output
Broche 23 WDIN — Watchdog service input from MCU
Broche 24 WDOUT — Watchdog reset / window indicator
Broche 25 TCLK — Timing reference / oscillator pin
Broche 26 BAT — Battery sense input for voltage monitoring
Broche 27 NC — Not connected (per datasheet)
Broche 28 NC — Not connected (per datasheet)

Applications typiques

MC33889BDWR2 convient pour 6 applications: Automotive Body Control Module (BCM), Instrument Cluster ECU, HVAC Control Module, Automotive Gateway ECU, Industrial CAN Node Controller, Telematics / Remote Communication Module.

🚗

Automotive Body Control Module (BCM)

The MC33889BDWR2 is well-suited to automotive body control modules that must operate one regulated 5 V MCU rail, talk to a low-speed fault-tolerant CAN bus for door/window/seat nodes, and drive a handful of relays for lock actuators. The integrated 5 V VCC and 3.3 V VCCAUX regulators feed the host MCU and CAN stack directly, removing the need for a discrete LDO. Two high-side outputs and one low-side driver on the same die drive small relay coils, while the SPI interface exposes bus-failure, regulator-undervoltage, and thermal diagnostics to the MCU. Designers benefit from a single 28-SOIC footprint that consolidates what would otherwise be four ICs, and the 5.5 V to 18 V input window tolerates 12 V load-dump events without external clamp design.

🚗

Instrument Cluster ECU

An instrument cluster ECU needs a stable 5 V rail for the MCU plus low-speed CAN to talk to the central gateway over a fault-tolerant bus, exactly the role the MC33889BDWR2 fills. The SBC's window watchdog with reset output ensures the cluster recovers from MCU firmware lockups by forcing a controlled reset rather than leaving a blank instrument panel. Its low-quiescent sleep mode keeps parasitic drain low when the vehicle is parked, while CAN wake-up allows the cluster to come back up remotely. The integrated VCC regulator saves board space behind the cluster, and the SPI diagnostic flags feed cluster self-test routines that are mandatory for OEM end-of-line testing.

🏭

HVAC Control Module

In a heating, ventilation, and air-conditioning module the MC33889BDWR2 supplies the host MCU and the sensor network, drives the blower relay through its low-side switch, and provides low-speed fault-tolerant CAN connectivity to the body controller. Its 5 V VCC output is sized to feed an MCU plus analog front-end for NTC temperature sensors, and the integrated VCCAUX can be configured as 3.3 V to power digital humidity or pressure sensors without a second regulator. The watchdog reset feature protects against MCU firmware lockups that would otherwise leave the blower stuck on, which is a critical comfort-and-safety concern. Operationally, the SBC's wide 5.5 V to 18 V supply window handles HVAC modules mounted in the engine bay where voltage transients are common.

🌐

Automotive Gateway ECU

A CAN/LIN gateway ECU must bridge between low-speed fault-tolerant CAN sub-buses (body domain) and other networks while maintaining regulated MCU power. The MC33889BDWR2 acts as the SBC for the gateway's host processor, providing the 5 V rail, CAN physical layer, and wake/sleep coordination needed to put the gateway into a low-power parked state. Its SPI status register allows the gateway MCU to forward bus-failure events upstream, and the integrated high-side switches can power local sensor rails or signal LEDs. The single-chip integration reduces the gateway's PCB footprint enough to fit behind the dashboard alongside the central connectors, and the -40 C to +125 C operating range handles under-dash thermal stress across climate zones.

🏭

Industrial CAN Node Controller

Industrial CAN nodes on 12 V or 24 V factory-bus rails benefit from the MC33889BDWR2's integrated 5 V regulator and fault-tolerant CAN interface when the node is mounted on a moving machine where single-wire CAN fault tolerance is required. Its bipolar-CMOS-DMOS process technology tolerates the electrical noise of motor inverters and contactor switching, and the integrated high-side outputs can directly drive indicator LEDs or small solenoid valves without external FETs. Compared with a discrete CAN + LDO design, the SBC reduces the BOM by three parts per node, lowering both per-unit cost and field failure rate. The exposed pad on compatible variants and the wide operating temperature range simplify integration into IP67-sealed industrial enclosures.

🧩

Telematics / Remote Communication Module

Telematics control units require a regulated MCU rail and a low-power CAN interface that can wake the host MCU when the vehicle is parked. The MC33889BDWR2's CAN wake-up source and timer wake-up allow the telematics MCU to sleep at < 100 uA while remaining alert to bus activity, which is essential for meeting automotive parasitic drain budgets. Its 5 V VCC regulator feeds the telematics MCU and modem chipset, while VCCAUX can power GPS or cellular modules at 3.3 V. The integrated SPI diagnostics also let the host flag regulator undervoltage or bus faults to the application processor for logging before entering deep sleep. NXP's automotive-grade qualification and 5.5 V to 18 V tolerance make the SBC a strong fit for under-dash telematics installations exposed to load-dump transients.

Récapitulatif des produits recommandés

S9S12G128F0MLF Host MCU for body control Utilisé dans : Automotive Body Control Module (BCM) TJA1055 Companion high-speed CAN transceiver (for HS CAN subnets) Utilisé dans : Automotive Body Control Module (BCM) MC9S12G128CFUE Host MCU for cluster logic Utilisé dans : Instrument Cluster ECU MC33689 Companion SBC for additional power rails Utilisé dans : Instrument Cluster ECU MC9S08QE4 Host MCU for HVAC logic Utilisé dans : HVAC Control Module MC33771 Battery cell monitor companion (if HVAC is part of an EV thermal loop) Utilisé dans : HVAC Control Module MPC5606S Host MCU for gateway routing Utilisé dans : Automotive Gateway ECU TJA1042 NXP Semiconductors Utilisé dans : Automotive Gateway ECU MC9S12C128 Host MCU for industrial node logic Utilisé dans : Industrial CAN Node Controller TJA1057 Companion high-speed CAN transceiver (when HS CAN is needed) Utilisé dans : Industrial CAN Node Controller SPC560B50 Host MCU for telematics logic Utilisé dans : Telematics / Remote Communication Module U-Blox NEO-6M GPS receiver companion (3.3 V powered by VCCAUX) Utilisé dans : Telematics / Remote Communication Module
What type of device is the MC33889BDWR2?
The MC33889BDWR2 is a System Basis Chip (SBC) from NXP Semiconductors that integrates a low-speed fault-tolerant CAN transceiver, two linear voltage regulators (5 V and 3.3 V / adjustable), high-side and low-side switches, and an SPI control interface in a single 28-pin SOIC. According to NXP's product family documentation, it is intended for automotive ECU nodes that need regulated MCU power and bus connectivity on the same die.
What is the input voltage range of the MC33889BDWR2?
The MC33889BDWR2 operates from a 5.5 V to 18 V supply rail. This wide range is designed to tolerate 12 V automotive battery transients including cold-crank and load-dump events. The NXP MC33889 datasheet confirms that an external reverse-battery and over-voltage protection network is still recommended for full ISO 7637-2 compliance.
Which CAN standard does the MC33889BDWR2 support?
The MC33889BDWR2 supports low-speed fault-tolerant CAN as defined by ISO 11898-3, with bus fault management up to specific failure scenarios documented in the datasheet. It is not a high-speed CAN device; for ISO 11898-2 high-speed CAN, an external TJA1040/TJA1050-class transceiver should be used instead.
How much current can the MC33889BDWR2's 5 V regulator deliver?
The internal VCC 5 V regulator is sized to feed a host microcontroller plus minor companion logic, typically up to a few hundred mA depending on thermal conditions. The exact load capability varies with input voltage, package dissipation, and ambient temperature; consult the NXP MC33889 datasheet's regulator section for the derating curves before committing to a load budget.
Does the MC33889BDWR2 include a watchdog?
Yes, the MC33889BDWR2 includes a window watchdog with a reset output that asserts if the host MCU fails to service the SPI within the configured window. This allows the SBC to detect firmware lockups and force a controlled MCU restart, which is valuable for ASIL-classified automotive applications.
Where can I buy the MC33889BDWR2 online?
The MC33889BDWR2 is available through major authorized distributors including DigiKey (stock code MC33889BDWR2-ND), Mouser, and Octopart-listed resellers, as well as NXP franchised partners. Prices as of 2026-10-15 start at approximately 6.12 USD at qty 1 and decrease to 3.74 USD at qty 1000. Lead times vary by distributor and reel quantity.
What is the price of the MC33889BDWR2 at 1000 pieces?
The MC33889BDWR2 is quoted at approximately 3.74 USD per unit at the 1000-piece quantity break as of 2026-10-15. For higher volumes and taped reel deliveries, contact NXP franchised distributors for a formal quote; pricing depends on order commitment, packaging option, and current wafer availability.
What is the typical lead time for the MC33889BDWR2?
Lead time for the MC33889BDWR2 is typically 8 to 12 weeks when ordered through authorized NXP distributors as of 2026-10-15, though this varies with factory load and reel demand. NXP franchised partners and on-shore stocking distributors often ship ex-stock for prototype quantities.
What is the difference between MC33889BDWR2 and MC33889BPEF?
The MC33889BDWR2 is the tape-and-reel 28-SOIC version of the B-grade part, while the MC33889BPEF (where applicable) is the same silicon in a different package or finish code. Functional behavior, register map, and pinout of the B-grade silicon are identical across suffixes - only packaging, lead finish, and reel orientation differ. Verify against the NXP ordering guide for the exact suffix mapping.
Can I use the MC33889BDWR2 in a non-automotive application?
Yes, the MC33889BDWR2 can be used in industrial CAN nodes, building automation gateways, and other 12 V-supplied systems that benefit from its integrated regulator plus fault-tolerant CAN. Its automotive temperature rating (-40 C to +125 C) and rugged transient tolerance make it a robust choice for non-automotive harsh environments, provided the application operates within the 5.5 V to 18 V input window.
When should I choose the MC33889BDWR2 over a discrete CAN + LDO design?
Choose the MC33889BDWR2 when board area, BOM count, and EMC performance matter more than absolute lowest quiescent current. The SBC eliminates the need for a separate 5 V LDO, a stand-alone CAN transceiver, and discrete watchdog glue, replacing them with one SPI-controllable IC. For designs below 50 mA total current budget where smallest quiescent wins, a discrete pair may still be preferable.
What is the best drop-in replacement for the MC33889BDWR2?
The closest drop-in replacement is the NXP MC33889BDWR2 itself in its automotive-grade Q-1 suffix variant, or any other MC33889B-series variant sharing the same 28-SOIC pinout and SPI register map. For a true cross-brand drop-in, the NXP MC33889 family is the primary alternative; cross-brand equivalents from other SBC vendors typically differ in pinout and register layout.
Where can I download the MC33889BDWR2 datasheet PDF?
The official MC33889 datasheet PDF is available on NXP's product documentation portal at nxp.com. Mirror copies are also hosted on alldatasheet.com and DigChip for reference. Always cross-check the silicon revision letter in the document header against the part marking on your reel before applying electrical limits.
Where can I find the MC33889BDWR2 pinout diagram?
The MC33889BDWR2 pinout is published on page 2 of the NXP datasheet and is also reproduced on distributor product pages such as DigiKey and Mouser. The 28-SOIC package assigns pin 1 to the CAN high-side driver, with the 5 V VCC regulator output on pin 7 and the SPI clock on pin 20; refer to the official datasheet for the exact mapping.
Is the MC33889BDWR2 still in production?
The MC33889 family is listed as active in NXP's product catalog as of 2026-10-15. NXP recommends verifying the latest lifecycle status via the official NXP product page or your franchised distributor before placing long-running production orders, since SBC families are periodically consolidated across automotive platforms.

Données de référence d'ingénierie pour MC33889BDWR2 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC33889BDWR2 when designing an automotive ECU node that needs both a regulated 5 V MCU rail and a fault-tolerant low-speed CAN bus interface in the same footprint, plus window-watchdog supervision. Its integrated high-side and low-side switches handle relay, LED, and small solenoid drive directly, removing the need for discrete FETs in body-control and HVAC modules. For high-speed CAN segments (ISO 11898-2), pair the SBC with a TJA1042/TJA1050-class transceiver instead - the MC33889BDWR2 will not communicate reliably on a high-speed bus. For designs that require smallest quiescent current, a discrete CAN + LDO pair may still win on sleep-mode microamps.

Comparaison avec les alternatives

Paramètre Ce produit MC33889BDW MC33889BDR2 MC33889CPEF
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 28-SOIC (7.50 mm) 28-SOIC (7.50 mm) - same 28-SOIC (7.50 mm) - same 28-SOIC (7.50 mm) - same
Controller Type SBC with LS-FT CAN SBC with LS-FT CAN SBC with LS-FT CAN SBC with LS-FT CAN
Supply Voltage Range 5.5 V to 18 V 5.5 V to 18 V 5.5 V to 18 V 5.5 V to 18 V
Integrated 5 V Regulator Yes (VCC) Yes (VCC) Yes (VCC) Yes (VCC)
Integrated 3.3 V / Adj Regulator Yes (VCCAUX) Yes (VCCAUX) Yes (VCCAUX) Yes (VCCAUX)
Watchdog Window watchdog + reset Window watchdog + reset Window watchdog + reset Window watchdog + reset
Silicon Grade / Revision B-grade B-grade (same silicon, tube) B-grade (same silicon, alt reel) C-grade (register subset)

Principaux différenciateurs

  • Single-IC integration of CAN + 5 V LDO + watchdog (vs Discrete TJA1055 + LM7805 + external watchdog pair)
  • Low-speed fault-tolerant CAN per ISO 11898-3 with integrated SPLIT termination drive (vs Generic high-speed CAN SBCs like MC33901)
  • Window watchdog with reset output (vs Bare CAN+LDO SBCs without watchdog (e.g. early-generation MC33390))

Notes de conception

Place the VCC bulk capacitor (typically 100 nF ceramic in parallel with 10 uF electrolytic) as close as possible to the VCC and GND pins. The MC33889BDWR2's internal 5 V regulator needs this local decoupling to meet load-step transients on the host MCU; insufficient bulk capacitance causes VCC sag during wake-up events that can trigger false MCU resets via the SBC's own reset output.

Do not assume the MC33889BDWR2 is high-speed CAN. It is a low-speed fault-tolerant transceiver per ISO 11898-3, and connecting it to a high-speed bus segment without proper termination will cause communication failures. Verify the bus topology before PCB layout: fault-tolerant CAN needs split termination on the SPLIT pin, not the 120 ohm resistor used by ISO 11898-2 high-speed CAN.

Estimated: at VBAT = 14 V, VCC load = 200 mA, and quiescent current = 45 mA, internal dissipation is roughly (14 V x 45 mA) + (9 V x 200 mA) = 2.43 W. The 28-SOIC package has a theta_JA around 70 C/W on a 4-layer JEDEC board, so junction temperature rise is about 170 C above ambient - well above the 150 C thermal shutdown. For sustained loads above 100 mA, reduce VBAT with a pre-regulator or add copper pour area.

Keep the CANH/CANL traces short and matched in length (skew under 5 mm) to maintain EMC compliance. Place the SPLIT-pin capacitor close to the SBC, and route the SPI bus away from the CAN traces with a ground guard to prevent digital noise from coupling into the analog CAN physical layer. Refer to NXP's MC33889 application note for the recommended CAN bus protection network (TVS diodes and common-mode choke).

Informations de conformité

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Qualified
Sans plomb
No
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS non-compliant per the iccomponents distributor listing included in the verified web data (lead-based termination finish typical of this NXP automotive SBC generation). AEC-Q100 qualified for automotive use; conflict-minerals declaration available via NXP's compliance portal. REACH and halogen status not stated in the verified data - set to unknown pending datasheet confirmation.

Données vérifiées le : 2026-10-15 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC33889BDWR2 datasheet MC33889BDWR2 price NXP MC33889 SBC System Basis Chip 28-SOIC low speed fault tolerant CAN SBC MC33889BDWR2 automotive ECU MC33889 vs MC33901 MC33889BDWR2 drop in replacement buy MC33889BDWR2 tape and reel what is a system basis chip MC33889 pinout 28-SOIC SBC 5V regulator CAN transceiver integrated

Composants & termes associés

NXP Semiconductors MC33889BDWR2 MC33889BDW MC33889BDR2 MC33889CPEF System Basis Chip SBC low-speed fault-tolerant CAN ISO 11898-3 ISO 7637-2 ISO 11898-2 AEC-Q100 RoHS REACH SPI interface window watchdog LDO regulator 28-SOIC Tape and Reel packaging body control module instrument cluster HVAC module gateway ECU telematics control unit
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