MC34903CS5EK - SBC, LIN, 2x 5V/400mA LDO, 32-SOIC-EP | NXP
N.º da peça: MC34903CS5EK ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.4 | $6,40 |
| 10 | $5.76 | $57,60 |
| 100 | $5.12 | $512,00 |
| 500 | $4.61 | $2.305,00 |
| 1.000 | $4.1 | $4.100,00 |
MC34903CS5EK Visão geral
A System Basis Chip (SBC) is a mixed-signal analog companion IC for a microcontroller that consolidates power, communication, and supervisory functions onto one die. The taxonomy: SBC -> analog companion IC -> power management + transceiver IC -> mixed-signal semiconductor. By co-integrating 5 V LDOs, CAN, and LIN, the SBC eliminates discrete power and interface circuitry, reduces BOM count, and provides unified fault handling through one SPI-controlled status register.
Key features of the MC34903CS5EK include two independent 5.0 V ±2% tracking LDOs delivering up to 400 mA each, a LIN 2.1 physical layer compliant with ISO 9141, a high-speed CAN physical layer compliant with ISO 11898, and configurable 2/3 wakeup pins for low-power sleep/standby modes. The IC supports wide battery supply input from 5.5 V to 28 V (load-dump tolerant in automotive bus variants), low standby current, and an SPI bus for diagnostics and configuration.
The MC34903CS5EK is targeted at industrial CAN/LIN nodes, building automation, HVAC controllers, sensor nodes, and industrial sensor-actuator modules. The wide VIN range directly supports 12 V and 24 V industrial backplanes without additional pre-regulation. End-of-life status makes this part suitable for legacy designs only; new designs should use the recommended NXP replacement (see selection_guide).
When designing with the MC34903CS5EK, ensure the exposed pad is soldered to a sufficient copper area (>= 1 square inch) on inner or top PCB layers to meet the 32-SOIC-EP thermal budget. The LIN/CAN bus pins require external protection (TVS + common-mode choke) per IEC 61000-4-2 for industrial EMC compliance.
This page synthesizes distributor inventory, EOL replacement guidance, and parametric drop-in alternatives - information not bundled in the original manufacturer datasheet.
Alternativas drop-in para MC34903CS5EK — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC33903CS5EK
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33903CP5EK
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC33903BS5EK
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC34903CS5EK/R2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33904D5EK
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC34903CS5EK Especificações
| Product Type | System Basis Chip (SBC) |
| LDO Regulators | 2 x 5.0 V, up to 400 mA each |
| LIN Interface | LIN 2.1 / ISO 9141 compliant |
| CAN Interface | High-speed CAN, ISO 11898 compliant |
| Wakeup Inputs | 2 / 3 configurable wake pins |
| Supply Voltage Range | 5.5 V to 28 V |
| Temperatura de operação | -40C to +125C |
| Encapsulamento | 32-SOIC-EP (exposed pad) |
| Tipo de montagem | Surface Mount |
| Configuration Interface | SPI (status + control) |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| AEC-Q100 | Not applicable (industrial grade) |
Configuração de pinos do MC34903CS5EK
| Pino 1 | VBAT — Battery supply input (5.5 V to 28 V) |
| Pino 2 | VSUP1 — Switched supply output / sense |
| Pino 3 | VSUP2 — Switched supply output / sense |
| Pino 4 | GND — Ground |
| Pino 5 | VCC1 — 5 V LDO1 output |
| Pino 6 | VCC2 — 5 V LDO2 output |
| Pino 7 | EN1 — LDO1 enable input |
| Pino 8 | EN2 — LDO2 enable input |
| Pino 9 | WAKE1 — Wakeup input 1 |
| Pino 10 | WAKE2 — Wakeup input 2 |
| Pino 11 | WAKE3 — Wakeup input 3 |
| Pino 12 | LIN — LIN bus line |
| Pino 13 | CANH — CAN high line |
| Pino 14 | CANL — CAN low line |
| Pino 15 | CAN_TX — CAN transmit data from MCU |
| Pino 16 | CAN_RX — CAN receive data to MCU |
| Pino 17 | LIN_TX — LIN transmit data from MCU |
| Pino 18 | LIN_RX — LIN receive data to MCU |
| Pino 19 | SCLK — SPI clock from MCU |
| Pino 20 | MOSI — SPI master-out slave-in (data to SBC) |
| Pino 21 | MISO — SPI master-in slave-out (data from SBC) |
| Pino 22 | CS — SPI chip select (active low) |
| Pino 23 | INT — Interrupt output to MCU |
| Pino 24 | RST — Reset output to MCU |
| Pino 25 | TXD — MCU UART TX (alternate mapping) |
| Pino 26 | RXD — MCU UART RX (alternate mapping) |
| Pino 27 | GPIO1 — General purpose I/O |
| Pino 28 | GPIO2 — General purpose I/O |
| Pino 29 | VCC3 — Auxiliary supply rail |
| Pino 30 | NC — Not connected (per datasheet) |
| Pino 31 | NC — Not connected (per datasheet) |
| Pino 32 | EP — Exposed pad - thermal/ground |
Aplicações típicas
MC34903CS5EK é adequado para 6 aplicaçãos: Industrial CAN/LIN Gateway Module, Building Automation Controller, Industrial Sensor / Actuator Node, HVAC and Climate Control Module, Industrial Sensor-Actuator Brick, Industrial Pump / Valve Controller.
Industrial CAN/LIN Gateway Module
The MC34903CS5EK is purpose-built for industrial CAN/LIN gateway modules where a single IC must deliver both bus physical layers and the host MCU rails. Its integrated high-speed CAN (ISO 11898) and LIN 2.1 (ISO 9141) interfaces eliminate two discrete transceiver ICs, while the two 5 V / 400 mA LDOs power the host MCU, the CAN isolator, and the sensor front-end from a single VBAT rail. The 5.5 V to 28 V VBAT range directly accepts 12 V and 24 V industrial backplanes without pre-regulation. Designers gain SPI-driven diagnostics and 2/3 wakeup inputs, enabling deterministic sleep/wake transitions that minimize node quiescent current between bus events.
Recomendado
Building Automation Controller
In building automation controllers (HVAC, lighting, access control), the MC34903CS5EK serves as the analog companion to a low-power MCU such as the Kinetis E series. Its two 5 V/400 mA LDOs supply the MCU core, the RS-485 transceiver, and the relay drivers, while the integrated LIN interface connects to peripheral nodes (smart thermostats, blind actuators) that use LIN as the sub-bus. The SPI-based diagnostics register exposes fault flags to the host MCU, supporting predictive maintenance. Industrial -40C to +125C temperature operation ensures reliability in unconditioned electrical closets and rooftop equipment.
Recomendado
Industrial Sensor / Actuator Node
Distributed industrial sensor and actuator nodes use the MC34903CS5EK to minimize PCB area while delivering both bus connectivity and regulated rails. The two integrated 5 V LDOs power the sensor ASIC and the MCU, while the LIN or CAN physical layer carries the node's measurement data back to the gateway. The 2/3 wakeup pins allow the node to remain in deep sleep (low quiescent current) until either a bus message or a sensor interrupt wakes the host. This combination is critical for battery-backed or energy-harvested industrial sensor nodes where quiescent current dominates energy budget.
Recomendado
HVAC and Climate Control Module
HVAC control modules in commercial buildings combine multiple bus interfaces with precise analog rails. The MC34903CS5EK integrates the LIN 2.1 interface for communicating with damper actuators, fan controllers, and zone sensors, while the CAN interface links the module to the central building management system. The two 5 V/400 mA LDO outputs supply the host MCU and the analog front-end for temperature/humidity sensing. SPI-driven fault diagnostics enable rapid service diagnostics in the field. EOL status means new HVAC designs should target the MC33903 successor for long-term supply assurance.
Recomendado
Industrial Sensor-Actuator Brick
Compact 'brick' style industrial modules that combine sensing, computation, and bus interfacing in a sealed enclosure rely on the MC34903CS5EK to deliver both bus connectivity and tightly regulated internal rails. The integrated CAN/LIN physical layers reduce PCB area versus discrete transceiver implementations, while the two LDOs deliver up to 800 mA total to power the host MCU, sensor signal chain, and actuator drivers. The wide 5.5 V to 28 V VBAT range supports direct connection to industrial 24 V backplanes without intermediate regulation, simplifying the brick's power input stage.
Recomendado
Industrial Pump / Valve Controller
Pump and valve controllers in process automation require robust CAN/CANopen communication and tightly regulated MCU rails. The MC34903CS5EK provides the high-speed CAN physical layer for CANopen DS301/DS401 communication with the PLC, while its two 5 V/400 mA LDOs supply the host MCU and the H-bridge driver logic. Industrial -40C to +125C operation ensures reliable behavior in unconditioned field cabinets. The exposed pad on the 32-SOIC-EP package must be soldered to a sufficient copper pour to dissipate internal losses during high bus-activity events.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC34903CS5EK — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC33903CS5EK | MC33903CP5EK | MC33903BS5EK | MC34903CS5EK/R2 | MC33904D5EK |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SOIC-EP | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same |
| LDO Outputs | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA |
| LIN Interface | LIN 2.1 (ISO 9141) | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 |
| CAN Interface | High-speed CAN (ISO 11898) | High-speed CAN | High-speed CAN | High-speed CAN | High-speed CAN | High-speed CAN |
| Wakeup Inputs | 2 / 3 configurable | 2 / 3 | 2 / 3 | 2 / 3 | 2 / 3 | 2 / 3 |
| Supply Voltage Range | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Lifecycle Status | EOL | Active | Active | Active | EOL | Active |
Principais diferenciais
- Drop-in replacement availability via direct NXP successor (vs MC33903CS5EK)
- Integrated dual-bus physical layer (LIN + CAN) (vs MC34903CS5EK/R2)
- Wide 5.5 V to 28 V battery supply range (vs MC33904D5EK)
Notas de projeto
The 32-SOIC-EP package's exposed pad MUST be soldered to a copper pour of at least 1 square inch on the top or inner PCB layer. Without this thermal via array, junction temperature can exceed 150C under sustained 800 mA total LDO load (VCC1 + VCC2) plus CAN/LIN bus activity. Tie the exposed pad to the ground plane with at least 9 thermal vias (0.3 mm drill, 1 oz copper plating) for best thermal performance.
Place VCC1 and VCC2 decoupling capacitors (1 uF X7R minimum, 10 uF recommended) within 2 mm of the respective LDO output pins. The VBAT pin requires a 10 uF bulk capacitor plus a 100 nF high-frequency bypass. Keep the LIN and CAN bus traces short and route them away from switching nodes to minimize EMI coupling into the bus physical layers. Add a TVS diode (e.g., SMAJ33CA) and common-mode choke on the bus connector for IEC 61000-4-2 ESD compliance.
Do not exceed VBAT = 28 V (load-dump tolerant variants only) - verify the specific variant's absolute maximum rating before applying inductive load transients. The SPI chip-select pin must be pulled high during MCU reset to prevent spurious writes to the SBC's configuration registers. The WAKE pins are edge-sensitive; add RC filtering (10 kohm + 100 nF) on mechanical-switch sources to prevent false wake events from contact bounce.
Informações de conformidade
RoHS and lead-free per NXP product page. Industrial temperature grade -40C to +125C. Not AEC-Q100 qualified (industrial SBC, not automotive).
