MC34903CS5EK - SBC, LIN, 2x 5V/400mA LDO, 32-SOIC-EP | NXP
부품 번호: MC34903CS5EK ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.4 | $6.40 |
| 10 | $5.76 | $57.60 |
| 100 | $5.12 | $512.00 |
| 500 | $4.61 | $2,305.00 |
| 1,000 | $4.1 | $4,100.00 |
MC34903CS5EK 개요
A System Basis Chip (SBC) is a mixed-signal analog companion IC for a microcontroller that consolidates power, communication, and supervisory functions onto one die. The taxonomy: SBC -> analog companion IC -> power management + transceiver IC -> mixed-signal semiconductor. By co-integrating 5 V LDOs, CAN, and LIN, the SBC eliminates discrete power and interface circuitry, reduces BOM count, and provides unified fault handling through one SPI-controlled status register.
Key features of the MC34903CS5EK include two independent 5.0 V ±2% tracking LDOs delivering up to 400 mA each, a LIN 2.1 physical layer compliant with ISO 9141, a high-speed CAN physical layer compliant with ISO 11898, and configurable 2/3 wakeup pins for low-power sleep/standby modes. The IC supports wide battery supply input from 5.5 V to 28 V (load-dump tolerant in automotive bus variants), low standby current, and an SPI bus for diagnostics and configuration.
The MC34903CS5EK is targeted at industrial CAN/LIN nodes, building automation, HVAC controllers, sensor nodes, and industrial sensor-actuator modules. The wide VIN range directly supports 12 V and 24 V industrial backplanes without additional pre-regulation. End-of-life status makes this part suitable for legacy designs only; new designs should use the recommended NXP replacement (see selection_guide).
When designing with the MC34903CS5EK, ensure the exposed pad is soldered to a sufficient copper area (>= 1 square inch) on inner or top PCB layers to meet the 32-SOIC-EP thermal budget. The LIN/CAN bus pins require external protection (TVS + common-mode choke) per IEC 61000-4-2 for industrial EMC compliance.
This page synthesizes distributor inventory, EOL replacement guidance, and parametric drop-in alternatives - information not bundled in the original manufacturer datasheet.
드롭인 대체품: MC34903CS5EK — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC33903CS5EK
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC33903CP5EK
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC33903BS5EK
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC34903CS5EK/R2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC33904D5EK
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC34903CS5EK 사양
| Product Type | System Basis Chip (SBC) |
| LDO Regulators | 2 x 5.0 V, up to 400 mA each |
| LIN Interface | LIN 2.1 / ISO 9141 compliant |
| CAN Interface | High-speed CAN, ISO 11898 compliant |
| Wakeup Inputs | 2 / 3 configurable wake pins |
| Supply Voltage Range | 5.5 V to 28 V |
| 동작 온도 | -40C to +125C |
| 패키지 | 32-SOIC-EP (exposed pad) |
| 실장 유형 | Surface Mount |
| Configuration Interface | SPI (status + control) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| AEC-Q100 | Not applicable (industrial grade) |
MC34903CS5EK 핀 구성
| 핀 1 | VBAT — Battery supply input (5.5 V to 28 V) |
| 핀 2 | VSUP1 — Switched supply output / sense |
| 핀 3 | VSUP2 — Switched supply output / sense |
| 핀 4 | GND — Ground |
| 핀 5 | VCC1 — 5 V LDO1 output |
| 핀 6 | VCC2 — 5 V LDO2 output |
| 핀 7 | EN1 — LDO1 enable input |
| 핀 8 | EN2 — LDO2 enable input |
| 핀 9 | WAKE1 — Wakeup input 1 |
| 핀 10 | WAKE2 — Wakeup input 2 |
| 핀 11 | WAKE3 — Wakeup input 3 |
| 핀 12 | LIN — LIN bus line |
| 핀 13 | CANH — CAN high line |
| 핀 14 | CANL — CAN low line |
| 핀 15 | CAN_TX — CAN transmit data from MCU |
| 핀 16 | CAN_RX — CAN receive data to MCU |
| 핀 17 | LIN_TX — LIN transmit data from MCU |
| 핀 18 | LIN_RX — LIN receive data to MCU |
| 핀 19 | SCLK — SPI clock from MCU |
| 핀 20 | MOSI — SPI master-out slave-in (data to SBC) |
| 핀 21 | MISO — SPI master-in slave-out (data from SBC) |
| 핀 22 | CS — SPI chip select (active low) |
| 핀 23 | INT — Interrupt output to MCU |
| 핀 24 | RST — Reset output to MCU |
| 핀 25 | TXD — MCU UART TX (alternate mapping) |
| 핀 26 | RXD — MCU UART RX (alternate mapping) |
| 핀 27 | GPIO1 — General purpose I/O |
| 핀 28 | GPIO2 — General purpose I/O |
| 핀 29 | VCC3 — Auxiliary supply rail |
| 핀 30 | NC — Not connected (per datasheet) |
| 핀 31 | NC — Not connected (per datasheet) |
| 핀 32 | EP — Exposed pad - thermal/ground |
일반적인 애플리케이션
MC34903CS5EK 적합 용도: 6 애플리케이션s: Industrial CAN/LIN Gateway Module, Building Automation Controller, Industrial Sensor / Actuator Node, HVAC and Climate Control Module, Industrial Sensor-Actuator Brick, Industrial Pump / Valve Controller.
Industrial CAN/LIN Gateway Module
The MC34903CS5EK is purpose-built for industrial CAN/LIN gateway modules where a single IC must deliver both bus physical layers and the host MCU rails. Its integrated high-speed CAN (ISO 11898) and LIN 2.1 (ISO 9141) interfaces eliminate two discrete transceiver ICs, while the two 5 V / 400 mA LDOs power the host MCU, the CAN isolator, and the sensor front-end from a single VBAT rail. The 5.5 V to 28 V VBAT range directly accepts 12 V and 24 V industrial backplanes without pre-regulation. Designers gain SPI-driven diagnostics and 2/3 wakeup inputs, enabling deterministic sleep/wake transitions that minimize node quiescent current between bus events.
추천
Building Automation Controller
In building automation controllers (HVAC, lighting, access control), the MC34903CS5EK serves as the analog companion to a low-power MCU such as the Kinetis E series. Its two 5 V/400 mA LDOs supply the MCU core, the RS-485 transceiver, and the relay drivers, while the integrated LIN interface connects to peripheral nodes (smart thermostats, blind actuators) that use LIN as the sub-bus. The SPI-based diagnostics register exposes fault flags to the host MCU, supporting predictive maintenance. Industrial -40C to +125C temperature operation ensures reliability in unconditioned electrical closets and rooftop equipment.
추천
Industrial Sensor / Actuator Node
Distributed industrial sensor and actuator nodes use the MC34903CS5EK to minimize PCB area while delivering both bus connectivity and regulated rails. The two integrated 5 V LDOs power the sensor ASIC and the MCU, while the LIN or CAN physical layer carries the node's measurement data back to the gateway. The 2/3 wakeup pins allow the node to remain in deep sleep (low quiescent current) until either a bus message or a sensor interrupt wakes the host. This combination is critical for battery-backed or energy-harvested industrial sensor nodes where quiescent current dominates energy budget.
추천
HVAC and Climate Control Module
HVAC control modules in commercial buildings combine multiple bus interfaces with precise analog rails. The MC34903CS5EK integrates the LIN 2.1 interface for communicating with damper actuators, fan controllers, and zone sensors, while the CAN interface links the module to the central building management system. The two 5 V/400 mA LDO outputs supply the host MCU and the analog front-end for temperature/humidity sensing. SPI-driven fault diagnostics enable rapid service diagnostics in the field. EOL status means new HVAC designs should target the MC33903 successor for long-term supply assurance.
추천
Industrial Sensor-Actuator Brick
Compact 'brick' style industrial modules that combine sensing, computation, and bus interfacing in a sealed enclosure rely on the MC34903CS5EK to deliver both bus connectivity and tightly regulated internal rails. The integrated CAN/LIN physical layers reduce PCB area versus discrete transceiver implementations, while the two LDOs deliver up to 800 mA total to power the host MCU, sensor signal chain, and actuator drivers. The wide 5.5 V to 28 V VBAT range supports direct connection to industrial 24 V backplanes without intermediate regulation, simplifying the brick's power input stage.
추천
Industrial Pump / Valve Controller
Pump and valve controllers in process automation require robust CAN/CANopen communication and tightly regulated MCU rails. The MC34903CS5EK provides the high-speed CAN physical layer for CANopen DS301/DS401 communication with the PLC, while its two 5 V/400 mA LDOs supply the host MCU and the H-bridge driver logic. Industrial -40C to +125C operation ensures reliable behavior in unconditioned field cabinets. The exposed pad on the 32-SOIC-EP package must be soldered to a sufficient copper pour to dissipate internal losses during high bus-activity events.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC34903CS5EK — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC33903CS5EK | MC33903CP5EK | MC33903BS5EK | MC34903CS5EK/R2 | MC33904D5EK |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SOIC-EP | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same |
| LDO Outputs | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA | 2 x 5 V / 400 mA |
| LIN Interface | LIN 2.1 (ISO 9141) | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 |
| CAN Interface | High-speed CAN (ISO 11898) | High-speed CAN | High-speed CAN | High-speed CAN | High-speed CAN | High-speed CAN |
| Wakeup Inputs | 2 / 3 configurable | 2 / 3 | 2 / 3 | 2 / 3 | 2 / 3 | 2 / 3 |
| Supply Voltage Range | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Lifecycle Status | EOL | Active | Active | Active | EOL | Active |
주요 차별점
- Drop-in replacement availability via direct NXP successor (vs MC33903CS5EK)
- Integrated dual-bus physical layer (LIN + CAN) (vs MC34903CS5EK/R2)
- Wide 5.5 V to 28 V battery supply range (vs MC33904D5EK)
설계 노트
The 32-SOIC-EP package's exposed pad MUST be soldered to a copper pour of at least 1 square inch on the top or inner PCB layer. Without this thermal via array, junction temperature can exceed 150C under sustained 800 mA total LDO load (VCC1 + VCC2) plus CAN/LIN bus activity. Tie the exposed pad to the ground plane with at least 9 thermal vias (0.3 mm drill, 1 oz copper plating) for best thermal performance.
Place VCC1 and VCC2 decoupling capacitors (1 uF X7R minimum, 10 uF recommended) within 2 mm of the respective LDO output pins. The VBAT pin requires a 10 uF bulk capacitor plus a 100 nF high-frequency bypass. Keep the LIN and CAN bus traces short and route them away from switching nodes to minimize EMI coupling into the bus physical layers. Add a TVS diode (e.g., SMAJ33CA) and common-mode choke on the bus connector for IEC 61000-4-2 ESD compliance.
Do not exceed VBAT = 28 V (load-dump tolerant variants only) - verify the specific variant's absolute maximum rating before applying inductive load transients. The SPI chip-select pin must be pulled high during MCU reset to prevent spurious writes to the SBC's configuration registers. The WAKE pins are edge-sensitive; add RC filtering (10 kohm + 100 nF) on mechanical-switch sources to prevent false wake events from contact bounce.
규정 준수 정보
RoHS and lead-free per NXP product page. Industrial temperature grade -40C to +125C. Not AEC-Q100 qualified (industrial SBC, not automotive).
