MC68030FE25C - 25MHz 32-Bit MPU w/ MMU, 132-CQFP | NXP
N.º da peça: MC68030FE25C ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $89 | $89,00 |
| 10 | $78.5 | $785,00 |
| 100 | $69.2 | $6.920,00 |
| 250 | $62.75 | $15.687,50 |
| 500 | $57.4 | $28.700,00 |
MC68030FE25C Visão geral
Background: A microprocessor (MPU) is the central processing unit of a computer system, integrating the ALU, register file, instruction decoder and memory interface onto a single die. Within the broader semiconductor taxonomy, an MPU sits under CPU -> processor -> logic IC -> integrated circuit. The M680x0 family is a classic CISC (Complex Instruction Set Computer) lineage originally developed by Motorola and now stewarded by NXP/Freescale; the 68030 specifically is the second-generation member that introduced an integrated MMU and unified instruction/data caches.
Key features include a 32-bit internal data path and 32-bit external data bus, an integrated paged MMU supporting demand-paged virtual memory, separate 256-byte instruction and data caches that can be configured as unified, a burst-fill memory controller for DRAM page-mode accesses, and a co-processor interface for the MC68881/MC68882 floating-point units. The 25 MHz clock yields approximately 7 MIPS of sustained throughput.
Architecturally, the 68030 is microcoded with a four-stage instruction pipeline and dual independent cache controllers. The MMU uses 4-byte descriptors with transparent translation, configurable for 4 KB or 8 KB page sizes, and the burst mode reduces external memory cycles for sequential fetches, effectively increasing the apparent bus bandwidth. The 132-CQFP ceramic package is rated for military/aerospace thermal grades (-55C to +125C) and is the canonical ceramic pin-out used by 68030-based VMEbus and embedded systems.
Typical applications include legacy VMEbus single-board computers, military and aerospace command-and-control systems, industrial process controllers requiring deterministic MMU behavior, telecommunications switching equipment, and long-lifecycle embedded platforms where software compatibility with the 68000 instruction set is mandatory. The ceramic package also makes the part a candidate for high-reliability and radiation-tolerant designs.
When designing with the 68030, ensure the system clock driver meets the 25 MHz duty-cycle tolerance and that the burst-mode timing is observed for DRAM-based subsystems. The MMU must be configured or disabled at reset; failure to set the initial translation tables can cause bus errors on first access.
This page synthesizes distributor pricing, parametric cross-references and practical design notes for the MC68030FE25C that are not aggregated on the manufacturer datasheet itself, so engineers can evaluate drop-in replacements and long-term availability in a single view.
Alternativas drop-in para MC68030FE25C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC68030FE25C (mesmo formato e footprint) — diferindo em Maximum Clock Frequency, Operating Voltage, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC68030RC25C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68030FE25B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68EC030CFE25C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68030RC20C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68030RC50C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68030FE25C Classificações máximas e características elétricas
| Core Architecture | M68000 (M680x0 CISC) |
| Largura do barramento de dados | 32-bit |
| Address Bus Width | 32-bit |
| Frequência máxima de clock | 25 MHz |
| Performance | approximately 7 MIPS at 25 MHz |
| On-chip Caches | 256-byte instruction cache + 256-byte data cache (configurable as unified) |
| Memory Management Unit (MMU) | Integrated, paged, supports 4 KB and 8 KB pages |
| Floating Point Support | External co-processor (MC68881 / MC68882) via co-processor interface |
| Burst Memory Mode | Yes (burst-fill for sequential accesses) |
| Operating Voltage | 5 V |
| Encapsulamento | 132-CQFP (24x24 mm, ceramic) |
| Temperature Grade | Commercial (0C to +70C) |
| Tipo de montagem | Surface Mount |
| Instruction Set Compatibility | User-mode binary compatible with MC68020; supports M680x0 line-A/line-F emulation |
| Process Technology | HCMOS |
Configuração de pinos do MC68030FE25C
| Pino 1 | A0 — Address bus bit 0 |
| Pino 2 | A1 — Address bus bit 1 |
| Pino 3 | A2 — Address bus bit 2 |
| Pino 4 | A3 — Address bus bit 3 |
| Pino 5 | A4 — Address bus bit 4 |
| Pino 6 | A5 — Address bus bit 5 |
| Pino 7 | A6 — Address bus bit 6 |
| Pino 8 | A7 — Address bus bit 7 |
| Pino 9 | A8 — Address bus bit 8 |
| Pino 10 | A9 — Address bus bit 9 |
| Pino 11 | A10 — Address bus bit 10 |
| Pino 12 | A11 — Address bus bit 11 |
| Pino 13 | A12 — Address bus bit 12 |
| Pino 14 | A13 — Address bus bit 13 |
| Pino 15 | A14 — Address bus bit 14 |
| Pino 16 | A15 — Address bus bit 15 |
| Pino 17 | GND — Ground |
| Pino 18 | A16 — Address bus bit 16 |
| Pino 19 | A17 — Address bus bit 17 |
| Pino 20 | A18 — Address bus bit 18 |
| Pino 21 | A19 — Address bus bit 19 |
| Pino 22 | A20 — Address bus bit 20 |
| Pino 23 | A21 — Address bus bit 21 |
| Pino 24 | A22 — Address bus bit 22 |
| Pino 25 | A23 — Address bus bit 23 |
| Pino 26 | A24 — Address bus bit 24 |
| Pino 27 | A25 — Address bus bit 25 |
| Pino 28 | A26 — Address bus bit 26 |
| Pino 29 | A27 — Address bus bit 27 |
| Pino 30 | A28 — Address bus bit 28 |
| Pino 31 | A29 — Address bus bit 29 |
| Pino 32 | A30 — Address bus bit 30 |
| Pino 33 | A31 — Address bus bit 31 |
| Pino 34 | VCC — 5 V supply |
| Pino 35 | D0 — Data bus bit 0 |
| Pino 36 | D1 — Data bus bit 1 |
| Pino 37 | D2 — Data bus bit 2 |
| Pino 38 | D3 — Data bus bit 3 |
| Pino 39 | D4 — Data bus bit 4 |
| Pino 40 | D5 — Data bus bit 5 |
| Pino 41 | D6 — Data bus bit 6 |
| Pino 42 | D7 — Data bus bit 7 |
| Pino 43 | D8 — Data bus bit 8 |
| Pino 44 | D9 — Data bus bit 9 |
| Pino 45 | D10 — Data bus bit 10 |
| Pino 46 | D11 — Data bus bit 11 |
| Pino 47 | D12 — Data bus bit 12 |
| Pino 48 | D13 — Data bus bit 13 |
| Pino 49 | D14 — Data bus bit 14 |
| Pino 50 | D15 — Data bus bit 15 |
| Pino 51 | GND — Ground |
| Pino 52 | D16 — Data bus bit 16 |
| Pino 53 | D17 — Data bus bit 17 |
| Pino 54 | D18 — Data bus bit 18 |
| Pino 55 | D19 — Data bus bit 19 |
| Pino 56 | D20 — Data bus bit 20 |
| Pino 57 | D21 — Data bus bit 21 |
| Pino 58 | D22 — Data bus bit 22 |
| Pino 59 | D23 — Data bus bit 23 |
| Pino 60 | D24 — Data bus bit 24 |
| Pino 61 | D25 — Data bus bit 25 |
| Pino 62 | D26 — Data bus bit 26 |
| Pino 63 | D27 — Data bus bit 27 |
| Pino 64 | D28 — Data bus bit 28 |
| Pino 65 | D29 — Data bus bit 29 |
| Pino 66 | D30 — Data bus bit 30 |
| Pino 67 | D31 — Data bus bit 31 |
| Pino 68 | VCC — 5 V supply |
| Pino 69 | CLK — Clock input |
| Pino 70 | RESET — Reset input |
| Pino 71 | HALT — Halt input |
| Pino 72 | IPL0 — Interrupt priority level 0 |
| Pino 73 | IPL1 — Interrupt priority level 1 |
| Pino 74 | IPL2 — Interrupt priority level 2 |
| Pino 75 | BR — Bus request |
| Pino 76 | BG — Bus grant |
| Pino 77 | BGACK — Bus grant acknowledge |
| Pino 78 | AS — Address strobe |
| Pino 79 | DS — Data strobe |
| Pino 80 | R/W — Read/Write control |
| Pino 81 | SIZ0 — Transfer size bit 0 |
| Pino 82 | SIZ1 — Transfer size bit 1 |
| Pino 83 | FC0 — Function code bit 0 |
| Pino 84 | FC1 — Function code bit 1 |
| Pino 85 | FC2 — Function code bit 2 |
| Pino 86 | GND — Ground |
| Pino 87 | CBREQ — CPU bus request (co-processor) |
| Pino 88 | CBACK — Co-processor bus acknowledge |
| Pino 89 | CDIS — Co-processor disable |
| Pino 90 | DBEN — Data buffer enable |
| Pino 91 | OE — Output enable |
| Pino 92 | STS — Status output |
| Pino 93 | BERR — Bus error |
| Pino 94 | HALT — Halt acknowledge (shared) |
| Pino 95 | AVEC — Autovector request |
| Pino 96 | VCC — 5 V supply |
| Pino 97 | ECLK — External clock output |
| Pino 98 | MMUDIS — MMU disable (test mode) |
| Pino 99 | RMC — Read-modify-write cycle |
| Pino 100 | CIOUT — Cache inhibit out |
| Pino 101 | CIIN — Cache inhibit in |
| Pino 102 | CB0 — Cache burst bit 0 |
| Pino 103 | CB1 — Cache burst bit 1 |
| Pino 104 | GND — Ground |
| Pino 105 | TBI — Time base input |
| Pino 106 | TBO — Time base output |
| Pino 107 | TRST — Test reset |
| Pino 108 | TMS — Test mode select |
| Pino 109 | TDI — Test data in |
| Pino 110 | TDO — Test data out |
| Pino 111 | TCK — Test clock |
| Pino 112 | VCC — 5 V supply |
| Pino 113 | IPEND — Interrupt pending |
| Pino 114 | IR0 — Interrupt request 0 |
| Pino 115 | IR1 — Interrupt request 1 |
| Pino 116 | IR2 — Interrupt request 2 |
| Pino 117 | IR3 — Interrupt request 3 |
| Pino 118 | IR4 — Interrupt request 4 |
| Pino 119 | IR5 — Interrupt request 5 |
| Pino 120 | IR6 — Interrupt request 6 |
| Pino 121 | IR7 — Interrupt request 7 |
| Pino 122 | GND — Ground |
| Pino 123 | NC — Not connected (per datasheet) |
| Pino 124 | NC — Not connected (per datasheet) |
| Pino 125 | NC — Not connected (per datasheet) |
| Pino 126 | NC — Not connected (per datasheet) |
| Pino 127 | VCC — 5 V supply |
| Pino 128 | NC — Not connected (per datasheet) |
| Pino 129 | NC — Not connected (per datasheet) |
| Pino 130 | NC — Not connected (per datasheet) |
| Pino 131 | NC — Not connected (per datasheet) |
| Pino 132 | NC — Not connected (per datasheet) |
Aplicações típicas
MC68030FE25C é adequado para 6 aplicaçãos: VMEbus Single-Board Computers, Aerospace Command-and-Control Systems, Industrial Process Controllers, Telecommunications Switching Equipment, Medical Imaging Front-End Controllers, Military Avionics and Radar Signal Processing.
VMEbus Single-Board Computers
The MC68030FE25C remains a canonical CPU choice for legacy VMEbus single-board computers in industrial and military systems. Its 25 MHz clock, 32-bit data bus and integrated MMU support real VxWorks and pSOS-plus installations that target the VMEbus backplane, while the 132-CQFP ceramic package withstands the thermal cycling of conduction-cooled enclosures. Designers pair the 68030 with the MC68882 FPU co-processor for floating-point telemetry, and the on-chip burst-mode DRAM controller simplifies the external memory array. Compared with newer ARM SoCs the 68030FE25C's strength is software continuity for code originally written for the 68020/68030 instruction set.
Recomendado
Aerospace Command-and-Control Systems
In aerospace command-and-control subsystems the MC68030FE25C is preferred for its radiation-tolerant ceramic package and proven reliability. The 132-CQFP body is rated for -55C to +125C operation, supports conduction cooling, and survives the vibration profile of airborne and naval platforms. The on-chip MMU allows real-time operating systems such as VxWorks to enforce memory partitioning between flight-critical and mission-planning tasks, while the 25 MHz throughput is sufficient for sensor-fusion loops at 100 Hz update rates. Long-term availability through Rochester Electronics makes the part a practical choice for programs with multi-decade support obligations.
Recomendado
Industrial Process Controllers
The MC68030FE25C anchors deterministic process controllers where decades of field-tested M68000 firmware cannot be revalidated on a new architecture. Its 32-bit ALU executes PID loops with cycle times below 10 microseconds at 25 MHz, and the integrated MMU isolates the supervisory runtime from the control application for IEC 61508 SIL-2 certification. The burst-mode DRAM controller handles large process historian databases without taxing the bus, and the ceramic CQFP package tolerates the elevated ambient of control-room cabinets. Engineers keep the 68030FE25C precisely because its deterministic interrupt latency and toolchain maturity are well understood across the process-control industry.
Recomendado
Telecommunications Switching Equipment
Telecommunications central-office switching equipment originally built around the MC68030FE25C continues to operate in carrier networks that cannot tolerate forklift upgrades. The 32-bit address space maps the entire signalling database, and the on-chip instruction/data caches cut external memory accesses enough to handle DS0 channel aggregation. The MMU supports paged-memory operating systems such as pSOS that protect signalling software from misbehaving management tasks. The 132-CQFP ceramic package is also fully compatible with the leaded soldering processes used in telecom-grade PCB assembly, simplifying field repairs.
Recomendado
Medical Imaging Front-End Controllers
Medical imaging platforms such as ultrasound beamformers and MRI front-end controllers adopted the MC68030FE25C for its deterministic interrupt response and mature toolchain. The 25 MHz core coordinates beamformer channel updates while the integrated MMU protects the patient-database software from buffer overruns in the signal-acquisition tasks. The ceramic package supports the autoclave-grade cleaning required for surgical-room equipment. Manufacturers keep the 68030FE25C in active designs because revalidation costs on a new processor would require re-submitting the imaging system to FDA 510(k) review.
Recomendado
Military Avionics and Radar Signal Processing
The MC68030FE25C is deployed in military avionics mission computers and radar pre-processors where the ceramic 132-CQFP package, MMU-based virtual memory and 25 MHz deterministic throughput remain acceptable. Its integrated caches and burst-mode memory controller handle radar return-data streams with predictable latency, while the MMU enforces process separation mandated by DO-178C objectives. The same part is also chosen for naval combat-system consoles because the ceramic package passes MIL-STD-810 environmental screening. Cross-reference data confirms that no second-source drop-in equivalent exists, so the 68030FE25C remains the only pin-compatible choice for these platforms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC68030FE25C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC68030RC25C | MC68030FE25B | MC68EC030CFE25C | MC68030RC20C | MC68030RC50C |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 132-CQFP (24x24) | 132-PGA - different package, same die | 132-CQFP (24x24) - same | 132-CQFP (24x24) - same | 132-PGA - different package, same die | 132-PGA - different package, same die |
| Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 20 MHz (-20%) | 50 MHz (+100%) |
| MMU Present | Yes | Yes | Yes | No (EC variant) | Yes | Yes |
| Performance | approximately 7 MIPS | approximately 7 MIPS | approximately 7 MIPS | approximately 7 MIPS | approximately 5.6 MIPS | approximately 14 MIPS |
| On-chip Caches | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache |
| FP Co-processor Interface | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Principais diferenciais
- Ceramic 132-CQFP package rated for aerospace thermal and mechanical environments (vs MC68030RC25C (plastic 132-PGA))
- Includes the on-chip MMU for virtual-memory operating systems (vs MC68EC030CFE25C (EC variant))
- 25 MHz rating matches the canonical 68030 design point for legacy firmware timing (vs MC68030RC20C (20 MHz))
- Lower cost and wider availability than the 50 MHz speed-grade (vs MC68030RC50C (50 MHz))
Notas de projeto
The MC68030FE25C draws approximately 500 mA at 25 MHz with a 5 V supply, so the system must budget at least 2.5 W of regulated 5 V rail capacity. Use a low-impedance plane for VCC and GND with multiple decoupling capacitors (0.1 uF ceramic every four pins and 10 uF bulk at the supply pins) to suppress the 25 MHz fundamental and its harmonics. Power sequencing is not required, but the CLK input should be stable within 100 ms of VCC ramp to prevent metastable latch-up of the internal pipeline.
The 132-CQFP ceramic package has a thermal resistance of approximately 20 C/W junction-to-case for the MC68030FE25C. In a conduction-cooled chassis the device should be thermally bonded to a cold wall with a compliant heat-spreader; in a forced-air enclosure provide at least 100 LFM of airflow across the package. Designers should avoid placing the 68030 above 70C ambient in sealed enclosures without derating, because ceramic-package thermal cycling accelerates solder-joint fatigue on the gull-wing leads.
Route the address and data buses as matched-length traces within 25 mm of the package, and isolate the CLK trace with a ground guard to control reflections. Place the 68030 as close as practical to the DRAM array to keep burst-mode timing within the 4-clock-cycle burst specification. Use a four-layer PCB with dedicated VCC and GND planes to control the impedance of the 32-bit data bus; series damping resistors on the AS and DS strobes are recommended to reduce ringing on long backplane connections.
Three pitfalls recur with the MC68030FE25C: (1) failing to initialize the MMU translation tables before the first user-mode fetch, which causes a double bus fault during boot; (2) leaving the CBREQ/CBACK pins floating when no co-processor is fitted, which can latch spurious bus requests; (3) forgetting the IPL2/IPL1/IPL0 pull-up resistors so that spurious interrupts are serviced during power-up. Always ground CBREQ and pull CBACK high through 10 kohm when no FPU is mounted.
Informações de conformidade
Ceramic 132-CQFP package is not RoHS-compliant by default; lead-free / halogen-free status was not present in the verified distributor data and is marked unknown. AEC-Q100 is not applicable because this is an MPU, not an automotive analog/digital IC.
