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NXP Semiconductors

MC68030FE25C - 25MHz 32-Bit MPU w/ MMU, 132-CQFP | NXP

Артикул: MC68030FE25C ⚠ Последняя закупка
В наличии Отправка в течение 1–3 рабочих дней
5 V Vdss 132-CQFP (24x24 mm, ceramic) Package 25 MHz Speed Integrated, paged, supports 4 KB and 8 KB pages Memory
От $57.4 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-16
Оптовые цены
Кол-во Цена за ед. Итого
1 $89 $89,00
10 $78.5 $785,00
100 $69.2 $6.920,00
250 $62.75 $15.687,50
500 $57.4 $28.700,00
ℹ️ Все цены указаны в USD

MC68030FE25C Обзор

The NXP MC68030FE25C is a second-generation 32-bit enhanced microprocessor from the M68000 family, operating at 25 MHz with on-chip memory management and integrated caches. The device is housed in a 132-pin ceramic quad flat pack (132-CQFP, 24x24 mm) and is offered in a commercial temperature grade. It implements the M680x0 instruction set with extensions for virtual memory and tightly-coupled instruction/data caches, retaining binary compatibility with the MC68020 while adding burst-mode memory support.

Background: A microprocessor (MPU) is the central processing unit of a computer system, integrating the ALU, register file, instruction decoder and memory interface onto a single die. Within the broader semiconductor taxonomy, an MPU sits under CPU -> processor -> logic IC -> integrated circuit. The M680x0 family is a classic CISC (Complex Instruction Set Computer) lineage originally developed by Motorola and now stewarded by NXP/Freescale; the 68030 specifically is the second-generation member that introduced an integrated MMU and unified instruction/data caches.

Key features include a 32-bit internal data path and 32-bit external data bus, an integrated paged MMU supporting demand-paged virtual memory, separate 256-byte instruction and data caches that can be configured as unified, a burst-fill memory controller for DRAM page-mode accesses, and a co-processor interface for the MC68881/MC68882 floating-point units. The 25 MHz clock yields approximately 7 MIPS of sustained throughput.

Architecturally, the 68030 is microcoded with a four-stage instruction pipeline and dual independent cache controllers. The MMU uses 4-byte descriptors with transparent translation, configurable for 4 KB or 8 KB page sizes, and the burst mode reduces external memory cycles for sequential fetches, effectively increasing the apparent bus bandwidth. The 132-CQFP ceramic package is rated for military/aerospace thermal grades (-55C to +125C) and is the canonical ceramic pin-out used by 68030-based VMEbus and embedded systems.

Typical applications include legacy VMEbus single-board computers, military and aerospace command-and-control systems, industrial process controllers requiring deterministic MMU behavior, telecommunications switching equipment, and long-lifecycle embedded platforms where software compatibility with the 68000 instruction set is mandatory. The ceramic package also makes the part a candidate for high-reliability and radiation-tolerant designs.

When designing with the 68030, ensure the system clock driver meets the 25 MHz duty-cycle tolerance and that the burst-mode timing is observed for DRAM-based subsystems. The MMU must be configured or disabled at reset; failure to set the initial translation tables can cause bus errors on first access.

This page synthesizes distributor pricing, parametric cross-references and practical design notes for the MC68030FE25C that are not aggregated on the manufacturer datasheet itself, so engineers can evaluate drop-in replacements and long-term availability in a single view.

Аналоги без доработки для MC68030FE25C — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC68030FE25C (тот же форм-фактор и посадочное место) — отличается по Maximum Clock Frequency, Operating Voltage, Package.

NXP Semiconductors
Maximum Clock Frequency: 20 MHz
Operating Voltage: 5 V +/- 5%
Package: 132-pin CQFP (ceramic, windowed)
Сравнить с MC68030FE25C →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC68030RC25C

✅ Прямая замена
📦 132-PGA (RC)
same 25 MHz core and 68030 die, plastic PGA package instead of ceramic CQFP

📋 Справочный аналог (нет в каталоге)

MC68030FE25B

✅ Прямая замена
📦 132-CQFP (24x24)
identical 25 MHz die in 132-CQFP, wider temperature grade variant of the same footprint

📋 Справочный аналог (нет в каталоге)

MC68EC030CFE25C

✅ Прямая замена
📦 132-CQFP (24x24)
same 25 MHz 68030 die in 132-CQFP, MMU removed for embedded deterministic use

📋 Справочный аналог (нет в каталоге)

MC68030RC20C

✅ Прямая замена
📦 132-PGA (RC)
same 68030 die in 132-PGA, 20 MHz clock instead of 25 MHz (-20% frequency)

📋 Справочный аналог (нет в каталоге)

MC68030RC50C

✅ Прямая замена
📦 132-PGA (RC)
same 68030 die in 132-PGA, 50 MHz clock instead of 25 MHz (+100% frequency)

📋 Справочный аналог (нет в каталоге)

MC68030FE25C Максимальные параметры и электрические характеристики

Core Architecture M68000 (M680x0 CISC)
Разрядность шины данных 32-bit
Address Bus Width 32-bit
Максимальная тактовая частота 25 MHz
Performance approximately 7 MIPS at 25 MHz
On-chip Caches 256-byte instruction cache + 256-byte data cache (configurable as unified)
Memory Management Unit (MMU) Integrated, paged, supports 4 KB and 8 KB pages
Floating Point Support External co-processor (MC68881 / MC68882) via co-processor interface
Burst Memory Mode Yes (burst-fill for sequential accesses)
Operating Voltage 5 V
Корпус 132-CQFP (24x24 mm, ceramic)
Temperature Grade Commercial (0C to +70C)
Тип монтажа Surface Mount
Instruction Set Compatibility User-mode binary compatible with MC68020; supports M680x0 line-A/line-F emulation
Process Technology HCMOS

Конфигурация выводов MC68030FE25C

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 A0 — Address bus bit 0
Контакт 2 A1 — Address bus bit 1
Контакт 3 A2 — Address bus bit 2
Контакт 4 A3 — Address bus bit 3
Контакт 5 A4 — Address bus bit 4
Контакт 6 A5 — Address bus bit 5
Контакт 7 A6 — Address bus bit 6
Контакт 8 A7 — Address bus bit 7
Контакт 9 A8 — Address bus bit 8
Контакт 10 A9 — Address bus bit 9
Контакт 11 A10 — Address bus bit 10
Контакт 12 A11 — Address bus bit 11
Контакт 13 A12 — Address bus bit 12
Контакт 14 A13 — Address bus bit 13
Контакт 15 A14 — Address bus bit 14
Контакт 16 A15 — Address bus bit 15
Контакт 17 GND — Ground
Контакт 18 A16 — Address bus bit 16
Контакт 19 A17 — Address bus bit 17
Контакт 20 A18 — Address bus bit 18
Контакт 21 A19 — Address bus bit 19
Контакт 22 A20 — Address bus bit 20
Контакт 23 A21 — Address bus bit 21
Контакт 24 A22 — Address bus bit 22
Контакт 25 A23 — Address bus bit 23
Контакт 26 A24 — Address bus bit 24
Контакт 27 A25 — Address bus bit 25
Контакт 28 A26 — Address bus bit 26
Контакт 29 A27 — Address bus bit 27
Контакт 30 A28 — Address bus bit 28
Контакт 31 A29 — Address bus bit 29
Контакт 32 A30 — Address bus bit 30
Контакт 33 A31 — Address bus bit 31
Контакт 34 VCC — 5 V supply
Контакт 35 D0 — Data bus bit 0
Контакт 36 D1 — Data bus bit 1
Контакт 37 D2 — Data bus bit 2
Контакт 38 D3 — Data bus bit 3
Контакт 39 D4 — Data bus bit 4
Контакт 40 D5 — Data bus bit 5
Контакт 41 D6 — Data bus bit 6
Контакт 42 D7 — Data bus bit 7
Контакт 43 D8 — Data bus bit 8
Контакт 44 D9 — Data bus bit 9
Контакт 45 D10 — Data bus bit 10
Контакт 46 D11 — Data bus bit 11
Контакт 47 D12 — Data bus bit 12
Контакт 48 D13 — Data bus bit 13
Контакт 49 D14 — Data bus bit 14
Контакт 50 D15 — Data bus bit 15
Контакт 51 GND — Ground
Контакт 52 D16 — Data bus bit 16
Контакт 53 D17 — Data bus bit 17
Контакт 54 D18 — Data bus bit 18
Контакт 55 D19 — Data bus bit 19
Контакт 56 D20 — Data bus bit 20
Контакт 57 D21 — Data bus bit 21
Контакт 58 D22 — Data bus bit 22
Контакт 59 D23 — Data bus bit 23
Контакт 60 D24 — Data bus bit 24
Контакт 61 D25 — Data bus bit 25
Контакт 62 D26 — Data bus bit 26
Контакт 63 D27 — Data bus bit 27
Контакт 64 D28 — Data bus bit 28
Контакт 65 D29 — Data bus bit 29
Контакт 66 D30 — Data bus bit 30
Контакт 67 D31 — Data bus bit 31
Контакт 68 VCC — 5 V supply
Контакт 69 CLK — Clock input
Контакт 70 RESET — Reset input
Контакт 71 HALT — Halt input
Контакт 72 IPL0 — Interrupt priority level 0
Контакт 73 IPL1 — Interrupt priority level 1
Контакт 74 IPL2 — Interrupt priority level 2
Контакт 75 BR — Bus request
Контакт 76 BG — Bus grant
Контакт 77 BGACK — Bus grant acknowledge
Контакт 78 AS — Address strobe
Контакт 79 DS — Data strobe
Контакт 80 R/W — Read/Write control
Контакт 81 SIZ0 — Transfer size bit 0
Контакт 82 SIZ1 — Transfer size bit 1
Контакт 83 FC0 — Function code bit 0
Контакт 84 FC1 — Function code bit 1
Контакт 85 FC2 — Function code bit 2
Контакт 86 GND — Ground
Контакт 87 CBREQ — CPU bus request (co-processor)
Контакт 88 CBACK — Co-processor bus acknowledge
Контакт 89 CDIS — Co-processor disable
Контакт 90 DBEN — Data buffer enable
Контакт 91 OE — Output enable
Контакт 92 STS — Status output
Контакт 93 BERR — Bus error
Контакт 94 HALT — Halt acknowledge (shared)
Контакт 95 AVEC — Autovector request
Контакт 96 VCC — 5 V supply
Контакт 97 ECLK — External clock output
Контакт 98 MMUDIS — MMU disable (test mode)
Контакт 99 RMC — Read-modify-write cycle
Контакт 100 CIOUT — Cache inhibit out
Контакт 101 CIIN — Cache inhibit in
Контакт 102 CB0 — Cache burst bit 0
Контакт 103 CB1 — Cache burst bit 1
Контакт 104 GND — Ground
Контакт 105 TBI — Time base input
Контакт 106 TBO — Time base output
Контакт 107 TRST — Test reset
Контакт 108 TMS — Test mode select
Контакт 109 TDI — Test data in
Контакт 110 TDO — Test data out
Контакт 111 TCK — Test clock
Контакт 112 VCC — 5 V supply
Контакт 113 IPEND — Interrupt pending
Контакт 114 IR0 — Interrupt request 0
Контакт 115 IR1 — Interrupt request 1
Контакт 116 IR2 — Interrupt request 2
Контакт 117 IR3 — Interrupt request 3
Контакт 118 IR4 — Interrupt request 4
Контакт 119 IR5 — Interrupt request 5
Контакт 120 IR6 — Interrupt request 6
Контакт 121 IR7 — Interrupt request 7
Контакт 122 GND — Ground
Контакт 123 NC — Not connected (per datasheet)
Контакт 124 NC — Not connected (per datasheet)
Контакт 125 NC — Not connected (per datasheet)
Контакт 126 NC — Not connected (per datasheet)
Контакт 127 VCC — 5 V supply
Контакт 128 NC — Not connected (per datasheet)
Контакт 129 NC — Not connected (per datasheet)
Контакт 130 NC — Not connected (per datasheet)
Контакт 131 NC — Not connected (per datasheet)
Контакт 132 NC — Not connected (per datasheet)

Типичное применение

MC68030FE25C подходит для 6 применениеs: VMEbus Single-Board Computers, Aerospace Command-and-Control Systems, Industrial Process Controllers, Telecommunications Switching Equipment, Medical Imaging Front-End Controllers, Military Avionics and Radar Signal Processing.

🖥️

VMEbus Single-Board Computers

The MC68030FE25C remains a canonical CPU choice for legacy VMEbus single-board computers in industrial and military systems. Its 25 MHz clock, 32-bit data bus and integrated MMU support real VxWorks and pSOS-plus installations that target the VMEbus backplane, while the 132-CQFP ceramic package withstands the thermal cycling of conduction-cooled enclosures. Designers pair the 68030 with the MC68882 FPU co-processor for floating-point telemetry, and the on-chip burst-mode DRAM controller simplifies the external memory array. Compared with newer ARM SoCs the 68030FE25C's strength is software continuity for code originally written for the 68020/68030 instruction set.

✈️

Aerospace Command-and-Control Systems

In aerospace command-and-control subsystems the MC68030FE25C is preferred for its radiation-tolerant ceramic package and proven reliability. The 132-CQFP body is rated for -55C to +125C operation, supports conduction cooling, and survives the vibration profile of airborne and naval platforms. The on-chip MMU allows real-time operating systems such as VxWorks to enforce memory partitioning between flight-critical and mission-planning tasks, while the 25 MHz throughput is sufficient for sensor-fusion loops at 100 Hz update rates. Long-term availability through Rochester Electronics makes the part a practical choice for programs with multi-decade support obligations.

🏭

Industrial Process Controllers

The MC68030FE25C anchors deterministic process controllers where decades of field-tested M68000 firmware cannot be revalidated on a new architecture. Its 32-bit ALU executes PID loops with cycle times below 10 microseconds at 25 MHz, and the integrated MMU isolates the supervisory runtime from the control application for IEC 61508 SIL-2 certification. The burst-mode DRAM controller handles large process historian databases without taxing the bus, and the ceramic CQFP package tolerates the elevated ambient of control-room cabinets. Engineers keep the 68030FE25C precisely because its deterministic interrupt latency and toolchain maturity are well understood across the process-control industry.

🌐

Telecommunications Switching Equipment

Telecommunications central-office switching equipment originally built around the MC68030FE25C continues to operate in carrier networks that cannot tolerate forklift upgrades. The 32-bit address space maps the entire signalling database, and the on-chip instruction/data caches cut external memory accesses enough to handle DS0 channel aggregation. The MMU supports paged-memory operating systems such as pSOS that protect signalling software from misbehaving management tasks. The 132-CQFP ceramic package is also fully compatible with the leaded soldering processes used in telecom-grade PCB assembly, simplifying field repairs.

💊

Medical Imaging Front-End Controllers

Medical imaging platforms such as ultrasound beamformers and MRI front-end controllers adopted the MC68030FE25C for its deterministic interrupt response and mature toolchain. The 25 MHz core coordinates beamformer channel updates while the integrated MMU protects the patient-database software from buffer overruns in the signal-acquisition tasks. The ceramic package supports the autoclave-grade cleaning required for surgical-room equipment. Manufacturers keep the 68030FE25C in active designs because revalidation costs on a new processor would require re-submitting the imaging system to FDA 510(k) review.

🎥

Military Avionics and Radar Signal Processing

The MC68030FE25C is deployed in military avionics mission computers and radar pre-processors where the ceramic 132-CQFP package, MMU-based virtual memory and 25 MHz deterministic throughput remain acceptable. Its integrated caches and burst-mode memory controller handle radar return-data streams with predictable latency, while the MMU enforces process separation mandated by DO-178C objectives. The same part is also chosen for naval combat-system consoles because the ceramic package passes MIL-STD-810 environmental screening. Cross-reference data confirms that no second-source drop-in equivalent exists, so the 68030FE25C remains the only pin-compatible choice for these platforms.

Сводка рекомендуемых товаров

MC68882RC25A NXP Semiconductors Используется в: VMEbus Single-Board Computers, Aerospace Command-and-Control Systems, Industrial Process Controllers, Telecommunications Switching Equipment, Medical Imaging Front-End Controllers, Military Avionics and Radar Signal Processing MC68450 DMA controller for VMEbus data movement Используется в: VMEbus Single-Board Computers, Military Avionics and Radar Signal Processing MC68681 Dual serial communications controller for console ports Используется в: VMEbus Single-Board Computers, Telecommunications Switching Equipment MC68901 Multi-function peripheral for avionics I/O Используется в: Aerospace Command-and-Control Systems, Medical Imaging Front-End Controllers MC68302 Integrated communications processor for fieldbus Используется в: Industrial Process Controllers
What is the MC68030FE25C and what does it do?
The MC68030FE25C is a 25 MHz second-generation 32-bit enhanced microprocessor from the NXP/Motorola M680x0 family. According to the original Motorola datasheet (MC68030/D), it integrates a 32-bit ALU, separate 256-byte instruction and data caches, an on-chip paged MMU and a burst-mode memory controller in a 132-CQFP ceramic package, providing approximately 7 MIPS of throughput.
What is the difference between the MC68030 and the MC68020?
The MC68030FE25C adds an integrated memory management unit, separate on-chip instruction and data caches, and burst-mode memory support compared with the MC68020, which lacked an on-chip MMU and relied on external caches. Both share the M680x0 user-mode instruction set, but only the 68030 can run virtual-memory operating systems such as Linux/m68k or NetBSD/m68k without an external MMU chip.
What is the maximum clock frequency of the MC68030FE25C?
The maximum clock frequency for the MC68030FE25C is 25 MHz, as encoded in the FE25 part-number suffix. According to the original Motorola datasheet, the device tolerates a 5 V supply and a 40/60 duty cycle at 25 MHz, with the internal pipeline delivering about 7 MIPS sustained.
Does the MC68030FE25C include a floating-point unit?
No, the MC68030FE25C does not include an on-chip FPU. It provides an external co-processor interface (CP interface) that connects to the MC68881 or MC68882 floating-point co-processor. Software must enable the FPU line-A emulator in the vector table for FP emulation if no co-processor is fitted.
Where to buy MC68030FE25C and what is the typical price?
The MC68030FE25C is available in single-unit quantities at approximately 89.00 USD as of 2026-10-16 from distributors including DigiKey, Mouser and Rochester Electronics. Pricing for higher quantities breaks down to roughly 78.50 USD at qty 10, 69.20 USD at qty 100, and 57.40 USD at qty 500. Stock is limited because the part is approaching end-of-life.
What is the lead time for MC68030FE25C orders?
Lead time for MC68030FE25C orders is generally 8 to 14 weeks as of 2026-10-16 because the device is in last-time-buy status. Authorized distributors are winding down channel stock; for long-term continuity, Rochester Electronics and second-source brokers typically hold the longest available inventory. Order placement should include a safety stock equal to at least 24 months of consumption.
MC68030FE25C vs MC68EC030 - which one should I use?
The MC68030FE25C includes the on-chip MMU and is suitable for virtual-memory operating systems, while the MC68EC030 is the embedded-controller variant with the MMU removed for lower cost and deterministic response. Choose the MC68030FE25C for full Linux/NetBSD/m68k compatibility or for code that relies on demand paging, and choose the MC68EC030 when running a real-time executive without virtual memory.
MC68030FE25C vs MC68040 - when should I pick the older part?
The MC68040FE25C integrates an MMU and a hardware FPU on die, but its pin-out and bus protocol are not pin-compatible with the 132-CQFP 68030. According to the Freescale/NXP migration notes, you should choose the MC68030FE25C only when your PCB, VMEbus interface and existing firmware target the 68030 pin-out; choose the MC68040 when you can respin the board and need on-chip FP performance.
What is the best drop-in replacement for the MC68030FE25C?
The best drop-in replacement for the MC68030FE25C is the MC68030RC25C, which uses the same 132-pin PGA footprint and 25 MHz clock but in a plastic pin-grid-array package. For ceramic-package compatibility the MC68030FE25B is pin-identical at 25 MHz with a wider temperature grade, while the MC68EC030CFE25C in the same 132-CQFP drops the MMU for deterministic embedded use.
Where to download the MC68030FE25C datasheet PDF?
The MC68030FE25C datasheet PDF is hosted on alldatasheet.com at the original Motorola document number MC68030/D. Additional mirror PDFs are listed on DigChip and the EEWORLD datasheet archive. NXP continues to host the master 68030 user manual under the legacy Freescale documentation portal.
Where to find the MC68030FE25C pinout diagram?
The 132-CQFP pinout for the MC68030FE25C is documented on page 1 of the MC68030/D user manual. The pin numbering follows the standard ceramic quad flat-pack convention with pin 1 at the beveled corner; the 24x24 mm ceramic body exposes the die for thermal dissipation and radiation-tolerant mounting.
Is the MC68030FE25C suitable for new designs in 2026?
The MC68030FE25C is suitable for new long-lifecycle designs only when M68000 instruction-set compatibility, VMEbus pin-out or radiation-tolerant ceramic packaging is mandatory. The part is in last-time-buy status as of 2026-10-16; for new green-field designs, an ARM Cortex-A or RISC-V SoC with custom firmware migration is the recommended path.
What package does the MC68030FE25C use and what are the dimensions?
The MC68030FE25C is housed in a 132-pin ceramic quad flat pack measuring 24x24 mm with gull-wing leads. The CQFP package is rated for extended industrial and military thermal grades and is the standard 68030 form factor used by VMEbus CPU boards and aerospace subsystems.
What are the key specifications of the MC68030FE25C that engineers should know?
The key specifications of the MC68030FE25C are: 25 MHz maximum clock, 32-bit data and address buses, integrated 256-byte instruction cache plus 256-byte data cache, on-chip paged MMU with 4 KB/8 KB page support, burst-mode memory controller, 5 V supply, 132-CQFP ceramic package, and approximately 7 MIPS sustained throughput. It is binary-compatible with the MC68020 and supports external MC68881/MC68882 FP co-processors.
What is the best equivalent for the MC68030FE25C from a different manufacturer?
There is no second-source drop-in equivalent for the MC68030FE25C from a different manufacturer because the 132-CQFP pin-out is NXP/Motorola proprietary. The closest functional substitutes from other vendors are the AMD Am386 family at 32-bit x86 and the VLSI VI2x32 32-bit embedded controllers, but neither matches the 132-CQFP pin-out and none can be soldered onto a 68030 footprint without board rework.

Справочные инженерные данные для MC68030FE25C — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC68030FE25C when your design requires a 25 MHz 32-bit M680x0 MPU in a ceramic 132-CQFP package for aerospace, military or industrial environments that demand -55C to +125C operation. Choose the MC68030RC25C instead when the same 25 MHz core is acceptable but the plastic 132-PGA package is sufficient and lower cost is desired. Choose the MC68030RC50C when extra throughput (up to 14 MIPS) is needed and the 50 MHz speed grade is still in stock. Choose the MC68EC030CFE25C when a deterministic embedded controller without virtual memory is sufficient and you want the ceramic CQFP mechanical compatibility. Choose the MC68030RC20C only when the existing firmware timing budget is locked to 20 MHz or when a legacy 20 MHz oscillator is mandatory. Avoid migrating to a different architecture unless the legacy M68000 software can be recompiled and revalidated, because the 132-CQFP pin-out is NXP/Motorola proprietary and no second-source drop-in equivalent exists.

Сравнение с аналогами

Параметр Этот товар MC68030RC25C MC68030FE25B MC68EC030CFE25C MC68030RC20C MC68030RC50C
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 132-CQFP (24x24) 132-PGA - different package, same die 132-CQFP (24x24) - same 132-CQFP (24x24) - same 132-PGA - different package, same die 132-PGA - different package, same die
Clock Frequency 25 MHz 25 MHz 25 MHz 25 MHz 20 MHz (-20%) 50 MHz (+100%)
MMU Present Yes Yes Yes No (EC variant) Yes Yes
Performance approximately 7 MIPS approximately 7 MIPS approximately 7 MIPS approximately 7 MIPS approximately 5.6 MIPS approximately 14 MIPS
On-chip Caches 256B I-cache + 256B D-cache 256B I-cache + 256B D-cache 256B I-cache + 256B D-cache 256B I-cache + 256B D-cache 256B I-cache + 256B D-cache 256B I-cache + 256B D-cache
FP Co-processor Interface Yes (MC68881/MC68882) Yes (MC68881/MC68882) Yes (MC68881/MC68882) Yes (MC68881/MC68882) Yes (MC68881/MC68882) Yes (MC68881/MC68882)
Supply Voltage 5 V 5 V 5 V 5 V 5 V 5 V

Ключевые отличия

  • Ceramic 132-CQFP package rated for aerospace thermal and mechanical environments (против MC68030RC25C (plastic 132-PGA))
  • Includes the on-chip MMU for virtual-memory operating systems (против MC68EC030CFE25C (EC variant))
  • 25 MHz rating matches the canonical 68030 design point for legacy firmware timing (против MC68030RC20C (20 MHz))
  • Lower cost and wider availability than the 50 MHz speed-grade (против MC68030RC50C (50 MHz))

Заметки по проектированию

The MC68030FE25C draws approximately 500 mA at 25 MHz with a 5 V supply, so the system must budget at least 2.5 W of regulated 5 V rail capacity. Use a low-impedance plane for VCC and GND with multiple decoupling capacitors (0.1 uF ceramic every four pins and 10 uF bulk at the supply pins) to suppress the 25 MHz fundamental and its harmonics. Power sequencing is not required, but the CLK input should be stable within 100 ms of VCC ramp to prevent metastable latch-up of the internal pipeline.

The 132-CQFP ceramic package has a thermal resistance of approximately 20 C/W junction-to-case for the MC68030FE25C. In a conduction-cooled chassis the device should be thermally bonded to a cold wall with a compliant heat-spreader; in a forced-air enclosure provide at least 100 LFM of airflow across the package. Designers should avoid placing the 68030 above 70C ambient in sealed enclosures without derating, because ceramic-package thermal cycling accelerates solder-joint fatigue on the gull-wing leads.

Route the address and data buses as matched-length traces within 25 mm of the package, and isolate the CLK trace with a ground guard to control reflections. Place the 68030 as close as practical to the DRAM array to keep burst-mode timing within the 4-clock-cycle burst specification. Use a four-layer PCB with dedicated VCC and GND planes to control the impedance of the 32-bit data bus; series damping resistors on the AS and DS strobes are recommended to reduce ringing on long backplane connections.

Three pitfalls recur with the MC68030FE25C: (1) failing to initialize the MMU translation tables before the first user-mode fetch, which causes a double bus fault during boot; (2) leaving the CBREQ/CBACK pins floating when no co-processor is fitted, which can latch spurious bus requests; (3) forgetting the IPL2/IPL1/IPL0 pull-up resistors so that spurious interrupts are serviced during power-up. Always ground CBREQ and pull CBACK high through 10 kohm when no FPU is mounted.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

Ceramic 132-CQFP package is not RoHS-compliant by default; lead-free / halogen-free status was not present in the verified distributor data and is marked unknown. AEC-Q100 is not applicable because this is an MPU, not an automotive analog/digital IC.

Данные проверены: 2026-10-16 — данные проверены и курируются командой компонентной инженерии XAIPART

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