MC9S08AW60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP
N.º da peça: MC9S08AW60CFGE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MC9S08AW60CFGE Visão geral
An 8-bit microcontroller is an integrated circuit that contains a processor core, memory, and programmable peripherals on a single chip, executing instructions on 8-bit data words. Within the embedded systems hierarchy, the MCU sits at the device level of the broader microcontroller family: HCS08 core -> S08 family -> Freescale/NXP 8-bit MCU -> semiconductor IC. MCUs like the S08AW are used where cost, low pin count, and sufficient performance matter more than raw processing power.
Key features of the MC9S08AW60 include the enhanced HCS08 core with HC08 instruction set compatibility plus the added BGND instruction, single-wire background debug mode (BDM) interface for low-cost emulation and flashing, 8-channel 10-bit ADC, and a supply voltage range of 2.7V to 5.5V, supporting both 3.3V and 5V systems. The part is available in industrial and automotive-qualified contexts per NXP product information, with 38 general-purpose I/O lines on this package variant.
Architecturally, the S08AW family uses flash-based program memory with in-application programming capability, and the on-chip peripherals include timer/PWM modules, serial communication interfaces (SCI, SPI), and an IIC bus controller, enabling single-chip designs for measurement and control tasks without external components.
Typical applications include automotive body electronics (window lifters, lighting control, cluster functions), industrial control and motor-adjacent logic, appliance control boards, and low-cost human-machine interfaces. The wide 2.7V to 5.5V operating range and robust I/O make it well suited to harsh electrical environments.
A key design consideration is lifecycle status: NXP lists this part as NRND (Not Recommended for New Designs), so new projects should evaluate family successors, while existing designs can continue sourcing through authorized channels.
This page adds value beyond the datasheet by consolidating drop-in alternatives, lifecycle guidance, comparison tables, and design notes sourced from NXP and distributor data verified as of 2026-10-18.
Alternativas drop-in para MC9S08AW60CFGE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08AW60CFGE (mesmo formato e footprint) — diferindo em Package, Debug Interface, Core, Supply Voltage, ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08AW48CFGE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.05 / unidade
Ver ficha técnica →MC9S08AW32CFGE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.86 / unidade
Ver ficha técnica →MC9S08AW16CFGE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →S9S08AW48CFGE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08AW32CFGE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08AW60CFGE Classificações máximas e características elétricas
| Core Processor | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit |
| Maximum CPU Frequency | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Flash Memory | 60 KB (60K x 8) |
| Supply Voltage Range | 2.7 V to 5.5 V |
| I/O Count | 38 general-purpose I/O |
| ADC Resolution | 10-bit, 8-channel |
| Instruction Set | HC08 instruction set with added BGND instruction |
| Debug Interface | Single-wire background debug mode (BDM) |
| Encapsulamento | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |
| Tipo de montagem | Surface Mount |
| Supply Voltage Nominal | 3.3 V / 5 V |
| Packaging | Tray |
| Status do ciclo de vida | NRND (Not Recommended for New Designs) per NXP |
| Family | MC9S08AW (S08AW series) |
Guia de Configuração de Pinos do MC9S08AW60CFGE 44-lqfp (10x10 mm), 0.50 mm pitch, mo-220vkkd-2
Configuração de pinos para MC9S08AW60CFGE (pacote 44-lqfp (10x10 mm), 0.50 mm pitch, mo-220vkkd-2). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC9S08AW60CFGE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC9S08AW60CFGE é adequado para 6 aplicaçãos: Automotive Body Electronics, Industrial Control Panels, Appliance Control Boards, Sensor and Data Acquisition Nodes, Lighting Control Modules, Legacy System Maintenance and Service Boards.
Automotive Body Electronics
The MC9S08AW60CFGE fits automotive body-control functions such as lighting modules, window lifters, seat adjusters, and wiper control, where NXP explicitly positions the MC9S08AW family for both industrial and automotive industries. Its 2.7V to 5.5V supply tolerance rides through regulated 5V rail sag during crank events, and the 38 general-purpose I/O lines of the 44-LQFP variant provide enough pins for switch matrices, relay drives, and LED indicators in a single chip. The 8-channel 10-bit ADC reads position potentiometers and current-sense shunts at 10-bit resolution, while timer/PWM modules generate lamp-dimming and motor-drive waveforms. Because the part is NRND, use it for service replacements or last-time-buy volumes, and select the automotive-qualified S9S08AW ordering variants for new production programs.
Recomendado
Industrial Control Panels
In industrial control panels, the MC9S08AW60CFGE acts as a single-chip supervisory and control controller handling push-button inputs, contactor drive logic, status LEDs, and analog monitoring. The 40 MHz CPU with 20 MHz bus provides ample headroom for control loops executing at kilohertz rates, while 60 KB flash accommodates protocol stacks and diagnostic logging that smaller 8-bit parts cannot hold. The 5V-tolerant I/O pairs naturally with 24V industrial panels through simple resistor dividers, and the 10-bit ADC digitizes sensor inputs such as potentiometers and thermistor chains. The single-wire BDM interface enables field firmware updates during panel commissioning with a low-cost debug pod. For designs needing CAN connectivity, pair it with a standalone CAN transceiver or step up to the S12X family.
Recomendado
Appliance Control Boards
White-goods and small-appliance control boards use the MC9S08AW60CFGE for user-interface scanning, motor/timer sequencing, and thermal monitoring in one low-cost package. The 60 KB flash stores multiple wash/dry/cook profiles plus localized UI strings, and the 2 KB RAM supports state machines and debounce buffers without external memory. Its 5V operation allows direct drive of LED segments and buzzer elements through the 38 I/O pins, and the ADC reads NTC thermistors for temperature-regulated cycles. The internal clock options reduce BOM cost by eliminating a crystal in non-precision-timing applications. Since the device is NRND, appliance makers with long production lives should plan last-time-buys or qualify the AW48/AW32 pin-compatible variants for future cost-down builds with the same PCB footprint.
Recomendado
Sensor and Data Acquisition Nodes
The MC9S08AW60CFGE serves as an intelligent sensor node where its 8-channel 10-bit ADC converts analog sensors and the 60 KB flash hosts scaling, filtering, and serial output routines. Typical deployments include pressure and level sensing heads, HVAC zone controllers, and portable measurement instruments. The 2.7V operation supports 3V lithium-battery designs for portable instruments, while quiescent power management and low-power wait/stop modes of the HCS08 core extend battery life in duty-cycled nodes. SCI and SPI interfaces stream readings to displays or wired backhaul, and the BDM interface enables calibration constant updates at end-of-line test stations. For higher-resolution needs, add an external delta-sigma ADC over SPI; for networked nodes, pair with a LIN/CAN transceiver on the SCI or a standalone controller.
Recomendado
Lighting Control Modules
Lighting modules - both automotive interior/exterior lamps and architectural LED fixtures - use the MC9S08AW60CFGE to generate PWM dimming, sequence lamp checks, and monitor current feedback through the ADC. The 20 MHz bus easily produces multiple synchronized PWM channels from the timer modules for RGB or multi-string fixtures, and 60 KB flash holds dimming curves, DALI-like protocol handlers, and fault logs. The 5V I/O directly interfaces to LED driver enable pins and diagnostic comparators. The wide 2.7V to 5.5V supply range allows a simple low-cost linear supply from a 12V or 24V input rail via a buck pre-regulator. For safety-relevant lamp diagnostics, the ADC can periodically sample current-sense outputs and flag open/short faults in firmware.
Recomendado
Legacy System Maintenance and Service Boards
A major ongoing use of the MC9S08AW60CFGE is maintaining deployed equipment - vehicle ECUs, factory machines, and metering products originally designed around the S08AW family. Because the part is NRND, service organizations purchase it to keep spare-board production running, and Rochester Electronics distributes remaining authorized stock. The pin-compatible MC9S08AW48CFGE and MC9S08AW32CFGE variants offer alternate flash sizes on the identical 44-LQFP footprint, letting repair shops substitute based on firmware size without PCB respins. When migrating firmware between variants, verify the flash protection vector locations and RAM allocation in the linker file, as these differ across memory-size options. BDM programmers remain widely available and inexpensive, supporting both repair re-flashing and clone-board production.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08AW60CFGE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08AW48CFGE | MC9S08AW32CFGE | MC9S08AW16CFGE | S9S08AW48CFGE | S9S08AW32CFGE |
|---|---|---|---|---|---|---|
| Package | 44-LQFP (10x10 mm) | 44-LQFP (10x10 mm) - same | 44-LQFP (10x10 mm) - same | 44-LQFP (10x10 mm) - same | 44-LQFP (10x10 mm) - same | 44-LQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (automotive variant) | NXP Semiconductors (automotive variant) |
| Core / Frequency | S08 (HCS08), 40 MHz | S08 (HCS08), 40 MHz | S08 (HCS08), 40 MHz | S08 (HCS08), 40 MHz | S08 (HCS08), 40 MHz | S08 (HCS08), 40 MHz |
| Flash Memory | 60 KB | 48 KB | 32 KB | 16 KB | 48 KB | 32 KB |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC | 10-bit, 8-channel | 10-bit, 8-channel | 10-bit, 8-channel | 10-bit, 8-channel | 10-bit, 8-channel | 10-bit, 8-channel |
| Debug Interface | Single-wire BDM | Single-wire BDM | Single-wire BDM | Single-wire BDM | Single-wire BDM | Single-wire BDM |
Principais diferenciais
- Largest flash in the 44-pin LQFP AW family (vs MC9S08AW48CFGE)
- Highest code capacity among pin-compatible drop-ins (vs MC9S08AW32CFGE)
- Standard commercial ordering variant (vs S9S08AW48CFGE)
Notas de projeto
The MC9S08AW60CFGE accepts 2.7V to 5.5V on VDD, but flash programming/erase timing and VDD ripple limits in the datasheet must be respected during in-circuit reprogramming. Place 0.1 uF ceramic decoupling capacitors at each VDD/VSS pair within 5 mm of the pins, plus one 4.7 uF bulk capacitor near the package. In 5V automotive systems fed from a 12V rail, use a pre-regulator with load-dump protection (e.g., a 5V automotive linear regulator with transient clamp) since the MCU itself tolerates only 5.5V maximum.
The part is NRND: NXP product change notices may still alter packaging or test flows, so subscribe to NXP PCN notifications for the MC9S08AW60 and lock your last-time-buy window early. When substituting the AW48/AW32/AW16 drop-ins, rebuild and relink firmware against the smaller memory map - link errors at flash boundary or the reset/interrupt vector placement are the most common migration failures. Also confirm the RAM allocation differs between variants before reusing linker files.
The 44-LQFP (10x10 mm, 0.5 mm pitch) footprint follows MO-220VKKD-2. Use solder-mask-defined pads with a nominal 0.25 mm pad width and 0.3 mm non-solder-mask opening per the LQFP land-pattern guidance in the datasheet package section; route debug (BGND/RESET) to a 4-pin header during layout - retrofitting BDM access on a finished board is effectively impossible. Keep the ADC reference path away from PWM traces; use a quiet analog ground island for VREFH/VREFL filtering.
At 40 MHz CPU / 20 MHz bus, edge rates are modest but the internal bus clock can still drive I/O toggle rates into the MHz range on PWM outputs. Limit series resistance (typically 100 ohm) on long LED or cable-driven lines to control ringing and EMI, and use the S08's configurable slew-rate and drive-strength options on output pins when driving unshielded harnesses. Crystal-based designs should follow the datasheet's load-capacitance recommendations and keep the oscillator loop short.
Informações de conformidade
Environmental quality data is referenced on the NXP product page (MC9S08AW60CFGE Overview > Environmental Quality) but specific RoHS/REACH status values were not stated in the retrieved data; consult the NXP product page for current certificates. The S9S08AW ordering prefix indicates automotive qualification intent per Findchips cross-reference listings.
