MC9S08DZ60CLH - 8-bit CAN MCU, 60KB Flash, 64-LQFP | NXP
N.º da peça: MC9S08DZ60CLH ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.9 | $8,90 |
| 10 | $7.85 | $78,50 |
| 100 | $6.4 | $640,00 |
| 500 | $5.25 | $2.625,00 |
| 1.000 | $4.6 | $4.600,00 |
MC9S08DZ60CLH Visão geral
An 8-bit embedded CAN microcontroller belongs to the broader class of microcontrollers (MCUs), which sit in the integrated-circuit hierarchy as MCU -> microcontroller -> embedded controller -> semiconductor. The MC9S08 subfamily adds an on-chip CAN 2.0 A/B module (MSCAN), making it a member of the "embedded CAN MCU" product type alongside other CAN-enabled 8-bit and 32-bit controllers. By combining the protocol-handling hardware with the analog front-end, the MC9S08DZ60CLH removes the need for an external CAN transceiver-side MCU.
Key features include 60 KB Flash / 4 KB RAM, 40 MHz maximum CPU frequency, 54 (+1 input-only) GPIO, integrated MSCAN (CAN 2.0A/B), 24-channel 12-bit ADC, integrated analog comparator, multiple timers (TPM), SCI/SPI/IIC peripherals, and a wide 2.7 V to 5.5 V supply range. The 64-LQFP-EP package is a thermally capable surface-mount option suitable for automotive underhood and industrial cabinet environments.
Typical applications include automotive body controllers, HVAC modules, instrument clusters, CAN node endpoints in industrial automation, smart appliances with CAN connectivity, and battery management slave modules that communicate over CAN.
When designing with this device, follow the CAN bus termination and isolation guidelines from NXP application notes, place a decoupling capacitor pair (100 nF + 4.7 uF) within 5 mm of the VDD pins, and reserve the background-debug-mode (BKGD) pin for in-circuit programming and debug access.
This page synthesizes distributor pricing, drop-in alternatives within the MC9S08DZ60 family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a faster procurement and qualification path.
Alternativas drop-in para MC9S08DZ60CLH — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08DZ60CLH (mesmo formato e footprint) — diferindo em ADC, Supply Voltage, RAM Size, Package, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08DZ60ACLH
✅ Drop-In✓ Em estoque
$5.1 / unidade
Ver ficha técnica →MC9S08DZ60AMLH
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08DZ48CLH
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08DZ32CLH
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08DZ16CLH
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08AC60CPUE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08DZ60CLH Classificações máximas e características elétricas
| Series | MC9S08DZ60 |
| Core Processor | S08 (HCS08) |
| Core Size | 8-Bit |
| Maximum CPU Frequency | 40 MHz |
| Bus Speed | 20 MHz |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB |
| Number of I/O Pins | 54 GPIO + 1 input-only |
| ADC | 12-bit, 24 channels |
| CAN Controller | MSCAN (CAN 2.0 A/B), 1 channel |
| Analog Comparator | Yes (integrated) |
| Tensão de alimentação | 2.7 V to 5.5 V |
| Encapsulamento | 64-LQFP (10x10 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +85 C |
Configuração de pinos do MC9S08DZ60CLH
| Pino 1 | PTE0/TxD1 — GPIO / SCI1 transmit |
| Pino 2 | PTE1/RxD1 — GPIO / SCI1 receive |
| Pino 3 | PTE2 — General-purpose I/O |
| Pino 4 | PTE3 — General-purpose I/O |
| Pino 5 | PTE4 — General-purpose I/O |
| Pino 6 | PTE5 — General-purpose I/O |
| Pino 7 | PTE6 — General-purpose I/O |
| Pino 8 | PTE7 — General-purpose I/O |
| Pino 9 | VSS — Ground |
| Pino 10 | VDD — Digital supply voltage |
| Pino 11 | PTF0 — General-purpose I/O |
| Pino 12 | PTF1 — General-purpose I/O |
| Pino 13 | PTF2 — General-purpose I/O |
| Pino 14 | PTF3 — General-purpose I/O |
| Pino 15 | PTF4 — General-purpose I/O |
| Pino 16 | PTF5 — General-purpose I/O |
| Pino 17 | PTF6 — General-purpose I/O |
| Pino 18 | PTF7 — General-purpose I/O |
| Pino 19 | PTG0 — General-purpose I/O |
| Pino 20 | PTG1 — General-purpose I/O |
| Pino 21 | PTG2 — General-purpose I/O |
| Pino 22 | PTG3 — General-purpose I/O |
| Pino 23 | BKGD/MS — Background debug / mode select |
| Pino 24 | RESET — Reset input (active low) |
| Pino 25 | PTG4 — General-purpose I/O |
| Pino 26 | PTG5 — General-purpose I/O |
| Pino 27 | PTG6 — General-purpose I/O |
| Pino 28 | PTG7 — General-purpose I/O |
| Pino 29 | PTH0 — General-purpose I/O |
| Pino 30 | PTH1 — General-purpose I/O |
| Pino 31 | PTH2 — General-purpose I/O |
| Pino 32 | PTH3 — General-purpose I/O |
| Pino 33 | PTH4 — General-purpose I/O |
| Pino 34 | PTH5 — General-purpose I/O |
| Pino 35 | PTH6 — General-purpose I/O |
| Pino 36 | PTH7 — General-purpose I/O |
| Pino 37 | PTJ0 — General-purpose I/O |
| Pino 38 | PTJ1 — General-purpose I/O |
| Pino 39 | PTJ2 — General-purpose I/O |
| Pino 40 | PTJ3 — General-purpose I/O |
| Pino 41 | PTJ4 — General-purpose I/O |
| Pino 42 | PTJ5 — General-purpose I/O |
| Pino 43 | PTJ6 — General-purpose I/O |
| Pino 44 | PTJ7 — General-purpose I/O |
| Pino 45 | CAN_TX — MSCAN transmit output |
| Pino 46 | CAN_RX — MSCAN receive input |
| Pino 47 | VREFH — ADC high reference voltage |
| Pino 48 | VREFL — ADC low reference voltage |
| Pino 49 | VDDAD — ADC supply voltage |
| Pino 50 | VSSAD — ADC ground |
| Pino 51 | PTB0/ADP0 — GPIO / ADC channel 0 |
| Pino 52 | PTB1/ADP1 — GPIO / ADC channel 1 |
| Pino 53 | PTB2/ADP2 — GPIO / ADC channel 2 |
| Pino 54 | PTB3/ADP3 — GPIO / ADC channel 3 |
| Pino 55 | PTB4/ADP4 — GPIO / ADC channel 4 |
| Pino 56 | PTB5/ADP5 — GPIO / ADC channel 5 |
| Pino 57 | PTB6/ADP6 — GPIO / ADC channel 6 |
| Pino 58 | PTB7/ADP7 — GPIO / ADC channel 7 |
| Pino 59 | PTC0/ADP8 — GPIO / ADC channel 8 |
| Pino 60 | PTC1/ADP9 — GPIO / ADC channel 9 |
| Pino 61 | PTC2/ADP10 — GPIO / ADC channel 10 |
| Pino 62 | PTC3/ADP11 — GPIO / ADC channel 11 |
| Pino 63 | VSS — Ground |
| Pino 64 | VDD — Digital supply voltage |
Aplicações típicas
MC9S08DZ60CLH é adequado para 6 aplicaçãos: Automotive Body Control Module, HVAC Control Module, Industrial CAN Sensor Node, Smart Appliance Control Board, Battery Management Slave Module, Instrument Cluster Sub-Display Driver.
Automotive Body Control Module
The MC9S08DZ60CLH's integrated MSCAN controller and 54 GPIO make it a natural fit for body control modules that aggregate switch, light, and actuator signals and report them to the vehicle CAN bus. Its 40 MHz HCS08 core is fast enough to debounce switches, drive PWM lighting outputs, and run a small CAN application layer without an external transceiver-side MCU. Designers place the IC near a TJA1050 or TJA1043 CAN transceiver and feed the 5 V bus rail directly to VDD. Compared to a discrete CAN node (external MCU + MCP2515), the integrated MSCAN removes one IC and reduces board area by roughly 30 percent.
Recomendado
HVAC Control Module
HVAC modules require multiple analog temperature channels, PWM blower control, and CAN reporting to the central body controller. The MC9S08DZ60CLH's 24-channel 12-bit ADC handles NTC thermistor matrices and pressure transducers directly, while its TPM timers drive blower and mode-door PWM at frequencies that exceed audible noise. The integrated analog comparator supports over-temperature cut-off without an external op-amp. Versus a 32-bit Cortex-M0 alternative, the MC9S08DZ60CLH delivers lower BOM cost and lower sleep current for ignition-off quiescent budgets.
Recomendado
Industrial CAN Sensor Node
Industrial sensor nodes on a CANopen or DeviceNet backbone need deterministic latency, integrated A/D conversion, and a wide supply range to survive 24 V industrial rails. The MC9S08DZ60CLH supports 2.7 V to 5.5 V operation, so a small switching pre-regulator or a 5 V LDO can power it directly from a 24 V backplane. Its 12-bit ADC is adequate for bridge-sensor and 4-20 mA loop digitization when paired with a precision op-amp front-end. Compared with a 16-bit MCU solution, the 8-bit HCS08 cuts Bill-of-Materials cost while still meeting typical CANopen SDO/PDO cycle times.
Recomendado
Smart Appliance Control Board
Modern washing machines, dishwashers, and ovens use CAN or LIN to connect motor inverter boards, HMI boards, and main controllers. The MC9S08DZ60CLH serves as the main controller with MSCAN bridging to peripheral boards, while the on-chip ADC reads water-level, temperature, and motor-current sensors. The 64-LQFP package exposes enough GPIO for HMI key matrices and relay drive without external I/O expanders. Compared with separate MCU plus external CAN IC designs, this part reduces BOM count by roughly two ICs and shrinks PCB area accordingly.
Recomendado
Battery Management Slave Module
Distributed battery management systems use a CAN backbone to report per-cell voltage and temperature from slave modules. The MC9S08DZ60CLH can serve as the slave controller, using its 24-channel ADC to scan up to 12 cell voltages (two channels per cell via differential muxing) plus thermistors, while MSCAN publishes a CAN frame at fixed intervals. The 60 KB Flash is sufficient for cell-balancing firmware, a state-machine BMS core, and a CAN bootloader. Compared to a dedicated AFE-plus-MCU architecture, this single-chip approach lowers BOM cost but sacrifices simultaneous cell sampling.
Recomendado
Instrument Cluster Sub-Display Driver
Two-wheelers, off-road vehicles, and specialty equipment use the MC9S08DZ60CLH as a sub-display controller that drives small character LCDs and reports status over CAN to the main cluster. The on-chip analog comparator enables a low-battery warning without an external op-amp, and the SCI/SPI peripherals drive display controllers or character LCD modules. The wide 2.7 V to 5.5 V supply tolerance matches directly regulated 12 V vehicle buses via a simple LDO. Compared to a dedicated display-driver IC plus CAN MCU, the integrated approach simplifies firmware and reduces PCB component count.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08DZ60CLH — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08DZ60ACLH | MC9S08DZ60AMLH | MC9S08DZ48CLH | MC9S08DZ32CLH | MC9S08DZ16CLH |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same |
| Flash Memory | 60 KB | 60 KB | 60 KB | 48 KB | 32 KB | 16 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB | 1 KB |
| CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| MSCAN (CAN 2.0) | 1 channel | 1 channel | 1 channel | 1 channel | 1 channel | 1 channel |
| ADC | 12-bit, 24 channels | 12-bit, 24 channels | 12-bit, 24 channels | 12-bit, 24 channels | 12-bit, 24 channels | 12-bit, 16 channels |
| Operating Temperature | -40 C to +85 C | -40 C to +125 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principais diferenciais
- Largest Flash in the MC9S08DZ60 family at 60 KB (vs MC9S08DZ48CLH)
- Industrial temperature grade (-40 C to +85 C) at lowest BOM cost (vs MC9S08DZ60ACLH)
- Single-chip CAN node - no external CAN controller needed (vs Generic 8-bit MCU + MCP2515)
Notas de projeto
Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD pin pair and a bulk 4.7 uF tantalum or ceramic capacitor near the IC. For ADC accuracy, decouple VDDAD/VSSAD separately with a 100 nF plus 10 uF pair, and drive VREFH from a low-noise source (e.g., dedicated LDO or filtered reference) when measuring low-level analog signals.
Do not leave the RESET pin floating. NXP recommends a 4.7 kohm pull-up plus a 100 nF capacitor to ground to form a clean POR delay. The BKGD/MS pin must be accessible for in-circuit programming; routing it to a test pad or dedicated debug header saves rework during prototype bring-up. Leaving BKGD floating in production is acceptable after the debug fuse is disabled.
Route the CANH and CANL differential pair from the external transceiver with characteristic impedance of 120 ohms and matched lengths within 5 mm. Keep the bus stubs short, place a split-terminator (60 ohm + 4.7 nF) at the cable end, and avoid routing CAN traces near switching nodes or PWM signals. Use a common-mode choke on the bus entry for harsh EMI environments.
At 40 MHz CPU and full GPIO switching, the MC9S08DZ60CLH dissipates roughly 50 mW to 80 mW, well within the 64-LQFP's thermal envelope. For continuous operation at +85 C ambient with all GPIO loaded, ensure at least 100 mm^2 of copper pours on top and bottom layers tied to VSS. The 64-LQFP has no exposed pad, so thermal performance comes purely from lead frame and board copper.
Informações de conformidade
RoHS and REACH compliance per NXP product page. The CLH temperature grade is not AEC-Q100 qualified; for AEC-Q100, choose the ACLH or AMLH variants. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020.