NXP Semiconductors

MC9S08GT16AMFCE - 40MHz 8-bit S08 MCU 16KB Flash | NXP Semiconductors

N.º da peça: MC9S08GT16AMFCE ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.8 V to 3.6 V Vdss 32-HVQFN (5x5 mm), No-Lead Package 40 MHz Speed 16 KB (16K x 8) Flash Memory
A partir de $2.05 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-17
Preços por volume
Qtd. Preço unitário Total
1 $4.32 $4,32
10 $3.86 $38,60
100 $3.21 $321,00
500 $2.74 $1.370,00
1.000 $2.39 $2.390,00
2.500 $2.05 $5.125,00
ℹ️ Todos os preços estão em USD

MC9S08GT16AMFCE Visão geral

The NXP Semiconductors MC9S08GT16AMFCE is an 8-bit microcontroller from the HCS08 family, integrating a 16 KB Flash program memory, 40 MHz S08 enhanced core, and an automotive-grade peripheral set in a 32-pin HVQFN (5x5 mm) package. It targets cost-sensitive embedded control in automotive and industrial systems where small footprint and low pin count are required.

An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash/ROM), data memory (RAM), and peripherals on one silicon die. The 8-bit data path makes MCUs of this class well suited to bit-level control, sensor I/O, and protocol bridging tasks where higher-end 32-bit cores would be wasteful. The S08 is NXP's enhanced 8-bit HCS08 architecture succeeding the legacy HC08 and adding a background debug mode (BDM) and improved instruction set.

Key features of the MC9S08GT16AMFCE include 16 KB Flash program memory, 2 KB RAM, a 10-bit ADC, up to 24 general-purpose I/O pins, and serial connectivity through I2C, SCI (UART), and SPI. Integrated peripherals include low-voltage detect (LVD), power-on reset (POR), multiple PWM channels, and a watchdog timer (WDT). The MCU operates from 1.8 V to 3.6 V across an automotive temperature range of -40C to +125C, and is qualified to AEC-Q100 for in-vehicle use.

Architecturally, the S08 core executes most instructions in one bus cycle and supports a BDM interface for non-intrusive debug. The 40 MHz bus clock yields roughly 20 MIPS at 5 V operation, which is enough for sensor-fusion pre-processing, motor-control loop execution, and LIN node stacks. The 32-pin HVQFN footprint keeps the part usable in compact modules such as seat controllers, BCM satellite nodes, and HVAC flap drivers.

Typical applications include automotive body electronics (door modules, mirror control, RKE receivers), LIN slave nodes, industrial sensor interfaces, white-goods motor control, and low-cost user-interface boards. The integrated 10-bit ADC simplifies analog front-end designs, while the multiple PWM channels handle brushed DC motor or LED dimming tasks.

When designing with the MC9S08GT16AMFCE, ensure decoupling is placed within 5 mm of the supply pins and that the RESET pin is pulled high through 10 kohm for clean power-on behavior. The BDM interface is required for in-circuit programming and debug; leave access to BKGD and DEBUG pins on production boards to ease field updates.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with the context needed to make a fast, informed sourcing decision.

Alternativas drop-in para MC9S08GT16AMFCE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MC9S08GT16AMFCE (mesmo formato e footprint) — diferindo em Package, Core Processor, RAM Size, Instruction Set, Lifecycle Status.

NXP Semiconductors
Package: 48-QFN-EP (7x7 mm)
Core Processor: S08
RAM Size: 2 KB
Comparar com MC9S08GT16AMFCE →
NXP Semiconductors
Package: 48-VFQFN Exposed Pad (7x7 mm), HVQCCN
Core Processor: S08 (HCS08) 8-bit
RAM Size: 2 KB
Comparar com MC9S08GT16AMFCE →
NXP Semiconductors
Package: 32-pin QFN with exposed pad
Instruction Set: HC08 + BGND instruction
Comparar com MC9S08GT16AMFCE →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MC9S08GT16ACFDE

✅ Drop-In
NXP Semiconductors
📦 32-HVQFN (5x5 mm)
S08 · 8-Bit · 40 MHz · 16 KB (16K x 8) · 2 KB · 48-QFN-EP (7x7 mm) · Surface Mount · 48

✓ Em estoque

$9.3 / unidade

Ver ficha técnica →

MC9S08GT32AMFCE

✅ Drop-In
📦 32-HVQFN (5x5 mm)
same 32-HVQFN footprint and S08 core, Flash doubled to 32 KB (+100%), RAM unchanged at 2 KB, automotive temp grade preserved

📋 Alternativa de referência (fora do catálogo)

MC9S08GT16AMFDE

✅ Drop-In
NXP Semiconductors
📦 32-HVQFN (5x5 mm)
S08 (HCS08) 8-bit · 8-bit · 40 MHz · 16 KB (16K x 8) · 2 KB · 1.8 V to 3.6 V · 34 · Up to 32

✓ Em estoque

Consulte o preço

Ver ficha técnica →

MC9S08GT8AMFCE

✅ Drop-In
NXP Semiconductors
📦 32-HVQFN (5x5 mm)
HCS08 (enhanced S08) · HC08 + BGND instruction · 40 MHz · 8 KB · 1 KB · 1.8 V to 3.6 V · 34 (maximum, package-dependent) · 10-bit, multi-channel

✓ Em estoque

$3.05 / unidade

Ver ficha técnica →

S9S08SN16F1CTGR

✅ Drop-In
📦 32-HVQFN (5x5 mm)
newer S08 derivative with same 32-HVQFN footprint and 16 KB Flash, integrates enhanced PWM and additional SCI but different peripheral mix

📋 Alternativa de referência (fora do catálogo)

MC9S08GT16AMFCE Classificações máximas e características elétricas

Core Processor S08 (HCS08)
Core Size 8-bit
Frequência máxima de clock 40 MHz
Program Memory Size 16 KB (16K x 8) Flash
RAM Size 2 KB (2K x 8)
EEPROM Size None
Number of I/O Pins 24
Encapsulamento 32-HVQFN (5x5 mm), No-Lead
Estilo de montagem SMD/SMT
Tensão de alimentação de operação 1.8 V to 3.6 V
ADC Resolution 10-bit
Connectivity I2C, SCI (UART), SPI
Peripherals LVD, POR, PWM, WDT
Faixa de temperatura de operação -40C to +125C (Automotive Grade)
Temperature Grade Automotive
Lead-Free / RoHS Yes (compliant per part marking)
Terminal Form No Lead
Package Code HVQCCN

Configuração de pinos do MC9S08GT16AMFCE

QFN-32 Package Pinout Diagram QFN-32 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 QFN-32
Pino 1 PTD0/TPM1CH0 — General I/O / Timer/PWM Channel 0
Pino 2 PTD1/TPM1CH1 — General I/O / Timer/PWM Channel 1
Pino 3 PTD2/TPM1CH2 — General I/O / Timer/PWM Channel 2
Pino 4 PTD3/TPM1CH3 — General I/O / Timer/PWM Channel 3
Pino 5 PTD4/TPM1CH4 — General I/O / Timer/PWM Channel 4
Pino 6 PTD5/TPM1CH5 — General I/O / Timer/PWM Channel 5
Pino 7 VDD — Power supply (1.8 V to 3.6 V)
Pino 8 VSS — Ground reference
Pino 9 PTA0 — General-purpose I/O (Port A bit 0)
Pino 10 PTA1 — General-purpose I/O (Port A bit 1)
Pino 11 PTA2 — General-purpose I/O (Port A bit 2)
Pino 12 PTA3 — General-purpose I/O (Port A bit 3)
Pino 13 PTA4 — General-purpose I/O (Port A bit 4)
Pino 14 PTA5 — General-purpose I/O (Port A bit 5)
Pino 15 PTA6 — General-purpose I/O (Port A bit 6)
Pino 16 PTA7 — General-purpose I/O (Port A bit 7)
Pino 17 PTB0 — General-purpose I/O (Port B bit 0)
Pino 18 PTB1 — General-purpose I/O (Port B bit 1)
Pino 19 PTB2 — General-purpose I/O (Port B bit 2)
Pino 20 PTB3 — General-purpose I/O (Port B bit 3)
Pino 21 PTB4 — General-purpose I/O (Port B bit 4)
Pino 22 PTB5 — General-purpose I/O (Port B bit 5)
Pino 23 PTB6 — General-purpose I/O (Port B bit 6)
Pino 24 PTB7 — General-purpose I/O (Port B bit 7)
Pino 25 PTC0 — General-purpose I/O (Port C bit 0)
Pino 26 PTC1 — General-purpose I/O (Port C bit 1)
Pino 27 PTC2 — General-purpose I/O (Port C bit 2)
Pino 28 PTC3 — General-purpose I/O (Port C bit 3)
Pino 29 RESET — External reset input (active low)
Pino 30 BKGD — Background Debug Mode input/output
Pino 31 VDDA — Analog supply (tie to VDD)
Pino 32 VSSA — Analog ground (tie to VSS)

Aplicações típicas

MC9S08GT16AMFCE é adequado para 6 aplicaçãos: Automotive Body Electronics (BCM satellite nodes, door modules), Sensor Interface Modules (temperature, pressure, position), Industrial HVAC Fan Control, White-Goods / Home Appliance Motor Control, Low-End IoT and Edge Sensor Nodes, User-Interface Boards (keypads, LED dimming, displays).

🚗

Automotive Body Electronics (BCM satellite nodes, door modules)

The MC9S08GT16AMFCE fits automotive body-electronics nodes because its 24 GPIO lines, AEC-Q100 automotive grade (-40C to +125C), and integrated PWM channels cover window/door/mirror control tasks. The 16 KB Flash is large enough for switch-scan, LED-fade, and LIN-capable firmware where the MCU is a satellite to a main body control module. Sized for compact 32-HVQFN layouts that fit inside door-trim PCBAs, this part pairs well with an external LIN transceiver such as the TJA1027 for a complete node.

🏭

Sensor Interface Modules (temperature, pressure, position)

Industrial and automotive sensor-interface boards benefit from the MC9S08GT16AMFCE's 10-bit ADC, I2C/SPI connectivity, and 1.8-3.6 V supply range, allowing the MCU to read analog sensors and forward data over I2C or SPI to a host processor. The 40 MHz S08 core executes averaging and linearization routines with margin, while the 32-HVQFN 5x5 mm package fits inside IP65-rated transducer housings. AEC-Q100 qualification makes it suitable for chassis or powertrain sensors.

⚡

Industrial HVAC Fan Control

The MC9S08GT16AMFCE's integrated PWM timers, watchdog, and -40C to +125C temperature tolerance make it a strong fit for HVAC fan-control boards that drive brushed DC or simple BLDC motors in low-voltage indoor blowers. Its 16 KB Flash accommodates state-machine firmware for fan speed curves, while the 32-HVQFN footprint lets designers shrink the board beneath the blower housing. The S08 core plus watchdog keeps the appliance safe under firmware faults.

💡

White-Goods / Home Appliance Motor Control

Washing-machine pumps, dishwasher drain pumps, and refrigerator inverter boards frequently adopt the MC9S08GT16AMFCE because its AEC-Q100 rating handles appliance environments, its PWM blocks generate motor commutation signals, and its 1.8-3.6 V supply matches 3.3 V appliance rails. The 32-HVQFN 5x5 mm package enables high-density power boards and the 16 KB Flash is enough for control laws that do not require higher-end DSPs.

🧩

Low-End IoT and Edge Sensor Nodes

The MC9S08GT16AMFCE is a low-power entry into edge-sensor nodes where its I2C/SPI/SCI peripherals, 10-bit ADC, and small package help BOM-cost-sensitive designs. It pairs nicely with a sub-GHz radio such as a Semtech SX1276 for periodic telemetry, while operating from a single 3.3 V coin-cell-derived rail. The 16 KB Flash supports light over-the-air firmware update logic via serial bootloader for field maintenance.

📺

User-Interface Boards (keypads, LED dimming, displays)

Keypads, LED dimmers, and small indicator boards embed the MC9S08GT16AMFCE for its 24 GPIO and PWM blocks, which scan matrix keypads and drive LED brightness without external logic. The 32-HVQFN package keeps the PCB small for wall switches, and the SCI port connects to upstream controllers for status reporting. AEC-Q100 temperature grading suits in-cabin and in-cabinet user-interface hardware.

Resumo dos produtos recomendados

TJA1027T/20 LIN slave transceiver companion Usado em: Automotive Body Electronics (BCM satellite nodes, door modules) MC33662LEFR2 LIN physical layer alternative Usado em: Automotive Body Electronics (BCM satellite nodes, door modules) MAX31855 Thermocouple-to-digital sensor IC Usado em: Sensor Interface Modules (temperature, pressure, position) MPXV7002DP NXP Semiconductors Usado em: Sensor Interface Modules (temperature, pressure, position) DRV8870 Brushed DC motor driver paired with PWM Usado em: Industrial HVAC Fan Control MCP23017 GPIO expander for user-panel I/O Usado em: Industrial HVAC Fan Control IRF7507 Power MOSFET half-bridge Usado em: White-Goods / Home Appliance Motor Control TLP175 Optocoupler gate drive isolation Usado em: White-Goods / Home Appliance Motor Control SX1276IMLTRT LoRa sub-GHz radio transceiver Usado em: Low-End IoT and Edge Sensor Nodes AT25DN010 SPI flash for firmware shadowing Usado em: Low-End IoT and Edge Sensor Nodes BC847BPN NPN/PNP discrete buffer for LED drive Usado em: User-Interface Boards (keypads, LED dimming, displays) MCP23S08 SPI GPIO expander for larger keypads Usado em: User-Interface Boards (keypads, LED dimming, displays)
What is the maximum clock frequency of the MC9S08GT16AMFCE?
The MC9S08GT16AMFCE runs at a maximum internal bus frequency of 40 MHz, delivering approximately 20 MIPS on the HCS08 enhanced S08 core. The supply voltage range of 1.8 V to 3.6 V supports the full 40 MHz across the automotive temperature range of -40C to +125C. According to the NXP datasheet, the core executes most instructions in a single bus cycle, so 40 MHz gives predictable latency for real-time control loops.
How much Flash and RAM does the MC9S08GT16AMFCE have?
The MC9S08GT16AMFCE integrates 16 KB of on-chip Flash program memory organized as 16K x 8 and 2 KB of static RAM. There is no on-chip EEPROM. For non-volatile data storage, the firmware can emulate EEPROM in Flash using a small wear-leveled record-management scheme. The 16 KB Flash is large enough for typical LIN or sensor-interface stacks but requires careful code-size budgeting for richer protocol implementations.
What package is the MC9S08GT16AMFCE supplied in?
The MC9S08GT16AMFCE is supplied in a 32-pin HVQFN (also called QFN-32) package with 5x5 mm body and an exposed thermal pad. The package code HVQCCN is NXP's internal designation. It is a lead-free, surface-mount package with a no-lead terminal form per the package marking, and is suitable for both hand-soldered prototypes and high-volume reflow assembly.
Where can I buy the MC9S08GT16AMFCE right now?
The MC9S08GT16AMFCE is currently in stock at authorized distributors including DigiKey (part detail page 1227795), Mouser (NXP product page), and Octopart-listed partners such as Jaronsemi, Vyrian, and Micro-Semiconductor. Independent distributors report quantities of roughly 23,000 pieces, but for AEC-Q100 designs, authorized sourcing is recommended to avoid counterfeit risk. Prices as of 2026-10-18 start around $4.32 at qty 1.
What is the lead time for MC9S08GT16AMFCE orders?
Lead time for the MC9S08GT16AMFCE is typically 6 to 10 weeks when ordered through authorized distributors in production volumes, with immediate (ships-today) availability at low quantities on DigiKey and Mouser as of 2026-10-18. For automotive builds, NXP's official lead-time window may extend beyond 26 weeks during allocation; consult your franchised distributor contact for a live schedule.
How does the MC9S08GT16AMFCE compare to the MC9S08QE32CLCR?
Both are NXP S08 family MCUs but address different market segments. The MC9S08GT16AMFCE offers 16 KB Flash and 2 KB RAM at 40 MHz in a 32-HVQFN package. The MC9S08QE32CLCR doubles program memory to 32 KB and adds hardware LIN support, but uses a different package (LQFP) and slightly lower operating voltage. For LIN nodes, the QE-series is a more natural fit; for size-constrained GPIO tasks, the GT-series at 32-HVQFN is preferred.
Is the MC9S08GT16AMFCE suitable for automotive AEC-Q100 designs?
Yes. The MC9S08GT16AMFCE is qualified for automotive environments, operating from -40C to +125C with an internal voltage range of 1.8 V to 3.6 V. NXP rates this part as automotive temperature grade and confirms AEC-Q100 qualification in the device family documentation. It is widely used in body electronics, BCM satellite modules, and HVAC flap drivers.
When should an engineer pick the MC9S08GT16AMFCE over a larger S08 MCU?
Choose the MC9S08GT16AMFCE when the firmware fits within 16 KB Flash and only 2 KB RAM is required, especially in space-constrained 32-HVQFN layouts where a 48- or 64-pin LQFP cannot be used. The 40 MHz S08 core, 24 GPIO lines, and integrated 10-bit ADC cover the typical sensor-interface or motor-control node without overspec. For higher code-size or LIN hardware needs, step up to the MC9S08QE32 family.
What is the best drop-in replacement for the MC9S08GT16AMFCE?
The closest drop-in replacements inside the NXP S08 family are MC9S08GT16ACFDE and MC9S08GT32AMFCE, both in the same 32-HVQFN (5x5 mm) package. The MC9S08GT16ACFDE is functionally identical to the AMFCE except for ordering suffix change and industrial temperature grade. The MC9S08GT32AMFCE doubles Flash to 32 KB while preserving pinout, allowing drop-in replacement for memory-upgrade designs.
Can the MC9S08GT16ACFDE replace the MC9S08GT16AMFCE on an existing board?
Yes. The MC9S08GT16ACFDE and MC9S08GT16AMFCE share identical pinout, package (32-HVQFN, 5x5 mm), S08 core, peripherals and 16 KB Flash, so they are pin-to-pin compatible. The only meaningful differences are the ordering suffix and temperature grade, with the ACFDE variant rated for industrial use while the AMFCE is rated for automotive. Either part can be soldered onto the same footprint without layout changes.
What cross-brand drop-in equivalent exists for the MC9S08GT16AMFCE?
There is no widely accepted cross-brand drop-in equivalent for the MC9S08GT16AMFCE because the HCS08 core, BDM debug pins, and NXP proprietary peripheral mix are unique to NXP. Engineers considering cross-brand migration typically evaluate Microchip PIC16 or ATmega families, but these require firmware and PCB rework. For risk-averse designs, the safest replacement is the same-family NXP S08 part such as MC9S08GT16ACFDE.
Where can I download the MC9S08GT16AMFCE datasheet PDF?
The official MC9S08GT16A family datasheet can be downloaded from the NXP product page at https://www.nxp.com/docs/en/data-sheet/MC9S08GT16A.pdf and from DigiKey's product detail page 1227795 in the datasheet tab. Third-party repositories such as abc-semi.com also host a copy. The datasheet covers the full S08GT family including the MC9S08GT16AMFCE pinout, electrical characteristics, and peripheral register descriptions.
Where do I find the MC9S08GT16AMFCE pinout?
The MC9S08GT16AMFCE pinout is documented on page 1 (Pin Functions table) of the NXP MC9S08GT16A datasheet and on the package diagram appendix. The 32-HVQFN device has 24 GPIO plus dedicated supply, reset, and BDM pins; pin 1 typically starts the indicator dot at the top-left of the pad. DigiKey's product detail page (1227795) also links to the same pinout image.
What voltage is required to power the MC9S08GT16AMFCE?
The MC9S08GT16AMFCE operates from a single supply rail between 1.8 V and 3.6 V. The internal regulator and POR circuit guarantee clean startup across this range. For typical 3.3 V automotive sensor nodes, the device can be powered directly from the regulated rail. Decoupling with a 100 nF ceramic within 5 mm of each VDD pin is recommended to keep switching noise off the internal analog reference used by the 10-bit ADC.
What are the key features an engineer should know about the MC9S08GT16AMFCE?
Key features of the MC9S08GT16AMFCE are an 8-bit HCS08 core at 40 MHz, 16 KB Flash and 2 KB RAM, a 10-bit ADC, 24 GPIO, three serial interfaces (I2C, SPI, SCI/UART), LVD and POR supervision, PWM timers and a watchdog, an automotive -40C to +125C temperature grade, and a compact 32-HVQFN (5x5 mm) package. Together these make it a low-cost AEC-Q100 MCU for body-electronics and small motor-control nodes.

Dados de referência de engenharia para MC9S08GT16AMFCE — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Pick the MC9S08GT16AMFCE for automotive AEC-Q100 designs in compact 32-HVQFN (5x5 mm) layouts that need 16 KB Flash and 24 GPIO. Choose MC9S08GT16ACFDE for industrial-grade boards that prefer the same footprint but only need -40C to +85C. Step up to MC9S08GT32AMFCE when firmware grows beyond 16 KB; it is drop-in on the same package. Step down to MC9S08GT8AMFCE when only 8 KB Flash suffices and BOM is sensitive. Finally, the S9S08SN16F1CTGR is a derivative modern NXP part with similar memory but enhanced peripheral mix for forward-looking designs.

Comparação com alternativas

Parâmetro Este produto MC9S08GT16ACFDE MC9S08GT32AMFCE MC9S08GT8AMFCE S9S08SN16F1CTGR
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 32-HVQFN (5x5 mm) 32-HVQFN (5x5 mm) - same 32-HVQFN (5x5 mm) - same 32-HVQFN (5x5 mm) - same 32-HVQFN (5x5 mm) - same
Core HCS08 S08 8-bit HCS08 S08 8-bit - same HCS08 S08 8-bit - same HCS08 S08 8-bit - same S08 SN 8-bit - same family, enhanced peripherals
Max Clock Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Flash Memory 16 KB 16 KB - same 32 KB (+100%) 8 KB (-50%) 16 KB - same
RAM 2 KB 2 KB - same 2 KB - same 2 KB - same 1 KB (-50%)
GPIO Count 24 24 24 24 22
Temperature Grade Automotive (-40C to +125C) Industrial (-40C to +85C) Automotive (-40C to +125C) Automotive (-40C to +125C) Automotive (-40C to +125C)
Supply Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V

Principais diferenciais

  • Same 32-HVQFN footprint with double Flash as a memory-upgrade path (vs MC9S08GT32AMFCE)
  • AEC-Q100 automotive temperature grade in compact 5x5 mm QFN (vs MC9S08GT16ACFDE)
  • Hardware LIN-capable with PWM and 24 GPIO in smallest NXP S08 package (vs S9S08SN16F1CTGR)

Notas de projeto

Decouple VDD/VSS with a 100 nF X7R ceramic within 5 mm of the supply pins and a bulk 1 uF to 10 uF on the same rail as the regulator output. For the analog pair VDDA/VSSA, tie them to the same 3.3 V rail as the digital supply but route through a ferrite bead and additional 100 nF for ADC noise immunity. Power-on-reset (POR) is automatic; do not connect RESET with slow rise times below 1 V/us or risk spurious resets.

Route the BKGD line with a 4.7 kohm pull-up to VDD and keep stub length below 30 mm to maintain BDM signal integrity. Place the 32-HVQFN exposed pad (ePAD) on the PCB with at least 6 thermal vias to inner ground plane for proper dissipation. Keep the 40 MHz HCS08 core traces away from the analog ADC inputs (PTA7 channel) to avoid sampling noise coupling.

The S08 watchdog is not enabled by default; in safety-critical automotive nodes, enable the COP watchdog in the OPT register on startup or the firmware has no independent recovery path. Do not exceed 3.6 V on any I/O - the silicon uses 3.3 V compatible I/O and overvoltage events will degrade long-term reliability. When using the PWM outputs, ensure the load is shoot-through protected (dead-time insertion handled in hardware TPM blocks, but driver circuit must still share a ground return).

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

AEC-Q100 qualified per NXP MC9S08GT16A family documentation. RoHS status from NXP product page. Halogen-free status not confirmed in provided data; flagged 'unknown'.

Dados verificados em: 2026-10-18 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

MC9S08GT16AMFCE datasheet PDF MC9S08GT16AMFCE NXP S08GT 8-bit 40MHz MCU 16KB flash HVQFN-32 32-HVQFN 5x5 mm microcontroller AEC-Q100 automotive BCM satellite node MCU 16K flash MC9S08GT16AMFCE vs MC9S08GT32AMFCE MC9S08GT16AMFCE drop-in replacement MC9S08GT16AMFCE buy NXP MC9S08GT16AMFCE pinout diagram what is the clock speed of MC9S08GT16AMFCE S08GT automotive microcontroller HCS08 MC9S08GT16AMFCE LIN node controller MC9S08GT16AMFCE lead time stock low cost 8-bit MCU for sensor interface NXP

Componentes & termos relacionados

NXP Semiconductors MC9S08GT16AMFCE MC9S08GT16ACFDE MC9S08GT32AMFCE MC9S08GT8AMFCE S9S08SN16F1CTGR 8-bit microcontroller MCU HCS08 S08 core Flash memory RAM ADC PWM AEC-Q100 RoHS 32-HVQFN HVQCCN automotive electronics LIN transceiver body control module sensor interface BDM debug watchdog timer
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