MC9S08GT8AMFCE - HCS08 8-bit MCU, 8KB Flash, 40MHz, QFN-32 | NXP
N.º da peça: MC9S08GT8AMFCE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.76 | $4,76 |
| 10 | $4.3 | $43,00 |
| 100 | $3.85 | $385,00 |
| 500 | $3.42 | $1.710,00 |
| 1.000 | $3.05 | $3.050,00 |
MC9S08GT8AMFCE Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, Flash program memory, and peripherals such as timers, ADCs, and communication interfaces. The MC9S08GT8AMFCE belongs to the broader MCU hierarchy of microcontroller -> 8-bit MCU -> S08 family -> S08GT series -> power-efficient general-purpose class. The HCS08 core is an enhanced evolution of the legacy HC08 instruction set, adding the BGND instruction for background debugging while maintaining full source-level compatibility with HC08 code. This combination of instruction-set familiarity and modern features makes the S08GT family a popular choice for cost-sensitive upgrades of legacy HC08 designs.
Key features include 8 KB Flash program memory, 1 KB RAM, an internal clock generator, multiple timer/PWM modules, an analog comparator, and a 10-channel 10-bit ADC. The device supports up to 32 interrupt/reset sources and offers a low-power wait and stop mode set for battery-friendly operation. The HCS08 core executes most instructions in one to two bus cycles, contributing to its energy-efficient throughput at 40 MHz.
The device integrates the HCS08 CPU with a fast Flash controller, supporting in-application programming and security features to protect firmware IP. Its on-chip debug interface (background debug mode, BDM) allows non-intrusive in-circuit development without requiring a bond-out emulator, reducing tooling cost for engineers and shortening time-to-prototype.
Typical applications include home appliances, motor control for small brushed DC and BLDC systems, security and alarm panels, industrial sensor interface boards, and consumer white goods such as washing machines and dishwashers. Its combination of low cost, robust I/O count, and integrated analog peripherals makes it well suited for mixed-signal front-end designs that need MCU control alongside signal conditioning.
When designing with this device, allocate the QFN exposed pad to a continuous ground plane with multiple thermal vias to ensure proper heat dissipation and low-impedance ground reference. Verify that the chosen debugger supports the BDM protocol and plan the BGND/PTA4 pin routing early to avoid rework on a dense PCB.
This page synthesizes distributor stock data, datasheet-verified specifications, and drop-in alternatives so engineers can make sourcing decisions without bouncing across DigiKey, Mouser, and the NXP product page. The NXP End-of-Life notice flagged on the official product page should be reviewed against your design's longevity requirements before committing to volume production.
Alternativas drop-in para MC9S08GT8AMFCE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08GT8AMFCE (mesmo formato e footprint) — diferindo em Package, Connectivity, Instruction Set, Program Memory Size, Temperature Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08GT8ACFCE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08GT16AMFCE
✅ Drop-In✓ Em estoque
$2.05 / unidade
Ver ficha técnica →MC9S08GT16ACFCE
✅ Drop-In✓ Em estoque
$2.31 / unidade
Ver ficha técnica →MC9S08GT8ACBCE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08GT8AMFCE Classificações máximas e características elétricas
| Core | HCS08 (enhanced S08) |
| Instruction Set | HC08 + BGND instruction |
| Maximum CPU Frequency | 40 MHz |
| Program Memory (Flash) | 8 KB |
| RAM | 1 KB |
| Tensão de alimentação | 1.8 V to 3.6 V |
| I/O Pins | 34 (maximum, package-dependent) |
| ADC | 10-bit, multi-channel |
| Encapsulamento | 32-pin QFN with exposed pad |
| Tipo de montagem | Surface Mount |
| Interrupt Sources | Up to 32 |
| Debug Interface | Background Debug Mode (BDM) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do MC9S08GT8AMFCE
| Pino 1 | PTA0/KBIP0/TCLK0 — General I/O, keyboard interrupt, timer channel |
| Pino 2 | PTA1/KBIP1/TCLK1 — General I/O, keyboard interrupt, timer channel |
| Pino 3 | PTA2/KBIP2 — General I/O, keyboard interrupt |
| Pino 4 | PTA3/KBIP3 — General I/O, keyboard interrupt |
| Pino 5 | PTA4/KBIP4/ACMPO/BKGD — General I/O, BKGD/MS for BDM debug |
| Pino 6 | PTA5/KBIP5/ACMP+ — General I/O, analog comparator input |
| Pino 7 | PTA6/KBIP6/ACMP- — General I/O, analog comparator input |
| Pino 8 | PTA7/KBIP7 — General I/O, keyboard interrupt |
| Pino 9 | VSS — Ground reference |
| Pino 10 | VDD — Supply voltage (1.8 V to 3.6 V) |
| Pino 11 | PTB0/SDA — I2C SDA or general I/O |
| Pino 12 | PTB1/SCL — I2C SCL or general I/O |
| Pino 13 | PTB2/MISO — SPI MISO or general I/O |
| Pino 14 | PTB3/MOSI — SPI MOSI or general I/O |
| Pino 15 | PTB4/SPSCK — SPI clock or general I/O |
| Pino 16 | PTB5/SS — SPI slave select or general I/O |
| Pino 17 | PTB6/TxD — UART transmit or general I/O |
| Pino 18 | PTB7/RxD — UART receive or general I/O |
| Pino 19 | PTC0/ADP0 — ADC channel 0 or general I/O |
| Pino 20 | PTC1/ADP1 — ADC channel 1 or general I/O |
| Pino 21 | PTC2/ADP2 — ADC channel 2 or general I/O |
| Pino 22 | PTC3/ADP3 — ADC channel 3 or general I/O |
| Pino 23 | PTC4/ADP4 — ADC channel 4 or general I/O |
| Pino 24 | PTC5/ADP5 — ADC channel 5 or general I/O |
| Pino 25 | PTC6/ADP6 — ADC channel 6 or general I/O |
| Pino 26 | PTC7/ADP7 — ADC channel 7 or general I/O |
| Pino 27 | PTD0/RESET — Reset input or general I/O |
| Pino 28 | PTD1/IRQ — External interrupt or general I/O |
| Pino 29 | PTD2 — General I/O |
| Pino 30 | PTD3 — General I/O |
| Pino 31 | VSS — Ground (second ground pin) |
| Pino 32 | VDD — Supply voltage (second power pin) |
| Pino EP | Exposed Pad — Thermal pad, must be soldered to ground plane |
Aplicações típicas
MC9S08GT8AMFCE é adequado para 6 aplicaçãos: Home Appliance Control Board, Small BLDC / Brushed DC Motor Control, Security and Alarm Panel, Industrial Sensor Interface Board, Consumer White Goods User Interface, Battery-Powered Sensor Edge Node.
Home Appliance Control Board
The MC9S08GT8AMFCE fits home-appliance main control boards thanks to its 8 KB Flash and 34 I/O pins, which is enough headroom for a user-interface keypad, an LED or LCD indicator driver, and a triac interface for heater or pump loads. With a 1.8-3.6 V supply, the MCU is directly compatible with 3.3 V logic-level triac optocouplers, and the on-chip 10-bit ADC is suitable for reading NTC temperature sensors used in ovens, refrigerators, and dishwashers.
Recomendado
Small BLDC / Brushed DC Motor Control
For small brushless or brushed DC motor control, the MC9S08GT8AMFCE delivers 40 MHz HCS08 throughput, multi-channel PWM-capable timers, and software-selectable pull-ups on its I/O. The 8 KB Flash is sufficient to host a sensorless or Hall-sensor trapezoidal commutation state machine, while the 1 KB RAM handles modest speed-loop state variables. Its QFN package and exposed pad aid thermal dissipation during high-current switching.
Recomendado
Security and Alarm Panel
The MC9S08GT8AMFCE suits wired security panels with its 34 I/O supporting multiple sensor zones, keypads, and sirens, while BDM background-debug enables in-circuit firmware upgrades during installation. The low-power wait and stop modes help meet quiescent-current budgets for always-on battery-backed panels. On-chip Flash security bits protect the alarm protocol stack from unauthorized readout.
Recomendado
Industrial Sensor Interface Board
The MC9S08GT8AMFCE operates over -40C to +85C industrial temperatures and 1.8-3.6 V supply, which is a comfortable range for 4-20 mA loop-powered sensor boards. Its on-chip 10-bit ADC plus analog comparator perform local signal conditioning before relaying digitized values over UART, SPI, or I2C to a larger controller. The QFN-32 footprint keeps PCB area minimal for dense DIN-rail mounted modules.
Recomendado
Consumer White Goods User Interface
Washing-machine, dishwasher, and microwave UI boards benefit from the MC9S08GT8AMFCE's mix of I/O pins for capacitive touch or matrix keypads, PWM outputs for buzzer tone generation, and 8 KB Flash for menu-driven state machines. The 1.8 V minimum supply enables direct Li-ion battery support for portable countertop appliances. QFN-32 footprint supports compact UI daughterboards.
Recomendado
Battery-Powered Sensor Edge Node
For battery-powered edge nodes such as wireless HVAC sensors or smart-home leak detectors, the MC9S08GT8AMFCE provides HCS08 throughput with low-power wait and stop modes to stretch battery life. Its 34 I/O accommodate multiple sensor inputs and a sub-GHz or BLE module interface, while the small QFN-32 footprint allows tight board integration inside sensor housings.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08GT8AMFCE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08GT8ACFCE | MC9S08GT16AMFCE | MC9S08GT16ACFCE | MC9S08GT8ACBCE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-QFN with exposed pad | 32-QFN with exposed pad - same | 32-QFN with exposed pad - same | 32-QFN with exposed pad - same | 32-QFN with exposed pad - same |
| Core | HCS08 (enhanced S08) | HCS08 | HCS08 | HCS08 | HCS08 |
| Maximum CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Program Flash | 8 KB | 8 KB | 16 KB (+100%) | 16 KB (+100%) | 8 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| I/O Pins | 34 | 34 | 34 | 34 | 34 |
| Debug Interface | BDM (background debug mode) | BDM | BDM | BDM | BDM |
Principais diferenciais
- Balanced Flash/RAM footprint in a compact QFN-32 (vs MC9S08GT16AMFCE)
- Mature HCS08 toolchain with BDM debug (vs MC9S08QB8CGK)
- Pin-compatible upgrade path within the S08GT family (vs MC9S08GT8ACFCE)
Notas de projeto
The 32-pin QFN package includes an exposed thermal pad (EP) that must be soldered to the ground plane for mechanical robustness and thermal dissipation. Recommended: place at least 9 thermal vias in the EP land pattern to conduct heat into inner ground layers. Failing to solder the EP can cause intermittent failures under thermal cycling.
Route the BKGD/MS pin (PTA4) early in PCB layout to keep the BDM debug header accessible. Keep the trace short and avoid routing high-frequency signals adjacent to the BKGD line to prevent debug-session corruption. Decouple VDD with a 100 nF ceramic capacitor within 5 mm of each VDD pin plus a bulk 4.7 uF tantalum.
Do not exceed the maximum supply voltage of 3.6 V (the absolute maximum is 4.0 V with risk of permanent damage). The reset pin (PTD0/RESET) requires an external pull-up when not driven by the BDM tool - omitting this pull-up causes the MCU to remain in reset after programming. The internal bandgap reference must be enabled before ADC conversions for accurate absolute-voltage readings.
For battery-powered designs, leverage the S08 low-power wait and stop modes; configure unused peripherals to their lowest-power state and gate the clock to unused modules via the SCGC register family. Wake-up from stop mode can be triggered by the keyboard interrupt module or the analog comparator, allowing event-driven operation at sub-10 uA average current.
Informações de conformidade
RoHS and lead-free confirmed per NXP product page. AEC-Q100 not applicable for general-purpose 8-bit MCU. Conflict minerals compliance per NXP corporate statement. Halogen-free status not stated in provided data.
