MC9S08RG32FGE - 8-bit HCS08 MCU 32KB Flash 44-LQFP | NXP
N.º da peça: MC9S08RG32FGE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.92 | $7,92 |
| 10 | $7.13 | $71,30 |
| 100 | $6.34 | $634,00 |
| 500 | $5.71 | $2.855,00 |
| 1.000 | $5.08 | $5.080,00 |
MC9S08RG32FGE Visão geral
A microcontroller (MCU) is a single-chip computer containing a processor core, non-volatile program memory (Flash), volatile data memory (RAM), and a rich set of peripherals such as timers, ADC, communication interfaces, and GPIO. The HCS08 is NXP/Freescale's 8-bit CISC core, descended from the long-running HC05/HC08 architecture, designed for ultra-low power and deterministic interrupt response. MCUs sit at the bottom of the embedded hierarchy: microcontroller -> embedded processor -> integrated circuit -> semiconductor.
Key features of the MC9S08RG32FGE include an integrated 8-channel 10-bit ADC, multiple timers (TPM), an SCI (UART) serial interface, an SPI peripheral, and up to 39 GPIO pins depending on package configuration. The HCS08 core uses a von Neumann architecture with a 16-bit stack pointer and supports BCD arithmetic instructions for low-overhead decimal math. An on-chip clock generator with internal oscillator trimming reduces external component count.
The device is fabricated in 0.25 µm CMOS technology optimized for low-power operation, supporting multiple STOP and WAIT modes. Power-on reset, low-voltage detect, and watchdog timer peripherals are integrated. The internal bus structure supports single-cycle access to most registers, making the 8 MHz bus speed deliver competitive throughput for its class.
Typical applications include white goods and appliance control, motor and fan control front-ends, building automation (thermostats, sensors), industrial sensors, low-end security panels, and battery-powered metering. The combination of small Flash footprint (32KB) and low pin count suits cost-sensitive embedded designs.
When designing with this device, verify the latest reference manual revision and use NXP's CodeWarrior or newer MCUXpresso/Eclipse-based tools with the S08 toolchain. Place decoupling capacitors (100 nF and 4.7 µF) close to the VDD pins.
This page synthesizes distributor inventory, drop-in compatible alternatives, application notes, and design tips that go beyond what is captured in the manufacturer datasheet alone, supporting sourcing decisions for legacy and active designs.
Alternativas drop-in para MC9S08RG32FGE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08RG32FGE (mesmo formato e footprint) — diferindo em Package, Mounting Type, Core, Manufacturer, RAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08RG60FGE
✅ Drop-In✓ Em estoque
$2.6971 / unidade
Ver ficha técnica →MC9S08RG32CFGE
✅ Drop-In✓ Em estoque
$5.55 / unidade
Ver ficha técnica →MC9S08RG32FGE-ND
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08RG32VGE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08RG32FGE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08RG32FGE Classificações máximas e características elétricas
| Core | HCS08 |
| Largura do barramento de dados | 8 bit |
| Frequência máxima de clock | 8 MHz |
| Program Memory Size | 32 KB Flash |
| RAM Size | 2 KB |
| Package Type | 44-LQFP (10 mm × 10 mm) |
| Tipo de montagem | Surface Mount |
| Terminal Pitch | 0.8 mm |
| Contagem de pinos | 44 |
| Tensão de alimentação de operação | 2.1 V to 5.5 V |
| Faixa de temperatura de operação | -40 °C to +85 °C |
| ADC | 8-channel, 10-bit |
| Communication Interfaces | SCI (UART), SPI |
| GPIO Count | Up to 39 |
| Timers | TPM (Timer/PWM Module) |
| On-chip Oscillator | Yes (internal with trimming) |
| Watchdog Timer | Yes (COP) |
| Low Voltage Detect (LVD) | Yes |
| Power-on Reset | Yes |
Guia de Configuração de Pinos do MC9S08RG32FGE 44-lqfp (10 mm × 10 mm)
Configuração de pinos para MC9S08RG32FGE (pacote 44-lqfp (10 mm × 10 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC9S08RG32FGE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC9S08RG32FGE é adequado para 6 aplicaçãos: White Goods and Appliance Control, Industrial Sensor Signal Conditioning, Building Automation Thermostats, Low-End Security and Access Panels, Battery-Powered Metering and Data Loggers, Small Motor and Fan Control Front-Ends.
White Goods and Appliance Control
The MC9S08RG32FGE fits appliance main control boards where 32 KB of Flash comfortably holds keypad scan, display driving, motor timing, and safety-state logic. The HCS08 core's deterministic interrupt response - with single-cycle instruction fetch from Flash - keeps I/O latency predictable for washing-machine drum control, refrigerator compressor sequencing, and dishwasher pump switching. The integrated 8-channel ADC reads thermistor inputs for temperature regulation, while the TPM outputs drive triac/MOSFET gates. Operating from 2.1 V to 5.5 V aligns with both 3.3 V and 5 V appliance rails. Designers should reserve at least 25 percent Flash headroom for field firmware updates.
Recomendado
Industrial Sensor Signal Conditioning
With 8 channels of 10-bit ADC and an SPI port for digital sensor front-ends, the MC9S08RG32FGE is well-matched to industrial sensor-conditioning nodes that digitize 4-20 mA loops, thermocouples, and strain-gauge bridges. The HCS08's BCD arithmetic instructions simplify decimal engineering-unit conversion for process instrumentation. The 2 KB RAM is sufficient for moving-average filters and PID loops at modest update rates. The 44-LQFP footprint provides enough GPIO for relay drivers, optocouplers, and HMI LEDs while keeping PCB area under 1 cm².
Recomendado
Building Automation Thermostats
The MC9S08RG32FGE's 32 KB Flash and 2 KB RAM pair with its ADC and TPM channels to drive HVAC thermostat designs that sense room temperature, drive a relay or TRIAC for fan/cool/heat stages, and communicate via UART or SPI to a building controller. The HCS08 STOP and WAIT low-power modes help thermostats meet standby power budgets, and the wide 2.1 V to 5.5 V supply range simplifies both battery-backed and line-powered implementations. The 44-LQFP provides mechanical robustness for panel mounting.
Recomendado
Low-End Security and Access Panels
Security keypads and access-control panels run keypad scanning, RFID reader interfaces, lock-driver timing, and alarm-event logging - a workload that fits comfortably in 32 KB of Flash on the MC9S08RG32FGE. The HCS08's SCI (UART) talks to RFID/Wiegand readers and the SPI port interfaces to EEPROM for credential storage. The COP watchdog timer and low-voltage detect help satisfy safety-critical panel requirements. Designers should use the background debug mode for in-field firmware updates.
Recomendado
Battery-Powered Metering and Data Loggers
The MC9S08RG32FGE is a good fit for battery-powered metering and data-logging applications such as gas, water, or energy meters where the MCU spends most of its time in STOP mode and wakes periodically to sample sensors, average readings, and update non-volatile memory. The HCS08 STOP mode with internal oscillator disabled draws microamp-level currents, while the on-chip ADC and 32 KB Flash handle weeks of logged samples. The 44-LQFP provides mechanical stability in meter housings.
Recomendado
Small Motor and Fan Control Front-Ends
Brushless DC and stepper motor control in small appliances, fans, and pumps use the MC9S08RG32FGE's TPM (Timer/PWM Module) channels to generate commutation PWM and the ADC to read back-EMF or current-sense signals. The 32 KB Flash is enough for sensorless BLDC start-up algorithms and stall-detection state machines, and the 44-LQFP provides sufficient GPIO for Hall-sensor inputs, gate-driver enable lines, and tachometer feedback. Designers should use external gate drivers rather than the MCU's GPIO to drive FETs directly.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08RG32FGE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08RG60FGE | MC9S08RG32CFGE | MC9S08RG32FGE-ND | MC9S08RG32VGE | S9S08RG32FGE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 44-LQFP (10x10) | 44-LQFP (10x10) - same | 44-LQFP (10x10) - same | 44-LQFP (10x10) - same | 44-LQFP (10x10) - same | 44-LQFP (10x10) - same |
| Core | HCS08 | HCS08 | HCS08 | HCS08 | HCS08 | HCS08 |
| Maximum Clock Frequency | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| Flash Program Memory | 32 KB | 60 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Operating Supply Voltage | 2.1 V to 5.5 V | 2.1 V to 5.5 V | 2.1 V to 5.5 V | 2.1 V to 5.5 V | 2.1 V to 5.5 V | 2.1 V to 5.5 V |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Extended | Industrial | Automotive (-40C to +105C) | Industrial |
| ADC | 8-ch, 10-bit | 8-ch, 10-bit | 8-ch, 10-bit | 8-ch, 10-bit | 8-ch, 10-bit | 8-ch, 10-bit |
Principais diferenciais
- Highest Flash capacity in the S08RG family at the original release (vs MC9S08RG60FGE)
- Industrial temperature grade variant widely available (vs MC9S08RG32VGE)
- NXP-branded successor offering identical silicon (vs S9S08RG32FGE)
Notas de projeto
Place a 100 nF ceramic decoupling capacitor within 3 mm of each VDD pin and a 4.7 µF bulk capacitor on the main supply rail. The MC9S08RG32FGE's internal voltage regulator generates the 1.8 V core supply; respect the VDD ramp rate (1 V/ms minimum, 250 V/ms maximum per the datasheet) to ensure clean power-on reset behavior.
Keep the Background Debug Mode (BDM) header accessible during prototype bring-up. The BDM pins (BKGD, RESET, VDD, GND) share general-purpose I/O functions, so plan the layout to keep the debug header reachable without removing the MCU. Route the external reset circuit (4.7 kΩ pull-up on RESET with optional capacitor) close to the IC.
Do not exceed 5.5 V on any pin; the HCS08 I/O structure is not 5 V tolerant on a 3.3 V supply configuration. When migrating code from Freescale HC08 to HCS08, remember that the HCS08 stack pointer is 16 bits, and that the HCS08 uses the new SBC/ROLX/ROLR instructions - older HC08-only code must be recompiled. Verify oscillator trim values against your application's temperature and voltage corner.
The MC9S08RG32FGE in 44-LQFP does not require a heatsink. Junction temperature is dominated by ambient and self-heating from GPIO toggling. For designs operating at +85 C ambient with all GPIO pins driving 20 pF loads at 8 MHz, typical self-heating is well below 1 W. The LQFP's exposed center pad (if present) should be soldered to a ground copper pour for thermal relief and ground integrity.
Informações de conformidade
RoHS, REACH, lead-free, and halogen-free status are not explicitly stated in the verified distributor listings for this NRND part. For new production designs, contact NXP directly for the latest compliance documentation. The part is not AEC-Q100 qualified - automotive designs should use the VGE suffix variant or the S08AW/S08QE automotive families.
