MC9S08RG60CFJE - 8-Bit S08 MCU 60KB Flash 32-LQFP | NXP
N.º da peça: MC9S08RG60CFJE ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.48 | $4,48 |
| 10 | $3.91 | $39,10 |
| 100 | $3.18 | $318,00 |
| 500 | $2.78 | $1.390,00 |
| 1.000 | $2.5 | $2.500,00 |
MC9S08RG60CFJE Visão geral
Background: An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path. The HCS08 (or S08) family is NXP's second-generation 8-bit core succeeding the HC08, offering improved instruction efficiency, lower power, and a richer peripheral set while preserving the CISC instruction set for legacy code compatibility. MCUs sit within the broader hierarchy: microcontroller -> embedded processor -> semiconductor IC, and the S08 family occupies the low-power, cost-optimized tier of NXP's 8-bit portfolio.
Key features include on-chip FLASH with in-application reprogrammability, an integrated ADC, timers, multiple communication peripherals, and an operating voltage range of 1.8V to 3.6V. The 32-LQFP package provides easy hand-soldering and breadboard-friendly prototyping, and the industrial temperature grade (-40C to +85C) supports commercial and industrial embedded deployments.
The MC9S08RG60 uses NXP's standard S08 core with a background debug mode (BDM) interface for non-intrusive in-circuit debugging, a feature carried over from the legacy HC08 architecture. The 60KB FLASH size positions this MCU for applications that have outgrown 32KB-class S08 parts but do not yet require the cost of 16-bit or 32-bit devices.
Typical applications include consumer appliances, HVAC controls, simple motor control loops, battery chargers, low-end human-machine interface (HMI) panels, and remote sensor nodes. The combination of FLASH memory, low voltage operation, and industrial temperature grade makes this MCU well suited to mains-powered industrial controllers and portable battery-driven products.
When designing with the MC9S08RG60CFJE, reserve the BDM pins (BKGD and RESET) for the debug header to enable in-circuit programming and debugging. Decouple VDD/VSS pairs with 100nF ceramic capacitors placed within 5 mm of the package pins, and follow NXP's PCB layout recommendations for oscillator and ADC analog rail routing.
This page synthesizes distributor pricing, datasheet specifications, and engineering context for the MC9S08RG60CFJE that go beyond the manufacturer product page, helping engineers select, source, and design with this MCU.
Alternativas drop-in para MC9S08RG60CFJE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08RG60CFJE (mesmo formato e footprint) — diferindo em Package, Flash Memory, Architecture, Instruction Set, Lifecycle Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08RG60CFE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08RG32CFJE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08SH32CFUE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08GT60CFD
✅ Drop-In✓ Em estoque
$5.1 / unidade
Ver ficha técnica →MC9S08QE128CLK
✅ Drop-In✓ Em estoque
$3.95 / unidade
Ver ficha técnica →MC9S08RG60CFJE Classificações máximas e características elétricas
| Core | HCS08 (S08) |
| Largura do barramento de dados | 8-Bit |
| Instruction Set | CISC |
| Maximum Bus Frequency | 8 MHz |
| Program Memory Size | 60 KB (60K x 8) FLASH |
| RAM Size | 2 KB |
| Operating Voltage Range | 1.8 V to 3.6 V |
| Encapsulamento | 32-LQFP (7x7 mm) |
| Contagem de pinos | 32 |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40C to +85C (Industrial) |
| Debug Interface | Background Debug Mode (BDM) |
| Status RoHS | Compliant |
Configuração de pinos do MC9S08RG60CFJE
| Pino 1 | PTD0/TxD — Port D bit 0 / SCI transmit |
| Pino 2 | PTD1/RxD — Port D bit 1 / SCI receive |
| Pino 3 | PTD2 — Port D bit 2 |
| Pino 4 | PTD3 — Port D bit 3 |
| Pino 5 | VDD — Positive supply (1.8V to 3.6V) |
| Pino 6 | VSS — Ground |
| Pino 7 | BKGD — Background Debug Mode data |
| Pino 8 | RESET — Reset input (active low) |
| Pino 9 | PTA0 — Port A bit 0 |
| Pino 10 | PTA1 — Port A bit 1 |
| Pino 11 | PTA2 — Port A bit 2 |
| Pino 12 | PTA3 — Port A bit 3 |
| Pino 13 | PTA4 — Port A bit 4 |
| Pino 14 | PTA5 — Port A bit 5 |
| Pino 15 | PTA6 — Port A bit 6 |
| Pino 16 | PTA7 — Port A bit 7 |
| Pino 17 | PTB0 — Port B bit 0 |
| Pino 18 | PTB1 — Port B bit 1 |
| Pino 19 | PTB2 — Port B bit 2 |
| Pino 20 | PTB3 — Port B bit 3 |
| Pino 21 | PTB4 — Port B bit 4 |
| Pino 22 | PTB5 — Port B bit 5 |
| Pino 23 | PTB6 — Port B bit 6 |
| Pino 24 | PTB7 — Port B bit 7 |
| Pino 25 | PTC0 — Port C bit 0 |
| Pino 26 | PTC1 — Port C bit 1 |
| Pino 27 | PTC2 — Port C bit 2 |
| Pino 28 | PTC3 — Port C bit 3 |
| Pino 29 | PTC4 — Port C bit 4 |
| Pino 30 | PTC5 — Port C bit 5 |
| Pino 31 | PTD4 — Port D bit 4 |
| Pino 32 | PTD5 — Port D bit 5 |
Aplicações típicas
MC9S08RG60CFJE é adequado para 6 aplicaçãos: Consumer Appliance Control, HVAC Thermostat and Climate Control, Battery Charger Controller, Simple Motor Control (BLDC/PWM), Low-End HMI / User Interface Panel, Remote Sensor Node (Industrial).
Consumer Appliance Control
The MC9S08RG60CFJE fits consumer appliance control boards where its 60KB FLASH accommodates full state-machine firmware plus UI handler, the 1.8-3.6V supply works directly from rectified mains-derived 3.3V rails, and the 32-LQFP footprint simplifies hand-build and rework. Its industrial temperature grade (-40C to +85C) handles kitchen and laundry environments, and the BDM debug interface speeds up firmware development for washing machines, dishwashers, microwave ovens, and induction cooktop controllers. Compared to larger ARM Cortex-M0 MCUs, the S08 core delivers lower cost and simpler toolchains for appliance-grade firmware.
Recomendado
HVAC Thermostat and Climate Control
The MC9S08RG60CFJE is well matched to HVAC thermostat and zone-controller designs where 60KB FLASH stores scheduling firmware, EEPROM emulation tables, and user-interface logic while 2KB RAM handles menu state and sensor fusion. The 8MHz bus is sufficient for slow-loop temperature control, and the wide 1.8-3.6V supply lets the MCU share the same rail as backlit LCD drivers. The 32-LQFP footprint drops onto common wall-thermostat PCB outlines, and the S08 core's deterministic interrupt latency suits safety-critical temperature-limit shutdown paths.
Recomendado
Battery Charger Controller
For battery charger applications (lead-acid, Li-ion, NiMH), the MC9S08RG60CFJE provides 60KB of FLASH for charge-algorithm tables, Coulomb-counting accumulators, and safety state machines while its 1.8-3.6V supply operates directly from a single-cell Li-ion rail. The 32-LQFP package supports compact charger PCB layouts, and the S08 BDM interface enables in-field firmware updates for new battery chemistries. The MCU's ADC and timer peripherals support constant-current/constant-voltage (CC/CV) loops with hardware-PWM-driven switching transistors.
Recomendado
Simple Motor Control (BLDC/PWM)
The MC9S08RG60CFJE handles small BLDC or brushed-DC motor control loops at low PWM frequencies (under 25 kHz) where 60KB FLASH stores commutation tables and 2KB RAM maintains state variables. The 8-bit S08 core is fast enough for 6-step trapezoidal commutation in fan, pump, and small-appliance motors, and the 32-LQFP package allows the MCU to sit alongside gate-driver ICs on compact motor-driver PCBs. For sensorless BLDC using back-EMF zero-cross detection, the S08's ADC with internal sample-and-hold suffices.
Recomendado
Low-End HMI / User Interface Panel
The MC9S08RG60CFJE serves low-end HMI panels (POS terminals, kiosk buttons, simple appliances with segmented LCDs) where 60KB FLASH stores menu logic and Unicode text tables, and the 32-LQFP package allows scan-matrix keypad and LED driving. The S08 core's low interrupt latency suits debounced button scanning, while the 1.8-3.6V supply is compatible with white-LED backlights running at 3.3V. The industrial temperature grade supports outdoor and factory-floor HMI enclosures without additional thermal protection.
Recomendado
Remote Sensor Node (Industrial)
The MC9S08RG60CFJE fits wired industrial sensor nodes (4-20 mA loops, RS-485 polled sensors, Modbus RTU slaves) where 60KB FLASH stores Modbus register maps and calibration tables. The S08 core's deterministic timing supports Modbus timing budgets, and the 1.8-3.6V supply runs from a 24V industrial rail via a small LDO. The 32-LQFP package provides industrial-friendly hand-soldering and the BDM debug interface enables field firmware updates via header. The MCU's industrial temperature grade is well-matched to factory-floor environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08RG60CFJE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08RG60CFE | MC9S08RG32CFJE | MC9S08SH32CFUE | MC9S08GT60CFD | MC9S08QE128CLK |
|---|---|---|---|---|---|---|
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08 (S08) 8-bit CISC | HCS08 (S08) 8-bit CISC | HCS08 (S08) 8-bit CISC | HCS08 (S08) 8-bit CISC | HCS08 (S08) 8-bit CISC | HCS08 (S08) 8-bit CISC |
| Flash Size | 60 KB | 60 KB | 32 KB | 32 KB | 60 KB | 128 KB |
| RAM Size | 2 KB | 2 KB | 2 KB | 1 KB | 4 KB | 8 KB |
| Max Bus Frequency | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- 60KB FLASH positions above common S08 32KB devices (vs MC9S08RG32CFJE)
- Same S08 core toolchain across entire family (vs MC9S08SH32CFUE)
- Industrial temperature grade in 32-LQFP (vs MC9S08GT60CFD)
Notas de projeto
The MC9S08RG60CFJE operates from 1.8V to 3.6V. Place a 100nF ceramic decoupling capacitor within 5 mm of each VDD/VSS pair (the 32-LQFP has multiple VDD/VSS pins) and add a bulk 10uF tantalum or ceramic cap near the IC. For battery applications powered from a single Li-ion cell (3.0-3.6V nominal), no additional LDO is needed; for 24V industrial rails, step down to 3.3V via a small buck regulator before the MCU. Estimate: at 8MHz active and typical peripheral usage, core current is single-digit mA - verify against the datasheet's ICC vs frequency curves.
Reserve the BKGD and RESET pins on the 32-LQFP for a 2-pin or 6-pin BDM header. The BDM (Background Debug Mode) interface is mandatory for in-circuit FLASH programming and non-intrusive debugging on S08 parts. Route BKGD and RESET directly to the debug header with short traces, place a 10 kohm pull-up on RESET, and follow NXP's BDM layout guidelines to avoid debugger lockup from noisy grounds.
Do not skip the external RESET filter capacitor (typically 100 nF from RESET to VDD) - the S08 internal POR alone is insufficient in noisy industrial environments. Also, ensure the BKGD pin is not pulled low during POR, as the S08 will enter BDM-active mode instead of normal reset, and the application firmware will not start. Always include a watchdog timer reset path in firmware to recover from software lockup.
Informações de conformidade
RoHS compliant per NXP/Freescale product page. Not AEC-Q100 qualified - for automotive applications choose a Q-qualified variant. Industrial temperature grade -40C to +85C.