MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP
MPN: MC9S08GT60CFD ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.5 | $7.50 |
| 10 | $6.85 | $68.50 |
| 100 | $6.2 | $620.00 |
| 500 | $5.65 | $2,825.00 |
| 1,000 | $5.1 | $5,100.00 |
MC9S08GT60CFD Overview
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and peripherals onto one silicon die. The HCS08 core is a CISC architecture that uses the HC08 instruction set with the added BGND instruction for background debugging. The MC9S08GT60CFD belongs to the S08GT family, which is a sub-family of the broader S08 microcontroller line within NXP's automotive and industrial MCU portfolio, characterized by low power consumption, integrated peripherals, and small form factors ideal for space-constrained designs.
Key features include 60 KB (60K x 8) of Flash memory, 4 KB of RAM, 39 general-purpose I/O lines, a 40 MHz maximum CPU frequency, support for up to 32 interrupt/reset sources, and software-selectable pullups on port pins when used as inputs. The internal pullup on the RESET and IRQ pin reduces external component count, lowering total BOM cost. Operating voltage is 2.5V or 3.3V, and the device includes an internal clock generator option.
The MC9S08GT60CFD uses a Harvard architecture with separate program/data bus structures and an enhanced HCS08 core that delivers approximately 1.6x the performance of the original HC08 at the same clock frequency. The integrated peripherals include timer/PWM modules, ADC, SCI/SPI/I2C serial interfaces, and a watchdog timer, providing flexible connectivity and control for motor control, sensor interfaces, and human-machine interface applications.
Typical applications include industrial control systems, white goods and home appliances, HVAC controls, security alarm systems, low-end consumer electronics, and sensor interface modules. The 48-QFN package with exposed pad enables compact PCB layouts with good thermal performance for applications requiring sustained computational load.
When designing with this device, verify supply voltage requirements carefully - the 2.5V variant and 3.3V variant require different DC-DC regulator configurations. Decoupling capacitors should be placed as close as possible to the VDD pins, and the exposed pad must be soldered to a properly sized copper pour for thermal dissipation and electrical grounding.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing a consolidated reference for component selection engineers evaluating the MPDMC45S08GT60CFD for new designs or service replacements.
Drop-in alternatives for MC9S08GT60CFD — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08GT60CFD (same form factor and footprint) — differing in Package, Core Processor, Debug Interface, RAM Size, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08GT60CFB
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08GT60CFDE
✅ Drop-In✓ In Stock
$8.75 / Unit
View Datasheet →MC9S08GT60VFD
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC9S08AC60CFGE
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.42 / Unit
View Datasheet →MC9S08AW60CFGE
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →MC9S08GT60CFD Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Family | HCS08 S08GT Series |
| Core Architecture | HCS08 (8-bit CISC) |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| Maximum CPU Frequency | 40 MHz |
| Number of I/O Pins | 39 |
| Package / Case | 48-VFQFN Exposed Pad (48-QFN 7x7 mm) |
| Operating Supply Voltage | 2.5V / 3.3V |
| Number of Interrupts/Reset Sources | Up to 32 |
| Mounting Type | Surface Mount |
| Tray Packaging | Tray (per FindIC listing) |
| Background Debug Mode | Yes (BGND instruction) |
| Internal Pullup | Yes (RESET and IRQ pins) |
MC9S08GT60CFD Pin Configuration
| Pin 1 | PTC0 — Port C I/O pin 0 (general purpose I/O) |
| Pin 2 | PTC1 — Port C I/O pin 1 (general purpose I/O) |
| Pin 3 | PTC2 — Port C I/O pin 2 (general purpose I/O) |
| Pin 4 | PTC3 — Port C I/O pin 3 (general purpose I/O) |
| Pin 5 | PTC4 — Port C I/O pin 4 (general purpose I/O) |
| Pin 6 | PTC5 — Port C I/O pin 5 (general purpose I/O) |
| Pin 7 | PTC6 — Port C I/O pin 6 (general purpose I/O) |
| Pin 8 | PTC7 — Port C I/O pin 7 (general purpose I/O) |
| Pin 9 | VSS — Ground reference |
| Pin 10 | VDD — Core logic supply voltage (2.5V or 3.3V) |
| Pin 11 | PTB0 — Port B I/O pin 0 |
| Pin 12 | PTB1 — Port B I/O pin 1 |
| Pin 13 | PTB2 — Port B I/O pin 2 |
| Pin 14 | PTB3 — Port B I/O pin 3 |
| Pin 15 | PTB4 — Port B I/O pin 4 |
| Pin 16 | PTB5 — Port B I/O pin 5 |
| Pin 17 | PTB6 — Port B I/O pin 6 |
| Pin 18 | PTB7 — Port B I/O pin 7 |
| Pin 19 | PTA0 — Port A I/O pin 0 (with peripheral alternate functions) |
| Pin 20 | PTA1 — Port A I/O pin 1 (with peripheral alternate functions) |
| Pin 21 | PTA2 — Port A I/O pin 2 (with peripheral alternate functions) |
| Pin 22 | PTA3 — Port A I/O pin 3 (with peripheral alternate functions) |
| Pin 23 | PTA4 — Port A I/O pin 4 (with peripheral alternate functions) |
| Pin 24 | PTA5 — Port A I/O pin 5 (with peripheral alternate functions) |
| Pin 25 | PTA6 — Port A I/O pin 6 (with peripheral alternate functions) |
| Pin 26 | PTA7 — Port A I/O pin 7 (with peripheral alternate functions) |
| Pin 27 | PTD0 — Port D I/O pin 0 |
| Pin 28 | PTD1 — Port D I/O pin 1 |
| Pin 29 | PTD2 — Port D I/O pin 2 |
| Pin 30 | PTD3 — Port D I/O pin 3 |
| Pin 31 | PTD4 — Port D I/O pin 4 |
| Pin 32 | PTD5 — Port D I/O pin 5 |
| Pin 33 | PTD6 — Port D I/O pin 6 |
| Pin 34 | PTD7 — Port D I/O pin 7 |
| Pin 35 | PTE0 — Port E I/O pin 0 |
| Pin 36 | PTE1 — Port E I/O pin 1 |
| Pin 37 | PTE2 — Port E I/O pin 2 |
| Pin 38 | PTE3 — Port E I/O pin 3 |
| Pin 39 | PTE4 — Port E I/O pin 4 |
| Pin 40 | PTE5 — Port E I/O pin 5 |
| Pin 41 | PTE6 — Port E I/O pin 6 |
| Pin 42 | PTE7 — Port E I/O pin 7 |
| Pin 43 | IRQ — External interrupt request input (with internal pullup) |
| Pin 44 | RESET — Reset input (with internal pullup, active low) |
| Pin 45 | BKGD — Background debug mode pin for in-circuit programming |
| Pin 46 | VDD — I/O supply voltage |
| Pin 47 | VSS — Ground reference |
| Pin 48 | PTF7 — Port F I/O pin 7 (or alternate peripheral function) |
| Pin 49 | EP — Exposed thermal pad - must be soldered to PCB ground pour |
Typical Applications
MC9S08GT60CFD is suitable for 6 applications: Industrial Control Systems, White Goods and Home Appliances, HVAC Climate Control, Security and Alarm Systems, Low-End Consumer Electronics, Sensor Interface Modules.
Industrial Control Systems
The MC9S08GT60CFD fits industrial control applications because its 40 MHz HCS08 core, 60 KB Flash, and 39 GPIO pins deliver sufficient compute and I/O for PLC-style logic, sensor aggregation, and actuator driving. Its 2.5V/3.3V dual-voltage operation simplifies interfacing with 3.3V industrial sensors while supporting legacy 2.5V rails. The 48-QFN package with exposed pad enables compact controller board designs where thermal dissipation is critical. Internal pullups on RESET and IRQ reduce external components, lowering total BOM and improving reliability in factory environments with electrical noise.
Recommended
White Goods and Home Appliances
The MC9S08GT60CFD suits white goods appliance control boards including washing machines, dishwashers, and refrigerators. Its 60 KB Flash accommodates full-featured user interface and motor control firmware, while 4 KB RAM supports runtime state buffers for wash cycles, temperature profiles, and user settings. The 39 GPIO pins interface with keypad inputs, LED/LCD displays, relays, and triac-driven heater elements. Software-selectable pullups simplify input button matrix wiring, reducing PCB complexity. The wide operating voltage tolerance supports direct connection to rectified mains-derived DC rails common in appliance designs.
Recommended
HVAC Climate Control
The MC9S08GT60CFD is well-matched for HVAC thermostat and climate control modules where reliable temperature sensing, relay control, and user interface management are required. Its ADC channels and PWM timers directly drive thermistor bridges, fan speed controllers, and compressor contactors without external glue logic. The HCS08 core's deterministic interrupt handling ensures timely response to sensor events. Low power consumption in idle modes extends thermostat battery life in wireless designs. The exposed-pad QFN package dissipates heat from continuous relay-driving operations reliably across HVAC operating temperature ranges.
Recommended
Security and Alarm Systems
The MC9S08GT60CFD serves as the central controller in security alarm panels, motion sensors with embedded intelligence, and access control readers. Its 60 KB Flash stores zone configuration tables, event logs, and communication protocol stacks. The 39 GPIO pins interface with PIR sensors, reed switches, keypad inputs, and siren drivers. Hardware background debug mode (BGND) enables in-circuit firmware updates during installation and service. Internal pullups reduce wiring harness component count. The robust HCS08 architecture has proven reliability in long-lifecycle security installations spanning 10+ years of continuous operation.
Recommended
Low-End Consumer Electronics
The MC9S08GT60CFD powers cost-sensitive consumer products such as remote controls, small appliances, toys, and educational electronics where unit cost and BOM simplicity matter most. Its 8-bit HCS08 core and 60 KB Flash provide adequate compute for user interface handling, sensor reading, and basic wireless protocol stacks. Software-selectable pullups reduce external resistor count. The compact 48-QFN package enables small form-factor consumer product designs. Low quiescent current extends battery life in portable consumer devices, and the proven HCS08 toolchain (CodeWarrior, Processor Expert) accelerates development cycles for time-to-market-driven consumer products.
Recommended
Sensor Interface Modules
The MC9S08GT60CFD integrates well in dedicated sensor interface modules that aggregate data from multiple analog and digital sensors before forwarding to a host controller via SPI, SCI, or I2C. Its ADC channels handle multiple analog sensor inputs, while GPIO pins read digital sensors and control local indicator LEDs. The 60 KB Flash accommodates sensor calibration tables, linearization routines, and protocol conversion firmware. The exposed-pad QFN package supports thermal stability required for precision analog measurement. Hardware BGND debug mode enables field calibration during sensor module manufacturing test processes.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08GT60CFD — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08GT60CFB | MC9S08GT60CFDE | MC9S08GT60VFD | MC9S08AC60CFGE | MC9S08AW60CFGE |
|---|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) |
| Flash Memory | 60 KB | 60 KB | 60 KB | 60 KB | 60 KB | 60 KB |
| RAM Size | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Max CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Operating Voltage | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V |
Key Differentiators
- Same S08GT60 silicon die across package variants (vs MC9S08GT60CFB)
- Extended temperature grade option within same family (vs MC9S08GT60CFDE)
- Higher-density alternative in same footprint (vs MC9S08AC60CFGE)
Design Notes
Estimated: The MC9S08GT60CFD core draws approximately 20-30 mA active at 40 MHz with 3.3V supply, based on typical HCS08 family specifications. Decouple VDD pins with 100 nF ceramic capacitors placed within 5 mm of each supply pin, plus a bulk 4.7 uF tantalum or ceramic capacitor near the package. The exposed thermal pad (EP) must be soldered to a ground-connected copper pour of at least 25 mm² to ensure proper thermal dissipation and electrical grounding. Estimated: active power dissipation at full clock is roughly 100 mW; sleep mode reduces this to under 1 mW for battery-friendly operation.
The 48-QFN package requires careful PCB layout: route all signal traces on inner layers if possible to free the top layer for the exposed pad copper pour. Place at least 4 thermal vias (0.3 mm drill, 0.5 mm pad) in the EP copper pour to transfer heat to internal ground planes. Keep high-speed signals (crystal, debug) short and direct. Maintain 50 ohm controlled impedance for external clock traces if used. Allow adequate clearance between analog and digital sections to minimize noise coupling on ADC inputs.
Do not leave the exposed pad (EP) unsoldered - this leads to thermal runaway and unreliable ground reference. Ensure the RESET pin has its internal pullup enabled or an external pullup to VDD; floating reset will cause unpredictable startup behavior. When using BGND debug mode, ensure the BKGD pin is not left floating during normal operation as it can inadvertently enter debug mode. Verify VDD voltage matches the device variant (2.5V or 3.3V) before applying power; overvoltage will damage the device permanently.
Compliance Information
RoHS compliance not explicitly confirmed in available verified data; AEC-Q100 not applicable for industrial-tilted S08GT family; lead-free packaging per NXP semiconductor standards
