MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP
N.º da peça: MC9S12B256MFUE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $36.37 | $36,37 |
| 10 | $32.45 | $324,50 |
| 100 | $28.2 | $2.820,00 |
| 500 | $24.85 | $12.425,00 |
| 1.000 | $21.6 | $21.600,00 |
MC9S12B256MFUE Visão geral
A microcontroller (MCU) is an integrated circuit that combines a CPU core, volatile memory (RAM), non-volatile program memory (Flash/ROM), and a configurable set of peripherals (timers, ADCs, communication interfaces) on a single die. The HCS12 core is a 16-bit CISC architecture from NXP that evolved from the HC11/HC12 lineage, optimized for automotive and industrial real-time control. The S12B family sits within the broader NXP 16-bit MCU hierarchy: HCS12 core -> S12B sub-family -> MC9S12B series -> specific MPNs with different memory/peripheral mixes.
Key features of the MC9S12B256MFUE include: 256KB Flash (256K x 8) with Fast Page Erase, 12KB RAM, 4KB EEPROM, a 10-bit ADC, an 8-channel PWM module, plus multiple communication interfaces including CAN 2.0 (msCAN), SCI, SPI, and I2C. The on-chip Enhanced Capture Timer (ECT) provides six 16-bit channels for input capture and output compare, supporting precise event timing required for engine and chassis control.
The device operates from 2.35V to 5.5V supply, supports -40C to +125C junction temperature, and integrates a PLL-based clock generator for flexible bus-speed scaling. The BDM (Background Debug Mode) interface and on-chip single-wire debug simplify in-circuit programming and field firmware updates. Internal architecture pairs the HCS12 CPU with a 32-bit HCS12X-style peripheral bus for higher throughput on time-critical registers.
Typical applications include automotive body and chassis modules, CAN-connected sensor nodes, industrial PLCs, HVAC controllers, and LIN/CAN bridges. Engineered for automotive multiplexing, the S12B family allows designers to swap memory or peripheral options without PCB rework, reducing time-to-market for tier-1 OEMs and aftermarket modules.
When designing with this MCU, place decoupling capacitors within 5 mm of each VDD/VSS pair, route the resonator/oscillator traces with a guarded ground channel, and keep CAN-H/CAN-L differential pairs at 100 ohm impedance. The NRND designation means NXP has flagged the part for limited future support - designers of new programs should evaluate S12XE or S12Z successors at the architectural level.
This page synthesizes distributor inventory, drop-in alternatives drawn from the same S12B and S12XE pin-compatible families, and practical design notes beyond what is in the standalone datasheet.
Alternativas drop-in para MC9S12B256MFUE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12B256MFUE (mesmo formato e footprint) — diferindo em Package, ADC, Core, Program Memory Size, Data Bus Width.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12B128MFUE
✅ Drop-In✓ Em estoque
$10.4 / unidade
Ver ficha técnica →MC9S12B512MFUE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DT256MFUE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$19.2 / unidade
Ver ficha técnica →MC9S12DJ256MFUE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12GC32MFUE
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →MC9S12D32MFUE
✅ Drop-In✓ Em estoque
$26.4032 / unidade
Ver ficha técnica →MC9S12XA256VAA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12B256MFUE Classificações máximas e características elétricas
| Core | HCS12 (16-bit CISC) |
| CPU Family | S12B (MC9S12B series) |
| Maximum CPU Clock | 25 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Tensão de alimentação | 2.35 V to 5.5 V |
| ADC | 10-bit, 8-channel |
| PWM Module | 8-channel, 8-bit |
| CAN (msCAN) | 1 x CAN 2.0A/B |
| SCI / SPI / I2C | Yes (1 each) |
| Enhanced Capture Timer | 6 x 16-bit channels |
| Temperatura de operação | -40 C to +125 C (junction) |
| Encapsulamento | 80-QFP, 14 x 14 mm, 1.0 mm pitch |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| Debug Interface | BDM (Background Debug Mode) |
| Lifecycle | NRND (Not Recommended for New Designs) |
Configuração de pinos do MC9S12B256MFUE
| Pino 1 | VDDR — Voltage regulator bypass / internal regulator output |
| Pino 2 | VDD1 — Digital I/O supply voltage (2.35V to 5.5V) |
| Pino 3 | VSS1 — Digital I/O ground |
| Pino 4 | VDD2 — Digital I/O supply voltage |
| Pino 5 | VSS2 — Digital I/O ground |
| Pino 6 | BKGD — Background Debug Mode (BDM) serial communication |
| Pino 7 | RESET — External reset input (active low, internal pull-up) |
| Pino 8 | XTAL — Crystal oscillator input / external clock input |
| Pino 9 | EXTAL — Crystal oscillator feedback |
| Pino 10 | PE7 — Port E bit 7 (general I/O, XIRQ interrupt capable) |
| Pino 11 | PE6 — Port E bit 6 (general I/O) |
| Pino 12 | PE5 — Port E bit 5 (general I/O) |
| Pino 13 | PE4 — Port E bit 4 (general I/O) |
| Pino 14 | PE3 — Port E bit 3 (general I/O) |
| Pino 15 | PE2 — Port E bit 2 (general I/O) |
| Pino 16 | PE1 — Port E bit 1 (general I/O, IRQ interrupt) |
| Pino 17 | PE0 — Port E bit 0 (general I/O, IRQ interrupt) |
| Pino 18 | PA7 — Port A bit 7 (general I/O, address/data bus) |
| Pino 19 | PA6 — Port A bit 6 (general I/O) |
| Pino 20 | PA5 — Port A bit 5 (general I/O) |
| Pino 21 | PA4 — Port A bit 4 (general I/O) |
| Pino 22 | PA3 — Port A bit 3 (general I/O) |
| Pino 23 | PA2 — Port A bit 2 (general I/O) |
| Pino 24 | PA1 — Port A bit 1 (general I/O) |
| Pino 25 | PA0 — Port A bit 0 (general I/O) |
| Pino 26 | PB7 — Port B bit 7 (general I/O) |
| Pino 27 | PB6 — Port B bit 6 (general I/O) |
| Pino 28 | PB5 — Port B bit 5 (general I/O) |
| Pino 29 | PB4 — Port B bit 4 (general I/O) |
| Pino 30 | PB3 — Port B bit 3 (general I/O) |
| Pino 31 | PB2 — Port B bit 2 (general I/O) |
| Pino 32 | PB1 — Port B bit 1 (general I/O) |
| Pino 33 | PB0 — Port B bit 0 (general I/O) |
| Pino 34 | PC7 — Port C bit 7 (general I/O) |
| Pino 35 | PC6 — Port C bit 6 (general I/O) |
| Pino 36 | PC5 — Port C bit 5 (general I/O) |
| Pino 37 | PC4 — Port C bit 4 (general I/O) |
| Pino 38 | PC3 — Port C bit 3 (general I/O) |
| Pino 39 | PC2 — Port C bit 2 (general I/O) |
| Pino 40 | PC1 — Port C bit 1 (general I/O) |
| Pino 41 | PC0 — Port C bit 0 (general I/O) |
| Pino 42 | PD7 — Port D bit 7 (CAN / I/O shared) |
| Pino 43 | PD6 — Port D bit 6 (CAN / I/O shared) |
| Pino 44 | PD5 — Port D bit 5 (PWM / I/O shared) |
| Pino 45 | PD4 — Port D bit 4 (PWM / I/O shared) |
| Pino 46 | PD3 — Port D bit 3 (PWM / I/O shared) |
| Pino 47 | PD2 — Port D bit 2 (PWM / I/O shared) |
| Pino 48 | PD1 — Port D bit 1 (PWM / I/O shared) |
| Pino 49 | PD0 — Port D bit 0 (PWM / I/O shared) |
| Pino 50 | PAD07 — Port AD bit 7 (analog/digital input, 10-bit ADC) |
| Pino 51 | PAD06 — Port AD bit 6 (analog/digital input, 10-bit ADC) |
| Pino 52 | PAD05 — Port AD bit 5 (analog/digital input, 10-bit ADC) |
| Pino 53 | PAD04 — Port AD bit 4 (analog/digital input, 10-bit ADC) |
| Pino 54 | PAD03 — Port AD bit 3 (analog/digital input, 10-bit ADC) |
| Pino 55 | PAD02 — Port AD bit 2 (analog/digital input, 10-bit ADC) |
| Pino 56 | PAD01 — Port AD bit 1 (analog/digital input, 10-bit ADC) |
| Pino 57 | PAD00 — Port AD bit 0 (analog/digital input, 10-bit ADC) |
| Pino 58 | VRH — ADC reference high voltage |
| Pino 59 | VRL — ADC reference low voltage |
| Pino 60 | VDD3 — Digital I/O supply |
| Pino 61 | VSS3 — Digital I/O ground |
| Pino 62 | PP7 — Port P bit 7 (PWM channel 7) |
| Pino 63 | PP6 — Port P bit 6 (PWM channel 6) |
| Pino 64 | PP5 — Port P bit 5 (PWM channel 5) |
| Pino 65 | PP4 — Port P bit 4 (PWM channel 4) |
| Pino 66 | PP3 — Port P bit 3 (PWM channel 3) |
| Pino 67 | PP2 — Port P bit 2 (PWM channel 2) |
| Pino 68 | PP1 — Port P bit 1 (PWM channel 1) |
| Pino 69 | PP0 — Port P bit 0 (PWM channel 0) |
| Pino 70 | PS7 — Port S bit 7 (SPI / I2C / SCI shared) |
| Pino 71 | PS6 — Port S bit 6 (SPI / I2C / SCI shared) |
| Pino 72 | PS5 — Port S bit 5 (SPI / I2C / SCI shared) |
| Pino 73 | PS4 — Port S bit 4 (SPI / I2C / SCI shared) |
| Pino 74 | PS3 — Port S bit 3 (SPI / I2C / SCI shared) |
| Pino 75 | PS2 — Port S bit 2 (SPI / I2C / SCI shared) |
| Pino 76 | PS1 — Port S bit 1 (SPI / I2C / SCI shared) |
| Pino 77 | PS0 — Port S bit 0 (SPI / I2C / SCI shared) |
| Pino 78 | XFC — PLL loop filter capacitor |
| Pino 79 | VDD4 — Digital I/O supply |
| Pino 80 | VSS4 — Digital I/O ground |
Aplicações típicas
MC9S12B256MFUE é adequado para 7 aplicaçãos: Automotive Body Control Module (BCM), Industrial Sensor Hub with CAN Output, HVAC Climate Control Unit, LIN/CAN Gateway Bridge, Battery Management Module (12V/24V Automotive), Automotive Instrument Cluster Auxiliary MCU, CAN-Connected Lighting Module.
Automotive Body Control Module (BCM)
The MC9S12B256MFUE is well suited to body control modules because it integrates 256 KB Flash for door/window/lamp logic plus a msCAN port for chassis-class networking. The 10-bit ADC reads ratiometric switches and battery voltage (up to 5.5 V tolerant) directly, and the 8-channel PWM drives LED dimming and mirror motors at 8-bit resolution. Compared with a discrete + LIN approach, putting the algorithm on the HCS12 core removes an external logic chip and reduces BOM cost. The 12 KB SRAM and 4 KB EEPROM are sufficient for storing learned trim positions and fault codes. Designers should budget 5-8 KB of Flash for the BDM-friendly bootloader used in field firmware updates.
Recomendado
Industrial Sensor Hub with CAN Output
The MC9S12B256MFUE serves as a CAN-connected industrial sensor hub: the 10-bit ADC digitizes analog sensors while the msCAN reports filtered readings on a 250 kbps bus. With 256 KB Flash, ample room remains for sensor linearization curves, digital filters, and a CANopen-style object dictionary. Operating from -40C to +125C allows deployment near motors and hydraulic actuators. The 25 MHz HCS12 core provides enough headroom for floating-point math and dual-axis sensor fusion without an external DSP. Place a CAN transceiver such as TJA1040 within 50 mm of the CAN pins to keep the differential pair matched at 100 ohm and meet IEC 61000-4-2 ESD on the bus.
Recomendado
HVAC Climate Control Unit
Climate-control units benefit from the MC9S12B256MFUE because the PWM module drives blower motors and stepper valves directly, while the ADC reads thermistor inputs for closed-loop temperature regulation. The 8-channel 8-bit PWM eliminates the need for a separate motor-driver MCU, and the on-chip EEPROM saves user-preference setpoints across power cycles. With a 2.35 V to 5.5 V supply range, the part survives cranking transients on 12 V automotive buses when paired with an external regulator. The Enhanced Capture Timer measures AC-line frequencies for 50/60 Hz hum rejection. Comparable in capability to dedicated HVAC MCUs, the B256 adds 256 KB Flash for graphical LCD menu code.
Recomendado
LIN/CAN Gateway Bridge
Use the MC9S12B256MFUE as a low-cost LIN-to-CAN bridge for automotive network segments. The SCI1 channel pairs with a TJA1027 LIN transceiver, while the msCAN port sits on the chassis CAN backbone. With 256 KB Flash the part holds the full LIN 2.1 diagnostic stack and CAN transport layer simultaneously. The HCS12 core executes the translation table at sub-millisecond latency, faster than typical LIN frame deadlines. Compared with dedicated bridge ICs, the B256 gives firmware-upgrade capability and OEM-customizable node behaviors. Keep the LIN and CAN traces separated by a ground pour to limit cross-bus noise coupling.
Recomendado
Battery Management Module (12V/24V Automotive)
For automotive battery monitoring, the MC9S12B256MFUE reads stack voltage, current shunt, and temperature sensors via its 10-bit ADC. The EEPROM stores battery aging parameters and SoH (state-of-health) history - 4 KB is enough for ~30 days of hourly logs. CAN connectivity streams SoC (state-of-charge) to the vehicle ECU. The wide 2.35 V to 5.5 V supply lets the part operate directly from a 12 V rail after a small LDO. Designers should verify the ADC's 10-bit precision across the -40C to +125C range; for higher accuracy consider the S12X derivatives with 12-bit ADC.
Recomendado
Automotive Instrument Cluster Auxiliary MCU
The MC9S12B256MFUE sits as an auxiliary controller driving stepper-motor gauges and warning lamps in an instrument cluster. Each PWM channel controls a single analog gauge, and the ADC reads fuel-level sender and oil-pressure inputs. The 256 KB Flash stores graphic-segment rendering code and CAN diagnostic tables. Compared with discrete logic, this approach yields a single firmware build that scales across car models by changing lookup tables in Flash. The NRND lifecycle status means designers planning new cluster programs should pivot to S12ZVL or S32K families - the B256 remains viable for legacy platforms only.
Recomendado
CAN-Connected Lighting Module
The MC9S12B256MFUE powers an automotive lighting module where the 8-channel PWM drives LED strings at 8-bit brightness per channel, and the msCAN bus receives lighting commands from the BCM. The 256 KB Flash contains the boot loader, LED thermal-folding algorithm, and CAN diagnostic handler. Operating junction temperature up to 125C supports under-hood placement. Compared with discrete 8-bit PWM expanders, the B256 reduces PCB area by roughly 60 percent. Pair each PWM output with an external MOSFET driver since the on-chip PWM is logic-level only and cannot sink incandescent bulb currents directly.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12B256MFUE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12B128MFUE | MC9S12B512MFUE | MC9S12DT256MFUE | MC9S12XA256VAA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP 14x14 mm | 80-QFP 14x14 mm (same) | 80-QFP 14x14 mm (same) | 80-QFP 14x14 mm (same) | 80-QFP 14x14 mm (same) |
| Flash Memory | 256 KB | 128 KB (-50%) | 512 KB (+100%) | 256 KB (same) | 256 KB (same) |
| RAM | 12 KB | 8 KB | 16 KB | 12 KB | 12 KB |
| CPU Core | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12X 16-bit + XGate co-processor |
| Maximum CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 40 MHz |
| CAN Controllers | 1 x msCAN | 1 x msCAN | 1 x msCAN | 2 x msCAN | 5 x msCAN |
| SCI / SPI / I2C | 1 / 1 / 1 | 1 / 1 / 1 | 1 / 1 / 1 | 2 / 1 / 1 | 2 / 1 / 1 |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
Principais diferenciais
- Largest Flash in the 80-QFP 14x14 S12B lineup with active CPU clock at 25 MHz (vs MC9S12B128MFUE)
- Pin-compatible upgrade path to dual-CAN with no PCB change (vs MC9S12DT256MFUE)
- Legacy-compatible HCS12 core without the XGate co-processor (vs MC9S12XA256VAA)
Notas de projeto
Place a 100 nF decoupling capacitor on every VDD/VSS pair (VDD1/SS1 through VDD4/SS4) within 5 mm of the pin. Add a single 10 uF bulk tantalum or ceramic at the supply entry point. The internal 2.5 V regulator requires a 1 uF low-ESR cap on VDDR (pin 1); failure to add this cap causes erratic PLL lock behavior. Total estimated decoupling budget: ~4 x 100 nF + 1 x 10 uF + 1 x 1 uF. Estimated total capacitor cost is approximately $0.20 per board at qty 1000.
Keep the XTAL/EXTAL traces short (under 10 mm) and surround them with a guarded ground channel. Place the crystal load capacitors within 5 mm of each pin and connect their common node to a quiet analog ground. If an external CMOS clock drives EXTAL, leave XTAL floating. For CAN-bus applications, route CAN-H/CAN-L as a 100 ohm differential pair, matching length within 5 mm, and keep the bus away from switching power traces by at least 3 mm. The 80-QFP 14x14 mm footprint allows generous creepage but still requires a ground pour under the package to reduce thermal resistance.
Do not connect the BKGD (Background Debug) pin to a push-pull driver; it uses an open-drain scheme with an internal pull-up. Reverse-engineered clone parts marked 9S12B256 are electrically similar but may disable the BDM lock command, allowing code extraction - always source from authorized distributors or directly from NXP. The NRND status on the NXP product page does not mean production has stopped - stock is still active as of 2026-10-21 - but new designs should evaluate S12Z or S32K derivatives.
Estimated: at 25 MHz CPU clock with all peripherals active and 5.0 V VDD, the MC9S12B256MFUE draws approximately 60 mA, dissipating ~300 mW. With a QFP-80 theta-JA of roughly 45 C/W on a 4-layer PCB with 1 oz copper, junction rise above 25 C ambient is ~13.5 C - well within the 125 C maximum. For tight enclosures above 85 C ambient, add thermal vias under the center pad and increase copper pour area. The part is specified for -40 C to +125 C junction operation per the verified NXP family data.
Informações de conformidade
RoHS compliant per NXP material declaration. Not AEC-Q100 qualified in this MPN suffix - for AEC-Q100 automotive-grade operation use the validated S12X/Q families. Halogen-free status not stated in the available data; set to unknown.
