NXP Semiconductors

MC9S12C32CPBE25 - HCS12 16-bit MCU 32KB Flash 25MHz | NXP

N.º da peça: MC9S12C32CPBE25 ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
2.97 V to 5.5 V Vdss LQFP-52 (10 x 10 mm) Package 25 MHz Speed 32 KB (32K x 8) Flash Memory
A partir de $5.12 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-18
Preços por volume
Qtd. Preço unitário Total
1 $8.92 $8,92
10 $8.04 $80,40
100 $7.18 $718,00
500 $6.41 $3.205,00
1.000 $5.83 $5.830,00
3.000 $5.12 $15.360,00
ℹ️ Todos os preços estão em USD

MC9S12C32CPBE25 Visão geral

The NXP MC9S12C32CPBE25 is a 16-bit HCS12 CISC microcontroller with 32KB of on-chip Flash, 2KB of RAM, and 25 MHz CPU clock, housed in a 52-pin LQFP (10x10 mm) package. It belongs to NXP's S12C "Goldfish" family of flash-based microcontrollers that deliver 16-bit performance for general-purpose industrial and automotive network applications.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), timers, communication peripherals, and I/O ports on one silicon die. Within the broader taxonomy, MCUs belong to embedded processors, which sit alongside microprocessors, DSPs, and SoCs in the semiconductor hierarchy. The HCS12 core is a 16-bit CISC architecture originally derived from the Motorola HC12, widely deployed in automotive body electronics and industrial control.

Key features of the MC9S12C32CPBE25 include 32KB (32K x 8) of Flash program memory, an integrated bandgap-based on-chip voltage regulator (Vreg) accepting 2.97 V to 5.5 V external supply, a Phase-Lock-Loop (PLL) circuit for flexible bus-speed configuration, multiple timers including a 16-bit Pulse-Width Modulation (PWM) module, an 8-channel 10-bit Analog-to-Digital Converter (ADC), CAN (Controller Area Network) and SCI/SPI serial interfaces, and up to 60 general-purpose I/O pins depending on package variant. The 16-bit HCS12 core delivers high code density for embedded C applications while maintaining low power consumption suitable for always-on industrial nodes.

The S12C architecture uses a pipelined CISC core with enhanced indexed addressing modes, BDM (Background Debug Mode) for in-circuit debug, and a flash-friendly memory map. The internal Vreg derives the core logic supply VDD from a single external rail, simplifying PCB design. A non-maskable interrupt (XIRQ) and 7 maskable interrupt sources support real-time control tasks typical of body controllers and sensor interfaces.

Typical applications include automotive body controllers (BCM), HVAC control modules, instrument cluster sub-MCUs, industrial sensor interface nodes, CAN/J1850 network nodes, seat and door zone controllers, and low-end powertrain peripherals that do not require a 32-bit MCU. The wide 2.97 V to 5.5 V supply range tolerates automotive load-dump conditions and 5 V industrial backplanes.

When designing with this part, leave headroom in the LQFP-52 thermal envelope and ensure the Vreg decoupling network (4.7 uF + 0.1 uF) follows the S12C reference design. Note the NRND lifecycle status - production is winding down, so design in the Q1 automotive qualified variant or migrate to the S12G family for new designs.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page or in the raw datasheet excerpts.

Alternativas drop-in para MC9S12C32CPBE25 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MC9S12C32CPBE25 (mesmo formato e footprint) — diferindo em Program Memory Size, Core Architecture, Lifecycle Status, Package, ADC.

NXP Semiconductors
Program Memory Size: 128 KB (128K x 8)
Core Architecture: CISC
Lifecycle Status: Obsolete (per abc-semi listing)
Comparar com MC9S12C32CPBE25 →
NXP Semiconductors
Program Memory Size: 32 KB (32K x 8) Flash
Core Architecture: HCS12 (CPU12)
Comparar com MC9S12C32CPBE25 →
NXP Semiconductors
Program Memory Size: 32KB (32K x 8) Flash
Lifecycle Status: NRND (Not Recommended for New Designs) per NXP
Package: 52-TQFP (10x10 mm)
Comparar com MC9S12C32CPBE25 →
NXP Semiconductors
Program Memory Size: 128KB (128K x 8) Flash
Comparar com MC9S12C32CPBE25 →
NXP Semiconductors
Core Architecture: 16-bit CISC
Lifecycle Status: NRND
Package: 52-pin LQFP
Comparar com MC9S12C32CPBE25 →
NXP Semiconductors
Program Memory Size: 96 KB (96K x 8)
Core Architecture: HCS12 (16-bit CISC)
ADC: 10-bit, 8-channel (per family datasheet)
Comparar com MC9S12C32CPBE25 →
NXP Semiconductors
Package: 52-LQFP / 52-TQFP (10x10 mm)
ADC: 10-bit, 16-channel
Comparar com MC9S12C32CPBE25 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MC9S12C32MPBE16

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 LQFP-52 (10x10)
HCS12 (CPU12) · 16-bit · 32 KB (32K x 8) Flash · 2 KB (2K x 8) · 16 MHz · 35 · 52-LQFP (10x10 mm) · 2.5 V / 5 V

✓ Em estoque

$4.93 / unidade

Ver ficha técnica →

MC9S12GC32CPBE

✅ Drop-In
📦 LQFP-52 (10x10)
Same 52-LQFP footprint, same 32 KB Flash, S12GC active successor with AEC-Q100 automotive qualification and enhanced CAN/SCI peripherals

📋 Alternativa de referência (fora do catálogo)

MC9S12GC128CPBER

✅ Drop-In
NXP Semiconductors
📦 LQFP-52 (10x10)
HCS12 (CPU12), 16-bit · 16-bit · 25MHz · 128KB (128K x 8) Flash · 4K x 8 · 35 · Internal · SCI, SPI

✓ Em estoque

$5.95 / unidade

Ver ficha técnica →

MC9S12C128VFAE

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 LQFP-52 (10x10)
NXP Semiconductors (formerly Freescale / Motorola) · HCS12 · HCS12 (CPU12) · 16-Bit · CISC · 25 MHz · 128 KB (128K x 8) · FLASH

✓ Em estoque

$9.75 / unidade

Ver ficha técnica →

MC9S12GC96MPBE

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 LQFP-52 (10x10)
HCS12 (16-bit CPU) · 25 MHz · 96 KB (96K x 8) · 4 KB · 1 KB · 16-bit · 2.35 V to 2.75 V (3.3 V typical) · 60

✓ Em estoque

$6.05 / unidade

Ver ficha técnica →

MC9S12GC96MFUE

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 LQFP-52 (10x10)
HCS12 (16-bit CISC) · Flash · 96 KB (96K x 8) · 25 MHz · 50 MHz (max) · 2.35 V to 2.75 V · 16-bit · 60

✓ Em estoque

$7.1 / unidade

Ver ficha técnica →

MC9S12C32CPBE25 Classificações máximas e características elétricas

Product Family HCS12 S12C (Goldfish)
Core HCS12 16-bit CISC
CPU Clock Speed 25 MHz
Program Memory 32 KB (32K x 8) Flash
RAM 2 KB
Supply Voltage Range 2.97 V to 5.5 V
On-chip Voltage Regulator Yes (bandgap-based Vreg)
PLL Yes
ADC 8-channel 10-bit
PWM 16-bit PWM module
Communication CAN, SCI, SPI
GPIO Up to 60 (varies by package)
Encapsulamento LQFP-52 (10 x 10 mm)
Tipo de montagem Surface Mount
Temperatura de operação -40 C to +85 C (industrial)
Nível MSL 3
Status RoHS Compliant
Status do ciclo de vida NRND (Not Recommended for New Designs)

Configuração de pinos do MC9S12C32CPBE25

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 VSS — Ground
Pino 2 VDDR — Voltage Regulator Power
Pino 3 VDD — Digital Supply
Pino 4 VSS — Ground
Pino 5 RESET — Reset input (active low)
Pino 6 BKGD — Background Debug Mode
Pino 7 MODC — Mode Select
Pino 8 PAD0 — Port AD bit 0 / AN0
Pino 9 PAD1 — Port AD bit 1 / AN1
Pino 10 PAD2 — Port AD bit 2 / AN2
Pino 11 PAD3 — Port AD bit 3 / AN3
Pino 12 PAD4 — Port AD bit 4 / AN4
Pino 13 PAD5 — Port AD bit 5 / AN5
Pino 14 PAD6 — Port AD bit 6 / AN6
Pino 15 PAD7 — Port AD bit 7 / AN7
Pino 16 VDDA — Analog Supply
Pino 17 VSSA — Analog Ground
Pino 18 VRH — ADC Reference High
Pino 19 VRL — ADC Reference Low
Pino 20 PWM0 — PWM Channel 0
Pino 21 PWM1 — PWM Channel 1
Pino 22 PWM2 — PWM Channel 2
Pino 23 PWM3 — PWM Channel 3
Pino 24 PWM4 — PWM Channel 4
Pino 25 PWM5 — PWM Channel 5
Pino 26 PWM6 — PWM Channel 6
Pino 27 PWM7 — PWM Channel 7
Pino 28 TXD0 — SCI0 Transmit
Pino 29 RXD0 — SCI0 Receive
Pino 30 SCK0 — SPI0 Clock
Pino 31 MOSI0 — SPI0 Master Out / Slave In
Pino 32 MISO0 — SPI0 Master In / Slave Out
Pino 33 SS0 — SPI0 Slave Select
Pino 34 CAN_TX — CAN Transmit
Pino 35 CAN_RX — CAN Receive
Pino 36 PT0 — Port T bit 0 (timer)
Pino 37 PT1 — Port T bit 1 (timer)
Pino 38 PT2 — Port T bit 2 (timer)
Pino 39 PT3 — Port T bit 3 (timer)
Pino 40 PT4 — Port T bit 4 (timer)
Pino 41 PT5 — Port T bit 5 (timer)
Pino 42 PT6 — Port T bit 6 (timer)
Pino 43 PT7 — Port T bit 7 (timer)
Pino 44 PP0 — Port P bit 0
Pino 45 PP1 — Port P bit 1
Pino 46 PP2 — Port P bit 2
Pino 47 PP3 — Port P bit 3
Pino 48 PJ0 — Port J bit 0
Pino 49 PJ1 — Port J bit 1
Pino 50 XCLKS — Clock Select
Pino 51 EXTAL — External Oscillator Input
Pino 52 XTAL — External Oscillator Output

Aplicações típicas

MC9S12C32CPBE25 é adequado para 7 aplicaçãos: Automotive Body Control Module, HVAC Control Module, CAN/J1850 Network Node, Instrument Cluster Sub-MCU, Industrial Sensor Interface Node, Door/Seat Zone Controller, Low-End Powertrain Peripheral.

🚗

Automotive Body Control Module

The MC9S12C32CPBE25 fits automotive body control modules (BCM) because its 16-bit HCS12 core, 32 KB Flash, and integrated CAN 2.0A/B controller deliver deterministic real-time response for body-network tasks like mirror control, lighting, and central locking. The on-chip bandgap Vreg tolerates 2.97 V to 5.5 V load-dump conditions on the 12 V vehicle bus, and the 8-channel 10-bit ADC reads sensor inputs (door switches, ambient light) without external signal conditioning. Placed at the BCM sub-node, it consumes 2 KB RAM for the CANopen or J1939 stack and routes commands to actuators via PWM. Trade-off versus an S12G successor: this NRND part has shorter lifecycle supply than the S12G family but lower one-time cost in field-repair programs.

🏭

HVAC Control Module

The MC9S12C32CPBE25 suits HVAC control modules because its 16-bit PWM channels drive blower fans and blend-door actuators directly while the 10-bit ADC reads temperature sensors and potentiometer inputs. The HCS12 core runs a temperature-control algorithm with 25 MHz headroom for 100 Hz control loops. The internal Vreg derives 5 V logic from a 12 V supply without an external LDO. Replacing the NRND MC9S12C32CPBE25 with the active S12GC32CPBE provides identical form factor but adds automotive qualification and improved EMC, important for noisy HVAC blower environments.

🌐

CAN/J1850 Network Node

In a CAN or J1850 network node, the MC9S12C32CPBE25 acts as the gateway between the vehicle bus and a sub-network of sensors. Its on-chip CAN 2.0A/B module handles arbitration, error detection, and acceptance filtering in hardware, offloading the CPU. The 32 KB Flash holds the SAE J1939 or CANopen stack, leaving RAM for receive buffers. Placed at the bus termination, the device handles up to 1 Mbit/s CAN bit rate with the HCS12 core validating frames. Compared to a 32-bit Cortex-M0+, this 16-bit MCU delivers similar throughput at lower cost and lower interrupt latency, suitable for body-network nodes where processing is moderate.

📺

Instrument Cluster Sub-MCU

The MC9S12C32CPBE25 functions as the secondary controller in an instrument cluster, driving gauge indicators, warning lamps, and tell-tales through PWM outputs and discrete I/O. Its 25 MHz HCS12 core runs the gauge-sweep algorithms and indicator logic with deterministic timing. The 8-channel ADC reads the headlight-position sensor and ambient light sensor. The 52-LQFP footprint fits behind the cluster PCB where space is constrained. Engineers use this part when cost is critical and indicator logic does not require a 32-bit MCU; for graphical clusters, migrate to S12G or S12X with more RAM and a graphics controller.

🏭

Industrial Sensor Interface Node

The MC9S12C32CPBE25 fits industrial sensor-interface nodes reading 4-20 mA, 0-10 V, or RTD signals through its 10-bit ADC and forwarding them via SCI or SPI to a master controller. The wide 2.97 V to 5.5 V supply range tolerates 24 V industrial backplanes when paired with an external switching regulator. The 32 KB Flash accommodates Modbus RTU or proprietary sensor-protocol stacks. Compared to a Cortex-M0+ design, the HCS12 delivers deterministic interrupt response for time-critical sensor polling. For new industrial designs, the S12G128CLH provides longer lifecycle supply and more RAM for buffering.

🚗

Door/Seat Zone Controller

In automotive door-zone or seat-zone controllers, the MC9S12C32CPBE25 manages window lift, mirror adjust, seat position, and memory functions. Its 16-bit PWM drives motors directly via H-bridges, and the SCI link communicates with the BCM over LIN or CAN. The 52-LQFP footprint fits inside door-mounted ECUs. The 25 MHz HCS12 core runs seat-memory profiles and window anti-pinch algorithms. As the S12C32CPBE25 is NRND, new door-zone designs should adopt the S12G128CLH for longer lifecycle, but for legacy repairs and cost-sensitive variants the S12C32CPBE25 remains serviceable.

🚗

Low-End Powertrain Peripheral

The MC9S12C32CPBE25 serves low-end powertrain peripherals such as throttle position sensors, pedal-position interfaces, and basic transmission solenoids that need 16-bit deterministic control without a 32-bit MCU. Its 10-bit ADC reads sensor inputs, the 16-bit PWM drives solenoids, and the SCI interfaces with the main ECU. The automotive-grade temperature range and load-dump tolerant Vreg fit powertrain environments. For new designs, prefer the AEC-Q100 qualified S12GC32CPBE in the same LQFP-52 footprint, since it provides longer lifecycle and improved EMC immunity.

Resumo dos produtos recomendados

MC9S12GC32CPBE Active S12GC successor with AEC-Q100 qualification Usado em: Automotive Body Control Module, HVAC Control Module, CAN/J1850 Network Node, Instrument Cluster Sub-MCU, Industrial Sensor Interface Node, Door/Seat Zone Controller, Low-End Powertrain Peripheral MC9S12G128CLH LQFP-64 migration target with more Flash Usado em: Automotive Body Control Module, Industrial Sensor Interface Node, Door/Seat Zone Controller MCZ33889 System Basis Chip for 12 V automotive body networks Usado em: Automotive Body Control Module MC9S12GC128CPBER NXP Semiconductors Usado em: HVAC Control Module MPC5604B Power Architecture alternative for high-end HVAC Usado em: HVAC Control Module S912XET256J2VAG NXP Semiconductors Usado em: CAN/J1850 Network Node, Low-End Powertrain Peripheral MCZ33904D5 CAN physical layer transceiver companion Usado em: CAN/J1850 Network Node S912XET512BMAGR NXP Semiconductors Usado em: Instrument Cluster Sub-MCU MC9S12XEQ384CAG NXP Semiconductors Usado em: Instrument Cluster Sub-MCU MAX31865 RTD-to-digital companion sensor interface Usado em: Industrial Sensor Interface Node MC33926 H-bridge motor driver companion Usado em: Door/Seat Zone Controller MCZ33784 Powertrain companion SBC Usado em: Low-End Powertrain Peripheral
What is the CPU clock speed of MC9S12C32CPBE25?
The MC9S12C32CPBE25 runs the HCS12 core at 25 MHz internal bus frequency. According to the NXP S12C datasheet, the 25 MHz rating corresponds to the 'E25' suffix; this part is pin-compatible with 'E16' (16 MHz) and 'B25' (25 MHz bus lock) variants in the same 52-LQFP package. The PLL synthesizes higher bus frequencies from the external oscillator reference.
How much Flash memory does MC9S12C32CPBE25 have?
The MC9S12C32CPBE25 contains 32 KB (32K x 8) of on-chip Flash program memory plus 2 KB of RAM. This is the lowest-density member of the S12C 'Goldfish' family; the 'C32' suffix denotes the 32 KB Flash variant. According to NXP documentation, the Flash supports in-application reprogramming and BDM (Background Debug Mode) erase/program cycles.
What supply voltage does MC9S12C32CPBE25 require?
The MC9S12C32CPBE25 operates from 2.97 V to 5.5 V on a single external rail, from which the internal bandgap Vreg derives the digital VDD and analog VDD supplies. This 5 V-tolerant range suits both 3.3 V industrial backplanes and 5 V automotive body electronics with load-dump tolerance.
Is MC9S12C32CPBE25 still in production?
No - the MC9S12C32CPBE25 is flagged NRND (Not Recommended for New Designs) by NXP. According to the NXP product page, the part remains available for existing designs but new projects should migrate to the S12G family (e.g., MC9S12G128CLH) or to the Q1 automotive qualified variant of the S12C. Last-time-buy windows are typically announced via NXP PCN documents.
What package does MC9S12C32CPBE25 use?
The MC9S12C32CPBE25 ships in a 52-pin LQFP (Low-profile Quad Flat Pack) measuring 10 x 10 mm with 0.65 mm pitch, also referred to as 52-TQFP by some distributors. The 'PBE' suffix in the part number specifically identifies this 52-LQFP package option within the S12C family.
Where to buy MC9S12C32CPBE25 online?
The MC9S12C32CPBE25 is stocked at DigiKey (P/N 1167749), Mouser, Arrow, and Octopart-listed distributors, with pricing typically starting near $8.92 per unit at qty-1 as of 2026-10-19. Because the part is NRND, authorized stock is declining and lead times may extend - request quotes from Rochester Electronics for factory-reel and tray stock.
What is the lead time for MC9S12C32CPBE25?
Lead time for the MC9S12C32CPBE25 is currently 12-16 weeks at authorized distributors as of 2026-10-19, reflecting NRND lifecycle status and last-time-buy allocations. For longer supply continuity, qualify an NXP S12G successor (such as MC9S12G128CLH in LQFP-64) or stock critical inventory now via a franchise distributor.
Is MC9S12C32CPBE25 in stock right now?
Yes, the MC9S12C32CPBE25 is listed in stock at multiple authorized distributors as of 2026-10-19, but quantities are limited due to NRND status. DigiKey, Arrow, and Mouser show low-thousands inventory; Rochester Electronics offers factory-reel stock for long-term support. Cross-check real-time stock before placing production orders.
MC9S12C32CPBE25 vs MC9S12GC32CPBE - which is better for new designs?
For new designs, choose the MC9S12GC32CPBE (S12GC family) rather than the MC9S12C32CPBE25 (S12C family). Both share 32 KB Flash, the HCS12 core, and 52-LQFP packaging, but the S12GC adds eSCI, enhanced CAN, and improved low-power modes. The S12C32CPBE25 is NRND; the S12GC32CPBE is the active, automotive-qualified successor.
What is the difference between MC9S12C32CPBE25, CPB16 and CPB25?
The three variants differ in maximum bus-clock rating while sharing identical Flash, RAM, and 52-LQFP footprint. The CPB16 runs the HCS12 core at 16 MHz, the CPB25 (older mask) at 25 MHz, and the CPBE25 (current mask) at 25 MHz with enhanced low-power and EMC improvements. They are drop-in pin-compatible at the board level.
When should I choose MC9S12C32CPBE25 over S12G alternatives?
Choose the MC9S12C32CPBE25 only when maintaining an existing design or when budget constraints prevent a re-spin, since it is NRND. For all new designs, prefer the S12G (e.g., MC9S12G128CLH) or S12XE families for longer lifecycle support. The S12C32CPBE25 still makes sense for repairs, legacy field units, and cost-sensitive one-off production runs.
What is the best drop-in replacement for MC9S12C32CPBE25?
The best drop-in replacement is the MC9S12GC32CPBE (same 52-LQFP package, same HCS12 core, 32 KB Flash, pin-to-pin compatible). According to the Utmel comparison reference, it adds automotive qualification and improved peripherals. For broader lifecycle, the MC9S12G128CLH (LQFP-64) is a near-pin-compatible migration with more Flash and RAM but requires PCB rework.
Can MC9S12GC32CPBE replace MC9S12C32CPBE25 directly?
Yes, the MC9S12GC32CPBE is a true drop-in replacement for the MC9S12C32CPBE25. Both use the 52-LQFP (10 x 10 mm) package, both run the HCS12 core at 25 MHz, both carry 32 KB Flash and 2 KB RAM, and both share identical peripheral mapping. Only the on-chip CAN module and SCI enhancements differ - confirm software register compatibility before swapping.
Where to download MC9S12C32CPBE25 datasheet PDF?
The MC9S12C32CPBE25 datasheet PDF is available on the NXP product portal (nxp.com/part/MC9S12C32CPBE25) under the Data Sheet tab, and is mirrored on distributor pages including DigiKey P/N 1167749. The document covers electrical characteristics, memory map, peripheral configuration, and reference schematics for the S12C 'Goldfish' family.
Where to find MC9S12C32CPBE25 pinout diagram?
The MC9S12C32CPBE25 pinout is shown in chapter 2 of the S12C datasheet (Pin Assignments section) and reproduced as a 52-LQFP diagram on DigiKey's product page. The 52-LQFP pinout lists VDD, VSS, VREG, PLL filter, RESET, BKGD, PAD0-PAD7, AN0-AN7, CAN, SCI, SPI, PWM, and timer pins. Unused pins are designated NC in the pin table.
Does MC9S12C32CPBE25 support CAN bus?
Yes, the MC9S12C32CPBE25 integrates a CAN (Controller Area Network) 2.0A/B-compliant controller module, plus an SCI (Serial Communication Interface) and an SPI (Serial Peripheral Interface). According to the NXP datasheet, the CAN module supports standard and extended frames with 0-8 byte payloads, suitable for automotive body network nodes and industrial CANopen stacks.
What are the key specifications of MC9S12C32CPBE25 that engineers should know?
The MC9S12C32CPBE25 is a 16-bit HCS12 CISC MCU with 25 MHz core clock, 32 KB Flash, 2 KB RAM, on-chip Vreg for 2.97 V to 5.5 V supply, 8-channel 10-bit ADC, 16-bit PWM, CAN, SCI, SPI peripherals, BDM debug, and 52-LQFP (10x10) package. It is NRND - new designs should target the S12GC family successor.

Dados de referência de engenharia para MC9S12C32CPBE25 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MC9S12C32CPBE25 only for maintenance of existing designs, field repairs, or cost-sensitive one-off production runs where lifecycle supply until end-of-service is already planned. For new designs, prefer the active MC9S12GC32CPBE which shares the identical 52-LQFP footprint and 32 KB Flash but adds AEC-Q100 automotive qualification. If more Flash headroom is needed, the MC9S12GC128CPBER (128 KB) or MC9S12C128VFAE (128 KB) are drop-in 52-LQFP alternatives. For non-automotive industrial designs, the S12G family (e.g., MC9S12G128CLH) provides the longest lifecycle supply. All listed alternatives share the same 52-LQFP (10x10) land pattern, so PCB layout can be reused across the S12C/S12GC/S12G variants.

Comparação com alternativas

Parâmetro Este produto MC9S12C32MPBE16 MC9S12GC32CPBE MC9S12GC128CPBER MC9S12C128VFAE MC9S12GC96MPBE MC9S12GC96MFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-52 (10x10) LQFP-52 (10x10) - same LQFP-52 (10x10) - same LQFP-52 (10x10) - same LQFP-52 (10x10) - same LQFP-52 (10x10) - same LQFP-52 (10x10) - same
Core HCS12 16-bit CISC HCS12 16-bit CISC - same HCS12 16-bit CISC - same HCS12 16-bit CISC - same HCS12 16-bit CISC - same HCS12 16-bit CISC - same HCS12 16-bit CISC - same
Max CPU Clock 25 MHz 16 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Flash 32 KB 32 KB 32 KB 128 KB 128 KB 96 KB 96 KB
RAM 2 KB 2 KB 2 KB 8 KB 8 KB 4 KB 4 KB
Supply Voltage 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V
Automotive Qualified No (industrial) No Yes (AEC-Q100) Yes (AEC-Q100) No Yes (AEC-Q100) Yes (AEC-Q100)
Lifecycle Status NRND NRND Active Active Active Active Active

Principais diferenciais

  • Industry-standard HCS12 16-bit core with mature toolchain support (vs Cortex-M0+ competitors)
  • Pin-compatible upgrade path to active S12G family (vs Other NRND microcontrollers)
  • Integrated bandgap Vreg eliminates external LDO (vs Discrete-regulator competitors)

Notas de projeto

The MC9S12C32CPBE25's on-chip bandgap Vreg requires a 4.7 uF tantalum (or low-ESR ceramic) bulk decoupling capacitor plus a 0.1 uF ceramic bypass on VDDR/VDD, placed within 5 mm of the package pin. According to the NXP S12C reference design, inadequate Vreg decoupling causes VDD droop during flash programming and bus-clock transitions. For 5 V industrial supplies, add a series ferrite bead between the external rail and VDDR to suppress conducted EMI from neighboring switching converters.

The LQFP-52 (10x10 mm) package has a thermal resistance theta_JA near 65 C/W (per NXP package thermal data). Estimated: at 25 MHz core clock and 5 V supply with full peripheral activity, the device dissipates approximately 120 mW, yielding a 8 C rise above ambient - well within the -40 C to +85 C industrial range. For automotive under-hood designs above +70 C ambient, add a thermal copper pour of at least 1 square inch on the top layer directly under the package exposed pad area.

Do not connect unused PWM pins as analog outputs without configuring the PCR register, or the pin will drive a default state at startup. The BKGD pin must remain accessible for in-circuit debug - do not place it on a non-breadboardable net. When migrating from CPB25 to CPBE25 mask sets, verify the EETSCLK register defaults because early mask revisions had a non-standard PLL lock behavior; consult the mask-set errata on NXP.com before production.

Route the EXTAL/XTAL oscillator traces as a guarded differential pair with a ground ring on both sides, keeping trace length under 5 mm and load capacitance within the datasheet's 12-22 pF specification. The PLL filter pin (if present on the chosen mask) needs an external RC network (10 kohm + 0.1 uF) placed within 5 mm. For noisy automotive environments, place a guard trace between CAN_TX/RX and the PWM outputs to prevent switching-noise coupling into the CAN bus dominant bit.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS and lead-free compliant per DigiKey product listing. Industrial-grade - not AEC-Q100 qualified; for automotive use select the Q1 or S12GC variant.

Dados verificados em: 2026-10-19 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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NXP Semiconductors MC9S12C32CPBE25 HCS12 S12C family Goldfish LQFP-52 TQFP-52 16-bit CISC Flash memory CAN 2.0A/B SCI SPI PWM ADC PLL BDM (Background Debug Mode) AEC-Q100 RoHS NRND automotive body control module HVAC controller sensor interface node instrument cluster Freescale Semiconductor CodeWarrior
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