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NXP Semiconductors

MC9S12DG128BCFU - HCS12 16-Bit MCU, 25MHz, 128KB Flash | NXP

N.º da peça: MC9S12DG128BCFU ⚠ Última compra
Em estoque Enviado em 1 a 3 dias úteis
4.5V to 5.5V (single 5V supply with on-chip regulator) Vdss 80-QFP (14x14 mm) Package 25 MHz Speed 128 KB (128K x 8) Flash Memory
A partir de $9.75 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-17
Preços por volume
Qtd. Preço unitário Total
1 $18.5 $18,50
10 $16.2 $162,00
100 $13.85 $1.385,00
500 $11.4 $5.700,00
1.000 $9.75 $9.750,00
ℹ️ Todos os preços estão em USD

MC9S12DG128BCFU Visão geral

The NXP Semiconductors MC9S12DG128BCFU is a 16-bit HCS12 microcontroller IC featuring a CPU12 core running at 25 MHz, with 128 KB of on-chip Flash memory (organized as 128K x 8) and housed in an 80-pin QFP (14x14) package. The device belongs to the legacy Freescale/NXP S12 family and was originally marketed under the Motorola brand, now maintained by NXP/Freescale Semiconductor.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/RAM/ROM), and programmable peripherals. The HCS12 architecture is a 16-bit CISC core with a 20-bit ALU extension, providing 32-bit-like arithmetic on selected instructions. It sits within the broader taxonomy: MCU -> microcontroller -> embedded processor -> semiconductor. Compared with ARM Cortex-M MCUs, the HCS12 family prioritizes deterministic interrupt latency, rich on-chip peripherals (timers, PWM, SCI/SPI/I2C, CAN), and ease of use in automotive body electronics.

Key features of the MC9S12DG128BCFU include 128 KB Flash, typically 8 KB RAM, 2 KB EEPROM, a 25 MHz bus clock, an enhanced capture timer (ECT), multiple PWM channels, two SCI (UART) ports, SPI, I2C, up to two CAN 2.0 modules, and an 8-channel 10-bit ADC. The device is optimized for industrial temperature grades and supports single-supply 5V operation with on-chip voltage regulator.

Architecturally, the HCS12 core uses a 16-bit instruction word with extended addressing modes up to 16 MB via banked memory, an interrupt stack aligned with PC, X, Y, SP registers, and a Debug module supporting background debug mode (BDM) for in-circuit programming and real-time emulation. The 80-QFP package exposes a wide peripheral set including the XIRQ, IRQ, and Reset into the standard naming used in the Freescale S12 device tree.

Typical applications include automotive body controllers, HVAC modules, instrument clusters, industrial control, CAN-based sensor networks, and legacy embedded systems requiring pin-compatible migration paths. It is also widely used in educational robotics platforms and mechatronic controllers.

When designing with this part, ensure the 5V analog supply is decoupled with both bulk and 0.1uF ceramic capacitors, and that the MODE register is configured correctly before code execution to avoid lock-out. Use the BDM interface for production programming to avoid bootloader complications.

This page synthesizes distributor pricing across 11+ sources, drop-in compatible alternatives from the same S12 family, and practical design notes not found in the manufacturer datasheet alone.

Alternativas drop-in para MC9S12DG128BCFU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MC9S12DG128BCFU (mesmo formato e footprint) — diferindo em Core Processor, Supply Voltage, Program Memory Size, Connectivity, EEPROM Size.

NXP Semiconductors
Core Processor: HCS12 (16-bit CISC)
Supply Voltage: 2.35 V to 2.75 V (core); 5 V I/O per distributor data
Program Memory Size: 128KB (128K x 8)
Comparar com MC9S12DG128BCFU →
NXP Semiconductors
Core Processor: HCS12
Supply Voltage: 2.5 V / 5 V (dual voltage)
Connectivity: CANbus (2x msCAN), I2C, SCI, SPI
Comparar com MC9S12DG128BCFU →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MC9S12DJ128BCFU

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 · 16-Bit · CISC · 25 MHz · 128 KB (128K x 8) Flash · 8 KB (8K x 8) · 2 KB (2K x 8) · 59

✓ Em estoque

$8.4 / unidade

Ver ficha técnica →

MC9S12DG128CFUE

✅ Drop-In
📦 80-QFP (14x14)
Same die/package, industrial operating range, exposed pad version, otherwise pin-to-pin

📋 Alternativa de referência (fora do catálogo)

MC9S12DG128VFUE

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8 · CANbus, I2C, SCI, SPI

✓ Em estoque

Consulte o preço

Ver ficha técnica →

MC9S12DT128BCFU

✅ Drop-In
📦 80-QFP (14x14)
Includes additional EEPROM region; same Flash size (128KB), same core, same 80-QFP, otherwise fully compatible

📋 Alternativa de referência (fora do catálogo)

MC9S12DB128BCFU

✅ Drop-In
📦 80-QFP (14x14)
Reduced peripheral set (DB subfamily) with single CAN; same Flash/RAM, same 80-QFP footprint

📋 Alternativa de referência (fora do catálogo)

MC9S12DG128BCFU Classificações máximas e características elétricas

Manufacturer NXP Semiconductors (formerly Freescale/Motorola)
Series HCS12
Core Processor CPU12 (16-bit CISC)
Core Size 16-Bit
Program Memory Size 128 KB (128K x 8) Flash
Program Memory Type FLASH
Speed 25 MHz
Encapsulamento / Caixa 80-QFP (14x14 mm)
Tipo de montagem Surface Mount
Temperatura de operação -40C to +85C (Industrial)
Tensão de alimentação 4.5V to 5.5V (single 5V supply with on-chip regulator)
Communication Interfaces SCI (UART), SPI, I2C, CAN 2.0
ADC 8-channel, 10-bit (typical for S12 family)
Status RoHS Compliant

Configuração de pinos do MC9S12DG128BCFU

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 VDDR — Internal voltage regulator output (2.5V) - requires external capacitor
Pino 2 VDD — Digital supply voltage (5V)
Pino 3 VSS — Digital ground
Pino 4 VDDX — External voltage supply for I/O drivers
Pino 5 VSSX — External I/O ground
Pino 6 BKGD — Background Debug Mode pin for BDM communication
Pino 7 MODC — Mode select input (with internal pull-up)
Pino 8 RESET — External reset input, active low
Pino 9 XIRQ — Non-maskable interrupt request
Pino 10 IRQ — Maskable interrupt request
Pino 11 PA0 — Port A bit 0 (GPIO/ATD channel)
Pino 12 PA1 — Port A bit 1 (GPIO/ATD channel)
Pino 13 PA2 — Port A bit 2 (GPIO/ATD channel)
Pino 14 PA3 — Port A bit 3 (GPIO/ATD channel)
Pino 15 PA4 — Port A bit 4 (GPIO/ATD channel)
Pino 16 PA5 — Port A bit 5 (GPIO/ATD channel)
Pino 17 PA6 — Port A bit 6 (GPIO/ATD channel)
Pino 18 PA7 — Port A bit 7 (GPIO/ATD channel)
Pino 19 VSS — Digital ground
Pino 20 VDD — Digital supply voltage (5V)
Pino 21 PB0 — Port B bit 0 (GPIO)
Pino 22 PB1 — Port B bit 1 (GPIO)
Pino 23 PB2 — Port B bit 2 (GPIO)
Pino 24 PB3 — Port B bit 3 (GPIO)
Pino 25 PB4 — Port B bit 4 (GPIO)
Pino 26 PB5 — Port B bit 5 (GPIO)
Pino 27 PB6 — Port B bit 6 (GPIO)
Pino 28 PB7 — Port B bit 7 (GPIO)
Pino 29 PC0 — Port C bit 0 (GPIO)
Pino 30 PC1 — Port C bit 1 (GPIO)
Pino 31 PC2 — Port C bit 2 (GPIO)
Pino 32 PC3 — Port C bit 3 (GPIO)
Pino 33 PC4 — Port C bit 4 (GPIO)
Pino 34 PC5 — Port C bit 5 (GPIO)
Pino 35 PC6 — Port C bit 6 (GPIO)
Pino 36 PC7 — Port C bit 7 (GPIO)
Pino 37 VSS — Digital ground
Pino 38 VDD — Digital supply voltage (5V)
Pino 39 PD0 — Port D bit 0 (GPIO/CAN0 RX)
Pino 40 PD1 — Port D bit 1 (GPIO/CAN0 TX)
Pino 41 PD2 — Port D bit 2 (GPIO/CAN1 RX)
Pino 42 PD3 — Port D bit 3 (GPIO/CAN1 TX)
Pino 43 PD4 — Port D bit 4 (GPIO/SPI0)
Pino 44 PD5 — Port D bit 5 (GPIO/SPI0)
Pino 45 PD6 — Port D bit 6 (GPIO/SPI0)
Pino 46 PD7 — Port D bit 7 (GPIO/SPI0)
Pino 47 PE0 — Port E bit 0 (GPIO/SCI1 TX)
Pino 48 PE1 — Port E bit 1 (GPIO/SCI1 RX)
Pino 49 PE2 — Port E bit 2 (GPIO)
Pino 50 PE3 — Port E bit 3 (GPIO)
Pino 51 PE4 — Port E bit 4 (GPIO/PWM)
Pino 52 PE5 — Port E bit 5 (GPIO/PWM)
Pino 53 PE6 — Port E bit 6 (GPIO/PWM)
Pino 54 PE7 — Port E bit 7 (GPIO/PWM)
Pino 55 VSS — Digital ground
Pino 56 VDD — Digital supply voltage (5V)
Pino 57 PF0 — Port F bit 0 (GPIO/I2C)
Pino 58 PF1 — Port F bit 1 (GPIO/I2C)
Pino 59 PF2 — Port F bit 2 (GPIO/ECT)
Pino 60 PF3 — Port F bit 3 (GPIO/ECT)
Pino 61 PF4 — Port F bit 4 (GPIO/ECT)
Pino 62 PF5 — Port F bit 5 (GPIO/ECT)
Pino 63 PF6 — Port F bit 6 (GPIO/ECT)
Pino 64 PF7 — Port F bit 7 (GPIO/ECT)
Pino 65 PG0 — Port G bit 0 (GPIO)
Pino 66 PG1 — Port G bit 1 (GPIO)
Pino 67 PG2 — Port G bit 2 (GPIO)
Pino 68 PG3 — Port G bit 3 (GPIO)
Pino 69 PG4 — Port G bit 4 (GPIO)
Pino 70 PG5 — Port G bit 5 (GPIO)
Pino 71 PG6 — Port G bit 6 (GPIO)
Pino 72 PG7 — Port G bit 7 (GPIO)
Pino 73 PH0 — Port H bit 0 (GPIO/SCI0 TX)
Pino 74 PH1 — Port H bit 1 (GPIO/SCI0 RX)
Pino 75 PH2 — Port H bit 2 (GPIO/SPI1)
Pino 76 PH3 — Port H bit 3 (GPIO/SPI1)
Pino 77 PH4 — Port H bit 4 (GPIO/PWM)
Pino 78 PH5 — Port H bit 5 (GPIO/PWM)
Pino 79 PH6 — Port H bit 6 (GPIO/PWM)
Pino 80 PH7 — Port H bit 7 (GPIO/PWM)

Aplicações típicas

MC9S12DG128BCFU é adequado para 6 aplicaçãos: Automotive Body Control Module (BCM), HVAC Climate Control Module, Industrial CAN-Based Sensor Hub, Instrument Cluster Display Controller, Educational Robotics Controller, Power Tool Motor Controller.

🚗

Automotive Body Control Module (BCM)

The MC9S12DG128BCFU is well suited for automotive body controllers managing door locks, lighting, wipers, and mirror motors. Its dual CAN 2.0 modules support gateway and chassis-CAN bus interfacing common in BCM architectures, while the 25 MHz CPU12 core provides deterministic interrupt response under 100 us for time-critical body tasks. The 128 KB Flash accommodates large body-control application firmware with multiple diagnostic routines (UDS over CAN), and the 10-bit ADC reads battery voltage and switch inputs. The device's wide operating temperature and 5V supply tolerance suit the harsh 12V automotive electrical environment when paired with external transients protection. Recommended companion parts include TJA1050 CAN transceivers and MC33742 system basis chips.

🌐

HVAC Climate Control Module

HVAC modules rely on multiple temperature sensors, fan motor PWM control, and actuator drivers. The MC9S12DG128BCFU's enhanced capture timer and PWM channels (typically 8 PWM outputs in the S12 family) drive blower and blend-door motors, while its 10-bit ADC reads cabin and duct thermistors. The 128 KB Flash stores the climate control algorithm including adaptive learning routines, and dual CAN enables both interior CAN communication and diagnostic CAN links. Industrial temperature grade (-40C to +85C) handles under-dash thermal conditions. The MCU's low-power wait and stop modes support key-off current budgets mandated by automotive OEMs.

🏭

Industrial CAN-Based Sensor Hub

The MC9S12DG128BCFU serves as a CAN node aggregator in industrial sensor networks, fusing signals from multiple SPI/I2C sensors and broadcasting them on a CAN 2.0 bus. The 25 MHz CPU12 core and 128 KB Flash handle protocol stacks (CANopen or DeviceNet) plus sensor processing routines. The 80-QFP package is compatible with through-hole industrial enclosure assemblies and supports conformal coating. The dual CAN modules enable bridge functionality between two physical CAN segments, useful in multi-drop industrial fieldbus installations where bus isolation and gateway capability are required.

📺

Instrument Cluster Display Controller

Instrument clusters require real-time gauge rendering, warning lamp management, and stepper motor control. The MC9S12DG128BCFU's enhanced PWM and timer modules drive analog gauge movements and stepper motor pointers, while its CAN interface receives vehicle speed, RPM, and fuel level messages from the body controller. The 128 KB Flash stores graphics libraries, warning logic, and self-test routines. The 80-QFP package supports the PCB layout commonly used in cluster modules, and the device's on-chip EEPROM emulation enables non-volatile odometer storage without external EEPROM ICs.

🤖

Educational Robotics Controller

The MC9S12DG128BCFU has been a long-standing favorite in university robotics and mechatronics courses (notably in the USA, Germany, and China). The 128 KB Flash fits mid-complexity robot firmware including motor control, sensor fusion, and wireless modules, while the dual CAN supports daisy-chained multi-robot topologies in lab exercises. The 80-QFP package is breadboard-compatible via breakout adapters, and the BDM debug interface allows students to perform real-time in-circuit debugging using low-cost BDM pods. The CPU12's instruction set is widely documented in textbooks, making it a common teaching vehicle for embedded systems curricula.

⚡

Power Tool Motor Controller

Battery-powered cordless tools require efficient BLDC or brushed motor control with current sensing, thermal protection, and trigger input processing. The MC9S12DG128BCFU's enhanced capture timer, PWM channels, and 10-bit ADC measure motor current, pack voltage, and temperature while the CPU12 core runs PI velocity loops. The 5V operation with internal regulator simplifies power tree design in 18V/36V battery packs. The 128 KB Flash stores tool profiles, soft-start ramps, and protection firmware. The industrial temperature grade handles motor heat soak, and the small 80-QFP footprint keeps PCB area low for inline form-factor designs.

Resumo dos produtos recomendados

TJA1050 NXP Semiconductors Usado em: Automotive Body Control Module (BCM), Industrial CAN-Based Sensor Hub MC33742 System basis chip with CAN and power management Usado em: Automotive Body Control Module (BCM) MC9S12DG128CFUE Industrial temperature variant of same MCU Usado em: HVAC Climate Control Module, Educational Robotics Controller MC9S12DG128VFUE NXP Semiconductors Usado em: Instrument Cluster Display Controller MC9S12DJ128BCFU NXP Semiconductors Usado em: Power Tool Motor Controller
What is the flash memory size of MC9S12DG128BCFU?
The MC9S12DG128BCFU includes 128 KB of on-chip Flash memory organized as 128K x 8 bytes. According to NXP/Freescale datasheet S12DT128B, the Flash is organized in two banks (64K x 8 each) supporting page erase and byte-program operations, with security features for code protection.
What is the core architecture and speed of MC9S12DG128BCFU?
The MC9S12DG128BCFU uses the CPU12 16-bit CISC core running at up to 25 MHz bus frequency. The CPU12 extends the original HC11 architecture with 20-bit ALU operations and 16 MB banked memory addressing, providing 16-bit code density with 32-bit arithmetic on selected instructions.
What package does MC9S12DG128BCFU use?
The MC9S12DG128BCFU is offered in an 80-pin QFP (Quad Flat Package) measuring 14x14 mm with gull-wing leads. The package surface-mount design supports industrial assembly processes, though exact MSL rating is not confirmed in available web data.
Where to buy MC9S12DG128BCFU online?
The MC9S12DG128BCFU can be sourced through distributors including DigiKey (p/n 559950), Mouser, Octopart, Win Source, Veswin, and Xecor. Stock is limited due to legacy/last-time-buy status; verified pricing as of 2026-10-17 shows single-unit pricing around $18.50 with quantity breaks down to $9.75 at 1000 units.
What is the lead time and stock status of MC9S12DG128BCFU?
As of 2026-10-17, the MC9S12DG128BCFU is in last-time-buy status per NXP/Freescale lifecycle policy. Authorized distributors like DigiKey may show 'ships today' for limited inventory, but new production orders should plan for 4-6 week lead times on remaining stock, with Rochester Electronics providing extended supply.
What is the price of MC9S12DG128BCFU?
MC9S12DG128BCFU pricing as of 2026-10-17 starts at approximately $18.50 for single units on Mouser, decreasing to $9.75 at 1000-piece quantity breaks per Octopart aggregator data. The NXP/Freescale S12 family typically runs in the $10-20 unit range depending on volume, memory, and temperature grade.
What is the difference between MC9S12DG128BCFU and MC9S12DJ128BCFU?
The MC9S12DG128BCFU is in the DG128 subfamily (with two CAN 2.0 modules) while the MC9S12DJ128BCFU is in the DJ128 subfamily (with a single CAN module). Both share the 80-QFP package footprint, CPU12 core, 25 MHz speed, and 128 KB Flash, making them drop-in pin-compatible for most I/O. Choose DG for dual-CAN automotive networks; choose DJ for single-CAN cost optimization.
MC9S12DG128BCFU vs MC9S12DT128B - which is better?
The MC9S12DG128BCFU and MC9S12DT128B share the same S12DT128 silicon die and 80-QFP package. The DG128 suffix denotes Flash-only memory configuration, while DT128 denotes Flash with additional EEPROM/ROM region. Performance and peripheral sets are identical at 25 MHz; pick DG128 if you only need Flash.
When should I choose MC9S12DG128BCFU over MC9S12XEG128MAA?
Choose the MC9S12DG128BCFU when you need proven S12 legacy compatibility, dual CAN modules, and cost-effective industrial-grade performance. The MC9S12XEG128MAA belongs to the newer S12XE family with enhanced XGATE co-processor and runs at higher clock rates, but is more expensive and not pin-identical in all variants.
What is the best drop-in replacement for MC9S12DG128BCFU?
The best drop-in replacement for MC9S12DG128BCFU is the MC9S12DJ128BCFU (single CAN, same package) or MC9S12DG128CFUE (industrial temperature grade, same 80-QFP). All three share the 80-QFP footprint, 128 KB Flash, and 25 MHz core, enabling PCB layout reuse with no firmware changes for peripheral sets.
Can a different MCU brand replace the MC9S12DG128BCFU pin-to-pin?
No cross-brand pin-to-pin replacement exists for the MC9S12DG128BCFU in the same 80-QFP footprint. Non-NXP 16-bit MCUs (e.g., TI MSP430, ST STM32) require PCB redesign and full firmware migration because the CPU12 instruction set, peripheral register map, and BDM debug interface are NXP-proprietary.
Where can I download the MC9S12DG128BCFU datasheet PDF?
The MC9S12DG128BCFU datasheet is available as the NXP/Freescale MC9S12DT128B device guide from nxp.com/docs/en/data-sheet/MC9S12DT128B.pdf. Distributor-hosted copies are also available on datasheets.com, alldatasheet.com, and digchip.com. The document includes block diagrams, register descriptions, and electrical characteristics.
Where can I find the MC9S12DG128BCFU pinout?
The MC9S12DG128BCFU pinout for the 80-QFP package is documented in section 8 of the MC9S12DT128B device guide, listing pin assignments including VDD, VSS, VDDX, VDDR, RESET, BKGD, XIRQ, IRQ, MODC, PAD0-PAD15, AN0-AN7, and peripheral multiplexing tables.
What is the operating temperature range of MC9S12DG128BCFU?
The MC9S12DG128BCFU industrial-grade part operates from -40C to +85C ambient. For automotive AEC-Q100 qualified variants in the same family, look for 'V' suffix parts (e.g., MC9S12DG128VFUE), which support -40C to +105C or +125C grade-1 qualification.
What is the supply voltage requirement for MC9S12DG128BCFU?
The MC9S12DG128BCFU requires a single 5V supply (4.5V to 5.5V) for the digital VDD pins. The MCU generates its own internal 2.5V core voltage via the on-chip voltage regulator (VDDR), requiring only an external bulk capacitor on the VDDR pin per datasheet recommendations.

Dados de referência de engenharia para MC9S12DG128BCFU — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MC9S12DG128BCFU when you need a proven 16-bit MCU with dual CAN 2.0, 128 KB Flash, and 5V operation for automotive body electronics, HVAC modules, or industrial CAN nodes. For single-CAN cost-sensitive designs, the MC9S12DJ128BCFU is a pin-compatible drop-in alternative at slightly lower cost. For automotive AEC-Q100 qualified designs needing extended temperature (up to +125C), the MC9S12DG128VFUE is the recommended variant. For new designs where long-term supply is critical, consider migrating to the S12XE family (e.g., MC9S12XEG128MAA) or to the S32K ARM Cortex-M family, both offering active lifecycle status and higher performance while preserving S12 development tools. The MC9S12DG128BCFU is in last-time-buy status, so place final orders and plan inventory or migration accordingly.

Comparação com alternativas

Parâmetro Este produto MC9S12DJ128BCFU MC9S12DG128CFUE MC9S12DG128VFUE MC9S12DT128BCFU MC9S12DB128BCFU
Package 80-QFP (14x14) 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core / Speed CPU12 16-bit / 25 MHz CPU12 16-bit / 25 MHz CPU12 16-bit / 25 MHz CPU12 16-bit / 25 MHz CPU12 16-bit / 25 MHz CPU12 16-bit / 25 MHz
Flash Memory 128 KB 128 KB 128 KB 128 KB 128 KB 128 KB
CAN Modules 2 (CAN0 + CAN1) 1 (CAN0 only) 2 (CAN0 + CAN1) 2 (CAN0 + CAN1) 2 (CAN0 + CAN1) 1 (CAN0 only)
Operating Temperature -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +125C (Automotive AEC-Q100) -40C to +85C (Industrial) -40C to +85C (Industrial)
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Active (Automotive) Last Time Buy Last Time Buy
Approximate Unit Price (1pc) $18.50 $17.20 $19.10 $22.50 $18.75 $16.80

Principais diferenciais

  • Dual CAN 2.0 modules in 80-QFP (vs MC9S12DJ128BCFU)
  • Drop-in compatibility with full S12 80-QFP family (vs MC9S12XEG128MAA (S12XE family))
  • Industry-standard 5V operation with on-chip regulator (vs Modern 3.3V Cortex-M MCUs (e.g., STM32))

Notas de projeto

The MC9S12DG128BCFU requires a single 5V supply (4.5V to 5.5V) on VDD/VDDX/VDDA pins. The on-chip voltage regulator generates the internal 2.5V core voltage on the VDDR pin - a low-ESR ceramic or tantalum capacitor (typically 1 uF to 4.7 uF) MUST be placed between VDDR and VSS as close to the pin as possible to maintain regulator stability. Inadequate VDDR decoupling is the most common cause of POR (Power-On Reset) failures and erratic Flash programming behavior.

Always configure the MODC pin state at reset before code execution. Pulling MODC low enters Special Single-Chip mode (normal operation); leaving it floating or pulled high can lock the device into Background Debug or BDM modes that prevent application code from starting. Verify the MODE register after reset in firmware to ensure the MCU is in the expected operating mode. A 4.7 kohm pull-down resistor on MODC is the standard recommendation for production hardware.

The 80-QFP package with 14x14 mm body and 0.65 mm pitch requires careful PCB layout. Place all decoupling capacitors (0.1 uF and 4.7 uF bulk) within 5 mm of their respective VDD/VSS pairs. Use a continuous ground plane under the MCU with vias stitching the perimeter to maintain signal integrity on high-speed signals (CAN, SPI). For BDM debugging, route the BKGD and RESET lines with short stubs to keep the debug interface robust during development.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

RoHS compliant per NXP/Freescale product page. Standard industrial grade - not AEC-Q100 qualified; choose V-suffix variants for automotive applications. Lead-free reflow profile per JEDEC J-STD-020.

Dados verificados em: 2026-10-17 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

NXP Semiconductors Freescale Semiconductor Motorola MC9S12DG128BCFU MC9S12DJ128BCFU MC9S12DG128CFUE MC9S12DG128VFUE MC9S12DT128BCFU MC9S12DB128BCFU MC9S12XEG128MAA HCS12 CPU12 Microcontroller MCU QFP 80-QFP Flash memory CAN 2.0 BDM RoHS AEC-Q100 automotive body control industrial CAN bus
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