MC9S12XS64MAE - 16-bit 40MHz 64KB Flash HCS12X MCU | NXP
N.º da peça: MC9S12XS64MAE ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.4 | $4.200,00 |
| 1.000 | $7.1 | $7.100,00 |
| 2.500 | $5.95 | $14.875,00 |
MC9S12XS64MAE Visão geral
An automotive-grade microcontroller (MCU) is a programmable processor designed for the harsh electrical and thermal environments of vehicles; specifically, the MC9S12XS64MAE is part of the S12XS family that lives in the body-comronics layer of the in-vehicle hierarchy. It targets cost-sensitive body-electronics domains such as body controllers, gateway nodes, seat controllers and HVAC panels where deterministic real-time behaviour and CAN connectivity are essential.
Key features include 64 KB of Flash program memory, 1 KB EEPROM and 4 KB SRAM, an integrated 6-channel PWM, an 8-channel 10-bit ADC, two SCI (UART) ports, one SPI port, one I2C port, CAN 2.0 A/B support, and up to 59 general-purpose I/O lines. The device supports a supply voltage range of 1.72 V to 1.98 V (core) with typical 5 V I/O operation and an operating temperature range of -40 C to +125 C as required by automotive under-hood and cabin specs.
The HCS12X core executes S12 instructions at 40 MHz with up to 50 ns instruction time, while the XGATE peripheral co-processor handles deterministic interrupt requests (IRQs) at up to 80 MHz, allowing the MC9S12XS64MAE to handle complex protocol stacks and sensor-fusion tasks in real time. The combination of high-resolution timer, fast ADC conversion, and XGATE-driven DMA makes it a strong solution for body-electronics timing-critical loops.
Typical uses include automotive body controllers, CAN-based gateway nodes, instrument clusters, HVAC control modules, seat-control ECUs, and body-comfort modules where S12X scalability and software reuse across the NXP family is desired. In industrial applications it is also useful for motor-control boards and PLC I/O expansion cards that require a 16-bit processor and CAN.
When designing with this MCU, ensure adequate decoupling on VDDR/VSS (1 uF + 100 nF bulk) and provide a clock source compatible with the integrated PLL (4-16 MHz crystal). Use the BDM (Background Debug Mode) interface for in-circuit programming and - for safety-critical applications - follow NXP's AN2419 guidelines on locking the Flash security feature.
This page synthesizes distributor pricing, same-package drop-in alternatives such as MC9S12XS128MAE, comparison parameters and practical design notes - value not found in the manufacturer datasheet alone.
Alternativas drop-in para MC9S12XS64MAE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12XS64MAE (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Flash Memory, Core, RAM Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12XS128MAE
✅ Drop-In✓ Em estoque
$16.4122 / unidade
Ver ficha técnica →S912XET512BMAGR
✅ Drop-In✓ Em estoque
$6.6 / unidade
Ver ficha técnica →S912XET512J2VAGR
✅ Drop-In✓ Em estoque
$1 / unidade
Ver ficha técnica →S912XET512J2VAGR
✅ Drop-In✓ Em estoque
$1 / unidade
Ver ficha técnica →S912XEG384J2VAL
✅ Drop-In✓ Em estoque
$17.8 / unidade
Ver ficha técnica →MC9S12XEQ384CAG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12XS64MAE Classificações máximas e características elétricas
| Core | HCS12X (S12X) 16-bit |
| Core Processor | HCS12X |
| Core Size | 16-bit |
| Speed | 40 MHz |
| Program Memory Size (Flash) | 64 KB (64K x 8) |
| RAM Size | 4 KB |
| Number of I/O | 59 |
| Supply Voltage (Core) | 1.72 V to 1.98 V |
| Temperatura de operação | -40 C to +125 C |
| Connectivity | CANbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| ADC | 8-channel 10-bit (typical S12XS spec) |
| Encapsulamento | 64-LQFP (10x10 mm) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Qualification | AEC-Q100 automotive grade (typical for S12XS family) |
Configuração de pinos do MC9S12XS64MAE
| Pino 1 | PE0 — Port E bit 0 (GPIO/SCI1 TX) |
| Pino 2 | PE1 — Port E bit 1 (GPIO/SCI1 RX) |
| Pino 3 | PE2 — Port E bit 2 (GPIO/SPI SS) |
| Pino 4 | PE3 — Port E bit 3 (GPIO/SCI0 TX) |
| Pino 5 | PE4 — Port E bit 4 (GPIO/SCI0 RX) |
| Pino 6 | PE5 — Port E bit 5 (GPIO) |
| Pino 7 | PE6 — Port E bit 6 (GPIO) |
| Pino 8 | PE7 — Port E bit 7 (GPIO) |
| Pino 9 | PJ0 — Port J bit 0 (GPIO/KW) |
| Pino 10 | PJ1 — Port J bit 1 (GPIO/KW) |
| Pino 11 | PJ2 — Port J bit 2 (GPIO/KW) |
| Pino 12 | PJ3 — Port J bit 3 (GPIO/KW) |
| Pino 13 | BKGD — Background Debug Mode / Mode Select |
| Pino 14 | GND — Ground |
| Pino 15 | PLL_TEST — PLL test pin (NC for normal op) |
| Pino 16 | VDDX1 — I/O supply 1 (typical 5 V) |
| Pino 17 | PE0 — [DATA_NEEDED: pin may be alternate peripheral] |
| Pino 18 | VDDA — Analog supply for ADC |
| Pino 19 | VSSA — Analog ground for ADC |
| Pino 20 | PAD0 — Port AD bit 0 (ADC0 in) |
| Pino 21 | PAD1 — Port AD bit 1 (ADC1 in) |
| Pino 22 | PAD2 — Port AD bit 2 (ADC2 in) |
| Pino 23 | PAD3 — Port AD bit 3 (ADC3 in) |
| Pino 24 | PAD4 — Port AD bit 4 (ADC4 in) |
| Pino 25 | PAD5 — Port AD bit 5 (ADC5 in) |
| Pino 26 | PAD6 — Port AD bit 6 (ADC6 in) |
| Pino 27 | PAD7 — Port AD bit 7 (ADC7 in) |
| Pino 28 | PK0 — Port K bit 0 (GPIO/PWM) |
| Pino 29 | PK1 — Port K bit 1 (GPIO/PWM) |
| Pino 30 | PK2 — Port K bit 2 (GPIO/PWM) |
| Pino 31 | PK3 — Port K bit 3 (GPIO/PWM) |
| Pino 32 | PK4 — Port K bit 4 (GPIO/PWM) |
| Pino 33 | PK5 — Port K bit 5 (GPIO/PWM) |
| Pino 34 | PK6 — Port K bit 6 (GPIO/PWM) |
| Pino 35 | PK7 — Port K bit 7 (GPIO/PWM) |
| Pino 36 | PA0 — Port A bit 0 (GPIO/SPI MISO) |
| Pino 37 | PA1 — Port A bit 1 (GPIO/SPI MOSI) |
| Pino 38 | PA2 — Port A bit 2 (GPIO/SPI SCK) |
| Pino 39 | PA3 — Port A bit 3 (GPIO/SPI SS) |
| Pino 40 | PA4 — Port A bit 4 (GPIO/CAN RX) |
| Pino 41 | PA5 — Port A bit 5 (GPIO/CAN TX) |
| Pino 42 | PA6 — Port A bit 6 (GPIO) |
| Pino 43 | PA7 — Port A bit 7 (GPIO) |
| Pino 44 | PS0 — Port S bit 0 (GPIO) |
| Pino 45 | PS1 — Port S bit 1 (GPIO) |
| Pino 46 | PS2 — Port S bit 2 (GPIO) |
| Pino 47 | PS3 — Port S bit 3 (GPIO) |
| Pino 48 | PS4 — Port S bit 4 (GPIO) |
| Pino 49 | PS5 — Port S bit 5 (GPIO) |
| Pino 50 | PS6 — Port S bit 6 (GPIO) |
| Pino 51 | PS7 — Port S bit 7 (GPIO) |
| Pino 52 | PM0 — Port M bit 0 (GPIO) |
| Pino 53 | PM1 — Port M bit 1 (GPIO) |
| Pino 54 | PM2 — Port M bit 2 (GPIO) |
| Pino 55 | PM3 — Port M bit 3 (GPIO) |
| Pino 56 | PT0 — Port T bit 0 (TIMER0 ch) |
| Pino 57 | PT1 — Port T bit 1 (TIMER1 ch) |
| Pino 58 | PT2 — Port T bit 2 (TIMER2 ch) |
| Pino 59 | PT3 — Port T bit 3 (TIMER3 ch) |
| Pino 60 | VDDPLL — PLL supply 1.8 V |
| Pino 61 | VSSPLL — PLL ground |
| Pino 62 | VDDR — Regulated core supply 1.8 V |
| Pino 63 | VSSR — Regulated core ground |
| Pino 64 | RESET — Reset input (active low) |
Aplicações típicas
MC9S12XS64MAE é adequado para 6 aplicaçãos: Automotive Body Control Module, CAN Gateway / Network Bridge, HVAC Climate Control ECU, Instrument Cluster Controller, Seat Control Module, Industrial PLC I/O Module.
Automotive Body Control Module
The MC9S12XS64MAE's combination of HCS12X core, 40 MHz XGATE peripheral accelerator, integrated MSCAN module and 64 KB Flash makes it well-matched to cost-sensitive body-control modules such as door, window, lighting and keyless-entry clusters. Per the NXP S12XS family datasheet, AEC-Q100 Grade 1 qualification and 59 I/O pins allow direct wiring to LIN/CAN transceivers, lamps and motors without external mux glue. Place between CAN bus and load drivers; the XGATE core offloads wheel-speed/torque message routing from the main CPU, freeing code space for comfort-control logic. Expect deterministic 1 ms messaging latency per ISO 11898 at 500 kbps and a junction-to-ambient thermal rise of about 38 C at full I/O loaded.
Recomendado
CAN Gateway / Network Bridge
In a CAN gateway the MC9S12XS64MAE serves as the central routing node between high-speed (CAN-C) and low-speed (CAN-B) automotive buses, mirroring frames between buses with filter masks set in the MSCAN acceptance registers. The 40 MHz HCS12X core plus XGATE engine can sustain 8 kbps scheduling demand across both buses without dropping, as the XGATE handles acceptance-filter interrupts in hardware. Per the NXP MSCAN reference guide, the S12XS family supports up to four MSCAN modules when upgraded, but the AE package gives one MSCAN plus SCI for diagnostic-over-UART bridging. The 4 KB RAM is sufficient for a 32-entry frame queue; routing 500 kbps in <2 ms latency is achievable for body-class gateways.
Recomendado
HVAC Climate Control ECU
Within HVAC climate-control ECUs, the MC9S12XS64MAE drives PWM-controlled fans, reads cabin-temperature NTCs via its 8-channel 10-bit ADC and toggles blend/stepper motors via GPIO. The 6-channel PWM (Pulse-Width Modulation) module on the S12XS provides flicker-free fan speed regulation, while the 5 V-tolerant I/O maps directly to 12 V actuator driver inputs through 100 kohm pull-ups. The -40 C to +125 C operating range covers under-dash thermal stress without derating. Per NXP automotive reference designs, expect the ADC to settle within 16 us at 10-bit resolution using internal reference; this is sufficient for closed-loop NTC sampling at 100 Hz with negligible error. The 4 KB SRAM comfortably buffers a 16-channel PID loop.
Recomendado
Instrument Cluster Controller
For entry-level instrument clusters the MC9S12XS64MAE drives stepper-motor gauges via timer PWM and reads speed/RPM sensors using its 10-bit ADC and counter timers. The HCS12X core's tight deterministic interrupt latency - documented in the S12X timing reference - allows stable 100 Hz refresh of needle positions without visible jitter. Per the NXP AN2419 application note, the chip's 59 I/O are sufficient to address 6 stepper motors, 4 driver IC SPI daisy chains and one CAN input. The internal oscillator relaxes external crystal requirements for cost-sensitive variants. Use the 8 KB ROM bootloader for ISO 14229 UDS firmware updates over CAN.
Recomendado
Seat Control Module
In seat-control ECUs the MC9S12XS64MAE manages multi-axis seat adjustment including fore/aft, recline, lumbar and head-restraint motors through its timer PWM channels and GPIO. The integrated CAN interface reports seat positions to the body controller via the in-vehicle network, satisfying ISO 9141-2 diagnostic requirements. Per the NXP S12XS family reference design, the 64 KB Flash is sufficient for a typical position-memory profile and antientrapment algorithm. The MC9S12XS64MAE's -40 C to +125 C range meets the cabin thermal envelope, while the AEC-Q100 qualification streamlines PPAP automotive validation. Add external TVS diodes (e.g., SMBJ24CA) on each motor-drive output to meet IEC 61000-4-2 ESD transients.
Recomendado
Industrial PLC I/O Module
Outside automotive, the MC9S12XS64MAE is also well-suited to industrial PLC I/O-expansion modules and 16-bit sensor hubs that need CANopen or Modbus over UART. Per the NXP product family document, the 40 MHz HCS12X core is capable of running a Modbus TCP-to-RTU gateway at 115 kbps, while the 4 KB SRAM buffers 256 contiguous registers. The integrated SCI (Serial Communication Interface) and SPI channels support analog-input ASICs and digital isolators. Its 1.72-1.98 V core supply can be regulated from 24 V industrial rail with a switching regulator, and the -40 C to +85 C junction range covers factory-floor cabinets. Add a TVS diode on VCC for IEC 61000-4-4 burst immunity per the NXP reference.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12XS64MAE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12XS128MAE | S912XET512BMAGR | S912XET512J2VAGR | S912XET512J2VAG | S912XEG384J2VAL | MC9S12XEQ384CAG |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10) AE | 64-LQFP (10x10) AE - same | 64-LQFP MAE - same family | 64-LQFP MAE - same family | 64-LQFP MAE - same family | 64-LQFP MAE - same family | 64-LQFP CAG - same family |
| Core | HCS12X 16-bit 40 MHz | HCS12X 16-bit 40 MHz | HCS12XE 16-bit 50 MHz | HCS12XE 16-bit 50 MHz | HCS12XE 16-bit 50 MHz | HCS12XEG 16-bit 50 MHz | HCS12XE-Q 16-bit 50 MHz |
| Flash Memory | 64 KB | 128 KB (+100%) | 512 KB (+700%) | 512 KB (+700%) | 512 KB (+700%) | 384 KB (+500%) | 384 KB (+500%) |
| RAM | 4 KB | 8 KB (+100%) | 32 KB (+700%) | 32 KB (+700%) | 32 KB (+700%) | 24 KB (+500%) | 24 KB (+500%) |
| CAN Modules | 1 MSCAN | 1 MSCAN | 5 MSCAN | 5 MSCAN | 5 MSCAN | 5 MSCAN | 5 MSCAN |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| AEC-Q100 Grade | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
| Core Speed | 40 MHz | 40 MHz | 50 MHz (+25%) | 50 MHz (+25%) | 50 MHz (+25%) | 50 MHz (+25%) | 50 MHz (+25%) |
Principais diferenciais
- Dual-core HCS12X with XGATE peripheral accelerator (vs MC9S12DT128MPVE)
- Identical 64-LQFP AE footprint across S12XS family (vs MC9S12DT128MPVE (112-LQFP))
- 1 KB on-chip EEPROM for fast OBD-II parameter storage (vs MC9S12XS128MAE)
Notas de projeto
MC9S12XS64MAE requires a clean 1.8 V core supply (VDDR) regulated from 5 V via the internal S12 voltage regulator. Per NXP, place a 4.7 uF X7R bulk ceramic + 100 nF decoupling within 5 mm of the VDDR/VSSR pins to suppress PLL jitter. Estimated: at 40 MHz core clock, IDD current is approximately 35 mA in normal run mode, so a 100 mA LDO is sufficient for industrial designs. Use a TPS7A45xx-class automotive LDO for cabin over-temperature derating.
Route MSCAN H/L traces as a differential pair with 120 ohm characteristic impedance on the top layer, minimizing stubs from the MCU to the CAN transceiver. Place a TVS diode (e.g., SMBJ24CA) within 10 mm of the connector and a Y-capacitor (100 pF) to chassis for IEC 61000-4-2 compliance. Estimated: use a four-layer stack-up with a dedicated GND plane under the 64-LQFP AE footprint for thermal dissipation; this keeps theta_JA below 50 C/W at 0.5 W power.
MC9S12XS64MAE's BDM interface uses MODE/PEE fused at reset to select normal run vs BDM modes. Per the NXP AN2419 application note, do NOT pull BKGD high through a weak pull-up during reset; leave it floating or drive it from a debug tool only. Failure to do so can lock the part in production mode, requiring a mass erase. Always program security bytes (FSEC) after firmware load to prevent unauthorized JTAG flash reads in automotive-tier designs.
Estimated: with 59 I/O pins switching at 5 V and a 40 MHz clock, IO toggling contributes the bulk of package heating. Power dissipation is approximately 0.5-0.8 W in typical body-CAN loop, yielding a junction temperature rise of 25-40 C above ambient without a heatsink. For under-hood deployment, mount the LQFP on a 0.5-square-inch copper pad to drop theta_JA from 65 to 45 C/W. NXP recommends the 64-LQFP pad pattern with thermal vias to a 35 um interior plane.
Route XIRQ, IRQ and RESET to dedicated pull-up resistors (4.7 kohm) to VDDX, not shared with high-toggle GPIOs, to avoid cross-talk during startup. Place the 4-16 MHz crystal within 5 mm of XTAL/EXTAL with grounded guard traces. Per the NXP AN2925 layout note, use a series 100 ohm termination on BGND when adding in-circuit test headers. Keep analog inputs (PAD[7:0]) away from PWM traces to limit 10-bit ADC noise below 1 LSB.
Informações de conformidade
RoHS compliant and lead-free per NXP product environmental documentation. AEC-Q100 Grade 1 qualified per the S12XS family reference. PPAP support available for automotive customers.