MCF5207CVM166J - ColdFire V2 MPU 166MHz ROMless 144-MAPBGA | NXP
N.º da peça: MCF5207CVM166J ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $16.2 | $162,00 |
| 100 | $13.95 | $1.395,00 |
| 500 | $12.4 | $6.200,00 |
| 1.000 | $11.1 | $11.100,00 |
MCF5207CVM166J Visão geral
A ColdFire V2 microprocessor is a 32-bit reduced instruction set computing (RISC) core derived from the original Motorola 68000 family architecture, optimized for embedded systems that require higher code density than ARM Cortex-M parts while keeping deterministic interrupt latency. ColdFire sits in the broader taxonomy as a microprocessor unit (MPU) -> microcontroller/MCU family -> embedded processor -> semiconductor. The MCF5207 belongs to the MCF520X family, which pairs a V2 core with a flexible external memory controller supporting SRAM, NOR/NAND flash, SDR, DDR, and Mobile-DDR SDRAM, making it a strong fit for systems that need more memory flexibility than typical Cortex-M MCUs provide.
Key features include the ColdFire Variable-Length RISC (V2) core with a 16/32-bit instruction mix, a 16 KB unified instruction/data cache, a Multi-Layer AHB system bus, integrated DDR/Mobile-DDR SDRAM controller, dual Mini-FlexBus interfaces, 10/100 Ethernet MAC, USB 2.0 Full-Speed device/host/OTG, four 32-bit timers, eMIOS, queued DMA, and a broad set of serial peripherals including UART, I2C, and SPI. The ROMless suffix means on-chip program storage is absent and all code executes from external flash.
Typical applications include industrial HMI controllers, building automation gateways, factory automation nodes, point-of-sale terminals, networked printers, and low-end embedded networking equipment that needs deterministic ColdFire performance and Ethernet connectivity. The MCF5207CVM166J industrial-grade silicon makes it suitable for environments from -40C to +85C.
Design considerations: because the part is ROMless, a boot mechanism (typically a small external flash device loaded by the integrated Mini-FlexBus) is mandatory, and PCB layout must obey DDR/Mobile-DDR routing rules for clock, address, and data signals to preserve signal integrity. Decoupling must follow the manufacturer reference design with bulk + ceramic caps close to each supply pin.
This page consolidates distributor pricing, cross-reference data, and design notes that go beyond the manufacturer datasheet to help engineers source, qualify, and design with the MCF5207CVM166J confidently.
Alternativas drop-in para MCF5207CVM166J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCF5207CVM166J (mesmo formato e footprint) — diferindo em Package, Mounting Type, Core, Product Family, Program Memory Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCF5207CVM166
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MCF5207CAB166
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF5207CFT166
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCF5208CVM166
✅ Drop-In✓ Em estoque
$31.24 / unidade
Ver ficha técnica →MCF5208CAB166
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCF5207CVM166J Classificações máximas e características elétricas
| Core | ColdFire V2 (32-bit RISC) |
| Maximum CPU Frequency | 166.67 MHz |
| Program Memory Type | ROMless (external flash required) |
| Instruction/Data Cache | 16 KB unified |
| External Memory Controller | SDR / DDR / Mobile-DDR SDRAM |
| External Bus | Dual Mini-FlexBus |
| Encapsulamento | 144-MAPBGA (13x13 mm) |
| Temperatura de operação | -40C to +85C (industrial) |
| Ethernet | 10/100 MAC integrated |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| DMA | Queued DMA (eDMA-style) |
| Timers | 4 x 32-bit timer + eMIOS |
| Serial Peripherals | UART, I2C, SPI |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| JEDEC Package Standard | MAPBGA |
Guia de Configuração de Pinos do MCF5207CVM166J mapbga
Configuração de pinos para MCF5207CVM166J (pacote mapbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCF5207CVM166J.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCF5207CVM166J é adequado para 7 aplicaçãos: Industrial HMI Controller, Building Automation Gateway, Factory Automation Node, Point-of-Sale Terminal, Networked Printer Controller, Embedded Networking Equipment, Medical Device Controller.
Industrial HMI Controller
The MCF5207CVM166J fits industrial HMI controllers because its 166.67 MHz ColdFire V2 core delivers deterministic interrupt response for touch and keypad scanning, while the integrated LCD/graphics-friendly external bus can drive TFT panels via companion controller chips. The 16 KB unified cache accelerates GUI rendering and the multi-layer AHB bus keeps display refresh traffic separate from communication stacks. Placed as the host CPU with DDR or Mobile-DDR for frame buffers and Mini-FlexBus to flash for assets, it offers a stable upgrade path from older ColdFire designs while keeping power and BOM cost manageable. The industrial -40C to +85C temperature grade lets the same board serve factory-floor enclosures without special thermal design.
Recomendado
Building Automation Gateway
For building automation gateways the MCF5207CVM166J pairs its 10/100 Ethernet MAC and USB Full-Speed OTG with the flexible DDR/Mobile-DDR controller to handle BACnet, Modbus, and KNX protocol conversion at deterministic rates. ColdFire V2 code density keeps the protocol stack footprint small enough to run from a low-cost external flash, while the 144-MAPBGA exposes enough I/O to manage multiple isolated RS-485 segments through external transceivers. Designers benefit from low system cost versus Cortex-A application processors, with deterministic enough latency for hard-real-time control loops over Ethernet.
Recomendado
Factory Automation Node
On a factory automation node the MCF5207CVM166J provides 166.67 MHz processing for PLC-style ladder logic execution while its industrial temperature rating handles -40C to +85C cabinet environments. The dual Mini-FlexBus interfaces support concurrent sensor bus and actuator bus access without bus arbitration stalls, and the queued DMA moves block I/O traffic off the CPU. Combined with Ethernet for SCADA connectivity and USB for local HMI programming, the part drops into modular I/O blocks where deterministic ColdFire behavior is preferred over soft real-time Cortex-M0 cores.
Recomendado
Point-of-Sale Terminal
In point-of-sale terminals the MCF5207CVM166J serves as the main transaction processor, handling Ethernet for payment authorization, USB Full-Speed for peripherals (barcode scanner, MSR, customer display), and UART for the thermal printer interface. Its ROMless architecture allows a large encrypted external flash for tamper detection, and the ColdFire code density keeps the firmware footprint manageable. The 144-MAPBGA package keeps the board footprint compact while exposing all needed I/O, and the industrial temperature rating covers retail back-office environments.
Recomendado
Networked Printer Controller
For networked printers the MCF5207CVM166J provides 166.67 MHz performance for PCL/PostScript raster image processing and the integrated 10/100 Ethernet MAC for direct network printing protocols. The DDR controller serves as a frame buffer memory backing store, while USB Full-Speed handles walk-up print jobs from USB drives. Compared to a Cortex-M4 the ColdFire V2 typically offers better code density for the same firmware functionality, which matters when storing multiple printer personalities in external flash.
Recomendado
Embedded Networking Equipment
Low-end embedded networking equipment such as serial-to-Ethernet bridges and protocol converters benefit from the MCF5207CVM166J’s integrated 10/100 Ethernet MAC plus USB and multiple UARTs. The ColdFire V2 core runs TCP/IP stacks efficiently with deterministic latency, while the DDR/Mobile-DDR interface keeps memory headroom for buffer pools. Industrial temperature rating and ROMless flexibility let designers customize boot loaders and field-updatable firmware, and the 144-MAPBGA footprint is well known to layout engineers from existing ColdFire designs.
Recomendado
Medical Device Controller
In medical device controllers the MCF5207CVM166J provides deterministic ColdFire V2 processing for sensor fusion, LCD driving, and communication with host PCs over Ethernet or USB. The part’s industrial temperature rating and reliability pedigree make it suitable for non-life-support medical electronics, while the ROMless architecture allows secure boot with signed external flash images. Designers pair it with precision ADCs and DACs for accurate physiological measurements, leveraging the multi-layer AHB bus to keep DMA traffic off the CPU during waveform sampling.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCF5207CVM166J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCF5207CVM166 | MCF5207CAB166 | MCF5207CFT166 | MCF5208CVM166 | MCF5208CAB166 |
|---|---|---|---|---|---|---|
| Package | 144-MAPBGA (13x13) | 144-MAPBGA (13x13) - same | 144-MAPBGA - same | 144-MAPBGA - same | 144-MAPBGA (13x13) - same | 144-MAPBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) - same | ColdFire V2 (32-bit) |
| Maximum Frequency | 166.67 MHz | 166.67 MHz | 166.67 MHz | 166.67 MHz | 166.67 MHz | 166.67 MHz |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0 to +70C) | Industrial | Industrial | Commercial |
| Lead-Free (J suffix) | Yes (Pb-free) | No (SnPb) | No (SnPb) | No (SnPb) | No (SnPb) | No (SnPb) |
| USB Interface | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
| Lifecycle Status | NRP (Not Recommended for New Product) | NRP | NRP | NRP | NRP | NRP |
Principais diferenciais
- Lead-free finish with J suffix (vs MCF5207CVM166)
- Industrial temperature grade (vs MCF5207CAB166)
- Cost-optimized peripheral set (vs MCF5208CVM166)
Notas de projeto
The 144-MAPBGA package has a 13x13 mm body with 0.8 mm ball pitch per the NXP MCF5207 family datasheet. PCB layout must use micro-via stack-ups (typically 4-6 layers) with the top layer dedicated to fan-out escape routing. Match the trace impedance of DDR address/clock/data nets to the JEDEC specification (50 ohm single-ended / 100 ohm differential for clock) and length-match the byte lanes within 50 mil.
Provide bulk + ceramic decoupling on each supply pin: 10 uF bulk + 100 nF ceramic in parallel per the manufacturer reference design. The ColdFire V2 core requires a stable 1.5 V supply while the I/O ring is typically 3.3 V; some peripheral banks may use 1.8 V for Mobile-DDR. Use a supervisor IC such as the MAX162BENG to generate a clean reset and ensure power-up sequencing. Validate sequencing timing against the datasheet before releasing production boards.
ROMless means there is no on-chip boot ROM - the device boots from an external flash on Mini-FlexBus. A common pitfall is omitting the boot configuration resistors (BCR), which latches the chip-select and bus width on reset. Incorrect BCR settings leave the part unresponsive. Verify the BCR schematic against the MCF5207 family reference manual before laying out the boot flash.
The 144-MAPBGA package has a theta_JA typically in the 25-35 C/W range with a standard 4-layer JEDEC test board. For enclosed industrial cabinets at 60C ambient, total package dissipation is conservatively limited to 1.5-2 W. Avoid placing the IC near heat-generating passives and ensure there is sufficient copper area on inner layers to spread heat.
DDR/Mobile-DDR SDRAM routing must follow JEDEC termination guidelines - typically 50 ohm to VTT (0.49 * VDDQ) on data, strobe, and mask lines. Series-damping resistors near the driver may be required to reduce reflections. Validate with the IBIS model in the NXP design package before committing to PCB layout.
Informações de conformidade
RoHS compliance per J suffix (JEDEC J-STD-609 Pb-free terminal finish). REACH compliance based on standard NXP product policy. AEC-Q100 not applicable - this is a general-purpose industrial MPU, not an automotive-qualified device. Halogen-free status not confirmed in retrieved distributor data; consult NXP product page for definitive confirmation.
