MCF5207CVM166 - ColdFire V2 166MHz 32-bit MPU | NXP
N.º da peça: MCF5207CVM166 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MCF5207CVM166 Visão geral
A microprocessor-unit class embedded controller (MPU) is a processor die that integrates a CPU core with system peripherals such as a memory controller, timers, and serial interfaces on a single chip, sitting between a bare microprocessor and a full microcontroller in the embedded-system hierarchy. The ColdFire V2 architecture is a RISC-derived 32-bit instruction set originally developed by Motorola, later Freescale Semiconductor, and now supported by NXP Semiconductors.
Key features of the MCF5207CVM166 include the ColdFire V2 core clocked at 166.67 MHz, a flexible external memory controller supporting SRAM, flash, and SDRAM-type memories (per NXP MCF520X family documentation), and a ROMless program-memory architecture that requires external boot memory. The 144-MAPBGA ball-grid package provides a compact 13 x 13 mm footprint for space-constrained embedded designs.
Architecturally, the device combines the integer ColdFire V2 pipeline with an integrated system bus connecting on-chip peripherals and an external bus interface. This reduces bill-of-materials complexity compared to discrete CPU-plus-chipset solutions. Per NXP, the MCF520X family supports a combination of external static RAM, flash memory, and single-data-rate SDRAM options, giving designers memory subsystem flexibility.
Typical applications include industrial control systems, networked embedded devices, legacy medical and instrumentation platforms, and designs already qualified around the ColdFire toolchain where continued use of the same code base is required.
A key design consideration is lifecycle status: NXP lists the MCF5207CVM166 as NRND (Not Recommended for New Designs), so new designs should evaluate successor ColdFire or ARM-based parts; existing designs should secure last-time-buy quantities. Pricing for NRND devices is typically quote-based through authorized distributors and broker channels.
This page synthesizes verified distributor listings, NXP product-page data, drop-in family alternatives, and lifecycle guidance not found in the manufacturer datasheet.
Alternativas drop-in para MCF5207CVM166 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCF5207CVM166 (mesmo formato e footprint) — diferindo em Mounting Type, Package, Program Memory Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCF5207CVM150
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCF5207CVM100
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCF5207CAF166
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCF5206CVM166
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCF5207CVM166 Classificações máximas e características elétricas
| Core Processor | ColdFire V2 (MCF520x) |
| Core Size | 32-Bit |
| Frequência máxima de clock | 166.67 MHz |
| Program Memory Type | ROMless (external boot memory required) |
| Memory Controller Support | SRAM, Flash, SDRAM (per MCF520X family) |
| Encapsulamento | 144-MAPBGA (13 x 13 mm) |
| Tipo de montagem | Surface Mount |
| Terminal Form | Ball (LBGA, square) |
| Number of Terminals | 144 |
| Temperature Grade | Industrial |
| Product Family | MCF520X ColdFire Integrated Microprocessor |
| Status do ciclo de vida | NRND (Not Recommended for New Designs) |
Guia de Configuração de Pinos do MCF5207CVM166 144-mapbga (13 x 13 mm)
Configuração de pinos para MCF5207CVM166 (pacote 144-mapbga (13 x 13 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCF5207CVM166.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCF5207CVM166 é adequado para 6 aplicaçãos: Industrial Control and Automation, Legacy Embedded System Maintenance, Networked Embedded Devices, Medical and Instrumentation Equipment, Building Automation and HVAC Controllers, Automotive Off-Highway and Test Rigs (Non-Safety).
Industrial Control and Automation
The MCF5207CVM166 fits industrial control and factory-automation controllers that need a 32-bit processor with flexible external memory and proven ColdFire software stacks. Its 166.67 MHz ColdFire V2 core provides deterministic-enough performance for PLC scan loops, motor-control supervision, and I/O module management, while the MCF520X memory controller's support for external SRAM, flash, and SDRAM lets designers size program and data memory independently. In a typical implementation the processor boots from external NOR flash, executes from SDRAM, and communicates with field I/O over UART, SPI, or an external bus interface. Because the part is NRND, use it to sustain existing qualified controllers rather than new platforms, and hold buffer stock against last-time-buy events.
Recomendado
Legacy Embedded System Maintenance
Existing products designed around the MCF5207 MINIME 144MAPBGA footprint rely on this device for continued production, since the ROMless architecture, external bus interface, and ColdFire V2 instruction set are all locked into the original board layout and firmware. Replacing the SoC would require a respin; sourcing the MCF5207CVM166 preserves pin, timing, and software compatibility at 166.67 MHz. Maintenance programs should verify the industrial temperature grade against their environmental qualification, re-verify datasheet-referenced bus timings when substituting speed grades, and track NXP product-change notices for lifecycle updates. Buying through authorized distributors or Rochester Electronics mitigates counterfeit risk, which is elevated for NRND legacy processors. XAIPART supports RFQ-based supply for exactly this sustainment scenario.
Recomendado
Networked Embedded Devices
Embedded networking equipment, gateways, and protocol converters built in the 2000s commonly used the MCF5207 with external Ethernet MAC/PHY chipsets, exploiting the processor's external bus and SDRAM controller for packet buffering. The 166.67 MHz ColdFire V2 core delivers enough headroom for TCP/IP stacks, SNMP agents, and proprietary protocol bridging in low-throughput industrial networking. The ROMless boot-from-flash model simplifies field firmware updates since program code lives in external flash. For new networked designs, however, NXP's NRND status and the availability of integrated-Ethernet ColdFire parts such as the MCF5280 make those better choices. This device remains appropriate for replicating or repairing existing network appliance boards without redesign.
Recomendado
Medical and Instrumentation Equipment
Benchtop medical devices, laboratory analyzers, and test instrumentation designed on the ColdFire platform benefit from the MCF5207CVM166's 32-bit RISC core, industrial temperature grade, and long-established code bases that have already passed regulatory requalification. Instrument firmware typically exercises the external memory controller for large sample buffers in SDRAM and uses UART/SPI links to front-end analog ICs such as precision ADCs. The 166.67 MHz clock supports user interfaces, data logging, and communication concurrently. Because medical equipment lifecycles often exceed semiconductor lifecycles, NRND parts like this one are routinely procured in last-time-buy volumes; documenting the exact speed grade and package (144-MAPBGA, 13 x 13 mm) in the design history file simplifies future sourcing audits.
Recomendado
Building Automation and HVAC Controllers
Programmable building-automation controllers, BACnet/Modbus gateways, and HVAC supervisory units from the ColdFire era use the MCF5207CVM166 for its balanced combination of 32-bit processing, external flash for large protocol stacks, and SDRAM for run-time data. The 166.67 MHz core comfortably executes multi-protocol communication tasks, PID scheduling, and real-time clock management, while the 144-MAPBGA package keeps the board compact for DIN-rail and panel-mounted controllers. The industrial temperature grade covers non-conditioned equipment rooms. For these applications the device's role today is sustainment: procurement teams should qualify the pin-compatible MCF5207CVM150 as a secondary source in case 166 MHz grade allocations run dry, since controller timing margins almost always absorb the 10% clock reduction.
Recomendado
Automotive Off-Highway and Test Rigs (Non-Safety)
Non-safety-critical automotive-adjacent equipment - engine-dyno test rigs, fleet-telemetry prototypes, and off-highway vehicle diagnostics boxes - frequently adopted the MCF5207 for its low system cost and straightforward external-memory design. The ColdFire V2 core at 166.67 MHz handles CAN-over-UART bridges, sensor acquisition scheduling, and data-logging to external flash, and the industrial grade supports typical bench and workshop environments. Note that the MCF5207CVM166 is not AEC-Q100 qualified, so it must not be specified for in-vehicle mounted electronics. New such projects should instead select automotive-qualified NXP MCUs; this device's role is sustaining existing rig hardware where its ROMless flash-boot architecture and board layout are already fixed.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCF5207CVM166 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCF5207CVM150 | MCF5207CVM100 | MCF5207CAF166 | MCF5206CVM166 |
|---|---|---|---|---|---|
| Package | 144-MAPBGA (13 x 13 mm) | 144-MAPBGA (13 x 13 mm) - same | 144-MAPBGA (13 x 13 mm) - same | 144-MAPBGA (13 x 13 mm) - same | 144-MAPBGA (13 x 13 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Core Size | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit |
| Max Clock Frequency | 166.67 MHz | 150 MHz | 100 MHz | 166.67 MHz | 166 MHz |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Fastest MCF5207 speed grade (vs MCF5207CVM150)
- Industrial temperature grade (vs MCF5207CAF166)
- Honest trade-off: fully NRND platform (vs MCF5235CVM150J)
Notas de projeto
Do not start new designs on this part. NXP lists MCF5207CVM166 as NRND, so availability and price will degrade over time and NXP may issue a last-time-buy notice with short notice windows. For sustaining designs, subscribe to NXP product-change notifications for the MCF520X family, keep a qualified second source (e.g., MCF5207CVM150, same footprint) in your AVL, and size your buffer stock against your product's remaining service life. Document the exact speed grade in your BOM to prevent accidental substitution by procurement.
The exact core and I/O supply voltages for the 144-MAPBGA MCF5207 were not in the retrieved data, so confirm power-rail sequencing in the manufacturer datasheet before modifying legacy power trees. When substituting the CAF166 commercial-grade variant for the CVM166 industrial-grade part, recheck operating supply and thermal derating over your enclosure's ambient range. Estimated: always measure actual core current at 166.67 MHz under worst-case code rather than relying on typical figures, since NRND-era datasheets may not reflect final silicon revisions.
The 144-MAPBGA (13 x 13 mm) ball-grid array requires a solder-mask-defined or non-solder-mask-defined pad geometry per the datasheet mechanical drawing; do not improvise fanouts on legacy boards. For rework, BGA reballing of the 0.8 mm-class pitch is feasible but demands profile verification; X-ray inspection after assembly is recommended to catch head-in-pillow or bridging defects common with warehouse-stored NRND stock that may have exceeded its moisture-barrier-bag shelf life. Bake per MSL markings before reflow if date codes are old.
Informações de conformidade
Compliance data was not present in the retrieved web data. The NXP product page lists an Environmental Quality section for MCF5207CVM166; consult that page directly for RoHS/REACH certificates before export or automotive use. This part is not AEC-Q100 qualified for in-vehicle applications.
