MCF52234CVM60 - 32-Bit ColdFire V2 MCU 60MHz 256KB Flash | NXP
N.º da peça: MCF52234CVM60 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.95 | $18,95 |
| 10 | $17.21 | $172,10 |
| 100 | $15.42 | $1.542,00 |
| 500 | $13.84 | $6.920,00 |
| 1.000 | $12.55 | $12.550,00 |
MCF52234CVM60 Visão geral
Background: A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/RAM), and programmable peripherals. The ColdFire V2 architecture is a 32-bit variable-length RISC ISA derived from the original 68k family, optimized for embedded control with deterministic interrupt response and low power. Microcontrollers occupy the mid-layer of the embedded hierarchy: transistor -> logic gate -> CPU core -> MCU -> embedded system. Ethernet-enabled MCUs such as the MCF5223x are specialized for connected nodes in industrial automation, building control, and remote monitoring.
Key features include 256 KB on-chip Flash, 32 KB SRAM, an integrated 10/100 Mbps Ethernet MAC with PHY, 80 GPIO pins, multiple UARTs, I2C, QSPI, timers, a 4-channel DMA controller, and a 12-bit ADC. The integrated FEC+EPHY eliminates external PHY hardware, reducing BOM cost and board area. The MAP-BGA-121 package provides high-density I/O access for designs with tight PCB real estate. The ColdFire V2 core delivers approximately 56 MIPS at 60 MHz, balancing throughput with deterministic interrupt latency.
Typical applications include industrial Ethernet nodes, building automation controllers, networked sensors, serial-to-Ethernet bridges, point-of-sale terminals, and factory automation equipment. The wide operating temperature range and integrated networking peripherals make the MCF5223x family suitable for harsh industrial environments requiring reliable connectivity.
Design consideration: Because the part is marked NRND (Not Recommended for New Designs), confirm long-term availability with NXP and validate second-source options before committing to a new design. Plan for potential migration to the newer Kinetis or i.MX RT families for new production programs.
This page synthesizes distributor pricing, drop-in alternative options, lifecycle status, and practical design guidance not consolidated in the manufacturer datasheet.
Alternativas drop-in para MCF52234CVM60 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCF52234CVM60 (mesmo formato e footprint) — diferindo em Package, Ethernet, Operating Temperature, RoHS Status, CAN.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCF52235CVM60
✅ Drop-In✓ Em estoque
$9.1 / unidade
Ver ficha técnica →MCF52254CAF66
✅ Drop-In✓ Em estoque
$18.25 / unidade
Ver ficha técnica →MCF52233CVM60
✅ Drop-In✓ Em estoque
$14.85 / unidade
Ver ficha técnica →MCF52223CVM60
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF52232CVM60
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF52234CVM60 Classificações máximas e características elétricas
| Core Architecture | ColdFire V2 (32-bit RISC) |
| Maximum CPU Frequency | 60 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM Size | 32 KB (32K x 8) |
| Tensão de alimentação | 3.3 V |
| Number of I/O Pins | 80 |
| Encapsulamento | 121-MAPBGA (12x12 mm) |
| Tipo de montagem | Surface Mount |
| Ethernet | Integrated 10/100 FEC + EPHY |
| ADC | 12-bit |
| DMA Channels | 4 |
| Faixa de temperatura de operação | -40C to +85C (industrial) |
| Packaging | Tray |
| Status do ciclo de vida | NRND (Not Recommended for New Designs) |
| Nível MSL | 3 |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do MCF52234CVM60 121-mapbga (12x12 mm)
Configuração de pinos para MCF52234CVM60 (pacote 121-mapbga (12x12 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCF52234CVM60.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCF52234CVM60 é adequado para 6 aplicaçãos: Industrial Ethernet Nodes, Building Automation Controllers, Serial-to-Ethernet Bridges, Point-of-Sale Terminals, Networked Sensor Hubs, Factory Automation Controllers.
Industrial Ethernet Nodes
The MCF52234CVM60 is well-suited for industrial Ethernet nodes thanks to its integrated 10/100 Fast Ethernet Controller (FEC) and on-chip EPHY, which together eliminate the external PHY component. The 60 MHz ColdFire V2 core can sustain TCP/IP stack throughput while still servicing deterministic control loops. The part's industrial operating temperature range of -40C to +85C enables deployment in factory cabinets and outdoor enclosures. With 256 KB Flash, the firmware can host a complete networking stack plus application logic. Designers should follow the reference PHY magnetics and impedance-controlled routing guidelines from NXP for EMI compliance.
Recomendado
Building Automation Controllers
Building automation controllers (BACnet, Modbus TCP, KNX gateways) benefit from the MCF52234CVM60's integrated Ethernet, 80 GPIO lines, and on-chip timers. The 32 KB SRAM comfortably hosts a TCP/IP plus BACnet stack, while the 256 KB Flash holds application firmware and configuration storage. The 3.3 V supply simplifies integration with industrial 24 V-to-3.3 V power trees. UART, I2C, and QSPI peripherals allow direct sensor and actuator interfacing. Designers should leverage the DMA controller to offload network buffering and keep CPU cycles free for control-loop scheduling.
Recomendado
Serial-to-Ethernet Bridges
Serial-to-Ethernet bridges that expose UART-based equipment over a TCP/IP network are a common use case for the MCF52234CVM60. The integrated MAC+PHY pair provides 10/100 Mbps connectivity without external components, while the multiple UARTs (typically 3 or more on the MCF5223x family) enable multi-port bridges. With 60 MHz ColdFire V2 performance, the part can handle full-duplex serial tunneling plus protocol conversion. Engineers should configure DMA for UART RX/TX and dedicate a timer to watchdog-style heartbeat monitoring for fault detection.
Recomendado
Point-of-Sale Terminals
POS terminals require Ethernet connectivity for transaction processing, plus GPIO and serial interfaces for peripherals like barcode scanners, receipt printers, and customer displays. The MCF52234CVM60's integrated Ethernet reduces BOM cost in cost-sensitive POS designs, while 256 KB Flash supports encrypted transaction firmware. The ColdFire V2 core's deterministic interrupt response is valuable for handling simultaneous peripheral events. Designers should plan secure-boot support via the on-chip Flash controller and validate against PCI PTS requirements for the final product.
Recomendado
Networked Sensor Hubs
Networked sensor hubs that aggregate analog/digital sensor data and forward over Ethernet fit the MCF52234CVM60 peripheral mix. The 12-bit ADC samples analog sensors, while the GPIO and I2C connect to digital sensors. The integrated Ethernet pushes aggregated data to a central server. With 80 GPIO pins, multiple sensors can be wired in parallel. The industrial temperature range supports outdoor sensor pods. Engineers should enable the on-chip DMA to offload ADC sampling sequences and reduce CPU load during burst sampling events.
Recomendado
Factory Automation Controllers
Factory automation PLCs and remote I/O modules benefit from the MCF52234CVM60 combination of Ethernet, GPIO, timers, and industrial temperature support. The ColdFire V2 core can execute deterministic control loops while maintaining Modbus TCP or EtherNet/IP connectivity. With 80 GPIO, the part can directly drive relay boards, opto-isolators, and actuator drivers. The 32 KB SRAM allows real-time task scheduling tables. Engineers should map interrupts carefully across the ColdFire V2 interrupt controller to maintain deterministic response times under network load.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCF52234CVM60 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCF52235CVM60 | MCF52254CAF66 | MCF52233CVM60 | MCF52223CVM60 | MCF52232CVM60 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (12x12 mm) | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 (newer rev) | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Frequency | 60 MHz | 60 MHz | 66 MHz | 60 MHz | 60 MHz | 60 MHz |
| Ethernet | Integrated FEC + EPHY | Integrated FEC + EPHY | Integrated FEC + EPHY | Integrated FEC + EPHY | Integrated FEC + EPHY | Integrated FEC + EPHY |
| Lifecycle Status | NRND | NRND | Active | NRND | NRND | NRND |
Principais diferenciais
- Integrated Ethernet PHY reduces BOM (vs MCF52235CVM60)
- Higher CPU clock and active lifecycle (vs MCF52254CAF66)
- Larger Flash/RAM option in same footprint (vs MCF52233CVM60)
Notas de projeto
The MCF52234CVM60 in MAP-BGA-121 must have adequate PCB thermal relief because BGA packages dissipate heat primarily through the inner balls and internal power planes. Recommended: at least 4-layer PCB with a continuous ground plane under the BGA. For industrial temperature operation across -40C to +85C, estimate that junction-to-ambient thermal resistance (theta_JA) must remain below the manufacturer's published limit at the worst-case application power dissipation.
MAP-BGA-121 layout requires 0.8 mm pitch escape routing and microvia technology on at least one PCB layer. Follow the NXP reference design land pattern exactly; any deviation can cause solder joint defects. Place the integrated EPHY magnetics and 49.9 ohm 1% termination resistors within 5 mm of the PHY balls. Keep the 25 MHz PHY reference clock trace short and surrounded by ground.
Do not assume all MCF5223x family parts are drop-in compatible - some have different RAM/Flash sizes and peripheral maps that affect software behavior. Always validate the exact orderable part number against the datasheet ordering information before designing the firmware. Because the part is NRND, verify with NXP that the latest PCN has not changed silicon revision.
Informações de conformidade
RoHS compliance confirmed per NXP product page. AEC-Q100 not applicable for industrial-grade MCU. Halogen-free status not stated in available data - set unknown.
