MCF52234CVM60 - 32-Bit ColdFire V2 MCU 60MHz 256KB Flash | NXP
料号： MCF52234CVM60 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.95 | $18.95 |
| 10 | $17.21 | $172.10 |
| 100 | $15.42 | $1,542.00 |
| 500 | $13.84 | $6,920.00 |
| 1,000 | $12.55 | $12,550.00 |
MCF52234CVM60 概述
Background: A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/RAM), and programmable peripherals. The ColdFire V2 architecture is a 32-bit variable-length RISC ISA derived from the original 68k family, optimized for embedded control with deterministic interrupt response and low power. Microcontrollers occupy the mid-layer of the embedded hierarchy: transistor -> logic gate -> CPU core -> MCU -> embedded system. Ethernet-enabled MCUs such as the MCF5223x are specialized for connected nodes in industrial automation, building control, and remote monitoring.
Key features include 256 KB on-chip Flash, 32 KB SRAM, an integrated 10/100 Mbps Ethernet MAC with PHY, 80 GPIO pins, multiple UARTs, I2C, QSPI, timers, a 4-channel DMA controller, and a 12-bit ADC. The integrated FEC+EPHY eliminates external PHY hardware, reducing BOM cost and board area. The MAP-BGA-121 package provides high-density I/O access for designs with tight PCB real estate. The ColdFire V2 core delivers approximately 56 MIPS at 60 MHz, balancing throughput with deterministic interrupt latency.
Typical applications include industrial Ethernet nodes, building automation controllers, networked sensors, serial-to-Ethernet bridges, point-of-sale terminals, and factory automation equipment. The wide operating temperature range and integrated networking peripherals make the MCF5223x family suitable for harsh industrial environments requiring reliable connectivity.
Design consideration: Because the part is marked NRND (Not Recommended for New Designs), confirm long-term availability with NXP and validate second-source options before committing to a new design. Plan for potential migration to the newer Kinetis or i.MX RT families for new production programs.
This page synthesizes distributor pricing, drop-in alternative options, lifecycle status, and practical design guidance not consolidated in the manufacturer datasheet.
直接替换替代料： MCF52234CVM60 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCF52234CVM60 （相同外形与封装尺寸） ——差异在于 Package, Ethernet, Operating Temperature, RoHS Status, CAN.
快速对比工具——选择替代料号进行并排对比：
MCF52235CVM60
✅ 直接替换✓ 有现货
$9.1 / 个
查看数据手册 →MCF52254CAF66
✅ 直接替换✓ 有现货
$18.25 / 个
查看数据手册 →MCF52233CVM60
✅ 直接替换✓ 有现货
$14.85 / 个
查看数据手册 →MCF52223CVM60
✅ 直接替换📋 参考替代料（不在目录中）
MCF52232CVM60
✅ 直接替换📋 参考替代料（不在目录中）
MCF52234CVM60 最大额定值与电气特性
| Core Architecture | ColdFire V2 (32-bit RISC) |
| Maximum CPU Frequency | 60 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM Size | 32 KB (32K x 8) |
| 电源电压 | 3.3 V |
| Number of I/O Pins | 80 |
| 封装 | 121-MAPBGA (12x12 mm) |
| 安装类型 | Surface Mount |
| Ethernet | Integrated 10/100 FEC + EPHY |
| ADC | 12-bit |
| DMA Channels | 4 |
| 工作温度范围 | -40C to +85C (industrial) |
| Packaging | Tray |
| 生命周期状态 | NRND (Not Recommended for New Designs) |
| MSL 等级 | 3 |
| RoHS 状态 | Compliant |
MCF52234CVM60 121-mapbga (12x12 mm) 引脚配置指南
MCF52234CVM60（121-mapbga (12x12 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MCF52234CVM60.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCF52234CVM60 适用于 6 应用s: Industrial Ethernet Nodes, Building Automation Controllers, Serial-to-Ethernet Bridges, Point-of-Sale Terminals, Networked Sensor Hubs, Factory Automation Controllers.
Industrial Ethernet Nodes
The MCF52234CVM60 is well-suited for industrial Ethernet nodes thanks to its integrated 10/100 Fast Ethernet Controller (FEC) and on-chip EPHY, which together eliminate the external PHY component. The 60 MHz ColdFire V2 core can sustain TCP/IP stack throughput while still servicing deterministic control loops. The part's industrial operating temperature range of -40C to +85C enables deployment in factory cabinets and outdoor enclosures. With 256 KB Flash, the firmware can host a complete networking stack plus application logic. Designers should follow the reference PHY magnetics and impedance-controlled routing guidelines from NXP for EMI compliance.
推荐
Building Automation Controllers
Building automation controllers (BACnet, Modbus TCP, KNX gateways) benefit from the MCF52234CVM60's integrated Ethernet, 80 GPIO lines, and on-chip timers. The 32 KB SRAM comfortably hosts a TCP/IP plus BACnet stack, while the 256 KB Flash holds application firmware and configuration storage. The 3.3 V supply simplifies integration with industrial 24 V-to-3.3 V power trees. UART, I2C, and QSPI peripherals allow direct sensor and actuator interfacing. Designers should leverage the DMA controller to offload network buffering and keep CPU cycles free for control-loop scheduling.
推荐
Serial-to-Ethernet Bridges
Serial-to-Ethernet bridges that expose UART-based equipment over a TCP/IP network are a common use case for the MCF52234CVM60. The integrated MAC+PHY pair provides 10/100 Mbps connectivity without external components, while the multiple UARTs (typically 3 or more on the MCF5223x family) enable multi-port bridges. With 60 MHz ColdFire V2 performance, the part can handle full-duplex serial tunneling plus protocol conversion. Engineers should configure DMA for UART RX/TX and dedicate a timer to watchdog-style heartbeat monitoring for fault detection.
推荐
Point-of-Sale Terminals
POS terminals require Ethernet connectivity for transaction processing, plus GPIO and serial interfaces for peripherals like barcode scanners, receipt printers, and customer displays. The MCF52234CVM60's integrated Ethernet reduces BOM cost in cost-sensitive POS designs, while 256 KB Flash supports encrypted transaction firmware. The ColdFire V2 core's deterministic interrupt response is valuable for handling simultaneous peripheral events. Designers should plan secure-boot support via the on-chip Flash controller and validate against PCI PTS requirements for the final product.
推荐
Networked Sensor Hubs
Networked sensor hubs that aggregate analog/digital sensor data and forward over Ethernet fit the MCF52234CVM60 peripheral mix. The 12-bit ADC samples analog sensors, while the GPIO and I2C connect to digital sensors. The integrated Ethernet pushes aggregated data to a central server. With 80 GPIO pins, multiple sensors can be wired in parallel. The industrial temperature range supports outdoor sensor pods. Engineers should enable the on-chip DMA to offload ADC sampling sequences and reduce CPU load during burst sampling events.
推荐
Factory Automation Controllers
Factory automation PLCs and remote I/O modules benefit from the MCF52234CVM60 combination of Ethernet, GPIO, timers, and industrial temperature support. The ColdFire V2 core can execute deterministic control loops while maintaining Modbus TCP or EtherNet/IP connectivity. With 80 GPIO, the part can directly drive relay boards, opto-isolators, and actuator drivers. The 32 KB SRAM allows real-time task scheduling tables. Engineers should map interrupts carefully across the ColdFire V2 interrupt controller to maintain deterministic response times under network load.
推荐
推荐产品汇总
工程参考数据： MCF52234CVM60 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCF52235CVM60 | MCF52254CAF66 | MCF52233CVM60 | MCF52223CVM60 | MCF52232CVM60 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (12x12 mm) | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 (newer rev) | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Frequency | 60 MHz | 60 MHz | 66 MHz | 60 MHz | 60 MHz | 60 MHz |
| Ethernet | Integrated FEC + EPHY | Integrated FEC + EPHY | Integrated FEC + EPHY | Integrated FEC + EPHY | Integrated FEC + EPHY | Integrated FEC + EPHY |
| Lifecycle Status | NRND | NRND | Active | NRND | NRND | NRND |
关键差异点
- Integrated Ethernet PHY reduces BOM （对比 MCF52235CVM60)
- Higher CPU clock and active lifecycle （对比 MCF52254CAF66)
- Larger Flash/RAM option in same footprint （对比 MCF52233CVM60)
设计说明
The MCF52234CVM60 in MAP-BGA-121 must have adequate PCB thermal relief because BGA packages dissipate heat primarily through the inner balls and internal power planes. Recommended: at least 4-layer PCB with a continuous ground plane under the BGA. For industrial temperature operation across -40C to +85C, estimate that junction-to-ambient thermal resistance (theta_JA) must remain below the manufacturer's published limit at the worst-case application power dissipation.
MAP-BGA-121 layout requires 0.8 mm pitch escape routing and microvia technology on at least one PCB layer. Follow the NXP reference design land pattern exactly; any deviation can cause solder joint defects. Place the integrated EPHY magnetics and 49.9 ohm 1% termination resistors within 5 mm of the PHY balls. Keep the 25 MHz PHY reference clock trace short and surrounded by ground.
Do not assume all MCF5223x family parts are drop-in compatible - some have different RAM/Flash sizes and peripheral maps that affect software behavior. Always validate the exact orderable part number against the datasheet ordering information before designing the firmware. Because the part is NRND, verify with NXP that the latest PCN has not changed silicon revision.
合规信息
RoHS compliance confirmed per NXP product page. AEC-Q100 not applicable for industrial-grade MCU. Halogen-free status not stated in available data - set unknown.
