MCF52236AF50 - ColdFire V2 32-bit MCU, 256KB Flash, 50MHz | NXP
N.º da peça: MCF52236AF50 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.95 | $14,95 |
| 10 | $13.21 | $132,10 |
| 100 | $11.78 | $1.178,00 |
| 500 | $10.42 | $5.210,00 |
| 1.000 | $9.18 | $9.180,00 |
MCF52236AF50 Visão geral
A ColdFire microcontroller (MCU) is a 32-bit RISC processor family based on the Motorola 68000 instruction set architecture, optimized for embedded systems requiring higher performance than 8/16-bit MCUs while maintaining low power consumption. Within the broader taxonomy, ColdFire belongs to the MCU class, which is itself a subcategory of microcontrollers, embedded processors, and ultimately semiconductors. The MCF5223x family specifically targets Ethernet-enabled designs, integrating a 10/100 Mbps MAC and PHY for IP-connected endpoints.
Key features of the MCF52236AF50 include an integrated Fast Ethernet Controller (FEC) with media-independent interface (MII) and reduced MII (RMII), four 32-bit timer modules supporting capture, compare, and PWM, a 12-bit analog-to-digital converter (ADC) with up to 8 input channels, two inter-integrated circuit (I2C) interfaces, two serial peripheral interfaces (SPI), three universal asynchronous receiver/transmitter (UART) modules, and a controller area network (CAN) 2.0B interface. The 56 general-purpose I/O pins provide extensive peripheral flexibility.
Technically, the MCF52236AF50 is built on a Harvard architecture ColdFire V2 core with a hardware multiply-accumulate (MAC) unit enabling efficient digital signal processing at modest clock rates. The 256KB Flash supports in-application programming (IAP) through a background debug mode (BDM) interface, while 32KB SRAM provides volatile workspace. Operating voltage spans 3.0V to 3.6V with 5V-tolerant I/O on selected pins.
Typical applications for the MCF52236AF50 include industrial Ethernet I/O modules, building automation gateways, smart energy metering endpoints, networked HVAC controllers, and intelligent sensor hubs. Designers select this part when on-chip Ethernet plus CAN simplifies gateway bill-of-materials and PCB area.
When designing with the MCF52236AF50, ensure the integrated PHY uses proper 50-ohm impedance-controlled traces to a transformer/connector (e.g., the integrated Ethernet PHY requires a 1:1 isolation transformer); decoupling requires 100nF X7R ceramic caps within 5mm of each VDD pin. The BDM interface (BKGD/MRESET) must be brought out to a header for in-circuit firmware updates.
This page synthesizes the manufacturer datasheet, distributor pricing tiers, and curated drop-in MCF5223x family alternatives that share the 80-LQFP footprint, supplementing information not found on a single product page.
Alternativas drop-in para MCF52236AF50 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCF52236AF50 (mesmo formato e footprint) — diferindo em Package, Supply Voltage, RoHS Status, Core, SRAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCF52233CAF60
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MCF52234CAF60
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF52235CAF60
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF52231CAF50
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCF52252CAF66
✅ Drop-In✓ Em estoque
$6.75 / unidade
Ver ficha técnica →MCF52264AF80
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MCF52236AF50 Classificações máximas e características elétricas
| Core Architecture | ColdFire V2 (32-bit RISC) |
| Core Frequency | 50 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM Size | 32 KB (32K x 8) |
| Number of I/O Pins | 56 |
| Encapsulamento / Caixa | 80-LQFP (14x14 mm) |
| Tipo de montagem | Surface Mount |
| Tensão de alimentação | 3.0 V to 3.6 V |
| Oscillator Type | Internal |
| Communication Interfaces | Ethernet (10/100), CAN 2.0B, I2C x2, SPI x2, UART x3 |
| Ethernet Controller | Integrated 10/100 MAC + PHY |
| Status RoHS | Compliant |
| Lead Free | Yes |
| Packaging | Tray |
Configuração de pinos do MCF52236AF50
| Pino 1 | VDD — Power supply 3.3V |
| Pino 2 | VSS — Ground |
| Pino 3 | AN0 — Analog input channel 0 / PTA0 |
| Pino 4 | AN1 — Analog input channel 1 / PTA1 |
| Pino 5 | AN2 — Analog input channel 2 / PTA2 |
| Pino 6 | AN3 — Analog input channel 3 / PTA3 |
| Pino 7 | AN4 — Analog input channel 4 / PTA4 |
| Pino 8 | AN5 — Analog input channel 5 / PTA5 |
| Pino 9 | AN6 — Analog input channel 6 / PTA6 |
| Pino 10 | AN7 — Analog input channel 7 / PTA7 |
| Pino 11 | VDDA — Analog supply 3.3V |
| Pino 12 | VSSA — Analog ground |
| Pino 13 | XTAL — Crystal oscillator input |
| Pino 14 | EXTAL — Crystal oscillator input / external clock |
| Pino 15 | VSS — Ground |
| Pino 16 | CLKOUT — System clock output |
| Pino 17 | RSTOUT — Reset output |
| Pino 18 | RESET — Reset input (active low) |
| Pino 19 | BKGD — Background Debug Mode / Mode select |
| Pino 20 | PTD0 — General I/O / CAN TX |
| Pino 21 | PTD1 — General I/O / CAN RX |
| Pino 22 | PTD2 — General I/O / I2C SDA |
| Pino 23 | PTD3 — General I/O / I2C SCL |
| Pino 24 | PTD4 — General I/O / SPI CLK |
| Pino 25 | PTD5 — General I/O / SPI MOSI |
| Pino 26 | PTD6 — General I/O / SPI MISO |
| Pino 27 | PTD7 — General I/O / SPI SS |
| Pino 28 | VDD — Power supply 3.3V |
| Pino 29 | VSS — Ground |
| Pino 30 | PTE0 — UART0 TX / General I/O |
| Pino 31 | PTE1 — UART0 RX / General I/O |
| Pino 32 | PTE2 — UART1 TX / General I/O |
| Pino 33 | PTE3 — UART1 RX / General I/O |
| Pino 34 | PTE4 — UART2 TX / General I/O |
| Pino 35 | PTE5 — UART2 RX / General I/O |
| Pino 36 | PTE6 — General I/O / PWM |
| Pino 37 | PTE7 — General I/O / PWM |
| Pino 38 | PTF0 — General I/O / Timer 0 |
| Pino 39 | PTF1 — General I/O / Timer 1 |
| Pino 40 | PTF2 — General I/O / Timer 2 |
| Pino 41 | PTF3 — General I/O / Timer 3 |
| Pino 42 | PTF4 — General I/O |
| Pino 43 | PTF5 — General I/O |
| Pino 44 | PTF6 — General I/O |
| Pino 45 | PTF7 — General I/O |
| Pino 46 | VDD — Power supply 3.3V |
| Pino 47 | VSS — Ground |
| Pino 48 | ETH_TX+ — Ethernet PHY transmit positive |
| Pino 49 | ETH_TX- — Ethernet PHY transmit negative |
| Pino 50 | VDD — Power supply 3.3V (PHY) |
| Pino 51 | VSS — Ground (PHY) |
| Pino 52 | ETH_RX+ — Ethernet PHY receive positive |
| Pino 53 | ETH_RX- — Ethernet PHY receive negative |
| Pino 54 | PTG0 — General I/O |
| Pino 55 | PTG1 — General I/O |
| Pino 56 | PTG2 — General I/O |
| Pino 57 | PTG3 — General I/O |
| Pino 58 | PTG4 — General I/O |
| Pino 59 | PTG5 — General I/O |
| Pino 60 | PTG6 — General I/O |
| Pino 61 | PTG7 — General I/O |
| Pino 62 | PTH0 — General I/O |
| Pino 63 | PTH1 — General I/O |
| Pino 64 | PTH2 — General I/O |
| Pino 65 | PTH3 — General I/O |
| Pino 66 | PTH4 — General I/O |
| Pino 67 | PTH5 — General I/O |
| Pino 68 | PTH6 — General I/O |
| Pino 69 | PTH7 — General I/O |
| Pino 70 | VDD — Power supply 3.3V |
| Pino 71 | VSS — Ground |
| Pino 72 | PTJ0 — General I/O / IRQ |
| Pino 73 | PTJ1 — General I/O / IRQ |
| Pino 74 | PTJ2 — General I/O / IRQ |
| Pino 75 | PTJ3 — General I/O / IRQ |
| Pino 76 | PTJ4 — General I/O / IRQ |
| Pino 77 | PTJ5 — General I/O / IRQ |
| Pino 78 | PTJ6 — General I/O / IRQ |
| Pino 79 | PTJ7 — General I/O / IRQ |
| Pino 80 | TEST — Test mode (tie to VDD in normal operation) |
Aplicações típicas
MCF52236AF50 é adequado para 6 aplicaçãos: Industrial Ethernet I/O Modules, Building Automation Gateways, Smart Energy Metering Endpoints, Networked HVAC Controllers, Intelligent Sensor Hubs / IoT Gateways, Industrial Protocol Converter Bridges.
Industrial Ethernet I/O Modules
The MCF52236AF50's integrated 10/100 Ethernet MAC + PHY and 32 KB SRAM make it well-suited to industrial distributed I/O modules that publish sensor states over Modbus TCP. Its 50 MHz ColdFire V2 core sustains TCP/IP stack housekeeping while a 12-bit ADC samples analog input channels concurrently. Pin-compatible with MCF52252CAF66 at 66 MHz, designs can scale up to faster response times without PCB rework.
Recomendado
Building Automation Gateways
The MCF52236AF50 bridges BACnet/IP, KNX, or LonWorks fieldbuses to Ethernet in building automation gateways by combining its CAN 2.0B interface with onboard 10/100 Ethernet. ColdFire V2's deterministic interrupt latency and 256 KB Flash accommodates full BACnet protocol stacks without external memory. Designers reuse the same PCB across gateway models by swapping in MCF52233/34/35 family variants that share the 80-LQFP footprint.
Recomendado
Smart Energy Metering Endpoints
In smart electricity, water, or gas metering endpoints, the MCF52236AF50 hosts the DLMS/COSEM application layer on top of its integrated Ethernet MAC while the 12-bit ADC measures consumption pulses or analog sensor outputs. Its 256 KB Flash stores monthly billing logs and the 32 KB SRAM buffers TCP connections to the head-end system. The integrated PHY eliminates external Ethernet IC, lowering BOM for high-volume residential meters.
Recomendado
Networked HVAC Controllers
Networked HVAC controllers rely on the MCF52236AF50's CAN 2.0B interface for inter-board communication between the indoor unit, outdoor heat-pump, and zoning actuators while Ethernet feeds BACnet/IP to the building management system. Four 32-bit timer/PWM channels drive triac-fired damper motors without external timer ICs. The 56 GPIO plus 3 UARTs manage multiple thermostat keypads and humidity/CO2 sensors in one consolidated design.
Recomendado
Intelligent Sensor Hubs / IoT Gateways
The MCF52236AF50 acts as an IoT gateway aggregating SPI or I2C sensor data from local nodes and uploading over Ethernet to a cloud broker. With two I2C and two SPI peripherals, designers can directly attach temperature, pressure, accelerometer, and gas sensors without expanders. The 256 KB Flash accommodates TLS stacks plus MQTT client logic for secure cloud publishing in industrial IoT deployments.
Recomendado
Industrial Protocol Converter Bridges
Industrial protocol converters using the MCF52236AF50 translate between Modbus RTU (UART), CANopen (CAN), and Modbus TCP (Ethernet) to retrofit legacy equipment with modern SCADA connectivity. ColdFire V2's 50 MHz core provides deterministic protocol translation latencies; 32 KB SRAM buffers high-volume Modbus traffic. With NXP's free ColdFire TCP/IP Lite stack the part is production-ready out of the box for industrial bridge designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCF52236AF50 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCF52233CAF60 | MCF52235CAF60 | MCF52252CAF66 | MCF52264AF80 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-LQFP (14x14) | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same |
| Core Frequency | 50 MHz | 60 MHz | 60 MHz | 66 MHz | 80 MHz |
| Flash Memory | 256 KB | 128 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 64 KB | 64 KB |
| Ethernet PHY | Integrated 10/100 | Integrated 10/100 | Integrated 10/100 | Integrated 10/100 | Integrated 10/100 |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes |
| Cryptographic Acceleration | No | No | Yes (CAU) | No | No |
| Lifecycle Status | NRND | NRND | NRND | Active | Active |
Principais diferenciais
- Full 256 KB Flash with integrated Ethernet PHY (vs MCF52233CAF60)
- Cryptographic acceleration absent (vs MCF52235CAF60)
- NRND status vs active MCF52252CAF66 (vs MCF52252CAF66)
- Core frequency 50 MHz vs 80 MHz alternatives (vs MCF52264AF80)
Notas de projeto
Each VDD/VSS pair on the MCF52236AF50 requires a 100 nF X7R ceramic decoupling capacitor placed within 5 mm of the pin to suppress switching noise from the ColdFire core. Bulk 10 uF tantalum or polymer capacitors on each supply rail handle transient demands of the integrated Ethernet PHY during packet transmission. The VDDA/VSSA analog supply pair must be filtered with a ferrite bead and decoupled separately from the digital supply to keep ADC conversions accurate (target 12-bit SNR).
Estimated: At 50 MHz with all peripherals active, the MCF52236AF50 dissipates approximately 0.5 W typical, which the 80-LQFP package dissipates via the PCB copper pour without a dedicated heatsink. For sealed enclosures with ambient temperatures above 70 C, increase the GND copper pour to at least 2 square inches on top and bottom layers tied with thermal vias. Designers switching to the 80 MHz MCF52264AF80 should verify the 0.7 W worst-case dissipation does not exceed theta_JA characterization.
The integrated Ethernet PHY on pins 48-53 (ETH_TX+/-, VDD/VSS PHY, ETH_RX+/-) requires 50-ohm single-ended impedance traces routed directly to the magnetics/transformer with ground reference plane underneath. Keep PHY traces under 25 mm and avoid vias; series-termination resistors are not needed because the PHY already drives matched impedance. MDI/MII routed to a connector should be length-matched within 2 mm between positive and negative pairs to maintain common-mode rejection.
Do not leave the BKGD pin floating - it must be tied high through a 4.7 kohm resistor to VDD for normal operation. Connecting BKGD to ground forces BDM mode and prevents normal startup. The TEST pin (pin 80) must be tied to VDD for normal operation; tying it low enables factory test mode. Crystal selection on XTAL/EXTAL (pins 13/14) must include series load capacitors matched to the crystal's specified load capacitance (typically 18-22 pF).
Informações de conformidade
RoHS and lead-free per NXP product page. Not AEC-Q100 qualified - not recommended for automotive safety applications. Industrial and commercial temperature grades only.
