MCIMX6G2DVK05AA - i.MX6UL 528MHz Cortex-A7 MPU 272-MAPBGA | NXP
N.º da peça: MCIMX6G2DVK05AA ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.21 | $12,21 |
| 10 | $11.45 | $114,50 |
| 100 | $10.18 | $1.018,00 |
| 500 | $9.02 | $4.510,00 |
| 1.000 | $8.1 | $8.100,00 |
MCIMX6G2DVK05AA Visão geral
An application processor (AP) is a system-on-chip (SoC) class IC that integrates a CPU core, memory controller, graphics/video pipeline, and a rich peripheral set into a single die. APs sit at the top of the embedded hierarchy: microcontroller -> microprocessor (MPU) -> application processor -> SoC, and are used when workloads exceed the capability of typical MCUs - including multimedia HMI, industrial control, and connected IoT gateways. The i.MX 6UltraLite family specifically targets cost- and power-sensitive designs that previously used MCUs but require Cortex-A class Linux capability.
Key features include hardware encryption (AES, SHA, DES/3DES), two 12-bit ADCs (up to 10 input channels each), two 12-bit DACs, two USB 2.0 controllers (one with HS PHY), two CAN-FD ports, two Gigabit-capable Ethernet MACs (one with 1588 timestamp), and an LCD controller supporting up to WXGA resolution. The integrated power management unit supports dynamic voltage and frequency scaling (DVFS) and multiple low-power modes (Run, Wait, Stop, Deep Sleep, Power Down).
Architecture highlights: the Cortex-A7 core delivers ARMv7-A compatibility with NEON SIMD and FPU, manufactured on a 40 nm low-power process. The unified L2 cache and dual 32-bit DDR3/LPDDR2 memory controller deliver up to 6.4 GB/s peak bandwidth. Hardware virtualization and TrustZone security extensions are supported, enabling secure boot and isolated execution environments.
Typical applications include industrial HMI panels, IoT gateways, smart energy meters, building automation controllers, point-of-sale terminals, portable medical monitoring, and low-end multimedia consoles. The wide peripheral mix makes the part well-suited for systems requiring Ethernet, CAN, USB, and LCD in a single chip.
When designing with this MPU, ensure proper PCB stack-up for the 272-pin MAPBGA - NXP recommends a 4+ layer board with microvia-in-pad for the exposed die-pad (EP) for thermal dissipation. DDR3/LPDDR2 routing requires length-matched fly-by topology and proper termination per JEDEC JESD79-3F; signal integrity simulations should be run before tape-out.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping engineers evaluate second-source options, lifecycle risk, and PCB layout considerations in one place.
Alternativas drop-in para MCIMX6G2DVK05AA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCIMX6G2DVK05AA (mesmo formato e footprint) — diferindo em Package, Core Architecture, L2 Cache, USB, CAN.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCIMX6G2DVK05AB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX6G2CVM05AA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX6G3DVM05AA
✅ Drop-In✓ Em estoque
$9.78 / unidade
Ver ficha técnica →MCIMX6G2CVK05AA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX6X3EVK10AB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX6G2DVK05AA Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | i.MX 6UltraLite (i.MX6UL) |
| Core Processor | ARM Cortex-A7 |
| Number of Cores / Bus Width | 1 Core / 32-Bit |
| Maximum CPU Clock | 528 MHz |
| L1 Cache (I/D) | 32 KB / 32 KB |
| L2 Cache | 128 KB unified |
| On-chip RAM (OCRAM) | 160 KB |
| Process Node | 40 nm low-power CMOS |
| Tensão de alimentação | 1.8 V / 2.8 V / 3.3 V |
| Temperatura de operação | -40C to +105C (industrial) |
| Encapsulamento | 272-MAPBGA (9x9 mm) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Configuração de pinos do MCIMX6G2DVK05AA
| Pino A1 | VDD_ARM_IN — ARM core voltage input (from PMIC) |
| Pino A2 | NVCC_GPIO — GPIO I/O supply (1.8 V / 3.3 V) |
| Pino B1 | DDR_VREF — DDR reference voltage |
| Pino C2 | GP_ANIO0 — Analog input / GPIO |
| Pino D1 | RGMII_TXC — Ethernet RGMII transmit clock |
| Pino E2 | RGMII_RXC — Ethernet RGMII receive clock |
| Pino F1 | LCD_DATA0 — LCD pixel data bit 0 |
| Pino G2 | LCD_DATA1 — LCD pixel data bit 1 |
| Pino H1 | USB1_DP — USB 2.0 high-speed D+ |
| Pino J2 | USB1_DN — USB 2.0 high-speed D- |
| Pino K1 | CAN1_TX — CAN-FD 1 transmit |
| Pino L2 | CAN1_RX — CAN-FD 1 receive |
| Pino M1 | UART1_TXD — Async serial transmit |
| Pino N2 | UART1_RXD — Async serial receive |
| Pino P1 | I2C1_SCL — I2C clock |
| Pino R2 | I2C1_SDA — I2C data |
| Pino T1 | JTAG_TCK — JTAG test clock |
| Pino U2 | JTAG_TMS — JTAG test mode select |
| Pino V1 | JTAG_TDO — JTAG test data out |
| Pino W2 | JTAG_TDI — JTAG test data in |
| Pino Y1 | RESET_IN — POR reset input |
| Pino AA2 | BOOT_MODE0 — Boot mode select 0 |
| Pino AB1 | BOOT_MODE1 — Boot mode select 1 |
| Pino AC2 | PMIC_STBY_REQ — PMIC standby request |
| Pino AD1 | PMIC_READY — PMIC ready output |
| Pino AE2 | GPIO_IO00 — General-purpose I/O 0 |
| Pino AF1 | GPIO_IO01 — General-purpose I/O 1 |
| Pino AG2 | GPIO_IO02 — General-purpose I/O 2 |
| Pino AH1 | EP — Exposed die-pad - thermal/ground |
Aplicações típicas
MCIMX6G2DVK05AA é adequado para 6 aplicaçãos: Industrial HMI Touch Panels, IoT Edge Gateways, Smart Energy Meters, Building Automation Controllers, Point-of-Sale Terminals, Portable Medical Monitoring Devices.
Industrial HMI Touch Panels
The MCIMX6G2DVK05AA fits industrial HMI panels because it integrates an LCD controller up to WXGA resolution, two 12-bit ADCs for touch sensing, hardware AES/SHA crypto for secure HMI, and a single 528 MHz Cortex-A7 core that runs Linux with Qt or Web-based UIs. With its 272-MAPBGA 9x9 mm package it fits 3.5" to 7" panel designs, and the two CAN-FD controllers connect directly to industrial PLC networks. Compared to MCUs, it adds multimedia capability while staying under 1 W typical consumption. Pin-compatible migration to the active i.MX6ULL family extends lifecycle into the 2030s for new panel designs.
Recomendado
IoT Edge Gateways
The MCIMX6G2DVK05AA fits IoT edge gateways because it combines two 10/100/1000 Ethernet MACs (one with IEEE 1588 hardware timestamping), two USB 2.0 ports, two CAN-FD ports, and the Cortex-A7 core running Linux with TCP/IP stacks. The 160 KB OCRAM handles packet queuing while DDR3/LPDDR2 holds the OS image and protocol stacks. Hardware AES/SHA accelerates TLS handshake offload, critical for constrained edge nodes. The wide 1.8 V / 2.8 V / 3.3 V supply flexibility simplifies integration with sensors and radio modules.
Recomendado
Smart Energy Meters
The MCIMX6G2DVK05AA fits smart energy meters because its two 12-bit ADCs sample voltage and current channels at >1 MSPS for Class 0.5 metering accuracy, while hardware crypto secures DLMS/COSEM communication. The Cortex-A7 core runs metering firmware plus optional Linux, and the wide operating temperature range (-40C to +105C) suits outdoor meter enclosures. The 272-MAPBGA's exposed die-pad provides robust thermal dissipation in sealed housings. Compared to typical metering MCUs, it adds GUI capability for in-home displays.
Recomendado
Building Automation Controllers
The MCIMX6G2DVK05AA fits BACnet/Modbus building controllers because its two CAN-FD plus dual Ethernet MACs bridge fieldbus segments, while the 528 MHz Cortex-A7 runs BACnet/IP stacks and HTML5 dashboards. Its 1.8 V / 2.8 V / 3.3 V rails integrate directly with 24 V field devices via simple buck conversion. Two USB 2.0 ports enable commissioning via flash drives. The integrated LCD controller drives a local display, eliminating a secondary graphics MCU. Wide temperature grade suits unconditioned mechanical rooms.
Recomendado
Point-of-Sale Terminals
The MCIMX6G2DVK05AA fits POS terminals because the Cortex-A7 at 528 MHz runs Android or Linux POS stacks, the LCD controller drives the operator display, and the hardware crypto accelerates EMV contactless payment flows. The two USB 2.0 ports connect printers and barcode scanners, while the 12-bit DAC generates audio prompts. Its low typical power consumption suits battery-backed designs. Pin-compatible migration to i.MX6ULL adds lifecycle margin for retail deployments.
Recomendado
Portable Medical Monitoring Devices
The MCIMX6G2DVK05AA fits portable patient monitors because its two 12-bit ADCs acquire ECG/EEG/SpO2 waveforms, hardware AES encrypts PHI at rest and in transit, and the Cortex-A7 core runs lightweight RTOS plus graphical UIs. The wide operating temperature supports clinical environments, and the 40 nm process keeps typical active power under 500 mW - extending battery life in handheld form factors. Two USB 2.0 ports support charging plus data sync.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCIMX6G2DVK05AA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCIMX6G2DVK05AB | MCIMX6G2CVM05AA | MCIMX6G3DVM05AA | MCIMX6G2CVK05AA | MCIMX6X3EVK10AB |
|---|---|---|---|---|---|---|
| Package | 272-MAPBGA (9x9 mm) | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A9 + Cortex-M4 |
| Maximum Clock | 528 MHz | 528 MHz | 528 MHz | 528 MHz | 528 MHz | 227 MHz + 1 GHz |
| OCRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 256 KB |
| Number of Cores | 1 Core / 32-Bit | 1 Core / 32-Bit | 1 Core / 32-Bit | 1 Core / 32-Bit | 1 Core / 32-Bit | 2 Cores / 32-Bit |
| Temperature Grade | -40C to +105C (industrial) | -40C to +105C (industrial) | 0C to +70C (consumer) | -40C to +105C (industrial) | 0C to +70C (consumer) | -40C to +105C (industrial) |
| Lifecycle Status | Obsolete (EOL) | Active (recommended replacement) | Obsolete | Obsolete | Obsolete | Active |
Principais diferenciais
- Direct NXP-recommended drop-in replacement for EOL systems (vs MCIMX6G2DVK05AB)
- Lower-power i.MX6ULL upgrade path available (vs MCIMX6G3DVM05AA)
- More peripherals than basic MCUs in similar price range (vs MCIMX6X3EVK10AB)
Notas de projeto
Estimated: the 272-MAPBGA at 0.5 mm pitch requires a 4+ layer stack-up with 1 oz copper outer layers and 0.5 oz inner layers per NXP hardware design guide. Microvia-in-pad on BGA balls reduces inductance for the 528 MHz DDR3 interface and prevents BGA solder joint defects during thermal cycling. Maintain a continuous ground pour under the exposed die-pad (EP) with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to keep junction temperature below 105C at 1 W dissipation.
DDR3/LPDDR2 routing on this MPU requires fly-by topology with 50 ohm single-ended impedance per JEDEC JESD79-3F, length-matched within +/-25 mils on the address/control bus, and +/-10 mils on the data byte lanes. Place the DDR termination VTT near the DRAM and route VTT traces in parallel with the address bus. Use IBIS-AMI simulation (available from NXP) to validate write/read margins before tape-out, especially at the 528 MHz core clock which generates tight DDR timing budgets.
Three common mistakes on i.MX6UL designs: (1) omitting the external 32.768 kHz crystal for RTC - the internal RC oscillator drifts and breaks timekeeping for metering/logging; (2) leaving JTAG_TEST_MODE floating during reset, which can lock the part into test state and prevent boot; (3) using a single bulk capacitor for NVCC_GPIO instead of 100 nF + 4.7 uF + 22 uF decoupling per NXP app note AN4577. Each issue causes field failures that are hard to debug without proper bring-up.
Estimated: with theta_JB of 8 C/W and theta_JA of 25 C/W on a 4-layer JEDEC test board, the i.MX6UL dissipating 1 W yields junction temperature rise of 25C above ambient. In sealed industrial housings at +70C ambient, derate to 0.7 W maximum. Use a continuous ground copper pour stitched with thermal vias under the exposed die-pad to spread dissipation across multiple board layers; avoid placing heat sources directly above the MAPBGA.
Informações de conformidade
RoHS compliant per NXP product page environmental section. Not AEC-Q100 qualified - automotive applications should use the i.MX6ULL automotive-grade variants. MSL-3 (168 hour) floor life per JEDEC J-STD-020.
