MCIMX6G3DVM05AA - i.MX6UL ARM Cortex-A7 MPU 528MHz | NXP
N.º da peça: MCIMX6G3DVM05AA ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16.85 | $16,85 |
| 10 | $15.42 | $154,20 |
| 100 | $13.18 | $1.318,00 |
| 500 | $11.25 | $5.625,00 |
| 1.000 | $9.78 | $9.780,00 |
MCIMX6G3DVM05AA Visão geral
An application processor (AP) is a system-on-chip (SoC) class integrated circuit that integrates one or more CPU cores with memory controllers, peripheral interfaces, and dedicated hardware accelerators. The i.MX 6UltraLite family sits within NXP's broader i.MX portfolio as a power-efficient, cost-optimized tier targeting connected, battery-powered, and industrial HMI products. Within the system hierarchy it functions as the central processing node between sensors, communication transceivers, and user-interface peripherals, while the on-chip companion PMIC (typically PF3000/PF3001) provides the multi-rail supply tree required for proper boot sequencing.
Key specifications include a 528 MHz single-core ARM Cortex-A7 with Neon media processing engine and hardware FPU, integrated 128 KB L2 cache, 32-bit DDR3/LPDDR2 memory controller, dual 10/100 Ethernet MACs with hardware timestamping, dual USB 2.0 OTG controllers with PHY, and a 12-bit ADC supporting up to 10 channels. Security features include a True Random Number Generator (TRNG), High Assurance Boot (HAB) support, AES/SHA accelerators, and on-chip tamper detection, making it suitable for connected industrial and payment applications.
The device is fabricated in a low-power 40 nm process and supports industrial temperature ranges from -40 °C to +105 °C. Integrated peripherals cover LCDIF for display panels, CSI for camera input, and multiple I2S/SAI/AC97 audio interfaces plus SPDIF. The combination of high-efficiency processing, hardware security, and broad connectivity positions the part for secure IoT gateways, smart energy meters, and portable medical devices.
Typical applications include building automation controllers, industrial HMI panels, smart energy / AMI metering, portable medical patient monitors, point-of-sale terminals, and connected appliance controllers. In these roles the Cortex-A7 class performance, hardware crypto accelerators, and dual Ethernet provide both deterministic control and secure network connectivity. When designing with this device, plan power-rail sequencing through a companion PMIC and provision adequate PCB thermal relief; the 289-ball MAPBGA requires a minimum of 6 PCB layers with controlled-impedance routing for the DDR3 interface.
Alternativas drop-in para MCIMX6G3DVM05AA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCIMX6G3DVM05AA (mesmo formato e footprint) — diferindo em Package, L2 Cache, Core Architecture, Mounting Type, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCIMX6G2DVM05AA
✅ Drop-In✓ Em estoque
$11.75 / unidade
Ver ficha técnica →MCIMX6G3DVM05AB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX6G3CVM05AA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCIMX6G3DVM07AA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCIMX6Y2DVM05AA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX6G3DVM05AA Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-A7 (single core) |
| Maximum CPU Frequency | 528 MHz |
| Operating Voltage | 1.8 V / 2.8 V / 3.3 V |
| Temperatura de operação | -40 °C to +105 °C (industrial) |
| Encapsulamento | 289-ball MAPBGA (14x14 mm) |
| L2 Cache | 128 KB unified |
| Memory Controller | 16-bit DDR3 / LPDDR2 |
| Ethernet MAC | Dual 10/100 Mbps with IEEE 1588 |
| USB | 2x USB 2.0 OTG with integrated PHY |
| ADC | 2x 12-bit, up to 10 input channels |
| Display Controller | LCDIF (parallel RGB) |
| Camera Interface | CSI (parallel) |
| Security Accelerators | AES, SHA, TRNG, HAB |
| Tipo de montagem | Surface Mount (BGA) |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Guia de Configuração de Pinos do MCIMX6G3DVM05AA 289-ball mapbga (14x14 mm)
Configuração de pinos para MCIMX6G3DVM05AA (pacote 289-ball mapbga (14x14 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCIMX6G3DVM05AA.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCIMX6G3DVM05AA é adequado para 6 aplicaçãos: Industrial IoT Gateway, Smart Energy Meter, Building Automation Controller, Portable Medical Patient Monitor, Point-of-Sale (POS) Terminal, Connected Appliance HMI.
Industrial IoT Gateway
The MCIMX6G3DVM05AA's 528 MHz Cortex-A7 with Linux BSP support and dual 10/100 Ethernet MACs (with hardware IEEE 1588 timestamping) make it ideal as the host processor for industrial IoT gateways aggregating Modbus TCP, PROFINET, EtherNet/IP, and OPC-UA field traffic. The dual USB 2.0 OTG ports enable cellular modem and Bluetooth/Wi-Fi dongle expansion, while the hardware AES/SHA accelerators (G3 SKU) secure TLS/DTLS tunnels with minimal CPU overhead. Its -40 to +105 °C industrial temperature grade supports outdoor DIN-rail enclosures, and the integrated LCDIF enables local HMI display. Power dissipation is roughly 0.5 W at typical gateway workloads, allowing fanless enclosure designs when paired with a PF3001 PMIC.
Recomendado
Smart Energy Meter
For smart electricity, water, and gas meters, the MCIMX6G3DVM05AA combines the Cortex-A7 headroom to run metering stacks with a 12-bit ADC (up to 10 channels) suitable for current-sense and voltage-divider sampling at 4 kHz. Hardware True Random Number Generator (TRNG) and High Assurance Boot (HAB) provide the cryptographic root of trust required for AMI rollouts, while AES/SHA offload secures DLMS/COSEM or ANSI C12.22 communications. The 32-bit DDR3 controller supports large meter log buffers without external SRAM. Power consumption in deep-sleep mode (~30 mW) is critical for battery-backed metering, and the industrial temperature rating accommodates outdoor meter enclosures in extreme climates.
Recomendado
Building Automation Controller
The MCIMX6G3DVM05AA is well suited for BACnet, KNX, and LonWorks building automation controllers, where the 528 MHz Cortex-A7 runs control logic, scheduling, and web-server frontends while the dual Ethernet MACs provide redundant IP backbone and daisy-chained field-bus segments. The LCDIF interface drives a 7-inch or 10-inch operator-interface display for room control panels, and the integrated CSI input supports camera-based occupancy sensing. Hardware cryptography secures BACnet/SC TLS handshakes, and the industrial temperature grade allows installation in mechanical rooms without active cooling. Pairing with the PF3001 PMIC yields deterministic power-up sequencing required for KNX stack initialization.
Recomendado
Portable Medical Patient Monitor
For portable medical patient monitors (SpO2, ECG, blood-pressure carts), the MCIMX6G3DVM05AA provides the ARM Cortex-A7 DSP-class throughput to run real-time DSP for pulse-oximetry and ECG signal processing, while the hardware floating-point unit accelerates FFT-based heart-rate-variability algorithms. The integrated 12-bit ADC captures bioelectric signals after external front-end amplification, and the LCDIF drives 4.3-inch to 7-inch patient-facing displays. Hardware AES encryption on the G3 SKU secures HIPAA-compliant patient data at rest on local storage. The industrial temperature rating accommodates ambulance and emergency-room environments. Active lifecycle planning requires verifying the part's LTB status against the device's clinical service life.
Recomendado
Point-of-Sale (POS) Terminal
The MCIMX6G3DVM05AA serves as the host processor for compact POS terminals, where the 528 MHz Cortex-A7 runs the payment application stack while the hardware AES/SHA/TRNG provides PCI PTS 5.x mandated cryptographic operations. Dual USB 2.0 OTG ports support cash-drawer, barcode scanner, and receipt-printer peripherals, and the LCDIF drives the merchant-facing touchscreen. The 32-bit DDR3 interface handles encryption latency without pipeline stalls, and the integrated 12-bit ADC monitors battery voltage and tamper switches. The industrial temperature rating supports semi-outdoor kiosk installations. The recommended NXP-native alternative is the active i.MX 6ULL family for new POS designs.
Recomendado
Connected Appliance HMI
For smart appliances (washers, ovens, refrigerators) and white-goods HMI boards, the MCIMX6G3DVM05AA provides just enough Cortex-A7 performance to drive a 7-inch to 10-inch capacitive-touch LCD via the LCDIF controller and run connected Wi-Fi/BLE app stacks. The dual Ethernet MAC supports wired cloud connectivity where Wi-Fi is unreliable (e.g., garage or basement installations), and the hardware crypto block secures MQTT-over-TLS to the manufacturer's cloud. The 289-ball MAPBGA package is small enough for a slimmer appliance control board, and the -40 to +105 °C rating survives laundry-room or kitchen-cabinet thermal stress. Typical application CPU load is well under 30%, leaving capacity for over-the-air (OTA) update management.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCIMX6G3DVM05AA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCIMX6G2DVM05AA | MCIMX6G3DVM05AB | MCIMX6G3CVM05AA | MCIMX6G3DVM07AA | MCIMX6Y2DVM05AA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 289-MAPBGA (14x14) | 289-MAPBGA (14x14) - same | 289-MAPBGA (14x14) - same | 289-MAPBGA (14x14) - same | 289-MAPBGA (14x14) - same | 289-MAPBGA (14x14) - same |
| Core / Max CPU Frequency | ARM Cortex-A7 / 528 MHz | Cortex-A7 / 528 MHz | Cortex-A7 / 528 MHz | Cortex-A7 / 528 MHz | Cortex-A7 / 696 MHz | Cortex-A7 / 528 MHz (6ULL) |
| Security Accelerators | AES/SHA/TRNG/HAB (G3) | Reduced (G2) | AES/SHA/TRNG/HAB (G3) | AES/SHA/TRNG/HAB (G3) | AES/SHA/TRNG/HAB (G3) | AES/SHA/TRNG/HAB (6ULL) |
| Operating Temperature | -40 to +105 C (industrial) | -40 to +105 C | -40 to +105 C | 0 to +70 C (commercial) | -40 to +105 C | -40 to +105 C |
| Memory Controller | 16-bit DDR3 / LPDDR2 | DDR3 / LPDDR2 | DDR3 / LPDDR2 | DDR3 / LPDDR2 | DDR3 / LPDDR2 | DDR3 / LPDDR2 / LPDDR4 (6ULL) |
| Lifecycle Status | Last Time Buy | Active | Last Time Buy | Last Time Buy | Last Time Buy | Active (recommended replacement) |
| Approx Unit Price (qty 1) | $16.85 | $14.50 (estimate) | $16.85 | $15.90 (estimate) | $18.50 (estimate) | $12.20 (estimate, active) |
Principais diferenciais
- Higher security accelerator tier than the G2 SKU (vs MCIMX6G2DVM05AA)
- Industrial temperature grade option at 528 MHz (vs MCIMX6G3CVM05AA)
- Active product lifecycle vs Last Time Buy (vs MCIMX6Y2DVM05AA)
Notas de projeto
The 289-ball MAPBGA with 0.8 mm pitch requires a minimum 6-layer PCB stack-up. Use microvia-in-pad for the BGA breakouts and matched-length routing (±25 mil) for the DDR3 byte lanes. Reference the NXP i.MX 6UL hardware design guide (document IMX6ULHDG) for the approved stack-up and routing topology. Power-plane islands for the core (VDD_SOC) and DDR (VDD_DDR) supplies must be solid under the package with stitched GND vias around the perimeter to minimize inductance.
Pair the MCIMX6G3DVM05AA with the NXP PF3001 PMIC for proper power-up sequencing. Discrete regulator solutions are possible but require careful sequencing logic to match the i.MX 6UL reset release timing. Core rail decoupling: 22 µF bulk + 0.1 µF high-frequency ceramic per the NXP reference schematic. Add a ferrite bead on the analog supply (VDDA) to isolate switching noise from the on-chip ADC. Cold-spare the PMIC's PWRON input to support software-controlled power cycling for OTA updates.
At 528 MHz CPU load with all peripherals active, the MCIMX6G3DVM05AA dissipates approximately 0.5 W to 1 W depending on workload. The 289-MAPBGA's exposed thermal pad requires stitching vias to the inner ground plane for heat extraction. For sealed enclosures with no airflow, derate the CPU clock or migrate to the i.MX 6ULL family which offers lower power at equivalent throughput. Always measure junction temperature on first prototypes with the on-chip thermal sensor rather than relying on ambient readings.
Critical pitfalls: (1) Forgetting to tie the BOOT_MODE[1:0] pins to the correct boot-source strapping (00 = internal boot from eFUSE, 01 = reserved, 10 = serial downloader, 11 = internal boot from fuses after serial download). (2) Connecting USB OTG VBUS without the required 5 V tolerant protection FET. (3) Omitting the 32.768 kHz RTC crystal load capacitors (typically 12 pF). (4) Routing the DDR3 address/control signals without matched-length tuning - the i.MX 6UL performs read/write leveling but tolerance is limited. Always validate boot from an empty eMMC/NAND before assuming the design is solid.
Route the CSI and LCDIF parallel data buses with controlled impedance (50 Ω single-ended) and length matching within 50 mils. Place the CSI sensor connector as close to the balls as possible to avoid coupling. Keep the SD card signals on the inner layers with ground shielding on both sides to suppress EMI from the high-speed DDR3 bus. The boot-mode strapping pins and JTAG chain should be brought out to a 0.1-inch header for manufacturing test access.
Informações de conformidade
RoHS and REACH compliant per NXP product page and verified DigiKey listing. Pb-free BGA finish with JEDEC J-STD-020 MSL-3 rating. AEC-Q100 not applicable - this is an application processor, not an automotive-qualified MCU. For automotive designs, NXP recommends the i.MX 6ULL automotive grade.
