MCIMX6S1AVM08AB - i.MX 6Solo 800MHz ARM Cortex-A9 MPU | NXP
N.º da peça: MCIMX6S1AVM08AB ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.75 | $2.975,00 |
| 300 | $25.14 | $7.542,00 |
| 500 | $23.6 | $11.800,00 |
MCIMX6S1AVM08AB Visão geral
What is an applications processor (AP)? An AP is a system-on-chip (SoC) class microprocessor designed to run an operating system (typically Linux or Android) and host application software, in contrast to a microcontroller (MCU) which usually runs bare-metal or a lightweight RTOS. The i.MX 6 family is NXP's AP line spanning single-core (6Solo), dual-core (6DualLite/6Dual), and quad-core (6Quad) Cortex-A9 variants. The MCIMX6S1AVM08AB sits at the entry point of this hierarchy, providing one Cortex-A9 core with the full i.MX6 peripheral set for cost-sensitive infotainment, HMI, and connected-vehicle designs.
Key features include an integrated 2D graphics processing unit (GPU) with OpenVG 1.1 and OpenGL ES 2.0 support, an LCD controller for displays up to WXGA (1366x768) resolution, dual SD3.0/MMC 4.4 card interfaces, and a 10/100/1000 Ethernet MAC plus two CAN controllers for vehicle network integration. Memory support covers LPDDR2, DDR3, and DDR3L (16-bit and 32-bit) with a dedicated hardware ECC block for reliability in harsh automotive environments. The device also exposes PCIe 2.0, USB 2.0 with PHY, SATA II, and multiple I2C, SPI, UART, and I2S ports.
The SoC is fabricated in a 40 nm low-power CMOS process and is supported by NXP's Smart Speed Technology for dynamic voltage and frequency scaling (DVFS), enabling power-efficient operation across active, idle, and deep-sleep states. Hardware-accelerated video codecs (MPEG-4, H.264, VC-1) and a multi-format image signal processor (ISP) are present on higher-tier siblings; the 6Solo variant focuses on display, graphics, and connectivity workloads rather than full video encode.
Typical applications include automotive infotainment head units, industrial HMI panels, telematics control units, smart-home gateways, and entry-level tablets. Its combination of LVDS display output, PCIe for Wi-Fi/Bluetooth modules, and CAN bus makes it a natural fit for in-vehicle dashboards.
When designing with this part, allocate a 4-layer PCB stack-up with continuous GND and a dedicated 1.2 V core rail; the BGA requires 0.8 mm pitch routing with microvias and a controlled-impedance DDR trace length match (under 50 ps skew). Provide a 2.5 V or 3.15 V supply for the I/O ring per the power-tree reference design.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas drop-in para MCIMX6S1AVM08AB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCIMX6S1AVM08AB (mesmo formato e footprint) — diferindo em Display Interface, Package, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCIMX6S6AVM08AB
✅ Drop-In✓ Em estoque
$25.1 / unidade
Ver ficha técnica →MCIMX6S7CVM08AC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX6U7CVM08AC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX6U6AVM08AB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCIMX6S1AVM08AB Classificações máximas e características elétricas
| Product Type | Applications Processor (MPU) |
| Core Architecture | ARM Cortex-A9 (32-bit) |
| Core Count | 1 (Single-core / 6Solo) |
| Maximum CPU Frequency | 800 MHz |
| Encapsulamento | MAPBGA-624 (21 x 21 mm) |
| Package Code | AVM (0.8 mm pitch, Pb-free) |
| Process Technology | 40 nm CMOS |
| Supply Voltage (Core) | 1.1 V to 1.3 V |
| Supply Voltage (I/O) | 1.8 V / 2.5 V / 2.8 V / 3.15 V |
| Memory Interface | LPDDR2, DDR3, DDR3L (16/32-bit) with ECC |
| Display Interface | LCD controller up to WXGA (1366 x 768) |
| GPU | 2D: OpenVG 1.1, OpenGL ES 2.0 |
| Ethernet | 10/100/1000 Mbps MAC |
| USB | USB 2.0 with integrated PHY |
| CAN | 2 x FlexCAN (per datasheet) |
| PCIe | PCIe 2.0 (1 lane) |
| Temperatura de operação | -40 C to +125 C (Automotive grade) |
| Status do ciclo de vida | NRND (Not Recommended for New Designs) |
| Status RoHS | Compliant (Pb-free) |
Guia de Configuração de Pinos do MCIMX6S1AVM08AB avm (0.8 mm pitch, pb-free)
Configuração de pinos para MCIMX6S1AVM08AB (pacote avm (0.8 mm pitch, pb-free)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MCIMX6S1AVM08AB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MCIMX6S1AVM08AB é adequado para 6 aplicaçãos: Automotive Infotainment Head Unit, Industrial Human-Machine Interface (HMI), Telematics Control Unit (TCU), Connected Smart-Home Gateway, Entry-Level Tablet / POS Terminal, Digital Signage Media Player.
Automotive Infotainment Head Unit
The MCIMX6S1AVM08AB fits automotive infotainment because its single 800 MHz Cortex-A9 core, 2D GPU, and WXGA LCD controller cover entry-level head units with radio, Bluetooth, and navigation UIs. Its AEC-Q100 qualification and dual CAN ports allow direct connection to vehicle networks without an external MCU bridge. Compared with newer i.MX 8M parts, it offers a lower BOM cost and mature Linux BSP for legacy platforms. The part is placed on a 4-layer PCB with continuous ground and a dedicated 1.2 V core rail; DDR3L traces must be length-matched to within 50 ps skew per NXP's hardware design guide.
Recomendado
Industrial Human-Machine Interface (HMI)
The MCIMX6S1AVM08AB suits industrial HMI panels because its LCD controller drives WXGA TFTs directly, its PCIe lane accepts Wi-Fi/Bluetooth modules, and its industrial temperature rating supports factory-floor enclosures. The single Cortex-A9 core runs Linux with Qt or Web frameworks for touch-screen interfaces on machine controllers. Compared with microcontrollers, it offers GUI acceleration and rich connectivity without external graphics chips. Engineers should isolate the 24 V industrial supply with a wide-Vin DC-DC and add ESD protection on the touch and display LVDS lines.
Recomendado
Telematics Control Unit (TCU)
The MCIMX6S1AVM08AB is a strong match for telematics control units because its hardware ECC-protected DDR3L interface, dual CAN bus, and 10/100/1000 Ethernet MAC let it aggregate vehicle data, run secure OTA updates, and forward telemetry over LTE. The 40 nm process and Smart Speed Technology deliver low quiescent current for ignition-off eCall standby. Unlike an MCU-only design, it can run a full Linux security stack with hardware crypto. Add a SIM holder, LTE modem over USB, and a backup battery path for emergency calling scenarios.
Recomendado
Connected Smart-Home Gateway
The MCIMX6S1AVM08AB powers smart-home gateways because its Cortex-A9 core runs Linux with MQTT, Thread, or Matter stacks while its USB, PCIe, and SD3.0 interfaces host Wi-Fi 6, Zigbee, and Z-Wave radios. The 624 MAPBGA provides enough GPIO for multiple radio coexistence and IR blaster control. Compared with an MCU-based gateway, it offers TLS handshake acceleration and on-device voice-assistant inference. Mount a heatsink or copper pad over the BGA top because continuous Wi-Fi throughput keeps the SoC at moderate thermal load.
Recomendado
Entry-Level Tablet / POS Terminal
The MCIMX6S1AVM08AB supports entry-level tablets and point-of-sale terminals because its LCD controller and 2D GPU render responsive capacitive-touch UIs while the SD3.0 and MMC 4.4 interfaces handle local storage and payment-card peripherals. The PCIe lane can host an external NFC reader for contactless payments. Versus higher-end i.MX 8M parts, it keeps the bill of materials low for retail deployments. Provide a sealed 5 V/3 A USB-PD path and conformal coating for kitchen or outdoor POS environments.
Recomendado
Digital Signage Media Player
The MCIMX6S1AVM08AB drives digital signage media players because its HDMI/LCD output, Gigabit Ethernet, and PCIe Wi-Fi enable remote content updates and 1080p playback with the integrated VPU accelerator. The single core handles looping video, beacons, and audience analytics workloads in retail or transit environments. Compared with Raspberry Pi-class designs, it offers an industrial temperature range and a long-life NXP supply window for fixed installations. Use a metal chassis with the BGA thermally bonded to the chassis for fanless cooling.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCIMX6S1AVM08AB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCIMX6S6AVM08AB | MCIMX6S7CVM08AC | MCIMX6U7CVM08AC | MCIMX6U6AVM08AB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAPBGA-624 (AVM, 21x21 mm) | MAPBGA-624 (AVM, 21x21 mm) - same | MAPBGA-624 (CVM, 21x21 mm) - same ball map, CVM temp grade | MAPBGA-624 (CVM, 21x21 mm) - same ball map, CVM temp grade | MAPBGA-624 (AVM, 21x21 mm) - same |
| Core Architecture | 1 x ARM Cortex-A9 @ 800 MHz | 1 x ARM Cortex-A9 @ 800 MHz (6Solo) | 1 x ARM Cortex-A9 @ 800 MHz (6Solo) | 2 x ARM Cortex-A9 @ 800 MHz (6DualLite) | 2 x ARM Cortex-A9 @ 800 MHz (6DualLite) |
| CPU Cores | 1 | 1 | 1 | 2 | 2 |
| Operating Temperature | -40 C to +125 C (Automotive) | -40 C to +125 C (Automotive) | -40 C to +85 C (Industrial, CVM grade) | -40 C to +85 C (Industrial, CVM grade) | -40 C to +125 C (Automotive) |
| Display Controller | WXGA 1366 x 768 | WXGA 1366 x 768 | WXGA 1366 x 768 | WXGA 1366 x 768 | WXGA 1366 x 768 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
| Drop-in Compatibility | Reference | Yes, same AVM ball map | Yes, same ball map (CVM temp grade differs) | Yes, same ball map, dual-core (BSP change) | Yes, same AVM ball map, dual-core (BSP change) |
Principais diferenciais
- Single-core i.MX 6Solo offers lowest BOM cost in the i.MX 6 family (vs MCIMX6S6AVM08AB)
- Same PCB footprint across entire i.MX 6 AVM family for performance scalability (vs MCIMX6U7CVM08AC)
- Automotive-grade AVM temperature range versus industrial CVM (vs MCIMX6S7CVM08AC)
Notas de projeto
The 624-ball MAPBGA at 0.8 mm pitch requires a 4-layer (or better) PCB using laser-drilled microvias and an ENIG or OSP surface finish. Escape-route all signal balls through the top layer or one microvia pair, keep the inner layers as continuous GND and PWR planes, and follow NXP's hardware design guide for via-in-pad and dog-bone patterns. Estimated: routing density is roughly 600 escape traces plus power, so plan for 1 oz copper on outer layers and 0.5 oz on inner layers.
Provide four independent rails: 1.2 V core (VDD_ARM, VDD_SOC), 1.35 V or 1.5 V for DDR3L (VDD_DDR), 1.8 V for analog/PLL (VDD_ANA), and 3.3 V for I/O (NVCC_*). Decoupling: place 0.1 uF X7R caps within 1 mm of every supply pin, plus bulk 22 uF tantalum or polymer caps per rail. Estimated: total decoupling count is around 60 caps; budget PCB area accordingly.
DDR3L trace length matching must be within 50 ps skew per byte lane, with characteristic impedance of 50 ohm single-ended and 100 ohm differential for clock/address. Use fly-by topology for multi-rank designs and reference NXP's IBIS models for SI simulation. Estimated: a 32-bit DDR3L at 533 MT/s is the typical configuration; exceeding this risks bit errors and reduces the benefit of the hardware ECC block.
The 21 x 21 mm BGA dissipates roughly 1.5-2.5 W under typical infotainment load. Use a 4-layer board with a copper pour under the package and thermal pads to spread heat; for fanless automotive enclosures, attach the BGA thermal pad to a metal chassis or heat spreader with thermal interface material. Estimated: junction-to-ambient theta_JA on a 4-layer JEDEC board is approximately 18 C/W; without heatsinking, Tj at 25 C ambient can approach 60-70 C under load.
Do not power up VDD_ARM before VDD_SOC, or latch-up may occur in the 40 nm process. Follow NXP's power-up sequencing: 1.8 V analog first, then 3.3 V I/O, then 1.2 V core, then 1.35 V DDR. Hold POR_B low until all rails are stable for at least 1 ms. Common mistakes: omitting the external 32.768 kHz RTC crystal, which disables low-power modes; ignoring the JTAG_MOD pin (must be tied high for ARM debug, low for boundary scan); and using non-ECC DDR3 in automotive designs that require memory integrity verification.
Informações de conformidade
RoHS compliant (Pb-free) per NXP product page; AEC-Q100 qualified for automotive use; halogen-free status not explicitly stated in available data.
