MPC563CZP40 - 32-bit PowerPC MCU 512KB Flash 40MHz BGA-388 | NXP
N.º da peça: MPC563CZP40 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $91.29 | $91,29 |
| 10 | $82.16 | $821,60 |
| 100 | $73.03 | $7.303,00 |
| 500 | $65 | $32.500,00 |
| 1.000 | $58.5 | $58.500,00 |
MPC563CZP40 Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/ROM and RAM), and a rich set of peripherals such as timers, ADC, communication controllers (CAN, SPI, SCI), and GPIO onto one die. Within the broader taxonomy, the MPC563 belongs to the PowerPC/e200 family -> 32-bit MCU -> microcontroller -> embedded processing -> semiconductor. The MPC5xx line was originally developed by Motorola and is now maintained by NXP (formerly Freescale) under the Qorivva branding.
Key features highlighted by the NXP product page include a high-speed 32-bit control unit, a common intermodule bus (IMB) that integrates standard on-chip modules, and 512 KB of embedded Flash suitable for both code and data storage. The C in the part number denotes the Flash-equipped, 40 temperature grade part; the ZP suffix indicates the 388-PBGA package. The device is qualified for -40/+85 degC automotive environments and supports an operating voltage range around 2.6V/5V, depending on peripheral supply configuration.
From an architectural standpoint, the MPC563 implements a RISC-style PowerPC core with peripheral pin multiplexing that allows flexible routing of timers, serial controllers, and other I/O to package pins. Code compression in Flash reduces the effective footprint for automotive calibration data, and the IM-bus architecture enables deterministic peripheral access for real-time control loops. Typical use cases include engine management, transmission control units, body control modules, and industrial drives that require deterministic 32-bit performance with automotive qualification.
When designing with this MCU, allow adequate PCB area for the 27x27 mm BGA fanout; a minimum of 4 routing layers plus dedicated power planes is recommended for signal integrity at 40 MHz system clocks. Decoupling must follow the manufacturer reference design with bulk, mid-frequency, and high-frequency capacitors placed close to each supply pin group.
This page synthesizes distributor pricing, lifecycle status, parametric alternatives, and practical design notes that complement the manufacturer datasheet and speed up engineering decisions for sourcing or replacement activities.
Alternativas drop-in para MPC563CZP40 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC563CZP40 (mesmo formato e footprint) — diferindo em Core Architecture, Package, Operating Temperature, Mounting Type, Automotive Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC563CVR40
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC565CZP40
✅ Drop-In✓ Em estoque
$52.1 / unidade
Ver ficha técnica →MPC533CVR40
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC563MZP56
✅ Drop-In✓ Em estoque
$17.95 / unidade
Ver ficha técnica →MPC564CZP40
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC563CZP40 Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) |
| Series | Qorivva MPC563 |
| Core Architecture | PowerPC MPC5xx / e200 RISC 32-bit |
| CPU Clock Speed (Max) | 40 MHz |
| Program Memory Size | 512 KB (512K x 8) Flash |
| Encapsulamento | 388-PBGA, 27x27 mm |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +85 C |
| Tensão de alimentação | 2.6 V / 5 V |
| Automotive Grade | Yes |
| Common Intermodule Bus (IMB) | Yes |
| Code Compression | Yes |
| Peripheral Pin Multiplexing | Yes |
| Status do ciclo de vida | End-of-Life (per NXP product page) |
Guia de Configuração de Pinos do MPC563CZP40 388-pbga, 27x27 mm
Configuração de pinos para MPC563CZP40 (pacote 388-pbga, 27x27 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC563CZP40.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC563CZP40 é adequado para 6 aplicaçãos: Engine Management ECU, Transmission Control Module, Body Control Module (BCM), Industrial Servo Drive, Chassis and Stability Control, Automotive Gateway / Network Bridge.
Engine Management ECU
The MPC563CZP40's 32-bit PowerPC core running at 40 MHz and 512 KB embedded Flash make it a strong fit for engine management ECUs that need deterministic closed-loop control of fuel injection, ignition timing, and air metering. The 388-PBGA package exposes enough I/O for multiple CAN channels, SCI links to the transmission, and a dedicated ADC bank for crank/cam position sensors. The -40 to +85 C operating range and automotive grade qualification satisfy underhood thermal and reliability requirements. Compared with a 16-bit MCU, the 32-bit path accelerates knock-detection DSP routines and OBD-II diagnostic services while keeping firmware in on-chip Flash to minimize external memory cost.
Recomendado
Transmission Control Module
The MPC563CZP40's IMB peripheral architecture supports deterministic timing for transmission solenoids, gear-position sensing, and torque management loops. Its 512 KB Flash stores shift maps and adaptive learning parameters, while the 388-PBGA fanout provides dedicated pins for multiple PWM channels and CAN-FD communication with the rest of the powertrain domain. The part's automotive qualification and -40 to +85 C range cover harsh underhood environments. Engineers value the code-compression feature, which effectively increases calibration data capacity within the same 512 KB Flash budget compared with earlier MPC5xx derivatives.
Recomendado
Body Control Module (BCM)
The MPC563CZP40 fits BCM designs that aggregate lighting, door, and HVAC LIN/CAN nodes because the 32-bit core delivers enough headroom for multiple communication stacks and PWM-driven LED matrices. The 388-PBGA package supports up to several dozen GPIOs for body-domain actuators, and the 512 KB Flash holds the network management and diagnostic firmware. Compared with smaller 8/16-bit BCUs, the MPC563's RISC architecture shortens LIN master scheduling latency and simplifies LIN/CAN gateway logic in one device.
Recomendado
Industrial Servo Drive
The MPC563CZP40's 40 MHz 32-bit PowerPC core provides deterministic loop times for industrial servo drives, while the 388-PBGA package offers PWM outputs, encoder interfaces, and CANopen or EtherCAT peripheral pins. The -40 to +85 C industrial-grade temperature range and on-chip Flash enable field firmware updates without external memory. Compared with general-purpose MCUs, the MPC563's IMB peripheral bus allows tight coupling between timers and ADC for current-loop control, reducing latency and improving torque-ripple performance.
Recomendado
Chassis and Stability Control
ABS and electronic stability control modules rely on fast, deterministic computation of wheel-speed and yaw-rate data, which the MPC563CZP40 delivers at 40 MHz with on-chip Flash for safety algorithms. The 388-PBGA package exposes enough pins for multi-channel PWM to valve drivers, dedicated timers for wheel-speed capture, and CAN-FD links to the vehicle network. The -40 to +85 C automotive qualification and built-in code compression support robust firmware deployment. Compared with 16-bit chassis MCUs, the 32-bit PowerPC core reduces sensor-fusion latency and improves ISO 26262 software partitioning.
Recomendado
Automotive Gateway / Network Bridge
The MPC563CZP40's multiple CAN controllers plus SCI/SPI peripherals allow it to act as a CAN-LIN gateway between powertrain and body domains. The 32-bit core handles message routing and protocol translation with predictable latency, and 512 KB Flash stores gateway routing tables and diagnostics. The 388-PBGA package supports dedicated pins for several CAN transceivers and a debug port. Compared with discrete bridges, integrating gateway logic in the MPC563 reduces BOM count, board area, and EMC complexity while maintaining automotive-grade reliability.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC563CZP40 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC563CVR40 | MPC565CZP40 | MPC533CVR40 | MPC563MZP56 | MPC564CZP40 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 388-PBGA (27x27) | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same |
| CPU Clock Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 56 MHz | 40 MHz |
| Flash Memory | 512 KB | 512 KB | Higher density (per family spec) | 512 KB | 512 KB | Higher density (per family spec) |
| Core Architecture | PowerPC e200 32-bit RISC | PowerPC e200 32-bit RISC | PowerPC e200 32-bit RISC | PowerPC MPC5xx 32-bit | PowerPC e200 32-bit RISC | PowerPC e200 32-bit RISC |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C (automotive) | -40 C to +85 C (per Utmel) | -40 C to +85 C (per ETEI) | -40 C to +85 C (per ETEI) |
| Automotive Grade | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Automotive-grade qualification on a mature PowerPC e200 core (vs MPC533CVR40)
- Higher CPU headroom available in same family (vs MPC563MZP56)
- Shared 388-PBGA footprint simplifies board reuse (vs MPC565CZP40)
Notas de projeto
The MPC563CZP40 uses a 388-ball PBGA on a 27x27 mm body, which demands a 4-layer minimum stack-up with continuous ground and power planes. Use 0.5 mm pitch via-in-pad microvias on the top layer to fan out the dense BGA grid, and stitch the inner ground plane around the BGA to control return paths for the 40 MHz system clock and CAN bus signals.
Decouple the MPC563CZP40 supplies with the manufacturer-referenced capacitor network: bulk electrolytic or polymer caps on the main 5V/2.6V rails plus 100 nF and 10 nF ceramics placed within 5 mm of each BGA supply ball group. The IMB peripherals can create instantaneous current spikes during timer/capture events, so localized decoupling is mandatory to keep Vdd ripple under 50 mV peak-to-peak.
At -40 to +85 C ambient automotive operation, derate the MPC563CZP40's quiescent and dynamic power carefully. Estimated: at 40 MHz with all peripherals active and 5V I/O supply, expect total power near 1 W; spread thermal mass across the BGA's inner-row ground balls and use thermal vias under the die shadow on the top-layer copper pour to keep junction temperature below 125 C.
Do not assume the MPC563CZP40 firmware is portable to MPC565CZP40 or MPC564CZP40 without peripheral remapping: although the 388-PBGA footprint is shared, the memory map, interrupt vector layout, and peripheral register set differ across the MPC5xx family. Validate vector table, Flash programming driver, and CAN filter configuration before declaring a 'drop-in' replacement in firmware terms.
Keep the analog supply (VDDA) and reference (VREF) traces short and isolated from digital switching returns. Route CAN bus signals as differential pairs with 120-ohm characteristic impedance, and place common-mode chokes within 10 mm of the transceiver. Avoid routing the external memory bus (if expanded) under the BGA's inner-row balls to prevent crosstalk into the address/data lines.
Informações de conformidade
Compliance fields not present in the verified web data; set to 'unknown' rather than guessed. The NXP product page indicates automotive grade but does not list RoHS/REACH/AEC-Q100 explicitly. Engineers should request the latest material declaration from NXP for regulatory submissions.
