최종 구매 공지: MPC563CZP40 단종에 가까워지고 있습니다. 최종 주문일: 문의하기. 사용 가능한 대체 부품 보기 →
NXP Semiconductors

MPC563CZP40 - 32-bit PowerPC MCU 512KB Flash 40MHz BGA-388 | NXP

부품 번호: MPC563CZP40 ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
2.6 V / 5 V Vdss 388-PBGA, 27x27 mm Package 40 MHz Speed 512 KB (512K x 8) Flash Memory
시작가 $58.5 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-17
볼륨 가격
수량 단가 합계
1 $91.29 $91.29
10 $82.16 $821.60
100 $73.03 $7,303.00
500 $65 $32,500.00
1,000 $58.5 $58,500.00
ℹ️ 모든 가격은 USD 기준입니다

MPC563CZP40 개요

The NXP MPC563CZP40 is a 32-bit PowerPC microcontroller built on the MPC5xx architecture, delivering 40 MHz CPU performance with 512 KB of on-chip Flash memory and packaged in a 388-ball Plastic BGA (27x27 mm) intended for automotive-grade applications. According to the NXP product information page, this MCU combines high-performance data manipulation capabilities with powerful peripheral subsystems targeting powertrain, chassis, and body-electronics domains.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/ROM and RAM), and a rich set of peripherals such as timers, ADC, communication controllers (CAN, SPI, SCI), and GPIO onto one die. Within the broader taxonomy, the MPC563 belongs to the PowerPC/e200 family -> 32-bit MCU -> microcontroller -> embedded processing -> semiconductor. The MPC5xx line was originally developed by Motorola and is now maintained by NXP (formerly Freescale) under the Qorivva branding.

Key features highlighted by the NXP product page include a high-speed 32-bit control unit, a common intermodule bus (IMB) that integrates standard on-chip modules, and 512 KB of embedded Flash suitable for both code and data storage. The C in the part number denotes the Flash-equipped, 40 temperature grade part; the ZP suffix indicates the 388-PBGA package. The device is qualified for -40/+85 degC automotive environments and supports an operating voltage range around 2.6V/5V, depending on peripheral supply configuration.

From an architectural standpoint, the MPC563 implements a RISC-style PowerPC core with peripheral pin multiplexing that allows flexible routing of timers, serial controllers, and other I/O to package pins. Code compression in Flash reduces the effective footprint for automotive calibration data, and the IM-bus architecture enables deterministic peripheral access for real-time control loops. Typical use cases include engine management, transmission control units, body control modules, and industrial drives that require deterministic 32-bit performance with automotive qualification.

When designing with this MCU, allow adequate PCB area for the 27x27 mm BGA fanout; a minimum of 4 routing layers plus dedicated power planes is recommended for signal integrity at 40 MHz system clocks. Decoupling must follow the manufacturer reference design with bulk, mid-frequency, and high-frequency capacitors placed close to each supply pin group.

This page synthesizes distributor pricing, lifecycle status, parametric alternatives, and practical design notes that complement the manufacturer datasheet and speed up engineering decisions for sourcing or replacement activities.

드롭인 대체품: MPC563CZP40 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MPC563CZP40 (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, Operating Temperature, Mounting Type, Automotive Grade.

NXP Semiconductors
Core Architecture: PowerPC MPC5xx RISC
Package: 388-PBGA (27x27 mm)
Operating Temperature: -40 C to +125 C
비교 대상: MPC563CZP40 →
NXP Semiconductors
Core Architecture: PowerPC MPC5xx (32-bit)
Package: 388-PBGA (27 x 27 mm)
Mounting Type: Surface Mount (BGA)
비교 대상: MPC563CZP40 →
NXP Semiconductors
Core Architecture: PowerPC MPC5xx (Power Architecture)
Package: 388-PBGA (27 x 27 mm)
Operating Temperature: -40C to +85C (automotive grade)
비교 대상: MPC563CZP40 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MPC563CVR40

✅ 드롭인
📦 388-PBGA (27x27)
same die/Flash/40 MHz, different shipping form (VR suffix typically indicates tape-and-reel vs ZP tray); pin-to-pin compatible 388-PBGA

📋 참조 대체품 (카탈로그에 없음)

MPC565CZP40

✅ 드롭인
NXP Semiconductors
📦 388-PBGA (27x27)
PowerPC MPC5xx (Power Architecture) · 32-bit PowerPC with integrated FPU · 40 MHz · 1 MB Flash (1M x 8) · Yes - IEEE-754 single and double precision · -40C to +85C (automotive grade)

✓ 재고 있음

$52.1 / 개

데이터시트 보기 →

MPC533CVR40

✅ 드롭인
📦 388-PBGA (27x27)
same 32-bit 40 MHz 512 KB Flash and 388-PBGA (27x27) per Utmel, but peripheral set belongs to MPC533 family; firmware/peripheral remapping required

📋 참조 대체품 (카탈로그에 없음)

MPC563MZP56

✅ 드롭인
NXP Semiconductors
📦 388-PBGA (27x27)
PowerPC MPC5xx (32-bit) · 56 MHz · 512 KB (512K x 8) · 36 KB · 5 V (typical) · 388-PBGA (27 x 27 mm) · Surface Mount (BGA)

✓ 재고 있음

$17.95 / 개

데이터시트 보기 →

MPC564CZP40

✅ 드롭인
📦 388-PBGA (27x27)
MPC564 family upgrade sharing the 388-PBGA footprint at 40 MHz per ETEI comparison; higher Flash and enhanced peripherals vs MPC563

📋 참조 대체품 (카탈로그에 없음)

MPC563CZP40 최대 정격 & 전기적 특성

Manufacturer NXP Semiconductors (formerly Freescale / Motorola)
Series Qorivva MPC563
Core Architecture PowerPC MPC5xx / e200 RISC 32-bit
CPU Clock Speed (Max) 40 MHz
Program Memory Size 512 KB (512K x 8) Flash
패키지 388-PBGA, 27x27 mm
실장 유형 Surface Mount
동작 온도 -40 C to +85 C
공급 전압 2.6 V / 5 V
Automotive Grade Yes
Common Intermodule Bus (IMB) Yes
Code Compression Yes
Peripheral Pin Multiplexing Yes
수명 주기 상태 End-of-Life (per NXP product page)

MPC563CZP40 388-pbga, 27x27 mm 핀 구성 가이드

MPC563CZP40(388-pbga, 27x27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

MPC563CZP40의 388-pbga, 27x27 mm 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: MPC563CZP40.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

MPC563CZP40 적합 용도: 6 애플리케이션s: Engine Management ECU, Transmission Control Module, Body Control Module (BCM), Industrial Servo Drive, Chassis and Stability Control, Automotive Gateway / Network Bridge.

🚗

Engine Management ECU

The MPC563CZP40's 32-bit PowerPC core running at 40 MHz and 512 KB embedded Flash make it a strong fit for engine management ECUs that need deterministic closed-loop control of fuel injection, ignition timing, and air metering. The 388-PBGA package exposes enough I/O for multiple CAN channels, SCI links to the transmission, and a dedicated ADC bank for crank/cam position sensors. The -40 to +85 C operating range and automotive grade qualification satisfy underhood thermal and reliability requirements. Compared with a 16-bit MCU, the 32-bit path accelerates knock-detection DSP routines and OBD-II diagnostic services while keeping firmware in on-chip Flash to minimize external memory cost.

🚗

Transmission Control Module

The MPC563CZP40's IMB peripheral architecture supports deterministic timing for transmission solenoids, gear-position sensing, and torque management loops. Its 512 KB Flash stores shift maps and adaptive learning parameters, while the 388-PBGA fanout provides dedicated pins for multiple PWM channels and CAN-FD communication with the rest of the powertrain domain. The part's automotive qualification and -40 to +85 C range cover harsh underhood environments. Engineers value the code-compression feature, which effectively increases calibration data capacity within the same 512 KB Flash budget compared with earlier MPC5xx derivatives.

🏭

Body Control Module (BCM)

The MPC563CZP40 fits BCM designs that aggregate lighting, door, and HVAC LIN/CAN nodes because the 32-bit core delivers enough headroom for multiple communication stacks and PWM-driven LED matrices. The 388-PBGA package supports up to several dozen GPIOs for body-domain actuators, and the 512 KB Flash holds the network management and diagnostic firmware. Compared with smaller 8/16-bit BCUs, the MPC563's RISC architecture shortens LIN master scheduling latency and simplifies LIN/CAN gateway logic in one device.

🏭

Industrial Servo Drive

The MPC563CZP40's 40 MHz 32-bit PowerPC core provides deterministic loop times for industrial servo drives, while the 388-PBGA package offers PWM outputs, encoder interfaces, and CANopen or EtherCAT peripheral pins. The -40 to +85 C industrial-grade temperature range and on-chip Flash enable field firmware updates without external memory. Compared with general-purpose MCUs, the MPC563's IMB peripheral bus allows tight coupling between timers and ADC for current-loop control, reducing latency and improving torque-ripple performance.

🚗

Chassis and Stability Control

ABS and electronic stability control modules rely on fast, deterministic computation of wheel-speed and yaw-rate data, which the MPC563CZP40 delivers at 40 MHz with on-chip Flash for safety algorithms. The 388-PBGA package exposes enough pins for multi-channel PWM to valve drivers, dedicated timers for wheel-speed capture, and CAN-FD links to the vehicle network. The -40 to +85 C automotive qualification and built-in code compression support robust firmware deployment. Compared with 16-bit chassis MCUs, the 32-bit PowerPC core reduces sensor-fusion latency and improves ISO 26262 software partitioning.

🌐

Automotive Gateway / Network Bridge

The MPC563CZP40's multiple CAN controllers plus SCI/SPI peripherals allow it to act as a CAN-LIN gateway between powertrain and body domains. The 32-bit core handles message routing and protocol translation with predictable latency, and 512 KB Flash stores gateway routing tables and diagnostics. The 388-PBGA package supports dedicated pins for several CAN transceivers and a debug port. Compared with discrete bridges, integrating gateway logic in the MPC563 reduces BOM count, board area, and EMC complexity while maintaining automotive-grade reliability.

추천 제품 요약

MPC563CVR40 Same-die tape-and-reel sibling 사용처: Engine Management ECU, Transmission Control Module, Chassis and Stability Control MPC565CZP40 NXP Semiconductors 사용처: Engine Management ECU, Body Control Module (BCM), Chassis and Stability Control MPC563MZP56 NXP Semiconductors 사용처: Engine Management ECU, Industrial Servo Drive MPC564CZP40 Higher integration for next-gen TCM 사용처: Transmission Control Module, Industrial Servo Drive, Automotive Gateway / Network Bridge MPC533CVR40 Compatible-footprint alternate 사용처: Body Control Module (BCM), Automotive Gateway / Network Bridge
What is the core architecture of the MPC563CZP40?
The MPC563CZP40 is built on the PowerPC MPC5xx / e200 32-bit RISC architecture, originally designed by Motorola and now supported by NXP under the Qorivva family. According to the NXP product page, this core combines high-performance data manipulation with powerful peripheral subsystems through a common intermodule bus (IMB), making it suitable for real-time automotive control.
How much Flash memory does the MPC563CZP40 contain?
The MPC563CZP40 contains 512 KB (512K x 8) of on-chip Flash memory used for both program code and data. DigiKey lists this as 512KB FLASH for the MPC563CZP40 entry, confirming the device integrates non-volatile storage directly on die to simplify automotive ECU design and reduce external memory cost.
What is the maximum CPU clock frequency of the MPC563CZP40?
The MPC563CZP40 runs up to 40 MHz CPU clock as indicated by the part suffix '40' and DigiKey's listing of 40 MHz. This frequency is sufficient for powertrain and chassis control loops requiring deterministic 32-bit performance, while keeping power consumption within automotive thermal envelopes.
What package does the MPC563CZP40 use?
The MPC563CZP40 uses a 388-ball Plastic BGA (PBGA) measuring 27x27 mm, as confirmed by DigiKey (388-PBGA (27x27)) and Mouser listings. This large BGA footprint provides ample I/O for automotive ECU peripherals such as CAN, SPI, SCI, timers, and ADC, but requires multi-layer PCB fanout.
Is the MPC563CZP40 still in production?
The NXP product page for MPC563CZP40 explicitly lists 'End of Life Overview' alongside operating features, indicating the part is in EOL status. Engineers should plan migration to active Qorivva successors or consult the NXP Cross Reference tool for replacement options. Distributors may still hold inventory for existing designs.
What is the operating temperature range of the MPC563CZP40?
The MPC563CZP40 is rated for -40 C to +85 C operation, qualifying it for automotive underhood and cabin environments. This temperature grade is explicitly listed in distributor descriptions (e.g., digchip.com 'Automotive Grade, -40/+85 degC'), confirming suitability for engine management and chassis ECUs.
Where can I buy the MPC563CZP40?
The MPC563CZP40 is currently available through authorized distributors including DigiKey, Mouser, Heisener, Xecor, and Win Source. Heisener lists 4,224 pieces in stock at approximately USD 91.29 unit price (as of 2026-10-17). Because the NXP product page marks the part as EOL, distributors may have remaining stock for service and maintenance designs.
What is the lead time for the MPC563CZP40?
Heisener reports 'Can Ship Immediately' with an estimated delivery window of Oct 19 to Oct 24 for the MPC563CZP40 (as of 2026-10-17). Lead times for EOL automotive MCUs can extend quickly as distributor inventory depletes, so designers should confirm stock and qualify alternates concurrently.
What is the price of the MPC563CZP40?
The MPC563CZP40 lists at approximately USD 91.29 per unit at qty 1 on Heisener (as of 2026-10-17). Volume pricing tiers on this product page are estimated at 1 / 10 / 100 / 500 / 1000 pieces based on observed distributor pricing patterns for legacy automotive MCUs in BGA-388 packages.
What is the difference between MPC563CZP40 and MPC563CVR40?
The MPC563CVR40 typically denotes the same MPC563 die in a different package suffix (often a tape-and-reel or alternate BGA variant) compared with the CZP40 (PBGA-388 tray). Both share the same 32-bit PowerPC core, 512 KB Flash, and 40 MHz speed; they differ in mechanical packaging and shipping form factor only.
What is the difference between MPC563CZP40 and MPC565CZP40?
The MPC565CZP40 upgrades the Flash density, peripheral count, and integration compared with the MPC563CZP40, while sharing the same 40 MHz PowerPC core and 388-PBGA package. Per Utmel comparison data, both parts share the same footprint, but the MPC565 offers additional peripherals and memory for more demanding powertrain applications.
Can the MPC563CZP40 be replaced by an MPC533CVR40?
The MPC533CVR40 shares the 32-bit 40 MHz 512 KB Flash and 388-PBGA (27x27) form factor with the MPC563CZP40, according to Utmel comparison data, but the MPC533 belongs to a different peripheral generation. Engineers should verify the on-chip peripheral set (CAN, ADC, timers) before using it as a true drop-in replacement.
When should I choose MPC563CZP40 over a newer Qorivva MCU?
Choose the MPC563CZP40 when maintaining existing automotive ECU designs with mature firmware, when qualification cycles prevent redesign, or when long-term service inventory must be replenished. For new designs, NXP recommends migrating to active Qorivva successors; the EOL notice signals eventual stock exhaustion.
Where to download the MPC563CZP40 datasheet PDF?
The MPC563CZP40 datasheet is available through the NXP product page at https://www.nxp.com/part/MPC563CZP40 and via legacy archives on alldatasheet.com (163 KB, 12-page legacy revision). For authoritative specifications always consult the manufacturer document, which describes the e200 core, memory map, and peripheral configuration in detail.
Where can I find the pinout for the MPC563CZP40?
The pinout for the MPC563CZP40 388-PBGA package is published in the manufacturer datasheet referenced from the NXP product page and on alldatasheet.com. Because the package has 388 balls, the datasheet pin map is large; engineers should also reference NXP's BGA layout guidelines for proper fanout, power/ground plane assignment, and decoupling strategy.

엔지니어링 참조 데이터: MPC563CZP40 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MPC563CZP40 when you are maintaining an existing automotive ECU design that was originally qualified around a 32-bit PowerPC core at 40 MHz with 512 KB Flash and a 388-PBGA footprint. It is the right fit for engine management, transmission, body, and chassis modules that need automotive-grade qualification and code compression in a familiar footprint. Choose the MPC563CVR40 if you need the same die in tape-and-reel packaging for high-volume assembly. Choose the MPC563MZP56 if you want extra CPU headroom (56 MHz) in the same package, accepting higher power. Choose the MPC565CZP40 or MPC564CZP40 when additional Flash and peripherals are needed without re-laying-out the board. Choose the MPC533CVR40 only as a last-resort alternate, because the peripheral set differs and firmware must be re-validated.

대체품과의 비교

파라미터 이 제품 MPC563CVR40 MPC565CZP40 MPC533CVR40 MPC563MZP56 MPC564CZP40
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 388-PBGA (27x27) 388-PBGA (27x27) - same 388-PBGA (27x27) - same 388-PBGA (27x27) - same 388-PBGA (27x27) - same 388-PBGA (27x27) - same
CPU Clock Speed 40 MHz 40 MHz 40 MHz 40 MHz 56 MHz 40 MHz
Flash Memory 512 KB 512 KB Higher density (per family spec) 512 KB 512 KB Higher density (per family spec)
Core Architecture PowerPC e200 32-bit RISC PowerPC e200 32-bit RISC PowerPC e200 32-bit RISC PowerPC MPC5xx 32-bit PowerPC e200 32-bit RISC PowerPC e200 32-bit RISC
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C (automotive) -40 C to +85 C (per Utmel) -40 C to +85 C (per ETEI) -40 C to +85 C (per ETEI)
Automotive Grade Yes Yes Yes Yes Yes Yes

주요 차별점

  • Automotive-grade qualification on a mature PowerPC e200 core (vs MPC533CVR40)
  • Higher CPU headroom available in same family (vs MPC563MZP56)
  • Shared 388-PBGA footprint simplifies board reuse (vs MPC565CZP40)

설계 노트

The MPC563CZP40 uses a 388-ball PBGA on a 27x27 mm body, which demands a 4-layer minimum stack-up with continuous ground and power planes. Use 0.5 mm pitch via-in-pad microvias on the top layer to fan out the dense BGA grid, and stitch the inner ground plane around the BGA to control return paths for the 40 MHz system clock and CAN bus signals.

Decouple the MPC563CZP40 supplies with the manufacturer-referenced capacitor network: bulk electrolytic or polymer caps on the main 5V/2.6V rails plus 100 nF and 10 nF ceramics placed within 5 mm of each BGA supply ball group. The IMB peripherals can create instantaneous current spikes during timer/capture events, so localized decoupling is mandatory to keep Vdd ripple under 50 mV peak-to-peak.

At -40 to +85 C ambient automotive operation, derate the MPC563CZP40's quiescent and dynamic power carefully. Estimated: at 40 MHz with all peripherals active and 5V I/O supply, expect total power near 1 W; spread thermal mass across the BGA's inner-row ground balls and use thermal vias under the die shadow on the top-layer copper pour to keep junction temperature below 125 C.

Do not assume the MPC563CZP40 firmware is portable to MPC565CZP40 or MPC564CZP40 without peripheral remapping: although the 388-PBGA footprint is shared, the memory map, interrupt vector layout, and peripheral register set differ across the MPC5xx family. Validate vector table, Flash programming driver, and CAN filter configuration before declaring a 'drop-in' replacement in firmware terms.

Keep the analog supply (VDDA) and reference (VREF) traces short and isolated from digital switching returns. Route CAN bus signals as differential pairs with 120-ohm characteristic impedance, and place common-mode chokes within 10 mm of the transceiver. Avoid routing the external memory bus (if expanded) under the BGA's inner-row balls to prevent crosstalk into the address/data lines.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

Compliance fields not present in the verified web data; set to 'unknown' rather than guessed. The NXP product page indicates automotive grade but does not list RoHS/REACH/AEC-Q100 explicitly. Engineers should request the latest material declaration from NXP for regulatory submissions.

데이터 검증일: 2026-10-17 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MPC563CZP40 datasheet MPC563CZP40 price MPC563CZP40 in stock NXP MPC563CZP40 automotive MCU MPC563CZP40 388 PBGA 40MHz MPC563CZP40 vs MPC565CZP40 MPC563CZP40 drop-in replacement MPC563CZP40 pinout BGA Qorivva MPC563 512KB flash MPC563CZP40 engine control ECU buy MPC563CZP40 online MPC563CZP40 EOL replacement MPC5xx microcontroller 32-bit 40MHz BGA-388 MPC563CZP40 lead time 2026

관련 부품 & 용어

NXP Semiconductors Freescale Semiconductor Motorola MPC563CZP40 MPC563CVR40 MPC565CZP40 MPC533CVR40 MPC563MZP56 MPC564CZP40 Qorivva PowerPC e200 MPC5xx 32-bit microcontroller 388-PBGA BGA-388 (27x27) Flash memory 512KB automotive grade AEC-Q100 RoHS REACH engine management ECU transmission control module body control module chassis control CAN bus
빠른 견적 RFQ
상세 정보를 모두 입력하십시오 — 영업팀이 24시간 이내에 답변드립니다
부품 번호 제조사 패키지 QTY 목표 가격 합계
합계: $0.00 USD
✓
견적이 제출되었습니다!

24시간 이내에 이메일로 답변드리겠습니다

1
RFQ 제출됨
2
견적 접수됨
3
주문 완료
4
결제
5
배송됨
6
배송 완료
RFQ 상세 보기