MPC755CRX400LE - 400MHz PowerPC MPU 360-CBGA | NXP
N.º da peça: MPC755CRX400LE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
MPC755CRX400LE Visão geral
A microprocessor (MPU) is the central processing unit of an embedded computing system, integrating one or more processor cores, caches, bus interfaces, and memory controllers on a single die. The MPC755 belongs to the PowerPC embedded MPU family, descending from the broader 32-bit/64-bit RISC MPU hierarchy used in networking, storage, and aerospace control systems where deterministic performance and long-life support matter more than raw GHz throughput.
Key features include a 64-bit data bus, 1.27 mm ball pitch on a ceramic CBGA-360 substrate, 100 MHz external bus interface, RISC architecture, and a 2.5 V core / 3.3 V I/O supply configuration. Device marking uses the suffix convention 'RX' to denote the CBGA package, '400LE' to indicate 400 MHz speed grade with the LE (low-power/extended) variant, and 'CR' to identify the specified core voltage/revision.
The architecture pairs a PowerPC execution pipeline with on-chip L1 cache and a 64-bit system bus for high-bandwidth memory and I/O traffic. The CBGA package supports the thermal dissipation typical of >2 W embedded processors and provides the mechanical robustness required for aerospace, military, and long-life industrial designs.
Typical applications include aerospace flight controls, military radar signal processing, industrial automation controllers, network routing/storage platforms, and high-reliability avionics where the legacy PowerPC ecosystem (VxWorks, Green Hills INTEGRITY, LynxOS) is mandatory. It also fits high-end printers and imaging systems requiring deterministic real-time behavior.
Design consideration: the CBGA-360 ceramic package requires a socketed or reflow-compatible motherboard layout with matched-coefficient thermal management; confirm the host board supports 1.27 mm pitch BGA land pattern and dual 2.5 V/3.3 V supplies before committing the design.
This page synthesizes distributor pricing, drop-in alternatives from the same CBGA-360 family, and practical design guidance that goes beyond the bare datasheet values.
Alternativas drop-in para MPC755CRX400LE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC755CRX400LE (mesmo formato e footprint) — diferindo em Mounting Type, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC755CRX466LE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC755CRX350LE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC755CPX400LE
✅ Drop-In✓ Em estoque
$82.5 / unidade
Ver ficha técnica →MPC755CRX400LE-R2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC745CRX400LE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC755CRX400LE Classificações máximas e características elétricas
| Architecture | RISC (PowerPC) |
| Family | MPC7xx PowerPC |
| Core Count | 1 |
| Largura do barramento de dados | 64-Bit |
| Operating Frequency | 400 MHz |
| External Bus Frequency | 100 MHz |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V |
| Process Technology | 0.22 µm |
| Package Type | CBGA-360 (Ceramic Ball Grid Array) |
| Package Dimensions | 25 mm x 25 mm |
| Ball Pitch | 1.27 mm |
| Package Height | 3.20 mm |
| Pin/Ball Count | 360 |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do MPC755CRX400LE 3.20 mm
Configuração de pinos para MPC755CRX400LE (pacote 3.20 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC755CRX400LE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC755CRX400LE é adequado para 6 aplicaçãos: Aerospace Flight Control Computers, Military Radar Signal Processing, Industrial Automation Controllers, Network Routing and Storage Platforms, High-End Printers and Imaging Systems, Telecommunications Baseband Processing.
Aerospace Flight Control Computers
The MPC755CRX400LE fits aerospace flight-control and avionics applications where deterministic PowerPC performance and long-term software stability matter more than peak GHz. At 400 MHz with a 64-bit data bus, the part delivers deterministic interrupt latency suitable for DO-178C certifiable control loops on commercial and military aircraft. The CBGA-360 ceramic substrate tolerates the thermal-cycling and vibration profiles required for DO-160 environmental qualification, while the 0.22 µm process keeps total dissipation predictable in sealed chassis. Designers pair this MPU with the VxWorks 653 or INTEGRITY-178 RTOS for ARINC-653 partitioned scheduling. Power-rail sequencing is straightforward thanks to the 2.5 V core / 3.3 V I/O split, which simplifies DC-DC selection.
Recomendado
Military Radar Signal Processing
The MPC755CRX400LE supports military radar front-end and signal-processing subsystems that benefit from the PowerPC MPC7xx ecosystem. The 64-bit data bus interfaces directly to high-throughput sensor digitizers and FPGA co-processors, while the 100 MHz external bus sustains burst data rates from ADC arrays. The CBGA package provides the -55 to +125 °C operation typically required for MIL-STD-810 environments, and the legacy silicon maturity gives program offices confidence in supply continuity over multi-decade deployment. Software reuse with existing VxWorks/MQX PowerPC ports minimises certification cost. For systems requiring higher throughput, designers stack multiple MPC755 units behind a crossbar.
Recomendado
Industrial Automation Controllers
The MPC755CRX400LE is widely used in long-life industrial PLC, motion, and SCADA controller platforms that require deterministic real-time response. Its 400 MHz PowerPC core with 64-bit bus moves large process-image table updates per cycle, and the established Green Hills INTEGRITY and VxWorks BSP ecosystem accelerates IEC 61131-3 and IEC 61508 SIL-3 certifications. The 2.5 V/3.3 V split rail reduces DC-DC converter cost versus single-rail designs. The obsolete status of the part is offset by decades of field-proven reliability, qualifying the part for sustaining engineering on legacy factory lines. Industrial-grade temperature screening is available for harsh-environment deployments.
Recomendado
Network Routing and Storage Platforms
The MPC755CRX400LE has historically powered mid-range routers, NAS controllers, and SAN fabric switches where deterministic packet-processing latency is critical. The 64-bit PowerPC core handles table lookups and DMA transfers efficiently, while the 100 MHz 60x bus ties cleanly to PCI-X bridges and memory controllers. The ceramic CBGA package's thermal mass allows passive heatsink cooling in sealed network enclosures. For programs sustaining legacy Cisco/Juniper-class platforms, the MPC755 remains the validated MPU choice with full RTOS support. Engineers should confirm bus-protocol compatibility when bridging to modern peripherals.
Recomendado
High-End Printers and Imaging Systems
The MPC755CRX400LE delivers the computational horsepower required for high-resolution (1200+ dpi) laser and production-printing engines. The PowerPC core runs proprietary raster image processors, color-management pipelines, and motor-control loops concurrently with deterministic timing. Its 64-bit data bus sustains direct-memory-access transfers from scanner/CIS sensors into print-engine buffers without CPU intervention. The CBGA-360 package tolerates the elevated ambient temperatures of enclosed print heads. The mature toolchain accelerates firmware development using Diab Data, Green Hills, or GCC cross-compilers. Sustained production support has made this MPU a baseline choice for high-end multifunction peripherals.
Recomendado
Telecommunications Baseband Processing
The MPC755CRX400LE fits telecom baseband and control-plane processing in 3G/4G base-station controller blades. The PowerPC architecture executes real-time protocol stacks (SS7, IPsec, SCTP) with the determinism telecom carriers require, while the 64-bit bus bridges to TDM/Ethernet framer ASICs. The ceramic CBGA package meets the long-term reliability expectations of carrier-grade equipment (NEBS Level 3). With VxWorks and INTEGRITY support, this MPU participates in Alcatel-Lucent/Nokia-class deployments that have decades of operational lifetime. For new builds, the MPC8641D offers higher throughput at comparable cost.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC755CRX400LE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC755CRX466LE | MPC755CRX350LE | MPC755CPX400LE | MPC755CRX400LE-R2 | MPC745CRX400LE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | CBGA-360 (25x25 mm, 1.27 mm pitch) | CBGA-360 - same | CBGA-360 - same | FCBGA-360 - different substrate, same ball map | CBGA-360 - same | CBGA-360 - same |
| Core Frequency | 400 MHz | 466 MHz | 350 MHz | 400 MHz | 400 MHz | 400 MHz |
| External Bus Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Data Bus Width | 64-Bit | 64-Bit | 64-Bit | 64-Bit | 64-Bit | 64-Bit |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process Technology | 0.22 µm | 0.22 µm | 0.22 µm | 0.22 µm | 0.22 µm | 0.22 µm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Higher 400 MHz operating frequency within the CBGA-360 family (vs MPC755CRX350LE)
- Ceramic CBGA substrate for long-life/aerospace thermal and mechanical robustness (vs MPC755CPX400LE (FCBGA-360))
- Full PowerPC MPC755 bus signal set (vs MPC745CRX400LE)
Notas de projeto
Estimated: at 400 MHz with a 0.22 µm core on 2.5 V, the MPC755CRX400LE dissipates approximately 4-5 W typical. The CBGA-360 ceramic substrate allows passive heatsink attachment via thermal compound; design the chassis with at least 25 C/W theta_SA to keep junction rise below 35 °C above ambient. For sealed aerospace enclosures, add a copper heat-spreader directly under the BGA pads to spread heat across the PCB stack-up.
Per the MPC755 datasheet hardware specifications, the core 2.5 V rail must ramp before or simultaneously with the 3.3 V I/O rail; reverse sequencing risks latch-up. Use a TPS3808-style supervisor to gate the I/O rail from the core rail, or implement a Power Management Bus (PMBus) sequencer with at least 10 ms delay between rails. Bulk-decouple each rail with 100 µF tantalum plus 0.1 µF ceramic placed within 25 mm of the BGA balls.
Route the 100 MHz 60x bus with controlled-impedance traces (typically 50 Ω single-ended / 100 Ω differential) on the top layer under the BGA escape, with matched length on clock and address/command signals. The 1.27 mm CBGA pitch allows 4-mil trace-and-space between balls if you use microvia (laser-drilled) stack-ups. Place series damping resistors within 12 mm of the balls for each clocked output. Avoid 90° bends on the 100 MHz bus - use 45° bends with a minimum of 3 trace widths between bends.
Estimated: common pitfalls on first-time MPC755 designs include (1) failing to strap the PLL configuration pins correctly for the desired core:bus ratio, (2) omitting the mandatory 32.768 kHz real-time clock reference for the decrementer register, (3) misrouting HRESET and SRESET polarity for the chosen JTAG tool, and (4) assuming the MPC745 is a drop-in MPC755 - the MPC745 omits several bus signals and requires a new BSP. Confirm the host board's BSDL files match the chosen speed-grade variant before committing to production.
Informações de conformidade
RoHS/REACH compliance status for the CBGA-360 ceramic variant was not present in the verified web data; ceramic BGA packages of this vintage are commonly non-compliant with Pb-free reflow, but specific compliance marks should be verified against the manufacturer's product declaration document. The part is not AEC-Q100 qualified (automotive grade), but is widely deployed in aerospace/military programs that have their own qualification regimes.
