MPC755CRX400LE - 400MHz PowerPC MPU 360-CBGA | NXP
部品番号: MPC755CRX400LE ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
MPC755CRX400LE 概要
A microprocessor (MPU) is the central processing unit of an embedded computing system, integrating one or more processor cores, caches, bus interfaces, and memory controllers on a single die. The MPC755 belongs to the PowerPC embedded MPU family, descending from the broader 32-bit/64-bit RISC MPU hierarchy used in networking, storage, and aerospace control systems where deterministic performance and long-life support matter more than raw GHz throughput.
Key features include a 64-bit data bus, 1.27 mm ball pitch on a ceramic CBGA-360 substrate, 100 MHz external bus interface, RISC architecture, and a 2.5 V core / 3.3 V I/O supply configuration. Device marking uses the suffix convention 'RX' to denote the CBGA package, '400LE' to indicate 400 MHz speed grade with the LE (low-power/extended) variant, and 'CR' to identify the specified core voltage/revision.
The architecture pairs a PowerPC execution pipeline with on-chip L1 cache and a 64-bit system bus for high-bandwidth memory and I/O traffic. The CBGA package supports the thermal dissipation typical of >2 W embedded processors and provides the mechanical robustness required for aerospace, military, and long-life industrial designs.
Typical applications include aerospace flight controls, military radar signal processing, industrial automation controllers, network routing/storage platforms, and high-reliability avionics where the legacy PowerPC ecosystem (VxWorks, Green Hills INTEGRITY, LynxOS) is mandatory. It also fits high-end printers and imaging systems requiring deterministic real-time behavior.
Design consideration: the CBGA-360 ceramic package requires a socketed or reflow-compatible motherboard layout with matched-coefficient thermal management; confirm the host board supports 1.27 mm pitch BGA land pattern and dual 2.5 V/3.3 V supplies before committing the design.
This page synthesizes distributor pricing, drop-in alternatives from the same CBGA-360 family, and practical design guidance that goes beyond the bare datasheet values.
ドロップイン代替品: MPC755CRX400LE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC755CRX400LE （同一形状・フットプリント） — 相違点: Mounting Type, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
MPC755CRX466LE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC755CRX350LE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC755CPX400LE
✅ ドロップイン✓ 在庫あり
$82.5 / 個
データシートを見る →MPC755CRX400LE-R2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC745CRX400LE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC755CRX400LE 最大定格＆電気的特性
| Architecture | RISC (PowerPC) |
| Family | MPC7xx PowerPC |
| Core Count | 1 |
| データバス幅 | 64-Bit |
| Operating Frequency | 400 MHz |
| External Bus Frequency | 100 MHz |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V |
| Process Technology | 0.22 µm |
| Package Type | CBGA-360 (Ceramic Ball Grid Array) |
| Package Dimensions | 25 mm x 25 mm |
| Ball Pitch | 1.27 mm |
| Package Height | 3.20 mm |
| Pin/Ball Count | 360 |
| 実装タイプ | Surface Mount |
MPC755CRX400LE 3.20 mm ピン配置ガイド
MPC755CRX400LE (3.20 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC755CRX400LE.
詳細は データシート をご参照ください。
主な用途
MPC755CRX400LE の用途: 6 件s: Aerospace Flight Control Computers, Military Radar Signal Processing, Industrial Automation Controllers, Network Routing and Storage Platforms, High-End Printers and Imaging Systems, Telecommunications Baseband Processing.
Aerospace Flight Control Computers
The MPC755CRX400LE fits aerospace flight-control and avionics applications where deterministic PowerPC performance and long-term software stability matter more than peak GHz. At 400 MHz with a 64-bit data bus, the part delivers deterministic interrupt latency suitable for DO-178C certifiable control loops on commercial and military aircraft. The CBGA-360 ceramic substrate tolerates the thermal-cycling and vibration profiles required for DO-160 environmental qualification, while the 0.22 µm process keeps total dissipation predictable in sealed chassis. Designers pair this MPU with the VxWorks 653 or INTEGRITY-178 RTOS for ARINC-653 partitioned scheduling. Power-rail sequencing is straightforward thanks to the 2.5 V core / 3.3 V I/O split, which simplifies DC-DC selection.
おすすめ
Military Radar Signal Processing
The MPC755CRX400LE supports military radar front-end and signal-processing subsystems that benefit from the PowerPC MPC7xx ecosystem. The 64-bit data bus interfaces directly to high-throughput sensor digitizers and FPGA co-processors, while the 100 MHz external bus sustains burst data rates from ADC arrays. The CBGA package provides the -55 to +125 °C operation typically required for MIL-STD-810 environments, and the legacy silicon maturity gives program offices confidence in supply continuity over multi-decade deployment. Software reuse with existing VxWorks/MQX PowerPC ports minimises certification cost. For systems requiring higher throughput, designers stack multiple MPC755 units behind a crossbar.
おすすめ
Industrial Automation Controllers
The MPC755CRX400LE is widely used in long-life industrial PLC, motion, and SCADA controller platforms that require deterministic real-time response. Its 400 MHz PowerPC core with 64-bit bus moves large process-image table updates per cycle, and the established Green Hills INTEGRITY and VxWorks BSP ecosystem accelerates IEC 61131-3 and IEC 61508 SIL-3 certifications. The 2.5 V/3.3 V split rail reduces DC-DC converter cost versus single-rail designs. The obsolete status of the part is offset by decades of field-proven reliability, qualifying the part for sustaining engineering on legacy factory lines. Industrial-grade temperature screening is available for harsh-environment deployments.
おすすめ
Network Routing and Storage Platforms
The MPC755CRX400LE has historically powered mid-range routers, NAS controllers, and SAN fabric switches where deterministic packet-processing latency is critical. The 64-bit PowerPC core handles table lookups and DMA transfers efficiently, while the 100 MHz 60x bus ties cleanly to PCI-X bridges and memory controllers. The ceramic CBGA package's thermal mass allows passive heatsink cooling in sealed network enclosures. For programs sustaining legacy Cisco/Juniper-class platforms, the MPC755 remains the validated MPU choice with full RTOS support. Engineers should confirm bus-protocol compatibility when bridging to modern peripherals.
おすすめ
High-End Printers and Imaging Systems
The MPC755CRX400LE delivers the computational horsepower required for high-resolution (1200+ dpi) laser and production-printing engines. The PowerPC core runs proprietary raster image processors, color-management pipelines, and motor-control loops concurrently with deterministic timing. Its 64-bit data bus sustains direct-memory-access transfers from scanner/CIS sensors into print-engine buffers without CPU intervention. The CBGA-360 package tolerates the elevated ambient temperatures of enclosed print heads. The mature toolchain accelerates firmware development using Diab Data, Green Hills, or GCC cross-compilers. Sustained production support has made this MPU a baseline choice for high-end multifunction peripherals.
おすすめ
Telecommunications Baseband Processing
The MPC755CRX400LE fits telecom baseband and control-plane processing in 3G/4G base-station controller blades. The PowerPC architecture executes real-time protocol stacks (SS7, IPsec, SCTP) with the determinism telecom carriers require, while the 64-bit bus bridges to TDM/Ethernet framer ASICs. The ceramic CBGA package meets the long-term reliability expectations of carrier-grade equipment (NEBS Level 3). With VxWorks and INTEGRITY support, this MPU participates in Alcatel-Lucent/Nokia-class deployments that have decades of operational lifetime. For new builds, the MPC8641D offers higher throughput at comparable cost.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC755CRX400LE — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC755CRX466LE | MPC755CRX350LE | MPC755CPX400LE | MPC755CRX400LE-R2 | MPC745CRX400LE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | CBGA-360 (25x25 mm, 1.27 mm pitch) | CBGA-360 - same | CBGA-360 - same | FCBGA-360 - different substrate, same ball map | CBGA-360 - same | CBGA-360 - same |
| Core Frequency | 400 MHz | 466 MHz | 350 MHz | 400 MHz | 400 MHz | 400 MHz |
| External Bus Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Data Bus Width | 64-Bit | 64-Bit | 64-Bit | 64-Bit | 64-Bit | 64-Bit |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process Technology | 0.22 µm | 0.22 µm | 0.22 µm | 0.22 µm | 0.22 µm | 0.22 µm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Higher 400 MHz operating frequency within the CBGA-360 family （vs MPC755CRX350LE)
- Ceramic CBGA substrate for long-life/aerospace thermal and mechanical robustness （vs MPC755CPX400LE (FCBGA-360))
- Full PowerPC MPC755 bus signal set （vs MPC745CRX400LE)
設計ノート
Estimated: at 400 MHz with a 0.22 µm core on 2.5 V, the MPC755CRX400LE dissipates approximately 4-5 W typical. The CBGA-360 ceramic substrate allows passive heatsink attachment via thermal compound; design the chassis with at least 25 C/W theta_SA to keep junction rise below 35 °C above ambient. For sealed aerospace enclosures, add a copper heat-spreader directly under the BGA pads to spread heat across the PCB stack-up.
Per the MPC755 datasheet hardware specifications, the core 2.5 V rail must ramp before or simultaneously with the 3.3 V I/O rail; reverse sequencing risks latch-up. Use a TPS3808-style supervisor to gate the I/O rail from the core rail, or implement a Power Management Bus (PMBus) sequencer with at least 10 ms delay between rails. Bulk-decouple each rail with 100 µF tantalum plus 0.1 µF ceramic placed within 25 mm of the BGA balls.
Route the 100 MHz 60x bus with controlled-impedance traces (typically 50 Ω single-ended / 100 Ω differential) on the top layer under the BGA escape, with matched length on clock and address/command signals. The 1.27 mm CBGA pitch allows 4-mil trace-and-space between balls if you use microvia (laser-drilled) stack-ups. Place series damping resistors within 12 mm of the balls for each clocked output. Avoid 90° bends on the 100 MHz bus - use 45° bends with a minimum of 3 trace widths between bends.
Estimated: common pitfalls on first-time MPC755 designs include (1) failing to strap the PLL configuration pins correctly for the desired core:bus ratio, (2) omitting the mandatory 32.768 kHz real-time clock reference for the decrementer register, (3) misrouting HRESET and SRESET polarity for the chosen JTAG tool, and (4) assuming the MPC745 is a drop-in MPC755 - the MPC745 omits several bus signals and requires a new BSP. Confirm the host board's BSDL files match the chosen speed-grade variant before committing to production.
コンプライアンス情報
RoHS/REACH compliance status for the CBGA-360 ceramic variant was not present in the verified web data; ceramic BGA packages of this vintage are commonly non-compliant with Pb-free reflow, but specific compliance marks should be verified against the manufacturer's product declaration document. The part is not AEC-Q100 qualified (automotive grade), but is widely deployed in aerospace/military programs that have their own qualification regimes.
