MPC8245TVV300D - PowerPC 603e 300MHz Host Processor | NXP
N.º da peça: MPC8245TVV300D ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $78.5 | $785,00 |
| 100 | $72 | $7.200,00 |
| 500 | $65.5 | $32.750,00 |
| 1.000 | $60 | $60.000,00 |
MPC8245TVV300D Visão geral
An Integrated Host Processor (IHP) is a category of system-on-chip that combines a microprocessor core with chipset-style peripherals on a single silicon die. The MPC8245 sits within the broader PowerPC 603e processor family and the MPC82xx IHP product line, bridging the gap between a standalone MPU and a fully integrated SoC. It belongs to the power management and embedded computing hierarchy that also includes microcontrollers, DSPs, and FPGAs.
Key features include a 300 MHz PowerPC 603e core with 16 KB instruction and 16 KB data L1 caches, a 64-bit memory bus supporting SDRAM and ROM/Flash, a 32-bit/33 MHz PCI interface (version 2.2 compliant), dual UART, I2C, and GPIO peripherals, and a flexible bus architecture supporting both big-endian and little-endian operation. The device operates from a 2.5V core supply with 3.3V I/O and memory bus supplies.
The architecture integrates the 603e core, a high-performance memory controller, and PCI bridge logic, eliminating the need for an external northbridge chip. This integration enables the engineer to design compact motherboards for embedded routers, industrial controllers, and point-of-sale terminals with a reduced BOM and PCB layer count compared to discrete CPU-plus-chipset solutions.
Typical applications include networking equipment (routers, switches, access points), industrial automation controllers, RAID storage controllers, point-of-sale terminals, imaging and print controllers, and embedded telecom line cards. The combination of PCI interface and integrated memory controller makes it well-suited for I/O-centric designs.
When designing with this part, verify that the 352-pin TBGA land pattern and 35x35 mm footprint match the target PCB layout. Power sequencing must follow the datasheet's VDD/GVDD/OVDD ramp order; failures here are a common cause of field returns. The device is in extended life-cycle status with limited remaining supply; confirm availability before committing to new designs.
Alternativas drop-in para MPC8245TVV300D — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8245TVV300D (mesmo formato e footprint) — diferindo em Core Architecture, Core Frequency, Mounting Type, Operating Temperature, PCI Interface.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasMPC8245TVV300D Classificações máximas e características elétricas
| Core Architecture | PowerPC 603e |
| Core Frequency | 300 MHz |
| Instruction Set | 32-bit Power Architecture |
| L1 Cache (Instruction) | 16 KB |
| L1 Cache (Data) | 16 KB |
| System Bus Width | 64-bit |
| PCI Interface | PCI 2.2, 32-bit/33 MHz |
| Memory Bus | SDRAM / ROM / Flash controller |
| Core Supply Voltage (VDD) | 2.5 V (range from datasheet absolute ratings 0-2.25 V upper - see note) |
| I/O Supply Voltage (OVDD) | 3.3 V |
| Memory Bus Supply (GVDD) | 3.3 V |
| Temperatura de operação | -40C to +105C |
| Encapsulamento | 352-TBGA (35x35 mm) |
| Tipo de montagem | Surface Mount (TBGA) |
| Process Technology | 0.25 um CMOS |
| Peripherals | Dual UART, I2C, GPIO |
| Endian Support | Big-endian and little-endian |
Guia de Configuração de Pinos do MPC8245TVV300D 352-tbga (35x35 mm)
Configuração de pinos para MPC8245TVV300D (pacote 352-tbga (35x35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8245TVV300D.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8245TVV300D é adequado para 6 aplicaçãos: Industrial Router / Access Point, RAID Storage Controller, Point-of-Sale (POS) Terminal, Imaging and Print Controller, Industrial Automation Controller, Embedded Telecom Line Card.
Industrial Router / Access Point
The MPC8245TVV300D's 300 MHz PowerPC 603e core, integrated PCI 2.2 32-bit/33 MHz interface, and SDRAM memory controller make it a strong fit for industrial router and wireless access point designs. Placed as the main processor on the router mainboard, it handles packet forwarding, routing tables, and management-plane tasks while offloading crypto to an external engine. The integrated chipset eliminates a northbridge, reducing PCB layer count and BOM cost versus a discrete CPU-plus-chipset design. The -40C to +105C operating range ensures reliable operation in outdoor enclosures and uncontrolled factory environments. Compared to discrete PowerQUICC solutions, the integrated host processor reduces power and board area while preserving the rich peripheral set.
Recomendado
RAID Storage Controller
The MPC8245TVV300D's 64-bit memory bus bandwidth and PCI 2.2 32-bit/33 MHz host interface suit RAID storage controller cards that move large blocks between host and disk arrays. The 300 MHz 603e delivers the throughput needed for software RAID5/6 parity calculations on SATA/SAS drives attached via PCI SATA controllers. The 352-TBGA package enables compact card designs that fit standard PCI slot footprints. The integrated memory controller supports the ECC SDRAM needed for storage reliability. Compared to microcontrollers, the PowerPC 603e pipeline provides much higher instructions-per-cycle for I/O-intensive storage workloads.
Recomendado
Point-of-Sale (POS) Terminal
The MPC8245TVV300D's combination of PCI interface, UARTs, I2C, GPIO, and SDRAM controller suits point-of-sale terminals that must communicate with cash drawers, receipt printers, magnetic-stripe readers, and customer displays. The 300 MHz 603e runs the terminal application stack while the integrated peripherals handle peripheral I/O without extra chips. The 352-TBGA package and surface-mount reflow profile fit high-volume SMT assembly lines typical of POS manufacturing. The industrial temperature range supports deployment in semi-outdoor retail locations and warehouse environments.
Recomendado
Imaging and Print Controller
The MPC8245TVV300D's 64-bit memory bus, PCI expansion, and integrated peripheral set fit imaging and print controller boards where high-resolution data streams must move between the scanner/print engine and the host. The 300 MHz PowerPC 603e executes raster image processing and compression algorithms in real time while the PCI bus interfaces to host PCs. The integrated chipset reduces component count, increasing mean time between failures for production-printer and large-format plotter deployments. The 352-TBGA enables compact controller cards that fit within the printer chassis.
Recomendado
Industrial Automation Controller
The MPC8245TVV300D's -40C to +105C operating range and PowerPC 603e performance make it suitable for industrial automation controllers (PLCs, motion controllers, HMI stations) that must run deterministic control loops while presenting fieldbus interfaces. The integrated UARTs, I2C, and GPIO connect to RS-485 transceivers and digital I/O without a secondary chip. The PCI bus enables expansion cards for specialized fieldbus modules (PROFIBUS, DeviceNet, CANopen). The integrated memory controller supports ECC SDRAM for high-reliability factory automation deployments. Compared to microcontrollers, the integrated host processor offers far higher code-density and I/O bandwidth.
Recomendado
Embedded Telecom Line Card
The MPC8245TVV300D's PCI 2.2 interface, dual UARTs, and PowerPC 603e core enable embedded telecom line cards that handle DS1/E1 framing, packetizing, and signaling. The 300 MHz performance is sufficient for software-defined low-density VoIP or media-gateway line cards. The integrated chipset shrinks board area versus a discrete CPU-plus-chipset design, enabling higher port density per AdvancedTCA or CompactPCI chassis slot. The 352-TBGA package is compatible with standard telecom card manufacturing processes. Industrial temperature rating supports central-office and outside-plant deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8245TVV300D — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8245TVV266D | MPC8245TVV350D | MPC8245LTVV300D |
|---|---|---|---|---|
| Package | 352-TBGA (35x35 mm) | 352-TBGA - same | 352-TBGA - same | 352-TBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors / Freescale | NXP Semiconductors / Freescale | NXP Semiconductors |
| Core Frequency | 300 MHz | 266 MHz (-11%) | 350 MHz (+17%) | 300 MHz (same) |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| System Bus Width | 64-bit | 64-bit | 64-bit | 64-bit |
| PCI Interface | PCI 2.2, 32-bit/33 MHz | PCI 2.2, 32-bit/33 MHz | PCI 2.2, 32-bit/33 MHz | PCI 2.2, 32-bit/33 MHz |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 1.8 V (lower) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principais diferenciais
- Integrated PCI + memory controller reduces BOM (vs MPC8245TVV266D)
- Lower-voltage variant available in same package (vs MPC8245LTVV300D)
- True drop-in frequency scaling (vs MPC8245TVV350D)
Notas de projeto
The MPC8245TVV300D requires three independent supply rails: VDD (2.5V) for the CPU core and peripheral logic, GVDD (3.3V) for the memory bus drivers, and OVDD (3.3V) for PCI and standard I/O buffers. Power sequencing per the datasheet hardware specifications must be observed - VDD must reach its threshold before GVDD/OVDD ramp, otherwise latch-up can occur. Use a power supervisor IC to enforce sequencing. Decoupling: place 0.1 uF X7R ceramic capacitors adjacent to every supply pin pair, plus bulk 10 uF-22 uF tantalum or polymer capacitors near each supply rail entry point.
Estimated: at 300 MHz with 2.5V core supply, typical core power is approximately 2.0-2.5W based on NXP-published figures for the 603e core. With 352-TBGA theta-JA of approximately 15-18 C/W on a 4-layer JEDEC test board, junction temperature rise at 25C ambient is approximately 30-45C. The TBGA package uses the center ball array for thermal dissipation; the PCB thermal pad and inner copper planes must be stitched with thermal vias to the central balls to carry heat to the bottom layer. Derate performance at higher ambient or in enclosed chassis.
The 352-TBGA 35x35 mm package has a 1.27 mm ball pitch (typical for this BGA family). PCB design must use laser-drilled or micro-via stackups to escape the inner ball array; 4-6 routing layers are typical. Matched-length impedance control is required for the 64-bit memory bus (typically 50 ohms single-ended) and PCI bus (50 ohms nominal). Place SDRAM as close to the memory bus pins as possible to minimize stub length and signal integrity issues. Reference NXP application note AN2764 for layout guidance.
Common pitfalls when designing with this part include: (1) forgetting to configure the endian reset configuration word correctly during POR, leading to boot failures; (2) omitting the 32.768 kHz real-time clock crystal on the RTC pins; (3) using 3.3V-only SDRAM when the memory controller is configured for 2.5V levels - verify GVDD matches SDRAM requirement; (4) failing to instantiate the JTAG header for boundary-scan debug - the 603e core exposes extensive IEEE 1149.1 support that is invaluable for first-article bring-up. The last-time-buy lifecycle means firmware bugs that require a silicon revision cannot be fixed - thorough validation on evaluation boards is essential.
Informações de conformidade
RoHS and lead-free status not explicitly listed in verified distributor data as of 2026-10-17. The part was originally released by Freescale Semiconductor (later acquired by NXP) circa 2002. Verify with the latest NXP material declaration before RoHS-critical designs.