XPC8240RVV250E - 250MHz PowerPC 603e MPU | NXP | 352-TBGA
N.º da peça: XPC8240RVV250E ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $45 | $45,00 |
| 10 | $38.5 | $385,00 |
| 100 | $32 | $3.200,00 |
| 500 | $28.75 | $14.375,00 |
| 1.000 | $25.5 | $25.500,00 |
XPC8240RVV250E Visão geral
An integrated processor (also called a system-on-chip or SoC) combines a CPU core, memory controller, and peripheral bridges in one package. Within the broader hierarchy, the MPC8240 sits between a microcontroller (no integrated DRAM controller) and a full application processor (with display, GPU, and high-speed SerDes). The PowerQUICC II family specifically targets communications infrastructure, RAID storage controllers, and embedded computing applications requiring PCI connectivity.
Key features of the XPC8240RVV250E include 250 MHz core speed, 2.625 V +/- 125 mV core supply, hardware-spec modifications for 250 MHz operation, a 32-bit PCI bridge (v2.2 compliant), DRAM/SDRAM memory controller with ECC support, two UARTs, I2C, and a 32-bit local bus. The part integrates a memory controller supporting up to 1 GB of DRAM, making it suitable for memory-intensive embedded applications.
Architecturally, the PowerPC 603e core is a superscalar design with out-of-order execution, seven-stage integer pipeline, and separate 16 KB instruction and 16 KB data L1 caches. Combined with the integrated PCI bridge, this architecture eliminates the need for a separate northbridge chip, reducing board space, BOM cost, and power consumption in embedded designs.
Typical applications for the XPC8240RVV250E include network routers and switches, RAID storage controllers, industrial control systems, telecom base station controllers, and PCI-based peripheral cards. The 250 MHz performance and integrated memory controller make it suitable for protocol processing, packet routing, and embedded control tasks.
When designing with this device, engineers must consider the 352-ball TBGA package complexity, which requires multilayer PCB with via-in-pad technology. Thermal management must also be addressed for industrial temperature operation at full 250 MHz clock rate, typically requiring airflow or heat spreader solutions.
This page synthesizes distributor pricing, lifecycle status, and application guidance not found in the manufacturer datasheet. All data was cross-referenced against distributor stock, octopart pricing, and the manufacturer product page.
Alternativas drop-in para XPC8240RVV250E — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8240VR250B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8240LVR250B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8240RVV250E
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XPC8240RVR250B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XPC8240RVV250E Classificações máximas e características elétricas
| Processor Type | MPC82xx PowerQUICC II, 32-bit |
| Core | PowerPC 603e |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| Core Frequency | 250 MHz |
| Core Voltage | 2.625 V +/- 125 mV |
| Temperatura de operação | 0C to +105C |
| Encapsulamento | 352-TBGA (35x35 mm) |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| Status RoHS | RoHS Compliant |
| PCI Bridge | Integrated, PCI 2.2 compliant |
| Memory Controller | DRAM, SDRAM |
| L1 Cache | 16 KB I-cache + 16 KB D-cache |
| Part Status | Obsolete |
Guia de Configuração de Pinos do XPC8240RVV250E 352-tbga (35x35 mm)
Configuração de pinos para XPC8240RVV250E (pacote 352-tbga (35x35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XPC8240RVV250E.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XPC8240RVV250E é adequado para 6 aplicaçãos: Network Router and Switch Control, RAID Storage Controller, Telecom Base Station Controller, Industrial Control Systems, PCI Peripheral Cards, Embedded Computing Platforms.
Network Router and Switch Control
The XPC8240RVV250E integrates a PowerPC 603e core at 250 MHz with a PCI 2.2 compliant bridge and DRAM/SDRAM controller on a single die. For router and switch control planes, this combination eliminates the need for a separate northbridge, reducing BOM cost by 20-30% versus discrete CPU-plus-chipset designs. The integrated PCI bridge connects directly to network processors, switch fabrics, and PHY devices. ECC memory support is critical for packet buffer integrity in carrier-grade equipment. The 0C to +105C industrial temperature range supports outdoor cabinet deployment.
Recomendado
RAID Storage Controller
The XPC8240RVV250E provides 250 MHz processing power with integrated PCI and DRAM controllers ideal for RAID controller cards. The ECC-enabled memory controller detects and corrects single-bit errors in cache memory, critical for data path integrity in RAID 5/6 configurations. The PCI bus supports multiple disk channels through external PCI-to-SATA or PCI-to-SAS bridge chips. PowerPC architecture offers deterministic interrupt latency required for disk I/O operations. Tray packaging simplifies production assembly of PCIe-to-SATA RAID cards.
Recomendado
Telecom Base Station Controller
The XPC8240RVV250E serves as a control processor in 2G/3G base station controllers with its industrial temperature grade (0C to +105C) and integrated peripheral set. The PowerPC 603e core runs RTOS or embedded Linux for protocol stack processing including Layer 2/3 functions. DRAM/SDRAM controller with ECC ensures reliable operation in carrier-grade equipment. Two UARTs, I2C, and 32-bit local bus connect to baseband DSPs, RF transceivers, and clock chips. The 352-TBGA package supports high-density PCB layouts required for compact base station designs.
Recomendado
Industrial Control Systems
The XPC8240RVV250E provides deterministic processing for PLCs, motor controllers, and SCADA systems requiring ruggedized computing. The 250 MHz PowerPC 603e core executes real-time control loops with predictable interrupt response times. Integrated PCI bridge connects to motion control cards, FPGA coprocessors, and fieldbus interfaces. The 32-bit local bus supports direct connection of parallel I/O expansion. Industrial temperature grade and lead-free packaging meet requirements for factory floor deployment with extended temperature exposure.
Recomendado
PCI Peripheral Cards
The XPC8240RVV250E integrates PCI 2.2 bridge and memory controller for intelligent PCI add-in cards. The processor offloads host CPU by handling data processing, buffering, and protocol translation locally. The 352-TBGA package provides the high pin density required for 32-bit PCI signaling plus memory interface. Applications include protocol accelerators, encryption cards, DSP coprocessor cards, and data acquisition cards. ECC memory support improves card reliability for mission-critical applications.
Recomendado
Embedded Computing Platforms
The XPC8240RVV250E powers VME/CompactPCI single-board computers used in defense, aerospace, and industrial computing. The integrated DRAM controller with up to 1 GB addressability supports memory-intensive applications. The PCI bridge connects to backplane for mezzanine card expansion. PowerPC architecture with MMU supports embedded Linux, VxWorks, and QNX real-time operating systems. Tray packaging and 352-TBGA suit high-reliability board assembly processes. The processor remains in service for long-lifecycle programs where hardware revision is costly.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XPC8240RVV250E — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8240VR250B | MPC8240LVR250B | MPC8240RVV250E | XPC8240RVR250B |
|---|---|---|---|---|---|
| Package | 352-TBGA (35x35 mm) | 352-TBGA - same | 352-TBGA - same | 352-TBGA - same | 352-TBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 250 MHz | 250 MHz | 250 MHz | 250 MHz | 250 MHz |
| Core Processor | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Number of Cores | 1 | 1 | 1 | 1 | 1 |
| Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Core Voltage | 2.625 V +/- 125 mV | 2.625 V +/- 125 mV | 2.5 V (lower power) | 2.625 V +/- 125 mV | 2.625 V +/- 125 mV |
| Temperature Grade | Industrial (0C to +105C) | Commercial | Commercial | Commercial | Industrial (XPC) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| PCI Bridge | Integrated, PCI 2.2 | Integrated, PCI 2.2 | Integrated, PCI 2.2 | Integrated, PCI 2.2 | Integrated, PCI 2.2 |
Principais diferenciais
- Industrial temperature grade XPC designation (vs MPC8240VR250B)
- Hardware-modified for guaranteed 250 MHz operation (vs MPC8240RVV250E)
- Integrated PCI bridge eliminates northbridge chip (vs Discrete CPU + chipset solutions)
Notas de projeto
The 352-TBGA package at 250 MHz dissipates significant power, requiring thermal management for reliable industrial temperature operation. At 2.625 V core supply with typical core-power of 2.5-3 W, the junction temperature can exceed 105C without adequate cooling. Design with at least 4-layer PCB with dedicated ground/power planes and consider adding a heat spreader or thermal pad connected to the central ball array. Verify thermal performance at maximum ambient (105C) before deployment in sealed enclosures.
The 352-TBGA package requires multilayer PCB (minimum 6 layers recommended) with microvia or via-in-pad technology for the fine-pitch ball grid. Trace escape routing must use dog-bone fanout patterns with impedance-controlled traces for the PCI bus and memory interface. Maintain 50 ohm controlled impedance for PCI signaling and proper trace length matching for DDR memory interface. Decoupling capacitors should be placed directly beneath or adjacent to the BGA using 0402 or 0201 size components.
The XPC8240RVV250E requires multiple voltage rails: 2.625 V core, 3.3 V I/O, and potentially 1.8 V for DDR memory. Use a multi-rail power management IC with sequencing capability to ensure proper power-up/power-down order. Core voltage tolerance is +/- 125 mV (2.5 V to 2.75 V), so use a buck regulator with tight load regulation. Place bulk capacitors (22 uF minimum) near the BGA power balls to handle switching transients and reduce voltage ripple below 50 mV peak-to-peak.
The 32-bit PCI bus at 33 MHz requires careful signal integrity management including series termination resistors (22-33 ohm) on PCI signals, length matching within 1500 mils, and proper reference plane continuity. Use a 4-layer PCB with continuous ground plane beneath the PCI signal traces. For DDR memory interface, maintain trace length matching within 50 mils for clock, address, and command signals. Apply series stub resistors on the memory data bus if using DIMM modules.
Informações de conformidade
RoHS compliant and lead-free per DigiKey listing. REACH and halogen-free status not explicitly stated in available data. AEC-Q100 not applicable for industrial microprocessor in non-automotive grade.