MPC8250AVVPIBC - PowerQUICC II 300MHz MPU | NXP 480-TBGA
N.º da peça: MPC8250AVVPIBC ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $158.64 | $158,64 |
| 10 | $145.2 | $1.452,00 |
| 100 | $128.75 | $12.875,00 |
| 250 | $119.4 | $29.850,00 |
| 500 | $108.9 | $54.450,00 |
MPC8250AVVPIBC Visão geral
A microprocessor (MPU) is the central processing unit of an embedded computing system, executing instruction streams, managing memory, and orchestrating peripheral I/O. The PowerPC G2 architecture is a 32-bit superscalar RISC core widely used in networking and telecommunications equipment, while PowerQUICC II devices additionally integrate a Communications Processor Module (CPM) that offloads DMA, serial, and networking tasks from the CPU. The MPC82xx family, MPC8250AVVPIBC's product family, sits at the top of the PowerQUICC II hierarchy and is intended for high-end routers, switches, and access multiplexers.
Key features include a 300 MHz CPU core frequency, a single PowerPC G2 core, a 32-bit data path, an integrated CPM with support for multiple fast communications controllers, an external bus supporting up to 133 MHz operation, and an industrial-grade operating temperature range. The 480-TBGA package integrates this processing and I/O density on a 37.5x37.5 mm footprint, which is the standard for the MPC82xx family.
The MPC8250AVVPIBC is implemented in a 0.25 micrometer CMOS process and operates from a 3.3 V core/IO supply. Its internal architecture separates the core and CPM clock domains, allowing the CPM to continue handling serial traffic while the core changes frequency or enters low-power states. The integrated memory controller supports SDRAM, ROM/Flash, and peripheral bus interfaces, reducing external chip count in router line-card designs.
Typical applications include high-end routers, DSLAM line cards, ATM and TDM switches, frame relay access devices, and industrial control platforms that require deterministic communications throughput. The combination of G2 core performance and CPM offload makes it ideal for wireline access and edge networking equipment.
Designers should ensure proper thermal management on the 480-TBGA; the large body size aids heat spreading but JTAG, reset, and PLL power filtering require close attention per NXP application notes. Provide a clean 3.3 V supply and follow the recommended PLL filter network.
This page synthesizes distributor pricing, same-family NXP drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para MPC8250AVVPIBC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8250AVVPIBC (mesmo formato e footprint) — diferindo em Operating Temperature, Process Technology, Data Bus Width, Mounting Type, Number of Cores.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8250AZUPIBC
✅ Drop-In✓ Em estoque
$110.25 / unidade
Ver ficha técnica →MPC8265AZUPIBC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8270VVUPEA
✅ Drop-In✓ Em estoque
$145 / unidade
Ver ficha técnica →MPC8270CZQMIBA
✅ Drop-In✓ Em estoque
$52.85 / unidade
Ver ficha técnica →MPC8250AVVPIBC Classificações máximas e características elétricas
| Core Architecture | PowerPC G2 |
| Number of Cores | 1 |
| Largura do barramento de dados | 32-Bit |
| Core Frequency | 300 MHz |
| Series | MPC82xx (PowerQUICC II) |
| Process Technology | 0.25 um CMOS |
| Tensão de alimentação | 3.3 V |
| Encapsulamento | 480-TBGA (37.5 x 37.5 mm) |
| Contagem de pinos | 480 |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0C to +105C |
| Communications Processor Module | Integrated CPM |
| External Bus Speed | Up to 133 MHz |
| Memory Controller | SDRAM / Flash / ROM |
| Status RoHS | Non-Compliant (NO-PB marking) |
Guia de Configuração de Pinos do MPC8250AVVPIBC 480-tbga (37.5 x 37.5 mm)
Configuração de pinos para MPC8250AVVPIBC (pacote 480-tbga (37.5 x 37.5 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8250AVVPIBC.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8250AVVPIBC é adequado para 6 aplicaçãos: High-End Router Control Plane, DSLAM Line Card Controller, ATM / TDM Multiplexer Switch, Frame Relay Access Device, Industrial Communications Controller, Legacy Telecom Base Station Controller.
High-End Router Control Plane
The MPC8250AVVPIBC fits high-end router control plane designs because its 300 MHz PowerPC G2 core handles routing-table lookups and exception processing while the integrated CPM offloads DMA and serial I/O. In a typical chassis, the MPU sits on a 133 MHz external bus connecting to SDRAM and a PCI bridge, with the CPM driving TDM and fast Ethernet channels. Its deterministic interrupt latency keeps forwarding plane timing predictable.
Recomendado
DSLAM Line Card Controller
The MPC8250AVVPIBC is well suited as a line-card controller in central-office DSLAMs where each card terminates multiple xDSL channels and aggregates traffic upward. Its integrated CPM handles ATM and HDLC serialization, while the G2 core runs the channel-control and bonding software. The 480-TBGA footprint allows dense line-card layouts with controlled impedance routing for high-speed signals.
Recomendado
ATM / TDM Multiplexer Switch
The MPC8250AVVPIBC serves as the processor in ATM and TDM multiplexer switches that combine multiple E1/T1, E3/T3, or OC-3 streams into higher-order trunks. The CPM block supports multiple SCCs and FCCs for these serial protocols, while the G2 core handles cell/packet segmentation and QoS scheduling. The 300 MHz core bandwidth is sufficient for several hundred Mbps of aggregate throughput at typical ATM cell rates.
Recomendado
Frame Relay Access Device
The MPC8250AVVPIBC supports frame relay access devices (FRADs) that concentrate DLCIs from multiple customer sites onto a single WAN uplink. Its on-chip CPM provides the HDLC framing needed for frame relay, and the G2 core runs routing and management software. The integrated memory controller simplifies BOM by interfacing directly to SDRAM and flash on the FRAD main board.
Recomendado
Industrial Communications Controller
The MPC8250AVVPIBC is used in industrial serial communications controllers that aggregate fieldbus, RS-485, and Ethernet traffic in factory automation systems. Its deterministic CPM and industrial temperature range make it suitable for harsh environments. Designers pair the MPU with external PHYs and isolation transformers, while the G2 core runs the deterministic real-time control loop.
Recomendado
Legacy Telecom Base Station Controller
The MPC8250AVVPIBC fits legacy GSM/UMTS base station controller designs where its CPM drives multiple E1/T1 trunks toward the radio network controller while the G2 core handles signaling stacks. The 480-TBGA package and 300 MHz headroom meet the latency budget of BTS-side call processing, and long-life-cycle support from franchised distributors extends deployment horizons.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8250AVVPIBC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8250AZUPIBC | MPC8265AZUPIBC | MPC8270VVUPEA | MPC8270CZQMIBA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same |
| Core Architecture | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 |
| RoHS Status | Non-Compliant (NO-PB) | Compliant (Pb-free) | Compliant (Pb-free) | Compliant (Pb-free) | Compliant |
| Data Bus Width | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Series | MPC82xx (PowerQUICC II) | MPC82xx (PowerQUICC II) | MPC82xx (PowerQUICC II) | MPC82xx (PowerQUICC II) | MPC82xx (PowerQUICC II) |
Principais diferenciais
- Pb-free drop-in equivalent available (vs MPC8250AZUPIBC)
- Higher-performance upgrade in same package (vs MPC8265AZUPIBC)
- Extended PowerQUICC II family support (vs MPC8270VVUPEA)
Notas de projeto
The MPC8250AVVPIBC requires a clean 3.3 V supply with low noise on the PLL power pins. Use the NXP-recommended PLL filter network (a ferrite bead plus decoupling capacitors) on the VCCSYN and VCCSYN1 pins. Place 0.1 uF and 10 uF decoupling capacitors as close as possible to each power pin, and provide a solid power plane to handle the 300 MHz core's switching transients.
The 480-TBGA package spreads heat across a 37.5 x 37.5 mm body, so the MPU typically operates without an external heatsink when mounted on a PCB with a continuous ground/power copper pour and modest airflow. Refer to the NXP PowerQUICC II thermal application note for theta-JA and derating curves. In sealed enclosures without airflow, derate the core frequency or add a heatsink.
Route the external bus as a controlled-impedance 50 ohm microstrip with matched trace lengths to maintain signal quality at 133 MHz. Provide a solid ground reference plane under the BGA and use microvia-in-pad or dog-bone fanout for the inner balls. Follow NXP's BGA routing guidelines in the hardware specifications document to avoid crosstalk between bus and CPM signals.
Do not assume the MPC8250AVVPIBC is RoHS compliant - it carries the NO-PB (leaded-ball) marking and requires a leaded solder profile. For RoHS designs, choose the MPC8250AZUPIBC instead. Also ensure the JTAG TCK frequency is below the BSDL-specified limit, and that HRESET is held asserted long enough during power-up to allow the PLL to lock before the first access.
Informações de conformidade
NO-PB marking per manufacturer datasheet - non-RoHS. Reach status compliant per typical NXP legacy parts. AEC-Q100 not applicable for legacy MPU.