MPC8250AZUPIBC - PowerPC G2 300MHz MPU | NXP | 480-TBGA
MPN: MPC8250AZUPIBC ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145.51 | $145.51 |
| 10 | $138.2 | $1,382.00 |
| 50 | $128.45 | $6,422.50 |
| 100 | $119.9 | $11,990.00 |
| 250 | $110.25 | $27,562.50 |
MPC8250AZUPIBC Overview
A microprocessor (MPU) is the central processing unit of an embedded system, executing instructions, managing memory, and orchestrating peripherals. The PowerQUICC II architecture is a category of communications-oriented MPUs that pair a PowerPC execution core with on-chip peripheral subsystems - in the MPC8250AZUPIBC's case, the HIP4C (High-Performance Peripheral Interface) hardware block - giving designers a single-chip solution for routers, switches, DSLAMs, and other networking gear. This hierarchy - PowerPC core -> communications MPU -> embedded processor -> integrated circuit - lets a single silicon die replace what previously required a CPU, a peripheral controller, and an external bus bridge.
Key differentiating features include the on-chip HIP4C communications engine supporting fast Ethernet, HDLC, ATM, and PCI interfaces, a 32-bit external bus interface with up to 133 MHz operation, and integrated memory controllers for SDRAM, ROM/Flash, and general-purpose peripherals. The 480-TBGA package provides a high-pin-count surface-mount solution optimized for high-speed signaling and thermal dissipation in networking line cards.
Technically, the MPC8250AZUPIBC combines a 16 Kbyte instruction cache and 16 Kbyte data cache with a unified 256 Kbyte L2 cache option, MMU with hardware table-walk, and a 60x-compatible system bus. The HIP4C block offloads DMA, protocol handling, and time-division multiplexing from the core, which is the defining advantage of PowerQUICC II in wired communications applications.
Typical applications include telecommunications line cards, DSLAMs, routers, multi-channel T1/E1 framers, and industrial control platforms requiring integrated communications peripherals. It is well-suited for designs that benefit from a single PowerQUICC II device replacing separate CPU, bridge, and peripheral ASICs.
When designing with this part, allocate at least four PCB layers for the high-speed 60x bus, place decoupling capacitors within 5 mm of each power pin, and verify the TBGA solder joint process window; the 37.5 mm package is not rework-friendly. Confirm HIP4C peripheral pin assignments against your chosen protocol stack before committing to layout.
This page synthesizes distributor pricing, drop-in alternatives from the same PowerQUICC II family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for MPC8250AZUPIBC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8250AZUPIBC (same form factor and footprint) — differing in Process Technology, Series, Operating Temperature, RoHS Status, Manufacturer.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8260ACZUMHBB
✅ Drop-In✓ In Stock
$162.1 / Unit
View Datasheet →MPC8265AZUPIBC
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8265AZUPJDC
✅ Drop-In✓ In Stock
$172 / Unit
View Datasheet →MPC8250ACVVMHBC
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8270VVQLDA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8250AZUPIBC Maximum Ratings & Electrical Characteristics
| Core Processor | PowerPC G2 |
| Number of Cores | 1 Core, 32-Bit |
| Core Speed | 300 MHz |
| Process Technology | 0.25 µm CMOS |
| Series | MPC82xx (PowerQUICC II) |
| Coprocessor | Communications (HIP4C) |
| Package | 480-TBGA (37.5 x 37.5 mm) |
| Mounting Type | Surface Mount |
| Supply Voltage | 3.3 V I/O |
| External Bus Width | 32-Bit (60x-compatible) |
| Operating Temperature | -40 °C to +85 °C (industrial) |
| L1 Instruction Cache | 16 Kbyte |
| L1 Data Cache | 16 Kbyte |
| Peripherals | PCI, HDLC, Fast Ethernet, ATM, TDM |
MPC8250AZUPIBC 480-tbga (37.5 x 37.5 mm) Pin Configuration Guide
Pin configuration for MPC8250AZUPIBC (480-tbga (37.5 x 37.5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8250AZUPIBC.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8250AZUPIBC is suitable for 6 applications: Telecommunications Line Cards (T1/E1 Framers), DSLAM and Access-Concentrator Platforms, Routers and Edge Networking Equipment, Industrial Control and Factory Automation, Multi-Channel HDLC Aggregation Backplanes, Legacy Networking Equipment Sustainment.
Telecommunications Line Cards (T1/E1 Framers)
The MPC8250AZUPIBC is well-suited for multi-channel T1/E1 line cards where the HIP4C communications coprocessor offloads HDLC framing, bit-stream assembly, and time-division multiplexing from the PowerPC G2 core. Designers place the MPC8250AZUPIBC between the line-interface units and the backplane, using its integrated HDLC channels to terminate 8-32 framed circuits without an external protocol ASIC. The 300 MHz core then handles routing-table maintenance, SNMP, and management-plane traffic. Compared with a discrete CPU-plus-bridge solution, the integrated design typically saves a component, ~30% board area, and significant power at the system level.
Recommended
DSLAM and Access-Concentrator Platforms
DSLAM line cards and access-concentrator shelves use the MPC8250AZUPIBC to terminate ATM and Ethernet traffic while running subscriber management code on the G2 core. The integrated ATM SAR inside HIP4C handles cell segmentation and reassembly across hundreds of PVCs, eliminating a discrete ATM chip. The 32-bit 60x external bus connects the MPU to SDRAM and a switch fabric ASIC. The 480-TBGA package provides the high pin count required for ATM Utopia-level interfacing and PCI links to upstream line cards.
Recommended
Routers and Edge Networking Equipment
Mid-range routers, edge gateways, and integrated access devices use the MPC8250AZUPIBC as the central forwarding engine, with the HIP4C block handling Fast Ethernet MACs and PCI peripherals while the G2 runs the routing stack. Its 300 MHz clock and 32-bit bus deliver adequate performance for 100 Mbps-class forwarding with QoS queues. The PowerQUICC II family is software-compatible across MPC8250/8260/8265, allowing firmware reuse across product tiers. The integrated PCI and Ethernet MACs shrink the BOM versus a CPU + bridge + Ethernet-ASIC design.
Recommended
Industrial Control and Factory Automation
Industrial controllers and factory-floor gateways leverage the MPC8250AZUPIBC's PCI, serial, and HDLC interfaces to bridge factory networks (Profibus, CAN, RS-485) with Ethernet uplinks. The industrial -40 °C to +85 °C temperature rating suits cabinet-mounted equipment. The PowerPC core runs deterministic control loops while HIP4C manages deterministic serial-protocol timing. The wide 32-bit bus accommodates SRAM for real-time task storage, and the integrated MMU supports protected Linux or VxWorks deployments.
Recommended
Multi-Channel HDLC Aggregation Backplanes
Central-office backplanes aggregating HDLC traffic from many tributary cards use the MPC8250AZUPIBC's high-channel-count HIP4C to consolidate framing without external glue logic. The MPU presents a single PCI or 60x-bus interface to the backplane controller, simplifying backplane pinout. Compared with discrete HDLC controller arrays, the integrated HIP4C reduces PCB layers, BOM count, and per-channel power. Designers typically pair the MPC8250AZUPIBC with a switch fabric and external PHY transceivers.
Recommended
Legacy Networking Equipment Sustainment
Field service organizations maintaining deployed PowerQUICC II equipment use the MPC8250AZUPIBC as a field-replacement part for end-of-life networking gear. The 480-TBGA package, pin-compatible across the MPC8250/8260/8265 family, allows direct swap when firmware accepts either die revision. Sustainment programs verify date codes and conformance to avoid counterfeit risk. Stocking the MPC8250AZUPIBC alongside the MPC8265AZUPIBC provides flexibility for legacy spares pools.
Recommended
Recommended Products Summary
Engineering reference data for MPC8250AZUPIBC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8260ACZUMHBB | MPC8265AZUPIBC | MPC8265AZUPJDC | MPC8250ACVVMHBC | MPC8270VVQLDA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same | TBGA - same family | TBGA - same family |
| Core Processor | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 (next-gen PowerQUICC II) |
| Series | MPC82xx (PowerQUICC II) | MPC82xx (PowerQUICC II) | MPC82xx (PowerQUICC II) | MPC82xx (PowerQUICC II) | MPC82xx (PowerQUICC II) | MPC82xx (PowerQUICC II) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Process Technology | 0.25 µm | 0.25 µm | 0.25 µm | 0.25 µm | 0.25 µm | 0.13 µm |
Key Differentiators
- Highest core clock in the pin-compatible 480-TBGA PowerQUICC II G2 family (vs MPC8260ACZUMHBB)
- Pin-compatible path within the same generation (vs MPC8265AZUPIBC)
- Older 0.25 µm process preserves software compatibility (vs MPC8270VVQLDA)
Design Notes
The 480-TBGA package at 37.5 x 37.5 mm requires a minimum 4-layer PCB with controlled-impedance routing for the 60x bus, which runs at up to 133 MHz. Use 50 Ω single-ended and 100 Ω differential impedance, with via-in-pad or microvia technology to reach inner-row balls. Decoupling capacitors (0.1 µF and 10 µF) must be placed within 5 mm of every power pin, and the inner power plane should be a continuous solid pour to minimize inductance on the 3.3 V I/O supply. Estimated: assume ~120 power/ground balls and ~360 signal balls based on standard 480-TBGA PowerQUICC II patterns; consult the NXP package drawing for exact ball-map assignment.
At 300 MHz on a 0.25 µm process, the MPC8250AZUPIBC dissipates roughly 1.5-2.0 W typical, which the 480-TBGA package spreads via the internal thermal balls. Provide a top-side copper pour over the BGA and at least 4 thermal vias to an internal ground plane. In enclosed chassis with limited airflow, derate the ambient by 10 °C or add a heatsink with thermal interface material. Estimated: typical core power is taken from NXP PowerQUICC II family datasheets; verify with the exact device datasheet before worst-case thermal analysis.
Do not assume the MPC8265AZUPIBC or MPC8270CZUUPEA is a drop-in replacement for the MPC8250AZUPIBC - while the 480-TBGA footprint is shared, peripheral pin mappings, bus timing, and core voltage differ across PowerQUICC II generations. Always cross-check the specific HIP4C peripheral pin map against your schematic before swapping. Also confirm date codes and traceability when sourcing from independent distributors; counterfeit PowerQUICC II devices have been documented in the gray market.
Compliance Information
Original PowerQUICC II parts predate current RoHS requirements; specific compliance status not confirmed in verified web data. Request current compliance letter from distributor before use in RoHS-restricted products.