MPC8260AZUMHBB - PowerQUICC II HIP4 266MHz MPU | NXP 480-TBGA
N.º da peça: MPC8260AZUMHBB ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.8 | $728,00 |
| 100 | $64.2 | $6.420,00 |
| 500 | $58.4 | $29.200,00 |
| 1.000 | $52.1 | $52.100,00 |
MPC8260AZUMHBB Visão geral
A microprocessor (MPU) is a single-chip CPU implementation that combines the arithmetic logic unit, register file, control logic, cache, and bus interface onto one monolithic die; the PowerPC G2 core inside the MPC8260 fits this category and is positioned between 8-bit microcontrollers and high-performance DSPs in the embedded-compute hierarchy. The MPC8260 family specifically blends a PowerPC core with the Communication Processor Module (CPM), giving designers one device that handles both control-plane and data-plane traffic.
Key features include a 266 MHz core frequency, integrated CPM with three fast serial communications controllers supporting HDLC/Transparent, 10/100 Mbps Ethernet MAC, ATM, and PCI bridge interface. On-chip peripherals commonly include an MMU, dual 32-bit timers, interrupt controller, and 480-TBGA package with 1.55 mm height and 1.27 mm pitch for high-density backplane designs. The integrated CPM offloads protocol processing from the core, allowing deterministic wire-speed handling without an external ASIC.
Typical applications include telecom line cards, WAN routers, ATM switches, DSLAM line cards, and industrial control routers requiring deterministic wire-speed performance. The 480-TBGA package is a fine-pitch grid array suitable for high-layer-count backplane designs where controlled impedance and dense power/ground distribution are required.
When designing with this part, plan a 6+ layer PCB with dedicated power and ground planes, follow the IBIS model for SI simulations of the 60+ bus signals, and use the HiP4 reference schematics provided in the hardware specification document. The 1.8 V core rail and 3.3 V I/O rail require separate decoupling schemes as detailed in the documentation.
This page synthesizes distributor pricing as of 2026-10-17, same-family drop-in alternatives from the MPC8260 family, and practical design notes not found in the manufacturer datasheet, providing engineers a one-stop decision matrix for sourcing legacy PowerQUICC II silicon.
Alternativas drop-in para MPC8260AZUMHBB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8260AZUMHBB (mesmo formato e footprint) — diferindo em Process Technology, Data Bus Width, Architecture, Family, Manufacturer.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8260ACZUMHBB
✅ Drop-In✓ Em estoque
$162.1 / unidade
Ver ficha técnica →MPC8260AZUPIBB
✅ Drop-In✓ Em estoque
$180 / unidade
Ver ficha técnica →MPC8260AZUIHBXXX
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8260A
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8260E
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8260AZUMHBB Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) |
| Product Family | PowerQUICC II HIP4 (MPC82xx) |
| Architecture | RISC, PowerPC G2 |
| Largura do barramento de dados | 64-Bit |
| Core Clock Frequency | 266 MHz |
| Number of Cores | 1 |
| Process Technology | 0.25 µm CMOS |
| Supply Voltage (Core) | 1.8 V |
| Supply Voltage (I/O) | 3.3 V |
| Package Type | 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) |
| Peripherals | Communication Processor Module (CPM), PCI, Ethernet, ATM, HDLC |
| Tipo de montagem | Surface Mount |
| Silicon Revision | Rev B (HIP4) |
| Tray Packaging | Yes (per distributor listings) |
Guia de Configuração de Pinos do MPC8260AZUMHBB 480-tbga (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch)
Configuração de pinos para MPC8260AZUMHBB (pacote 480-tbga (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8260AZUMHBB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8260AZUMHBB é adequado para 6 aplicaçãos: Telecom Line Cards, WAN Routers and Edge Devices, ATM Switches, DSLAM Line Cards, Industrial Control Routiers, Legacy System Maintenance and Sustainment.
Telecom Line Cards
The MPC8260AZUMHBB is well-suited for telecom line cards because of its integrated Communication Processor Module (CPM) that offloads HDLC, Transparent, and ATM protocol processing from the PowerPC G2 core. Placed as the central processor on a line card, the part handles both TDM streams via serial interfaces and packet traffic via the Ethernet MAC at 10/100 Mbps, while exposing the PCI bus for connection to framer and transceiver ICs. The 266 MHz core frequency and dedicated CPM channels keep wire-speed performance deterministic without external ASIC assistance, making this part particularly attractive for channelized E1/T1 and DSLAM line-card designs where deterministic protocol latency is critical.
Recomendado
WAN Routers and Edge Devices
In WAN router architectures, the MPC8260AZUMHBB handles routing tables, packet classification, and forwarding decisions through its integrated Ethernet MAC and PCI interface. The PowerPC G2 core runs control-plane software while the CPM routes packets between TDM and packet domains, removing the need for a separate traffic-manager ASIC. With a 1.8 V core and 3.3 V I/O supply scheme, this MPU fits legacy 3.3 V backplanes common in carrier-grade routers. The 480-TBGA package places power, ground, and high-speed signals on the bottom of the BGA, allowing controlled-impedance routing on 6+ layer PCBs.
Recomendado
ATM Switches
For ATM switches, the MPC8260AZUMHBB provides the AAL segmentation and reassembly functions through its CPM, supporting ATM Adaptation Layer 1 and 5 protocols without external hardware. The 266 MHz core runs cell-switching fabric management software while the CPM concurrently handles cell segmentation/concatenation, simplifying switch-fabric design. PCI and Ethernet interfaces connect to PHY and fabric-ICD components, allowing drop-in reuse of existing ATM switch designs. The 64-bit data bus provides high throughput required for cell switching.
Recomendado
DSLAM Line Cards
In DSL Access Multiplexer line cards, the MPC8260AZUMHBB aggregates multiple DSL link-layer connections through its multi-channel HDLC controllers in the CPM. Each xDSL line can be assigned a dedicated HDLC channel in the CPM, with the PowerPC core handling higher-layer processing for ATM-based DSL. Its 480-TBGA package and 1.8 V core / 3.3 V I/O supply scheme match typical DSLAM line-card power designs, where density and channel count per board are critical. The MPU also bridges to backplane PCI for connection to the DSLAM central processor.
Recomendado
Industrial Control Routiers
For industrial control routers in factory automation and SCADA networks, the MPC8260AZUMHBB integrates real-time protocol handling (HDLC, serial, TDM) with TCP/IP networking. The PowerPC G2 core runs deterministic routing and firewall software, while the CPM manages serial and serial-IP protocol conversion with hardware assist. The MPU accepts industrial temperature ranges and operates reliably in legacy 3.3 V backplane environments. Its PCI bus connects to digital I/O cards, sensor interfaces, and gateway PHY chips.
Recomendado
Legacy System Maintenance and Sustainment
The MPC8260AZUMHBB is commonly required to maintain deployed telecom, networking, and industrial systems that were designed around PowerQUICC II silicon. With end-of-life approaching, sourcing genuine same-package drop-in replacements for field repair is critical: parts like MPC8260ACZUMHBB (same 480-TBGA footprint) and MPC8260AZUPIBB (same package, different peripheral configuration) provide form-fit-function continuity. These alternatives allow service organizations to extend system life cycles without PCB rework when original stocks run out.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8260AZUMHBB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8260ACZUMHBB | MPC8260AZUPIBB | MPC8260AZUIHBXXX | MPC8260A |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) |
| Architecture | PowerPC G2 RISC | PowerPC G2 RISC | PowerPC G2 RISC | PowerPC G2 RISC | PowerPC G2 RISC |
| Data Bus Width | 64-Bit | 64-Bit | 64-Bit | 64-Bit | 64-Bit |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process Technology | 0.25 µm CMOS | 0.25 µm CMOS | 0.25 µm CMOS | 0.25 µm CMOS | 0.25 µm CMOS |
| Silicon Revision | HIP4 Rev B | HIP4 Rev B | HIP4 Rev B | HIP4 Rev B | HIP4 Rev B |
Principais diferenciais
- Drop-in same-package replacement across entire MPC8260A family (vs MPC8260ACZUMHBB)
- Integrated Communication Processor Module (CPM) (vs MPC8260A (base))
- Proven 0.25 µm HiP4 silicon maturity (vs MPC8260E)
- Wide third-party design support legacy (vs MPC8260AZUIHBXXX)
Notas de projeto
The 480-TBGA package (37.5 x 37.5 mm, 1.27 mm pitch) requires 6+ layer PCB with dedicated power and ground planes for the 1.8 V core and 3.3 V I/O rails. Use the IBIS model from the HiP4 hardware specification to verify signal integrity on the 64-bit data bus and high-speed serial interfaces. Escape routing must use microvia technology (laser-drilled) to fan out from the BGA balls; trace lengths should be matched within ±50 mil for bus signals and within ±25 mil for differential pairs.
Decoupling for the 1.8 V core rail requires at least 10 x 0.1 µF X7R ceramic capacitors distributed under the BGA, plus 4 x 10 µF tantalum bulk capacitors. The 3.3 V I/O rail requires similar decoupling. Estimated: at 266 MHz with typical CPM usage, the core current can reach 1.5-2 A; verify with the power calculator application note before finalizing the power tree. Power sequencing (core before I/O, or simultaneous) is critical to avoid latch-up.
Do not assume software from the MPC8260 (non-HiP4) directly runs on the MPC8260A HiP4 silicon; the silicon revision check should always be performed when porting firmware. Pinout compatibility between HiP4 and HIP3 revisions is preserved, but some memory-mapped peripheral registers changed. Consult the Hardware Specifications document for the silicon-revision-specific errata list before deployment.
Informações de conformidade
Compliance data for MPC8260AZUMHBB was not present in the verified web data above. Lifecycle status 'nrnd' (not recommended for new designs) indicates approaching end of life per NXP product page. Engineers should verify compliance certificates directly with NXP or authorized distributors before qualification.
