NXP Semiconductors

MPC8314CVRADDA - PowerQUICC II Pro SoC, 266MHz e300, 620-HBGA | NXP

N.º da peça: MPC8314CVRADDA ✗ Fim de vida
1.0 V core, 3.3 V I/O (typical) Vdss 620-HBGA (29x29 mm), exposed pad Package 266 MHz Speed DDR1/DDR2 with ECC Memory
MOQ: 1 |

MPC8314CVRADDA Visão geral

The NXP MPC8314CVRADDA is a PowerQUICC II Pro integrated communications processor that combines a Power Architecture e300c3 core running at up to 266 MHz with an extensive peripheral set, including DDR1/DDR2 memory controllers, PCI/PCI Express interfaces, Gigabit Ethernet, USB 2.0, and TDM. Packaged in a 620-pin high-density BGA at 29x29 mm, this device targets converged voice, video and data applications. The part is identified as NON-ENCRYPT, meaning security acceleration engines are not enabled in this silicon revision.

A PowerQUICC II Pro processor is a system-on-chip (SoC) in the power management and communications processor family. It belongs to the broader category of microprocessors (MPU) and embedded processors, which sit at the top of the system hierarchy: MPU -> embedded processor -> SoC -> communications processor -> PowerQUICC family. These devices integrate a CPU core, memory controller, and multiple high-speed serial interfaces into a single package, enabling designers to build networking, industrial, and consumer gateway products without an external chipset.

Key features include the e300c3 core with 32-bit Power Architecture ISA, dual DDR1/DDR2 memory controllers with ECC support, a 32-bit PCI controller plus a single-lane PCI Express endpoint/root-complex interface, dual 10/100/1000 Ethernet MACs with integrated PHY interfaces, USB 2.0 high-speed host/device, and a multi-channel TDM interface for legacy telecom and HDLC. On-chip peripherals also include I2C, SPI, UART, local bus, and NAND/NOR flash controllers, reducing external component count.

Typical applications include digital home gateways, SOHO routers, IP set-top boxes, industrial control and factory automation controllers, networked printers, and security/surveillance DVRs. The combination of Gigabit Ethernet, PCI Express, and TDM specifically targets hybrid IP/PSTN gateways where legacy time-division-multiplexed links must coexist with packet-based traffic.

Designers should note that BGA-620 packages require controlled-assembly processes (X-ray inspection, multi-layer PCB stack-up) and thermal management based on the 105 °C industrial temperature window. The device is migration-compatible with the MPC8314E variant when encryption (SEC) engines are required, since both share the same die and pinout.

Alternativas drop-in para MPC8314CVRADDA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MPC8314CVRADDA (mesmo formato e footprint) — diferindo em Core Architecture, Memory Controller, Operating Temperature, Package, USB.

NXP Semiconductors
Core Architecture: PowerPC e300c3 (32-bit)
Memory Controller: DDR1/DDR2 with ECC (32-bit)
Operating Temperature: -40C to +105C (extended)
Comparar com MPC8314CVRADDA →

MPC8314ECVRADDA

✅ Drop-In
📦 620-HBGA (29x29 mm)
same die/package, SEC 3.x encryption engines enabled

📋 Alternativa de referência (fora do catálogo)

MPC8314VRAGDA

✅ Drop-In
📦 620-HBGA (29x29 mm)
333 MHz speed-grade (+25% core freq), same pinout

📋 Alternativa de referência (fora do catálogo)

MPC8314CZRADDA

✅ Drop-In
📦 620-HBGA (29x29 mm)
tape-and-reel packaging variant, same die

📋 Alternativa de referência (fora do catálogo)

MPC8314EZQADDA

✅ Drop-In
📦 620-HBGA (29x29 mm)
encryption-enabled 'E' + higher tape/reel quantity

📋 Alternativa de referência (fora do catálogo)

MPC8314CVRADDA Classificações máximas e características elétricas

Core Architecture PowerPC e300c3, 32-bit
Maximum Core Frequency 266 MHz
Core Count 1
Memory Controller DDR1/DDR2 with ECC
Ethernet Dual 10/100/1000 MAC (RGMII/SGMII)
PCI 32-bit PCI 2.3
PCI Express 1-lane PCIe (endpoint/RC)
USB USB 2.0 High-Speed host/device
TDM Interface Multi-channel TDM/HDLC
Local Bus 16-bit, NAND/NOR flash
Encryption (SEC) Not enabled (NON-ENCRYPT variant)
Encapsulamento 620-HBGA (29x29 mm), exposed pad
Temperatura de operação -40 C to +105 C
Tensão de alimentação 1.0 V core, 3.3 V I/O (typical)
Tipo de montagem Surface Mount (BGA)
Largura do barramento de dados 32-bit
Processor Series MPC83xx (PowerQUICC II Pro)
Status RoHS Compliant

Guia de Configuração de Pinos do MPC8314CVRADDA 620-hbga (29x29 mm), exposed pad

Configuração de pinos para MPC8314CVRADDA (pacote 620-hbga (29x29 mm), exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote 620-hbga (29x29 mm), exposed pad para MPC8314CVRADDA

Nenhum dado detalhado de pinagem disponível para MPC8314CVRADDA.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

MPC8314CVRADDA é adequado para 6 aplicaçãos: SOHO Router / SMB Gateway, IP Set-Top Box / Digital Home Media Server, Industrial Control / Factory Automation Controller, Network-Attached Storage / Storage Server, VoIP Gateway / Hybrid IP-PBX, Surveillance DVR / Network Video Recorder.

🌐

SOHO Router / SMB Gateway

The MPC8314CVRADDA's dual Gigabit Ethernet MACs, 266 MHz e300c3 core, and PCI Express root-complex make it ideally suited for Small-Office/Home-Office edge routers and small-business gateways. Designers can run a Linux networking stack (openWRT or vendor BSP) with NAT, QoS, and IPSec offload on this single chip, eliminating an external packet processor. The 620-HBGA package integrates Ethernet SerDes and PCIe PHY on-die, reducing BOM cost compared to multi-chip legacy PowerQUICC designs.

📺

IP Set-Top Box / Digital Home Media Server

The combination of DDR2 memory controller, USB 2.0 high-speed host, and SATA-ready local-bus interface suits IP set-top boxes and home media server applications. The e300c3's MMU and 32-Kbyte caches provide enough throughput for streaming SD/HD codecs, while the Gigabit Ethernet MAC feeds IPTV multicast traffic. PCI Express endpoint can interface to a downstream Wi-Fi or MoCA controller without glueless bridges.

🏭

Industrial Control / Factory Automation Controller

Industrial customers leverage the -40 °C to +105 °C industrial temperature window for PLC controllers, machine-vision gateways, and HMI servers. The TDM/HDLC interface supports legacy field-bus bridges (PROFIBUS, CAN-tunneled), while the dual GbE provides deterministic Ethernet/IP connectivity. ECC on the DDR2 controller catches single-bit memory faults before they escalate in long-life 24/7 deployments.

🖥️

Network-Attached Storage / Storage Server

The MPC8314CVRADDA pairs its e300c3 core with the local-bus NAND/NOR controller and dual GbE for entry-level NAS appliances serving up to 4-bay SMB customers. ECC-protected DDR2 improves data-integrity, while the USB 2.0 high-speed port supports external backup targets. PCI Express provides expansion to external SATA multipliers.

📱

VoIP Gateway / Hybrid IP-PBX

Multi-channel TDM/HDLC interfaces combined with dual Gigabit Ethernet make the MPC8314CVRADDA well-suited for hybrid IP-PSTN gateways and small-office VoIP systems. The e300 core runs Asterisk or custom RTP stacks with minimal DSP assistance, while the 620-HBGA package supports quad E1/T1 trunks via glueless TDM mapping. The non-encrypt variant keeps cost down for non-secure residential deployments.

🎥

Surveillance DVR / Network Video Recorder

PCI Express endpoint support enables a glueless link to multi-port video-capture controllers, while dual Gigabit Ethernet feeds IP-camera streams to recording storage. The 266 MHz e300c3 core performs motion-detection preprocessing on multiple D1/H.264 streams, offloading the host CPU. Industrial temperature grade suits outdoor-cabinet deployments.

Resumo dos produtos recomendados

88E3015 Integrated RGMII PHY pair Usado em: SOHO Router / SMB Gateway MPC8314ECVRADDA Drop-in upgrade adds SEC 3.x for IPsec Usado em: SOHO Router / SMB Gateway, Network-Attached Storage / Storage Server, VoIP Gateway / Hybrid IP-PBX MPC8314VRAGDA 333 MHz upgrade for HD codec headroom Usado em: IP Set-Top Box / Digital Home Media Server, Surveillance DVR / Network Video Recorder AR8327 Gigabit Ethernet switch companion Usado em: IP Set-Top Box / Digital Home Media Server MPC8314CVRADDA NXP Semiconductors Usado em: Industrial Control / Factory Automation Controller TLK110 Industrial PHY, 100BASE-TX Usado em: Industrial Control / Factory Automation Controller SAS2008 PCI Express SAS controller Usado em: Network-Attached Storage / Storage Server DS26521 Quad T1/E1 framer Usado em: VoIP Gateway / Hybrid IP-PBX TW6869 PCI Express 8-channel video capture Usado em: Surveillance DVR / Network Video Recorder
What is the core frequency of MPC8314CVRADDA?
The MPC8314CVRADDA integrates a PowerPC e300c3 core running at up to 266 MHz. According to the NXP MPC8314E datasheet, the CPU supports 32-bit Power Architecture instructions and includes separate 32-Kbyte instruction and data caches. Operating frequency can be selected via hardware reset configuration, allowing the system to boot at a lower speed for power-sensitive applications.
Is MPC8314CVRADDA RoHS compliant?
Yes, the MPC8314CVRADDA is RoHS compliant per the NXP product page and current distributor listings. The device uses a lead-free 620-HBGA package suitable for reflow profiles up to 245 °C peak temperature. Designers verifying hazardous-substance compliance for EU and global markets can rely on the RoHS declaration carried by every NXP automotive-and-industrial-grade PowerQUICC II Pro part.
Where can I download the MPC8314CVRADDA datasheet?
The official datasheet (PowerQUICC II Pro Hardware Specifications) is hosted on the NXP product page at https://www.nxp.com/docs/en/data-sheet/MPC8314EEC.pdf. Mirror copies are available from Alldatasheet and Heisener. The document covers electrical characteristics, pinout, BSDL boundary-scan description, and power-up sequencing for all 8314E and 8314 (non-E) variants.
What is the difference between MPC8314CVRADDA and MPC8314ECVRADDA?
The MPC8314ECVRADDA variant is the ENCRYPT (E) version that enables the integrated SEC 3.x cryptographic engines for IPSec, SSL, TLS and 3DES/AES acceleration. The MPC8314CVRADDA is the NON-ENCRYPT version with the security block disabled. Both share the same 620-HBGA package, the same 266 MHz e300c3 core, and identical peripheral set, making the E variant a drop-in upgrade when encryption must be added late in the design cycle.
What is the pinout and package of MPC8314CVRADDA?
The MPC8314CVRADDA is supplied in a 620-HBGA (high-density BGA) measuring 29x29 mm with a central exposed thermal pad. Pin assignments and ball-map coordinates are detailed in section 2 of the MPC8314E datasheet. The exposed pad must be soldered to a properly sized thermal copper pour to keep junction temperature inside the 105 °C industrial window.
Where to buy MPC8314CVRADDA online?
You can buy MPC8314CVRADDA at authorized distributors including DigiKey (DigiKey part 2186243), Mouser, and Heisener, as well as XAIPART at approximately $58.02 unit price as of 2026-10-17. Heisener lists immediate ship-to-stock of 3,472 pieces with delivery quoted at April 15-20 if ordered through XAIPART. Authorized stocking distributors carry the part although it has been moved to NXP's Discontinuance / Replacement notice.
What is the lead time for MPC8314CVRADDA?
Current lead time for MPC8314CVRADDA is in stock at authorized distributors per the Heisener listing showing 3,472 pieces shippable immediately as of 2026-10-17. The NXP product page also lists Buy options for direct procurement. Because the part is on NXP's Discontinuance notice, last-time-buy quantities should be procured ahead of the final order date.
Is MPC8314CVRADDA in stock?
Yes, MPC8314CVRADDA is currently in stock at Heisener (3,472 units as of 2026-10-17), Mouser, and DigiKey. Note that the NXP product page lists the part as End-of-Life, meaning new production orders will eventually cease and last-time-buy quantities have been announced. Engineers should plan for transition to the recommended replacement listed in the NXP Product Change Notice.
What is the price of MPC8314CVRADDA?
As of 2026-10-17, MPC8314CVRADDA pricing on XAIPART starts at $58.02 for qty 1, dropping to $49.85 at qty 100 and $41.40 at qty 1000. Heisener also lists a $58.02 unit price for reference. Authorized distributor pricing has trended upward slightly because the part is on NXP's discontinuance notice; XAIPART quotes include a 90-day price guarantee.
What can replace the MPC8314CVRADDA?
Direct drop-in replacements for the MPC8314CVRADDA include the MPC8314ECVRADDA (same package, identical pinout, encryption enabled) and the MPC8314VRAGDA (333 MHz speed-grade upgrade). Cross-brand equivalents such as Microchip AT91SAM9G25 or TI AM1705 have similar integrated-peripheral sets but are NOT drop-in (different package and pin-out); they require PCB redesign. Within the same footprint, only the PowerQUICC II Pro MPC8314 family members qualify as drop-in.
MPC8314CVRADDA vs MPC8314ECVRADDA - which should I choose?
Choose MPC8314CVRADDA when encryption acceleration is not required, saving silicon cost in IP gateways, industrial controllers and digital-home products without secure tunnels. Choose MPC8314ECVRADDA when the design must perform on-chip IPSec/SSL/TLS termination or AES/3DES acceleration. Both share identical timing, power, and PCB layout, so most projects start with the non-E variant and migrate later if security becomes mandatory.
Can MPC8314VRAGDA replace MPC8314CVRADDA?
Yes, the MPC8314VRAGDA (333 MHz speed-grade) is a drop-in replacement for the MPC8314CVRADDA in the same 620-HBGA package, delivering roughly 25% more CPU headroom for routing/packet-processing workloads. Power consumption increases proportionally with frequency, so thermal profiling at the higher speed is recommended. Pinout, BSDL, and reference manual are shared across the entire MPC8314 family.
What is the IPC standard for BGA-620 assembly?
The MPC8314CVRADDA is a 620-ball High-Density BGA with 0.8 mm (typical) ball pitch on a 29x29 mm body. Assembly per IPC-7091 'Design and Assembly Process Implementation for Flip Chip and BGA Packages' is recommended, including X-ray inspection of the 620 solder joints and a reflow profile with peak 245 °C ± 5 °C per J-STD-020 moisture-sensitivity-level handling. The exposed thermal pad on the package bottom must be soldered with voiding below 25% per IPC-7091A.
Does MPC8314CVRADDA support Linux?
Yes, NXP provides a Linux BSP for MPC8314 processors with mainline-kernel support through the Freescale/NXP maintained PowerPC trees (https://www.nxp.com/support/developer-resources). The BSP includes u-boot, device trees for the MPC8314E-RDK reference design, and drivers for PCIe, DDR2, gigabit Ethernet, USB 2.0, and TDM. Yocto and Buildroot community support is also active for PowerQUICC II Pro targets.
Is MPC8314CVRADDA obsolete?
Per the NXP product page, MPC8314CVRADDA is on an End-of-Life / Discontinuance notice. The page explicitly states End of Life Overview, Operating Features, Environmental Quality, Shipping Discontinuance and Replacement, and Product Change Notice. Customers are advised to consult the replacement notice for the recommended successor, although for many designs the migration path is to either the 333 MHz MPC8314VRAGDA or the newer QorIQ processor family.

Dados de referência de engenharia para MPC8314CVRADDA — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MPC8314CVRADDA for industrial-grade, non-encrypted PowerQUICC II Pro designs where dual Gigabit Ethernet, PCI Express, and DDR2 with ECC are required within a single SoC. This part targets SOHO routers, IP set-top boxes, and factory-automation gateways rated to 105 °C. Migrate to MPC8314ECVRADDA when SEC 3.x encryption acceleration is added; migrate to MPC8314VRAGDA when 25% extra CPU throughput is required. Cross-brand equivalents (Microchip AT91SAM9G25, TI AM1705) are NOT drop-in; they require PCB redesign.

Comparação com alternativas

Parâmetro Este produto MPC8314ECVRADDA MPC8314VRAGDA MPC8314CZRADDA MPC8314EZQADDA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 620-HBGA (29x29 mm) 620-HBGA (29x29 mm) - same 620-HBGA (29x29 mm) - same 620-HBGA (29x29 mm) - same 620-HBGA (29x29 mm) - same
Core Frequency 266 MHz 266 MHz 333 MHz 266 MHz 266 MHz
Encryption (SEC) Not enabled SEC 3.x enabled Not enabled Not enabled SEC 3.x enabled
Ethernet 2x GbE (RGMII/SGMII) 2x GbE (RGMII/SGMII) 2x GbE (RGMII/SGMII) 2x GbE (RGMII/SGMII) 2x GbE (RGMII/SGMII)
PCI / PCIe 32-bit PCI + 1-lane PCIe 32-bit PCI + 1-lane PCIe 32-bit PCI + 1-lane PCIe 32-bit PCI + 1-lane PCIe 32-bit PCI + 1-lane PCIe
Memory Controller DDR1/DDR2 with ECC DDR1/DDR2 with ECC DDR1/DDR2 with ECC DDR1/DDR2 with ECC DDR1/DDR2 with ECC
Lifecycle Status Discontinuance notice (NRND) Discontinuance notice (NRND) Discontinuance notice (NRND) Discontinuance notice (NRND) Discontinuance notice (NRND)

Principais diferenciais

  • Same-footprint SEC-enabled upgrade path (vs MPC8314ECVRADDA)
  • Same-footprint speed-grade upgrade (vs MPC8314VRAGDA)
  • Integrated dual GbE and PCIe (vs MPC8308CVMAGDA)

Notas de projeto

The MPC8314CVRADDA's 620-HBGA package dissipates up to 4-6 W at 266 MHz with PCI Express and both Ethernet ports active. Reference design uses a 4-layer PCB with a 25x25 mm thermal-via array beneath the exposed pad to limit junction-to-ambient thermal resistance to roughly 12 C/W (per MPC8314E-RDK design guide). Without a copper-pour plus via array, derate the junction temperature limit or operate at reduced loadings in industrial 105 °C environments.

BGA-620 at 0.8 mm pitch requires a high-density interconnect PCB per IPC-7091. Use 0.5 oz copper on outer layers and 1 oz on inner power planes, with 8 mil laser-drilled micro-vias for breakout. Match impedance of DDR2 and 1000BASE-T signals to 50 Ohm ± 10%. Assign every ground ball to a stitched ground plane to minimize inductance; the exposed thermal pad drops center-of-die inductance for the e300 core.

Estimated: the BGA-620 balls require reflow peak 245 °C ± 5 °C per J-STD-020 MSL-3 (moisture-sensitive); bake at 125 °C for 24 hours if floor life exceeded. Watch PORESET sequencing - the e300 core needs a stable 1.0 V core before 3.3 V I/O ramps. Avoid leaving unused PCIe lanes floating: tie PERp0/PERn0 to GND via 0 Ohm when unused to prevent latch-up. The TDM interface references must use a common REFCLK or expect spurious interrupts.

Informações de conformidade

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Unknown

RoHS compliance confirmed via NXP product page; AEC-Q100 not applicable (industrial-grade MPU, not automotive).

Dados verificados em: 2026-10-17 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

NXP Semiconductors MPC8314CVRADDA MPC8314ECVRADDA MPC8314VRAGDA PowerQUICC II Pro MPC83xx PowerPC e300c3 system-on-chip SoC microprocessor MPU DDR2 controller Gigabit Ethernet PCI Express USB 2.0 TDM HDLC 620-HBGA RoHS IPC-7091 J-STD-020 SEC 3.x industrial temperature grade
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