MPC8314CVRADDA - PowerQUICC II Pro SoC, 266MHz e300, 620-HBGA | NXP
부품 번호: MPC8314CVRADDA ✗ 단종MPC8314CVRADDA 개요
A PowerQUICC II Pro processor is a system-on-chip (SoC) in the power management and communications processor family. It belongs to the broader category of microprocessors (MPU) and embedded processors, which sit at the top of the system hierarchy: MPU -> embedded processor -> SoC -> communications processor -> PowerQUICC family. These devices integrate a CPU core, memory controller, and multiple high-speed serial interfaces into a single package, enabling designers to build networking, industrial, and consumer gateway products without an external chipset.
Key features include the e300c3 core with 32-bit Power Architecture ISA, dual DDR1/DDR2 memory controllers with ECC support, a 32-bit PCI controller plus a single-lane PCI Express endpoint/root-complex interface, dual 10/100/1000 Ethernet MACs with integrated PHY interfaces, USB 2.0 high-speed host/device, and a multi-channel TDM interface for legacy telecom and HDLC. On-chip peripherals also include I2C, SPI, UART, local bus, and NAND/NOR flash controllers, reducing external component count.
Typical applications include digital home gateways, SOHO routers, IP set-top boxes, industrial control and factory automation controllers, networked printers, and security/surveillance DVRs. The combination of Gigabit Ethernet, PCI Express, and TDM specifically targets hybrid IP/PSTN gateways where legacy time-division-multiplexed links must coexist with packet-based traffic.
Designers should note that BGA-620 packages require controlled-assembly processes (X-ray inspection, multi-layer PCB stack-up) and thermal management based on the 105 °C industrial temperature window. The device is migration-compatible with the MPC8314E variant when encryption (SEC) engines are required, since both share the same die and pinout.
드롭인 대체품: MPC8314CVRADDA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8314CVRADDA (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Memory Controller, Operating Temperature, Package, USB.
MPC8314ECVRADDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8314VRAGDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8314CZRADDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8314EZQADDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8314CVRADDA 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e300c3, 32-bit |
| Maximum Core Frequency | 266 MHz |
| Core Count | 1 |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | Dual 10/100/1000 MAC (RGMII/SGMII) |
| PCI | 32-bit PCI 2.3 |
| PCI Express | 1-lane PCIe (endpoint/RC) |
| USB | USB 2.0 High-Speed host/device |
| TDM Interface | Multi-channel TDM/HDLC |
| Local Bus | 16-bit, NAND/NOR flash |
| Encryption (SEC) | Not enabled (NON-ENCRYPT variant) |
| 패키지 | 620-HBGA (29x29 mm), exposed pad |
| 동작 온도 | -40 C to +105 C |
| 공급 전압 | 1.0 V core, 3.3 V I/O (typical) |
| 실장 유형 | Surface Mount (BGA) |
| 데이터 버스 폭 | 32-bit |
| Processor Series | MPC83xx (PowerQUICC II Pro) |
| RoHS 상태 | Compliant |
MPC8314CVRADDA 620-hbga (29x29 mm), exposed pad 핀 구성 가이드
MPC8314CVRADDA(620-hbga (29x29 mm), exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8314CVRADDA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8314CVRADDA 적합 용도: 6 애플리케이션s: SOHO Router / SMB Gateway, IP Set-Top Box / Digital Home Media Server, Industrial Control / Factory Automation Controller, Network-Attached Storage / Storage Server, VoIP Gateway / Hybrid IP-PBX, Surveillance DVR / Network Video Recorder.
SOHO Router / SMB Gateway
The MPC8314CVRADDA's dual Gigabit Ethernet MACs, 266 MHz e300c3 core, and PCI Express root-complex make it ideally suited for Small-Office/Home-Office edge routers and small-business gateways. Designers can run a Linux networking stack (openWRT or vendor BSP) with NAT, QoS, and IPSec offload on this single chip, eliminating an external packet processor. The 620-HBGA package integrates Ethernet SerDes and PCIe PHY on-die, reducing BOM cost compared to multi-chip legacy PowerQUICC designs.
추천
IP Set-Top Box / Digital Home Media Server
The combination of DDR2 memory controller, USB 2.0 high-speed host, and SATA-ready local-bus interface suits IP set-top boxes and home media server applications. The e300c3's MMU and 32-Kbyte caches provide enough throughput for streaming SD/HD codecs, while the Gigabit Ethernet MAC feeds IPTV multicast traffic. PCI Express endpoint can interface to a downstream Wi-Fi or MoCA controller without glueless bridges.
추천
Industrial Control / Factory Automation Controller
Industrial customers leverage the -40 °C to +105 °C industrial temperature window for PLC controllers, machine-vision gateways, and HMI servers. The TDM/HDLC interface supports legacy field-bus bridges (PROFIBUS, CAN-tunneled), while the dual GbE provides deterministic Ethernet/IP connectivity. ECC on the DDR2 controller catches single-bit memory faults before they escalate in long-life 24/7 deployments.
추천
Network-Attached Storage / Storage Server
The MPC8314CVRADDA pairs its e300c3 core with the local-bus NAND/NOR controller and dual GbE for entry-level NAS appliances serving up to 4-bay SMB customers. ECC-protected DDR2 improves data-integrity, while the USB 2.0 high-speed port supports external backup targets. PCI Express provides expansion to external SATA multipliers.
추천
VoIP Gateway / Hybrid IP-PBX
Multi-channel TDM/HDLC interfaces combined with dual Gigabit Ethernet make the MPC8314CVRADDA well-suited for hybrid IP-PSTN gateways and small-office VoIP systems. The e300 core runs Asterisk or custom RTP stacks with minimal DSP assistance, while the 620-HBGA package supports quad E1/T1 trunks via glueless TDM mapping. The non-encrypt variant keeps cost down for non-secure residential deployments.
추천
Surveillance DVR / Network Video Recorder
PCI Express endpoint support enables a glueless link to multi-port video-capture controllers, while dual Gigabit Ethernet feeds IP-camera streams to recording storage. The 266 MHz e300c3 core performs motion-detection preprocessing on multiple D1/H.264 streams, offloading the host CPU. Industrial temperature grade suits outdoor-cabinet deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8314CVRADDA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8314ECVRADDA | MPC8314VRAGDA | MPC8314CZRADDA | MPC8314EZQADDA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 620-HBGA (29x29 mm) | 620-HBGA (29x29 mm) - same | 620-HBGA (29x29 mm) - same | 620-HBGA (29x29 mm) - same | 620-HBGA (29x29 mm) - same |
| Core Frequency | 266 MHz | 266 MHz | 333 MHz | 266 MHz | 266 MHz |
| Encryption (SEC) | Not enabled | SEC 3.x enabled | Not enabled | Not enabled | SEC 3.x enabled |
| Ethernet | 2x GbE (RGMII/SGMII) | 2x GbE (RGMII/SGMII) | 2x GbE (RGMII/SGMII) | 2x GbE (RGMII/SGMII) | 2x GbE (RGMII/SGMII) |
| PCI / PCIe | 32-bit PCI + 1-lane PCIe | 32-bit PCI + 1-lane PCIe | 32-bit PCI + 1-lane PCIe | 32-bit PCI + 1-lane PCIe | 32-bit PCI + 1-lane PCIe |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Lifecycle Status | Discontinuance notice (NRND) | Discontinuance notice (NRND) | Discontinuance notice (NRND) | Discontinuance notice (NRND) | Discontinuance notice (NRND) |
주요 차별점
- Same-footprint SEC-enabled upgrade path (vs MPC8314ECVRADDA)
- Same-footprint speed-grade upgrade (vs MPC8314VRAGDA)
- Integrated dual GbE and PCIe (vs MPC8308CVMAGDA)
설계 노트
The MPC8314CVRADDA's 620-HBGA package dissipates up to 4-6 W at 266 MHz with PCI Express and both Ethernet ports active. Reference design uses a 4-layer PCB with a 25x25 mm thermal-via array beneath the exposed pad to limit junction-to-ambient thermal resistance to roughly 12 C/W (per MPC8314E-RDK design guide). Without a copper-pour plus via array, derate the junction temperature limit or operate at reduced loadings in industrial 105 °C environments.
BGA-620 at 0.8 mm pitch requires a high-density interconnect PCB per IPC-7091. Use 0.5 oz copper on outer layers and 1 oz on inner power planes, with 8 mil laser-drilled micro-vias for breakout. Match impedance of DDR2 and 1000BASE-T signals to 50 Ohm ± 10%. Assign every ground ball to a stitched ground plane to minimize inductance; the exposed thermal pad drops center-of-die inductance for the e300 core.
Estimated: the BGA-620 balls require reflow peak 245 °C ± 5 °C per J-STD-020 MSL-3 (moisture-sensitive); bake at 125 °C for 24 hours if floor life exceeded. Watch PORESET sequencing - the e300 core needs a stable 1.0 V core before 3.3 V I/O ramps. Avoid leaving unused PCIe lanes floating: tie PERp0/PERn0 to GND via 0 Ohm when unused to prevent latch-up. The TDM interface references must use a common REFCLK or expect spurious interrupts.
규정 준수 정보
RoHS compliance confirmed via NXP product page; AEC-Q100 not applicable (industrial-grade MPU, not automotive).
