MPC8323CVRADDCA - 266MHz PowerQUICC II Pro PBGA-516 | NXP
N.º da peça: MPC8323CVRADDCA ⚠ Última compraMPC8323CVRADDCA Visão geral
A PowerQUICC II Pro processor is a Power-Architecture (Book-E) communications SoC family combining a CPU core, system logic and a programmable protocol engine. The "PowerQUICC" naming traces back to Freescale's original QUICC engine architecture; "II Pro" denotes enhanced CPU performance, faster serial interfaces, and integrated DDR memory support. These parts sit in the broader taxonomy of microprocessor IC > integrated communications processor > networking SoC > embedded MPU. They are commonly used in routers, DSLAMs, customer-premises equipment, industrial gateways, and PCI/USB-attached control boards where deterministic protocol handling matters.
Key features of the MPC8323CVRADDCA include 266MHz e300c2 core clock, integrated DDR1/DDR2 SDRAM controller with ECC, dual Gigabit Ethernet MACs with HiP3 GMII/RGMII/TBI support, a programmable QUICC Engine for TDM/UTOPIA/ATM/HDLC/PPP/serial multiplexing, USB 2.0 (full/high speed) on-chip PHY, PCI 2.3 interface, security accelerator (SEC 2.0 with DES/3DES/AES/SHA-1/MD-5), DMA controller, and JTAG/COP debug. The industrial-grade temperature range is -40C to +105C for fanless networking and harsh-environment designs. Hardware specifications are documented in the Freescale/NXP PowerQUICC II Pro MPC8323E family hardware specifications document.
The architecture pairs the e300c2 superscalar core with a coherent system bus and dedicated DMA paths to the QUICC Engine, allowing the host CPU to offload time-critical protocol work without consuming interrupt budget. The integrated security engine accelerates bulk cryptography without tying up the core, while PCI, USB, and Ethernet MACs expose the device directly to networking and host-controller chipsets on a typical line card or control blade.
Typical applications include broadband gateways, DSLAM line cards, multi-protocol routers, industrial Ethernet switches, networked printing and imaging controllers, and PCI-attached storage controllers. The part is widely designed into long-lifecycle industrial and telecom platforms because of its extended temperature grade and mature Freescale/NXP toolchain (CodeWarrior, Linux BSP).
When designing with the MPC8323, allocate a 27x27 mm footprint with 1.0 mm ball pitch, route DDR2 with 50 ohm controlled-impedance traces, and follow the manufacturer's hardware design checklist for power sequencing and thermal pad soldering. The extended-temperature grade parts (suffix "C") are recommended for outdoor and industrial enclosures.
This page synthesizes distributor pricing, datasheet specifications, application guidance, and drop-in alternative comparison data not collected in any single vendor listing.
Alternativas drop-in para MPC8323CVRADDCA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8323CVRADDCA (mesmo formato e footprint) — diferindo em Core Architecture, Communications Engine, Ethernet MACs, Memory Controller, PCI Interface.
MPC8323ECVRADDCA
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →MPC8323CVRADDC
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →MPC8323EZQADDCA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8323CVRADDCA Classificações máximas e características elétricas
| Core Architecture | e300c2 (Power Architecture Book-E) |
| Core Count | 1 |
| Largura do barramento de dados | 32-bit |
| Maximum CPU Clock | 266 MHz |
| Temperatura de operação | -40C to +105C |
| Package Type | PBGA-516 (27x27 mm, 1.0 mm pitch, 2.25 mm height) |
| Lead Free / RoHS | Lead free |
| Integrated Memory Controller | DDR1/DDR2 SDRAM with ECC |
| Ethernet MACs | 2x 10/100/1000 GMII/TBI/RGMII |
| Protocol Engine | QUICC Engine (TDM/UTOPIA/ATM/HDLC/PPP) |
| USB Interface | USB 2.0 (Full/High Speed) integrated PHY |
| PCI Interface | PCI 2.3 |
| Security Accelerator | SEC 2.0 (DES/3DES/AES/SHA-1/MD-5/RSA) |
| Debug Interface | JTAG / COP |
| DMA | General-purpose DMA controller on chip |
| Family | PowerQUICC II Pro (MPC8323E) |
Guia de Configuração de Pinos do MPC8323CVRADDCA pbga-516 (27x27 mm, 1.0 mm pitch, 2.25 mm height)
Configuração de pinos para MPC8323CVRADDCA (pacote pbga-516 (27x27 mm, 1.0 mm pitch, 2.25 mm height)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8323CVRADDCA.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8323CVRADDCA é adequado para 6 aplicaçãos: Broadband DSLAM Line Cards, Industrial Ethernet Gateways, Multi-Protocol Routers, Network-Attached Storage and Print Controllers, Customer Premises Equipment (CPE), PCI/USB Control Plane Boards.
Broadband DSLAM Line Cards
The MPC8323CVRADDCA fits DSLAM line-card designs because it integrates the QUICC Engine needed for UTOPIA, ATM, and HDLC transport, plus dual Gigabit Ethernet MACs (GMII/RGMII) for upstream aggregation to the DSLAM switch fabric. At 266 MHz the e300c2 core handles routing table management and per-subscriber Quality-of-Service scheduling at line-rate without offloading bottlenecks. The on-chip DDR1/DDR2 controller with ECC maintains deterministic packet buffer memory shared with the QUICC Engine. Unlike a discrete MAC plus MCU approach, this single-SoC solution reduces board area, BOM, and software complexity - critical for dense line cards where 16 to 32 ports per chassis squeeze router-board real-estate budgets.
Recomendado
Industrial Ethernet Gateways
The part's -40C to +105C industrial temperature range, dual Gigabit Ethernet, USB 2.0 host, and PCI 2.3 expansion make it a strong fit for factory-floor protocol gateways bridging Modbus/TCP, PROFINET, EtherNet/IP, and emerging TSN segments. The 266 MHz Power Architecture core runs gateway protocol stacks while the QUICC Engine accelerates legacy serial and TDM field-bus interconnects still common in supervisory control systems. Compared with a general-purpose MPU at the same clock, the integrated PCI and USB save a bridge chip, lowering the BOM and reducing points of failure in unmanned cabinets. Designers typically pair the device with industrial-grade DDR2 SO-DIMM or solder-down DRAM and tamper-resistant SPI NOR for firmware.
Recomendado
Multi-Protocol Routers
Multi-protocol branch-office routers benefit from the MPC8323CVRADDCA's QUICC Engine (HDLC/PPP), dual Gigabit Ethernet, and hardware-accelerated cryptography in a single chip. At 266 MHz the e300c2 core can sustain routing and firewall workloads even with VPN tunnels on modest WAN links, while the SEC 2.0 engine (in MPC8323E-family variants) accelerates IPsec/3DES/AES bulk encryption. The integrated PCI 2.3 bus lets designers add a hardware crypto offload card or a T1/E1 framer daughter-board for legacy WAN connectivity. A typical design terminates 2x GbE WAN ports plus a QUICC-managed TDM/serial multi-link trunk on a single board, removing the need for an external CPU and reducing per-port cost in volume deployments.
Recomendado
Network-Attached Storage and Print Controllers
PCI 2.3, USB 2.0, and dual Gigabit Ethernet on the MPC8323CVRADDCA map naturally to NAS, SAN, and networked printer controllers where the host needs reliable LAN connectivity plus expansion slots for storage or scanner modules. The e300c2 core runs the RAID stack, SMB/CIFS or iSCSI initiator, plus job scheduler at 266 MHz with headroom for small-office workloads. Hardware ECC on the DDR controller strengthens data path reliability for write-back caching where bit errors cannot be tolerated. Compared with a discrete multi-chip MPU + bridge solution, the integrated PCI and USB reduce PCB layers and BOM in compact desktop NAS enclosures, while the industrial temperature grade supports ambient-tolerant deployments in warehouses.
Recomendado
Customer Premises Equipment (CPE)
Residential and SMB CPE such as integrated access devices, VoIP gateways, and smart home hubs benefit from the MPC8323CVRADDCA's mix of Ethernet, USB, PCI, and QUICC Engine TDM/ATM support. The 266 MHz e300c2 core runs VoIP stacks, packet classification, and QoS marking with the QUICC Engine offloading DSP and DSL framing work. Hardware cryptography in the MPC8323E-family variant lets the gateway terminate IPsec/SRTP without taxing the main CPU, preserving voice quality. Designers typically pair the SoC with a DSL analog front-end or a fiber SFP cage, a Wi-Fi module on PCI/USB, and 64 to 256 MB of DDR2 memory for the OS image plus runtime buffers.
Recomendado
PCI/USB Control Plane Boards
PCI-attached control-plane boards in switches, routers, and base stations use the MPC8323CVRADDCA as a service-card MPU running OAM, telemetry, or management agent software. The PCI 2.3 interface plugs directly into a host backplane, while the USB 2.0 port handles 3G/4G modem or Wi-Fi module uplink. The on-chip DDR2 controller eliminates external buffers, and the QUICC Engine accelerates serial OAM channels on TDM/HDLC for legacy telecom boards. Compared with a generic micro-controller, this part supplies the encryption engine, deterministic protocol offload, and industrial temperature grade demanded by carrier-class control cards.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8323CVRADDCA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8323ECVRADDCA | MPC8323CVRADDC | MPC8323EZQADDCA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | PBGA-516 (27x27 mm) | PBGA-516 (27x27 mm) - same | PBGA-516 (27x27 mm) - same | PBGA-516 (27x27 mm) - same |
| Core Architecture | e300c2 (Power Architecture Book-E) | e300c2 (Power Architecture Book-E) | e300c2 (Power Architecture Book-E) | e300c2 (Power Architecture Book-E) |
| Maximum CPU Clock | 266 MHz | 266 MHz | 266 MHz | 266 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Ethernet MACs | 2x 10/100/1000 GMII/RGMII/TBI | 2x 10/100/1000 GMII/RGMII/TBI | 2x 10/100/1000 GMII/RGMII/TBI | 2x 10/100/1000 GMII/RGMII/TBI |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principais diferenciais
- 270 MHz-class performance with integrated QUICC Engine (vs MPC8321EVRADDCA)
- On-chip DDR1/DDR2 with ECC (vs MPC8313CVRADDC)
- Industrial temperature grade -40C to +105C (vs Standard MPC8323 commercial variants)
Notas de projeto
Route DDR2 address, command, and data signals as 50 ohm controlled-impedance traces with matched lengths per the Freescale/NXP hardware design checklist. Place VTT termination resistors within 2 inches of the controller pins. Use microstrip or stripline construction, keep reference planes unbroken under the BGA escape region, and provide a minimum of 4 layers with dedicated ground and power planes around the 27x27 mm PBGA footprint.
The 27x27 mm PBGA must dissipate several watts in router/gateway workloads. Estimate: at 1.5W typical power dissipation and 1.0 W/m-K PCB thermal conductivity, a 4-layer board with full ground plane keeps junction temperature rise around 20 to 25 C above ambient. Add thermal vias under the die area, consider a heat spreader or heat sink, and validate with the manufacturer-supplied thermal model before finalizing the enclosure thermal budget.
Do not assume the MPC8323CVRADDCA and the MPC8323EVRADDCA are drop-in equivalents. The base part may ship without the SEC 2.0 engine exposed - verify the exact dash code against the official ordering information. Confusing the MPC8323 family with the MPC8313 family is also a common pitfall: the latter is a lower-cost, lower-feature sibling with a different BGA pinout that cannot be dropped onto an MPC8323 board. Always check the BGA pinout revision in the latest hardware specifications document before PCB layout release.
Informações de conformidade
Lead-free per Freescale/NXP material declaration on the PBGA-516 package. RoHS and REACH compliance inferred from manufacturer product page text; AEC-Q100 not applicable to a communications MPU. Halogen-free status not stated in the provided data and is marked unknown.
