MPC8343EVRAGDB - PowerQUICC II Pro 400MHz Host Processor | NXP
N.º da peça: MPC8343EVRAGDB ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $65 | $65,00 |
| 10 | $58.5 | $585,00 |
| 100 | $52 | $5.200,00 |
| 500 | $46.5 | $23.250,00 |
| 1.000 | $41 | $41.000,00 |
MPC8343EVRAGDB Visão geral
A PowerQUICC (Quad Integrated Communications Controller) processor is a specialized communications SoC that combines a PowerPC host CPU with one or more RISC communications processor modules (CPM) for handling serial protocols, packet processing, and networking I/O. The PowerQUICC family evolved into MPC83xx and MPC85xx lines, all targeting telecom, networking, and industrial control where deterministic, hardware-accelerated protocol handling is required alongside a general-purpose host CPU.
The MPC8343EVRAGDB supports 1.8V, 2.5V, and 3.3V I/O voltages, contains a 32-bit DDR1/DDR2 SDRAM memory controller with ECC, and integrates dual 10/100/1000 Mbit Ethernet MACs, USB 2.0 (Full/Low Speed), PCI v2.3 interface, and an integrated security engine supporting DES, 3DES, AES, SHA-1, MD-5, and public-key algorithms. The e300 core is software-compatible with the older PowerPC 603e, preserving legacy software investments while adding modern peripheral integration.
Typical applications include SOHO and SMB routers, DSL and cable modems, integrated access devices, network attached storage (NAS), print servers, industrial gateways, and secure communications equipment. The integrated SEC engine offloads IPsec, SSL/TLS, and VPN processing, allowing the host CPU to focus on application-level tasks. According to NXP documentation, the e300 core combined with the CPM provides deterministic multi-protocol handling without software overhead.
When designing with this device, ensure proper thermal management: power dissipation reaches several watts at 400 MHz operation, and the HCTE BGA requires via-array PCB thermal relief. The part is rated for industrial 0 to 105C operation, and the security engine requires firmware initialization before use.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and engineering design notes for the MPC8343EVRAGDB, providing context not found in the standalone NXP datasheet.
Alternativas drop-in para MPC8343EVRAGDB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8343EVRAGDB (mesmo formato e footprint) — diferindo em Ethernet, USB, Memory Controller, Operating Temperature, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8343EZQAGDB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8343VRAGDB
✅ Drop-In✓ Em estoque
$22.4 / unidade
Ver ficha técnica →MPC8343CVRAGDB
✅ Drop-In✓ Em estoque
$79.4 / unidade
Ver ficha técnica →MPC8343EVRAGDB-T
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8343EAZQAGDB
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8343EVRAGDB Classificações máximas e características elétricas
| Core Architecture | PowerPC e300 (32-bit) |
| Core Frequency | 400 MHz |
| Encapsulamento | 620-pin HCTE BGA (29x29 mm) |
| Temperatura de operação | 0C to 105C |
| Memory Controller | DDR1/DDR2 SDRAM with ECC |
| Ethernet | 2x 10/100/1000 Mbit MAC |
| PCI Interface | PCI v2.3 |
| USB | USB 2.0 Full/Low Speed |
| Security Engine | SEC (DES/3DES/AES/SHA-1/MD-5/RSA) |
| I/O Voltage | 1.8V / 2.5V / 3.3V |
| Process Technology | 0.13 um CMOS |
| Series | PowerQUICC II Pro (MPC83xx) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant (Pb-free per NXP datasheet) |
| Tray Packaging | Tray (per FindIC datasheet listing) |
Guia de Configuração de Pinos do MPC8343EVRAGDB 620-pin hcte bga (29x29 mm)
Configuração de pinos para MPC8343EVRAGDB (pacote 620-pin hcte bga (29x29 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8343EVRAGDB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8343EVRAGDB é adequado para 6 aplicaçãos: SOHO/SMB Routers and Gateways, DSL and Cable Modem Integrated Access Devices, Network Attached Storage (NAS) and Print Servers, Industrial Gateways and Secure Communications, Wireless LAN Access Points and Controllers, Embedded Firewall and VPN Appliances.
SOHO/SMB Routers and Gateways
The MPC8343EVRAGDB fits SOHO and SMB routers because its 400 MHz e300 core, integrated dual Gigabit Ethernet MACs, and PCI expansion enable wire-speed routing and firewall processing in a single SoC. The hardware security engine offloads IPsec and SSL/TLS, freeing the CPU for routing tables and QoS. Memory bandwidth from the DDR1/DDR2 controller with ECC keeps packet buffers fast and reliable. Compared to a CPU + discrete NIC design, this integration cuts BOM cost and PCB area. Designers can stack a wireless mini-PCI card on the PCI bus for 802.11 access point variants. The 0 to 105C industrial temperature range supports fanless enclosures.
Recomendado
DSL and Cable Modem Integrated Access Devices
The MPC8343EVRAGDB is a strong fit for DSL/cable modem IADs because its PowerQUICC II Pro CPM handles ATM, PPP, and Ethernet protocols in hardware alongside the e300 host CPU. The integrated security engine accelerates VPN termination and parental-control filtering for residential gateways. DDR1/DDR2 memory with ECC supports voice-over-IP packet buffers, while the PCI bus can host a DSP for VoIP or an xDSL analog front-end. The 620-pin HCTE BGA allows compact motherboard designs for set-top-box form factors, and the 1.8/2.5/3.3V I/O simplifies mixed-voltage PHY interfaces.
Recomendado
Network Attached Storage (NAS) and Print Servers
The MPC8343EVRAGDB serves NAS appliances and print servers well thanks to its 400 MHz e300 CPU for filesystem operations, dual Gigabit Ethernet for LAN aggregation or link failover, and PCI for SATA/RAID controller cards. ECC DDR1/DDR2 memory prevents silent data corruption in long-running storage workloads. The USB 2.0 port supports external backup drives and printer sharing. Compared to ARM-based NAS chips, the PowerPC core offers stronger single-threaded performance for Samba/NFS throughput. The integrated SEC engine enables encrypted backups without CPU bottleneck.
Recomendado
Industrial Gateways and Secure Communications
The MPC8343EVRAGDB is ideal for industrial gateways requiring secure field-bus to Ethernet bridging, because its 0 to 105C operating range covers factory floor environments and the integrated SEC engine provides hardware-accelerated IPsec for site-to-site VPNs. The dual Gigabit Ethernet MACs support redundant ring topologies common in industrial Ethernet, while PCI can host CAN, Profibus, or RS-485 interface cards. The e300 core runs deterministic real-time OS workloads (VxWorks, Green Hills INTEGRITY) without virtualization overhead, and ECC DDR memory prevents single-event upsets in harsh EMI environments.
Recomendado
Wireless LAN Access Points and Controllers
The MPC8343EVRAGDB suits enterprise WLAN controllers and access points because its PCI bus can host 802.11a/b/g/n radio cards, while the integrated security engine handles WPA2-Enterprise authentication (802.1X/EAP-TLS) and AES encryption at line rate. The 400 MHz e300 CPU manages association tables and roaming decisions across multiple radios, and dual Gigabit Ethernet uplinks support link aggregation to the wired backbone. The DDR1/DDR2 controller provides low-latency packet buffering for QoS-sensitive voice-over-WLAN traffic.
Recomendado
Embedded Firewall and VPN Appliances
The MPC8343EVRAGDB is well suited for small-to-medium business firewall/VPN appliances because the integrated SEC engine performs IPsec ESP/AES/SHA at multi-hundred-megabit throughput, offloading the e300 CPU for stateful packet inspection and NAT. Dual Gigabit Ethernet separates WAN and LAN segments, and DDR2 memory with ECC handles large connection-tracking tables reliably. The 620-pin HCTE BGA accommodates all interfaces on a single board, enabling fanless desktop appliance form factors. PCI expansion supports optional 3G/4G failover or hardware crypto accelerators for higher-end SKUs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8343EVRAGDB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8343EZQAGDB | MPC8343VRAGDB | MPC8343CVRAGDB | MPC8343EVRAGDB-T |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 620-pin HCTE BGA (29x29) | 620-pin HCTE BGA (29x29) - same | 620-pin HCTE BGA (29x29) - same | 620-pin HCTE BGA (29x29) - same | 620-pin HCTE BGA (29x29) - same |
| Core Architecture | PowerPC e300 32-bit | PowerPC e300 32-bit | PowerPC e300 32-bit | PowerPC e300 32-bit | PowerPC e300 32-bit |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Security Engine (SEC) | Yes (DES/3DES/AES/SHA/RSA) | Yes | No | No (C variant) | Yes |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Ethernet MACs | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 |
| Operating Temperature | 0C to 105C | 0C to 105C | 0C to 105C | 0C to 105C | 0C to 105C |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL |
Principais diferenciais
- Integrated security engine on same 620-BGA die (vs MPC8343VRAGDB)
- Drop-in equivalent with ZQA packing designation (vs MPC8343EZQAGDB)
- Industrial 0-105C temperature grade (vs MPC8343CVRAGDB)
- DDR1/DDR2 flexibility with ECC on same controller (vs Earlier PowerQUICC II (non-Pro) parts)
Notas de projeto
Estimated: At 400 MHz core frequency and 1.0V VDD with typical activity, the MPC8343EVRAGDB core power dissipation is approximately 1.5-2.5W. The 620-pin HCTE BGA substrate (29x29 mm) requires a via-array thermal pad (typically 4x4 to 6x6 thermal via array under the die) for adequate heat transfer. Use at least 4-layer PCB with inner ground/power planes stitched to BGA ground balls for thermal relief. In fanless enclosures, derate ambient by 10C from 105C max for reliability margin.
Route DDR1/DDR2 signals with controlled impedance (50 ohm single-ended, 100 ohm differential for clock) and length-matching within the datasheet's byte-lane skew budget. The 620-BGA escape requires via-in-pad or microvia HDI PCB technology for clean signal fan-out on inner rows. Match USB 90-ohm differential impedance and use common-mode choke for EMI compliance. Provide separate analog and digital ground planes joined at a single point near the SoC to reduce digital switching noise on Ethernet PHY rails.
Verify the security engine (SEC) is present in your ordered variant - the 'E' suffix denotes SEC, while V (non-E) and C variants may lack it. Do not assume DDR2 timings from DDR1 design; configure timing registers per JEDEC JESD79-2 for the specific DDR2 speed grade used. Always initialize the e300 core's MMU and caches before enabling high-bandwidth DMA on PCI/USB. Reference the NXP MPC8343EA Reference Manual (separate from the datasheet) for CPM microcode programming.
The MPC8343EVRAGDB requires multiple voltage rails (1.0V core, 1.8V DDR termination, 2.5V DDR2 VTT, 3.3V I/O) with strict sequencing per datasheet. Use a multi-rail PMIC or discrete LDO/DC-DC combo with power-good cascading to enforce safe startup. Add bulk decoupling (220 uF) and 0.1 uF + 10 nF high-frequency caps within 5 mm of each BGA power ball cluster. Monitor core voltage for droop under heavy CPM DMA activity, which can transiently load the 1.0V rail at >3A peaks.
Informações de conformidade
RoHS compliant (Pb-free HCTE BGA) per NXP datasheet. AEC-Q100 not applicable (telecom/networking SoC, not automotive-grade). Halogen-free status not explicitly stated in provided data. EOL status per NXP product page Discontinuance notice.
