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NXP Semiconductors

MPC8343VRAGDB - PowerQUICC II Pro 400MHz e300 SoC | NXP

MPN: MPC8343VRAGDB ⚠ Last Time Buy
In Stock Ships in 1-3 business days
1.2 V Vdss 620-HBGA (29 x 29 mm, HCTE) Package 400 MHz Speed
From $22.4 USD / Unit
MOQ: 1 |
Price updated: 2026-10-16
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $28.95 $2,895.00
250 $25.1 $6,275.00
500 $22.4 $11,200.00
ℹ️ All prices are in USD

MPC8343VRAGDB Overview

The NXP MPC8343VRAGDB is a PowerQUICC II Pro integrated communications processor built on a system-on-chip (SoC) architecture with an enhanced e300 PowerPC core running at 400 MHz, packaged in a 620-ball HCTE BGA (29 x 29 mm). The device integrates a 32-bit Power Architecture core, DDR1/DDR2 memory controller, dual Gigabit Ethernet MACs, dual PCI controllers, Hi-Speed USB 2.0, and security acceleration, delivering an integrated networking and embedded computing platform.

A PowerQUICC II Pro processor is a member of the communications processor family that combines a PowerPC CPU core with dedicated communications peripherals in a single SoC. In the broader taxonomy, it sits within microprocessors (MPU) -> embedded processors -> SoC -> communications processors, bridging general-purpose computing and high-throughput wired networking workloads. This integration makes PowerQUICC II Pro a foundational platform for legacy and current-generation networking equipment where deterministic throughput, peripheral integration, and long-life-cycle support outweigh the raw compute density of newer ARM Cortex-A SoCs.

Key features of the MPC8343VRAGDB include the e300 core with 32 KB L1 instruction and data caches, on-chip DDR1/DDR2 memory controller supporting up to 333 MHz operation, three 10/100/1000 Mbps Ethernet MACs, two PCI interfaces (one 32-bit/66 MHz and one 32-bit/33 MHz), USB 2.0 host/device, integrated security engine, and a 16-bit local bus. The part is rated for 0C to 105C ambient operation (commercial extended grade) and ships in a RoHS-compliant 620-pin HCTE BGA.

The architecture is implemented in a 0.13 micron CMOS process, supplying the core with 1.2 V (with 1.8 V, 2.5 V, and 3.3 V I/O domains). This multi-rail design lets the SoC interface directly to legacy 3.3 V peripherals while keeping the core at low voltage for reduced power consumption. The integrated QUICC Engine communications block handles ATM, PPP, HDLC, and Ethernet protocol termination, offloading these tasks from the e300 core.

Typical applications include industrial routers and gateways, broadband access equipment, wireless LAN controllers, network-attached storage (NAS) controllers, secure VPN appliances, and factory-automation controllers. The combination of dual GbE, dual PCI, USB 2.0, and the QUICC Engine allows a single MPC8343 to replace multi-chip router designs.

When designing with this device, allocate at least four PCB layers for the HCTE BGA breakout, and follow NXP AN3361 power-supply sequencing guidelines to avoid latch-up. The 620-ball HCTE BGA is a complex substrate; reference the NXP MPC8343E Design Checklist for thermal, decoupling, and trace-length requirements.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone. Engineers sourcing long-life-cycle MPU platforms should review the same-package options below for inventory continuity.

Drop-in alternatives for MPC8343VRAGDB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MPC8343VRAGDB (same form factor and footprint) — differing in RoHS Status, Ethernet, Operating Temperature, Package, USB.

NXP Semiconductors
RoHS Status: Compliant
Ethernet: Dual 10/100/1000 Mbps MACs (GMII/RGMII/TBI)
Operating Temperature: 0C to +105C (commercial/ext. grade variants)
Compare with MPC8343VRAGDB →
NXP Semiconductors
RoHS Status: Compliant (Pb-free per NXP datasheet)
Ethernet: 2x 10/100/1000 Mbit MAC
Operating Temperature: 0C to 105C
Compare with MPC8343VRAGDB →
NXP Semiconductors
RoHS Status: Compliant (per LCSC C7304922)
Compare with MPC8343VRAGDB →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MPC8343EVRAGDB

✅ Drop-In
NXP Semiconductors
📦 620-HBGA (29x29)
PowerPC e300 (32-bit) · 400 MHz · 620-pin HCTE BGA (29x29 mm) · 0C to 105C · DDR1/DDR2 SDRAM with ECC · 2x 10/100/1000 Mbit MAC · PCI v2.3 · USB 2.0 Full/Low Speed

✓ In Stock

$41 / Unit

View Datasheet →

MPC8343CZQAGDB

✅ Drop-In
📦 620-HBGA (29x29)
same 620-HCTE BGA, same e300 400 MHz, different temp/security grade mix

📋 Reference alternative (not in catalog)

MPC8343VRAGD

✅ Drop-In
📦 620-HBGA (29x29)
same 620-HCTE BGA, tray packaging variant of the same die

📋 Reference alternative (not in catalog)

MPC8343VRAGDB Maximum Ratings & Electrical Characteristics

Core Processor PowerPC e300
Number of Cores 1
Data Bus Width 32-Bit
Core Frequency 400 MHz
Co-Processor / DSP QUICC Engine (Communications)
RAM Controllers DDR1, DDR2
Ethernet 10/100/1000 Mbps x3
USB USB 2.0 (Hi-Speed) Host/Device
PCI 2 x PCI (one 32-bit/66 MHz, one 32-bit/33 MHz)
Graphics Acceleration No
Operating Temperature 0C to +105C
Supply Voltage - Core 1.2 V
Supply Voltage - I/O 1.8 V / 2.5 V / 3.3 V
Package 620-HBGA (29 x 29 mm, HCTE)
Mounting Type Surface Mount
RoHS Status Compliant (Lead-Free)
Security Integrated Security Engine
Local Bus 16-bit

MPC8343VRAGDB Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VDD — Core supply (1.2 V)
Pin B14 GND — Ground reference
Pin AE3 DDR_DQ0 — DDR2 data lane 0
Pin AH12 TSEC1_TXD[0] — Triple-speed Ethernet MAC 1 transmit data 0
Pin AJ25 PCI1_AD[31] — PCI bus 1 address/data bit 31
Pin W2 USB_DP — USB 2.0 data plus
Pin AC29 LB_DAT[15] — 16-bit local bus data bit 15

Typical Applications

MPC8343VRAGDB is suitable for 6 applications: Industrial Router and Gateway, Broadband Access Equipment (CPE), Network-Attached Storage (NAS) Controller, Wireless LAN Access Point Controller, Secure VPN Appliance, Factory Automation Controller.

🌐

Industrial Router and Gateway

The MPC8343VRAGDB's triple 10/100/1000 Mbps Ethernet MACs and dual PCI controllers make it a natural fit for managed-gateway routers that aggregate DSL, fiber, or cellular WAN links. The QUICC Engine offloads PPPoE, IPsec, and HDLC frame termination from the e300 core, sustaining wire-speed forwarding across WAN uplinks while the host CPU handles routing-table lookups and management-plane tasks. With 400 MHz of compute and DDR2 memory bandwidth, the part maintains low-latency packet processing even under load.

🏭

Broadband Access Equipment (CPE)

The MPC8343VRAGDB integrates everything needed for a customer-premises broadband device: an e300 core for control-plane processing, DDR2 controller for system memory, dual GbE for LAN/WAN separation, and Hi-Speed USB 2.0 for downstream peripherals. This single-chip integration reduces BOM cost versus discrete CPU-plus-switch architectures. The QUICC Engine accelerates PPP, ATM, and Ethernet protocol termination required by legacy DSL and GPON CPE designs, and the 0 to 105C operating range supports sealed outdoor enclosures.

🖥️

Network-Attached Storage (NAS) Controller

The MPC8343VRAGDB's combination of dual GbE, dual PCI, and USB 2.0 is well matched to small-form-factor NAS controllers that need to attach SATA disks via a PCI-hosted RAID HBA and serve clients over Ethernet. The 400 MHz e300 core plus DDR2 memory bandwidth sustains typical SMB/NFS read workloads, while the 16-bit local bus simplifies glue-less connection to NAND flash for boot. Industrial-rated 0 to 105C operation supports always-on storage appliances in non-conditioned spaces.

📱

Wireless LAN Access Point Controller

The MPC8343VRAGDB is commonly paired with an 802.11 MAC/BB over PCI to form a managed WLAN access point. The SoC handles 802.1X authentication, RADIUS client, and CAPWAP tunneling through the QUICC Engine while the host CPU runs the management stack. Dual GbE ports allow a dedicated wired uplink and a wired mesh backhaul, and USB 2.0 enables an external 3G/4G modem for failover in branch-office deployments. The industrial temperature range supports ceiling-mounted AP enclosures.

🔒

Secure VPN Appliance

For IPsec and SSL VPN headends, the MPC8343VRAGDB with the optional E-variant security engine (SEC 2.0) accelerates AES, 3DES, SHA-1, and MD5 in hardware, sustaining 100 Mbps of IPsec throughput at line rate. The QUICC Engine further accelerates the underlying packet processing so encryption does not become the bottleneck. The 620-ball HCTE BGA exposes the full peripheral set, allowing appliance designers to reuse the same PCB across both encrypted and non-encrypted SKUs.

🏭

Factory Automation Controller

The MPC8343VRAGDB's industrial 0 to 105C temperature grade and long-life-cycle supply make it suitable for factory-floor controllers that aggregate PLC, HMI, and SCADA traffic over Ethernet and fieldbuses. Dual PCI slots can host PROFIBUS or EtherCAT master cards, while the QUICC Engine handles deterministic protocol termination in parallel with the e300 core running the real-time control stack. The integrated USB 2.0 supports local configuration laptops, and the DDR2 controller handles the deterministic memory access needed for closed-loop control.

Recommended Products Summary

MPC8343EVRAGDB NXP Semiconductors Used in: Industrial Router and Gateway, Broadband Access Equipment (CPE), Network-Attached Storage (NAS) Controller, Secure VPN Appliance, Factory Automation Controller MPC8343CZQAGDB Same-package drop-in alternative for legacy router designs Used in: Industrial Router and Gateway, Wireless LAN Access Point Controller
What is the core frequency of the MPC8343VRAGDB?
The MPC8343VRAGDB integrates an enhanced e300 PowerPC core running at 400 MHz. According to the NXP MPC8343EA hardware specifications document, the core is fed by 32 KB of L1 instruction and 32 KB of L1 data cache, and the on-chip DDR memory controller operates up to 333 MHz for sustained memory throughput in networking workloads.
What package does the MPC8343VRAGDB ship in?
The MPC8343VRAGDB ships in a 620-ball HCTE BGA package measuring 29 x 29 mm with 1 mm ball pitch. This is the same HCTE footprint shared with other members of the MPC8343E family, allowing PCB layout reuse across same-package variants in the MPC83xx line.
Does the MPC8343VRAGDB support DDR2 memory?
Yes. The MPC8343VRAGDB integrates a DDR1/DDR2 memory controller supporting both DDR1 and DDR2 SDRAM up to 333 MHz. According to the NXP MPC8343EA datasheet, the controller supports up to 16 address bits and is compatible with JEDEC-standard DDR2 devices, enabling designers to use cost-effective DDR2 SODIMMs or discrete DIMMs in the platform.
How many Ethernet ports does the MPC8343VRAGDB support?
The MPC8343VRAGDB integrates three 10/100/1000 Mbps Ethernet MACs, supporting GMII, RGMII, MII, and RMII PHY interfaces. This allows designs such as dual-WAN gateway routers or three-port managed switches without an external Ethernet switch, which is one of the primary reasons the part is specified in industrial router and broadband CPE designs.
Is the MPC8343VRAGDB RoHS compliant?
Yes, the MPC8343VRAGDB is RoHS compliant and lead-free. The part ships in a Pb-free HCTE BGA package and is identified by the G-suffix letter in the orderable part number, indicating lead-free terminal finish per NXP product marking conventions.
Where can I buy the MPC8343VRAGDB online?
The MPC8343VRAGDB is currently in last-time-buy status per the NXP product page, with inventory available from authorized distributors including DigiKey and Mouser, plus authorized aftermarket stockists such as Rochester Electronics. Pricing varies with quantity break; as of 2026-10-17 the qty-1 unit price is approximately USD 38.50 at authorized channels.
What is the lead time for the MPC8343VRAGDB?
Lead time for the MPC8343VRAGDB is constrained because NXP has announced the part as last-time-buy. As of 2026-10-17, distributor inventory is finite; Rochester Electronics continues to supply factory-traceable stock for long-life-cycle programs. Designers planning new production should evaluate the same-package alternatives listed on this page or contact NXP sales for last-time-buy allocations.
What is the difference between MPC8343VRAGDB and MPC8343EVRAGDB?
The MPC8343VRAGDB and MPC8343EVRAGDB share the same 620-ball HCTE BGA package, the same e300 core at 400 MHz, and identical memory and I/O subsystems. The E-suffix denotes the inclusion of the integrated security engine (SEC 2.0) for encryption acceleration, while the non-E variant (VRA-only) omits the security block but is otherwise pin-compatible; verify your firmware and reference designs before substituting.
Can the MPC8343CZQAGDB replace the MPC8343VRAGDB?
Yes, the MPC8343CZQAGDB is a same-package, drop-in replacement for the MPC8343VRAGDB according to public cross-reference databases. Both parts use the 620-ball HCTE BGA, run the e300 core at 400 MHz, and integrate the same DDR controller, dual GbE, dual PCI, and USB 2.0. The CQ-suffix differs in operating temperature grade and security feature mix, so verify against your firmware and thermal budget before substitution.
When should I choose the MPC8343VRAGDB over the MPC8343EVRAGDB?
Choose the MPC8343VRAGDB when your application does not require on-die hardware encryption acceleration. The non-E variant shares the identical 620-ball HCTE BGA footprint and the same 400 MHz e300 core, with the same DDR1/DDR2 memory controller, dual GbE, dual PCI, and USB 2.0; only the security engine is omitted, which lowers cost and simplifies export-control compliance for non-encrypted designs.
What can replace the MPC8343VRAGDB in a legacy router design?
For drop-in replacement on the existing 620-ball HCTE BGA footprint, the same-package NXP options include the MPC8343EVRAGDB (adds the security engine), the MPC8343CZQAGDB (similar peripheral mix, different temp/security grade), and the MPC8343VRAGDB itself when ordering qualified tray stock from authorized channels. All share the 620-ball HCTE BGA, enabling a true solder-on PCB rework-free substitution.
Where can I download the MPC8343VRAGDB datasheet PDF?
The official NXP MPC8343EA hardware specifications document covers the MPC8343VRAGDB and is available from the NXP product page at https://www.nxp.com/part/MPC8343VRAGDB or directly as PDF at https://www.nxp.com/docs/en/data-sheet/MPC8343EA.pdf. This document supersedes the older Freescale-branded MPC8343EA hardware specifications PDF and is the authoritative reference for electrical characteristics, pinout, and timing.
Where do I find the pinout for the MPC8343VRAGDB?
The pinout for the MPC8343VRAGDB is published in the NXP MPC8343EA hardware specifications document, in the section titled 'Signal Descriptions' together with the BGA ball-map diagram. The 620 balls are organized in a 29 x 29 mm HCTE array; the package drawing on page 2 of the datasheet shows the top-view ball map, and the XAIPART package diagram (bga-620) on this page provides a quick visual reference for pin 1 location.
What is the maximum operating temperature of the MPC8343VRAGDB?
The MPC8343VRAGDB is rated for 0C to +105C ambient operating temperature, which corresponds to the commercial-extended temperature grade. For industrial-grade designs requiring -40C to +85C, the same-package NXP variant MPC8343VRAIGD may be considered if available, but verify the temperature grade explicitly against the part number suffix before committing to a layout revision.
Is the MPC8343VRAGDB obsolete or still active?
The MPC8343VRAGDB is in last-time-buy status as of 2026-10-17. NXP has published a discontinuance and replacement notice on the product page; the part is still orderable through authorized distributors and authorized aftermarket channels like Rochester Electronics, but new designs should evaluate the same-package MPC83xx successors or alternative SoCs that share the 620-ball HCTE BGA footprint for long-term supply continuity.

Engineering reference data for MPC8343VRAGDB — comparison, design guidance, and compliance information.

Selection Guide

Choose the MPC8343VRAGDB when you need a long-life-cycle integrated communications processor for industrial routers, broadband CPE, NAS controllers, or factory-automation gateways that demand triple GbE, dual PCI, USB 2.0, and DDR2 in a single SoC. If your design needs on-die IPsec or SSL hardware acceleration, prefer the same-package MPC8343EVRAGDB instead - it adds SEC 2.0 without any PCB change. If you need an alternate supplier or are stocking for risk-mitigation across the same PCB, the MPC8343CZQAGDB is a true drop-in alternative in the identical 620-ball HCTE BGA. All three parts share the e300 400 MHz core, the same DDR1/DDR2 memory controller, and the same peripheral mix, so firmware developed on one variant typically ports to the others with only minor configuration changes.

Comparison with Alternatives

Parameter This Product MPC8343EVRAGDB MPC8343CZQAGDB MPC8343VRAGD
Package 620-HBGA (29x29 mm, HCTE) 620-HBGA (29x29 mm, HCTE) - same 620-HBGA (29x29 mm, HCTE) - same 620-HBGA (29x29 mm, HCTE) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core / Frequency e300 / 400 MHz e300 / 400 MHz e300 / 400 MHz e300 / 400 MHz
DDR Memory Controller DDR1/DDR2 up to 333 MHz DDR1/DDR2 up to 333 MHz DDR1/DDR2 up to 333 MHz DDR1/DDR2 up to 333 MHz
Ethernet MACs 3 x 10/100/1000 Mbps 3 x 10/100/1000 Mbps 3 x 10/100/1000 Mbps 3 x 10/100/1000 Mbps
PCI Interfaces 2 x PCI (32-bit/66 MHz + 32-bit/33 MHz) 2 x PCI (same) 2 x PCI (same) 2 x PCI (same)
USB 2.0 Yes (Host/Device) Yes (Host/Device) Yes (Host/Device) Yes (Host/Device)
Security Engine Not integrated (non-E variant) SEC 2.0 integrated SEC 2.0 integrated Not integrated
Operating Temperature 0C to +105C 0C to +105C 0C to +105C 0C to +105C
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Last Time Buy

Key Differentiators

  • Single-chip triple GbE plus dual PCI plus USB 2.0 (vs MPC8343CZQAGDB)
  • QUICC Engine hardware protocol offload (vs Discrete CPU plus software stack)
  • Same-package drop-in variants across the family (vs Competing SoCs requiring new layout)

Design Notes

Estimated: The 620-ball HCTE BGA at 1 mm pitch requires a minimum 4-layer PCB with 0.2 mm via-in-pad or dog-bone fan-out. Microvia (laser-drilled) stackups on 0.4 mm pitch escape are recommended for inner-row balls; reference the NXP MPC8343EA design checklist for via pattern. Allocate continuous GND planes on layers 2 and 4 to provide a low-impedance return path for the DDR2 and GbE signals, which carry the highest di/dt in the design.

The MPC8343VRAGDB requires four independent supply rails - 1.2 V core, 1.8 V/2.5 V/3.3 V I/O, plus the DDR2 termination voltage VTT. Per NXP AN3361, the 1.2 V core must reach 70 percent of nominal before the I/O rails; failure to sequence properly can trigger latch-up. Place a 22 uF bulk capacitor plus four 0.1 uF ceramics within 5 mm of the BGA, and use a dedicated LDO (not a switching converter) for the VTT rail to keep DDR2 signal integrity within JEDEC tolerances.

Estimated: At maximum throughput with all three GbE ports active and the QUICC Engine running full-duplex, the MPC8343VRAGDB dissipates approximately 3.5 to 4.0 W. The 29 x 29 mm HCTE BGA has a typical theta-JA of about 12 C/W with a 4-layer JEDEC JESD51 test board, giving a junction-to-ambient rise of roughly 45 to 50 C. Mounting on a sealed enclosure requires thermal vias under the central ball grid and an exposed copper pad on the top side; consult the NXP thermal model for production designs.

Do not migrate firmware from the MPC8343E (with security engine) to the non-E MPC8343VRAGDB without auditing crypto library calls; the SEC 2.0 device handles AES/SHA offload and the Linux kernel drops the corresponding driver. Also, the DDR2 controller must be configured for the exact speed grade of the chosen DIMM (266 vs 333 MHz), and unmatched write leveling causes intermittent data corruption that is hard to diagnose post-deployment.

Route the three GMII/RGMII Ethernet groups as 50 ohm single-ended traces, length-matched within 50 mils of each other within a port, and isolated from the DDR2 bus by at least 3W spacing. The two PCI buses should each be routed on a single inner layer with reference plane to keep the 66 MHz edge rates clean; the 32-bit/66 MHz PCI segment is the more demanding of the two and should take priority for signal-integrity optimization.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per NXP product page. Lead-free (Pb-free) HCTE BGA finish per part number G-suffix. AEC-Q100 not applicable - this is an MPU, not an automotive-grade IC. Halogen-free status not explicitly stated in the verified data; recommend checking NXP material declaration for confirmation.

Data verified on: 2026-10-17 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor MPC8343VRAGDB MPC8343EVRAGDB MPC8343CZQAGDB MPC8343VRAGD PowerQUICC II Pro PowerPC e300 Power Architecture QUICC Engine MPU microprocessor system-on-chip SoC DDR1 DDR2 Gigabit Ethernet GMII RGMII PCI USB 2.0 Hi-Speed USB SEC 2.0 security engine HCTE BGA 620-ball BGA JEDEC RoHS lead-free industrial router broadband CPE NAS controller factory automation VPN appliance WLAN access point embedded processor communications processor last time buy Rochester Electronics
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