MPC8347EVVALFB - PowerQUICC II Pro MPU, 667 MHz e300, 672-TBGA | NXP Semiconductors
N.º da peça: MPC8347EVVALFB ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $64.4 | $6.440,00 |
| 500 | $58.1 | $29.050,00 |
| 1.000 | $52.75 | $52.750,00 |
MPC8347EVVALFB Visão geral
A communications processor (often called a PowerQUICC or networking SoC) is a highly integrated microprocessor that combines a CPU core with multiple peripheral interfaces tailored for data-plane and control-plane telecom and industrial networking equipment. The MPC8347E sits in the product hierarchy as a PowerQUICC II Pro MPU -> PowerQUICC II family -> PowerQUICC communications processors -> microprocessors -> integrated circuits. Compared with a general-purpose microprocessor, it offloads DMA, Ethernet, and TDM/PKT processing to on-chip peripherals, reducing bill of materials in routers, DSLAMs, and industrial gateways.
Key features include a 667 MHz PowerPC e300 core, integrated DDR1/DDR2 SDRAM controller with ECC, dual 10/100/1 Gb Ethernet MACs (one SGMII-capable), dual USB 2.0 (full/low-speed host + device), 32-bit/66 MHz PCI, local bus controller (8/16/32-bit), four DMA channels, SPI and I²C interfaces, two UARTs, and a hardware Security Engine (SEC 3.0) supporting DES, 3DES, AES, SHA-1, MD5, and public-key crypto. The Security Engine accelerates IPsec, SSL/TLS, and MACsec without burdening the CPU.
Architecturally, the e300 core is a superset of the PowerPC 603e, executed on a 0.13 µm CMOS process, with separate 32 KB instruction and 32 KB data L1 caches and a unified L2 cache up to 256 KB. The system interface unit (SIU) handles interrupts, bus arbitration, reset configuration, and clock synthesis, while the CPM (Communications Processor Module) block drives the TDM, fast Ethernet, and HDLC controllers for legacy telecom interfaces.
Typical applications include enterprise branch routers, SOHO/SMB gateways with VPN acceleration, industrial control and SCADA controllers, secure broadband access equipment, networked printers, and embedded control servers. The combination of DDR2 support and crypto acceleration is particularly attractive for IPsec and VPN appliances where both throughput and security are mandated.
When designing with this device, plan power architecture carefully: the 1.2 V core rail must be sequenced after the 2.5 V PLL supply and before 3.3 V I/O to prevent latch-up. A four-layer PCB with solid ground planes is recommended for the 35 x 35 mm TBGA; route the DDR2 matched-length groups within 50 mils of tolerance and keep SERDES traces to the SGMII PHY at 100 Ω differential impedance.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same PowerQUICC II Pro family, and practical board-level design guidance that complements the manufacturer datasheet and reference manual set.
Alternativas drop-in para MPC8347EVVALFB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8347EVVALFB (mesmo formato e footprint) — diferindo em Ethernet, PCI, RoHS Status, Security Engine, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8347VVALFB
✅ Drop-In✓ Em estoque
$60.95 / unidade
Ver ficha técnica →MPC8349EVVALFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8349VVALFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8347CVVAGDB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8347EVVALFB Classificações máximas e características elétricas
| Series | PowerQUICC II Pro |
| Core | PowerPC e300 (32-bit) |
| Maximum Core Frequency | 667 MHz |
| Number of Cores | 1 |
| Faixa de temperatura de operação | 0 °C to +105 °C |
| Core Voltage | 1.2 V |
| I/O Voltages | 2.5 V / 3.3 V |
| Encapsulamento | 672-LBGA (TBGA), 35 x 35 mm |
| Tipo de montagem | Surface Mount |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | Up to 256 KB unified |
| Memory Controller | DDR1 / DDR2 SDRAM with ECC |
| Ethernet | Dual 10/100/1 GbE MAC (incl. SGMII) |
| PCI | 32-bit / 66 MHz |
| USB | USB 2.0 (host + device, full/low speed) |
| Security Engine | SEC 3.0 (DES, 3DES, AES, SHA-1, MD5, PKA) |
| DMA Channels | 4 (general-purpose) |
| Status RoHS | Compliant per distributor data |
| Lead Free | Yes (NOPB) |
| Product Brief | PowerQUICC, 32-Bit Power Arch SoC, 667 MHz, DDR1/2, PCI, 1 GbE, USB, SEC, Rev 2 |
Guia de Configuração de Pinos do MPC8347EVVALFB 672-lbga (tbga), 35 x 35 mm
Configuração de pinos para MPC8347EVVALFB (pacote 672-lbga (tbga), 35 x 35 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8347EVVALFB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8347EVVALFB é adequado para 6 aplicaçãos: Secure Branch Router / VPN Gateway, DSLAM Line Card / Broadband Access, Industrial Gateway / SCADA Controller, Networked Printer / Multifunction Controller, Embedded NAS / SOHO Storage Server, Secure Wireless Controller / IoT Edge Aggregation.
Secure Branch Router / VPN Gateway
The MPC8347EVVALFB fits secure branch router and IPsec VPN gateway designs because it pairs a 667 MHz PowerPC e300 core with NXP's Security Engine (SEC 3.0) that accelerates DES, 3DES, AES-128/192/256, SHA-1, MD5, and RSA/ECC. With SEC offloading IPsec ESP, AES-GCM, and RSA handshake operations, the e300 core retains cycles for routing, NAT, and QoS - typically sustaining >300 Mbps of IPsec throughput at 667 MHz. The integrated dual 10/100/1 GbE MACs (one SGMII-capable) connect directly to WAN/LAN PHYs, removing external switch silicon. Compared to a non-E variant, the 'E' suffix is the main reason designers choose this part for branch VPN appliances.
Recomendado
DSLAM Line Card / Broadband Access
The MPC8347EVVALFB's combination of a 32-bit PCI controller and dual GbE MACs plus the CPM's TDM/HDLC engine makes it suitable for DSLAM line cards, GPON/EPON OLT mini-blades, and broadband access multiplexers. The PowerQUICC II Pro can map legacy ATM/TDM traffic into IP via the CPM block while the e300 core handles L2/L3 forwarding. The DDR1/DDR2 controller with ECC supports line-rate packet buffering at full Gigabit line speed. Operates over the 0-105 °C industrial temperature span suited for central-office environments.
Recomendado
Industrial Gateway / SCADA Controller
The MPC8347EVVALFB suits industrial gateways that bridge Modbus/Profibus, EtherCAT, and serial fieldbus traffic onto IP networks, taking advantage of its two UARTs, SPI, I²C, and the local bus controller for legacy industrial peripherals. The industrial temperature grade (0-105 °C) and hardware AES acceleration make it a strong choice for sub-station gateways and SCADA controllers that must secure DNP3/IP traffic. The 4-channel general-purpose DMA offloads block transfers between serial, PCI, and memory without burdening the e300 core, which holds plenty of headroom for protocol stacks at 667 MHz.
Recomendado
Networked Printer / Multifunction Controller
The MPC8347EVVALFB is a candidate for high-performance network-attached printers, scanners, and MFP controllers where a 667 MHz core with 256 KB L2 cache drives image rendering pipelines. Its USB 2.0 host + device interface supports host-side printing from USB thumb drives and target-side RNDIS to a host PC. The 10/100/1 GbE MAC delivers pages to the engine at full Gigabit rates, while the DDR2 controller with ECC handles large page buffers without data corruption. The Security Engine accelerates driver/print-job authentication and SSL/TLS for embedded web admin pages.
Recomendado
Embedded NAS / SOHO Storage Server
The MPC8347EVVALFB's 667 MHz core, dual GbE MACs, and DDR2 memory controller with ECC are well-matched to small-form-factor NAS and SOHO storage servers handling up to four drive bays. The Security Engine offloads SMB3 / iSCSI CHAP authentication to its AES and public-key accelerators, reducing CPU load. PCI provides expansion for additional SATA HBAs via a bridge chip. Operating cost is favorable because the PowerPC e300 dissipates far less than a general-purpose x86 Celeron at equivalent throughput, simplifying chassis thermal design.
Recomendado
Secure Wireless Controller / IoT Edge Aggregation
The MPC8347EVVALFB can serve as an aggregation controller for wireless access points, IoT gateways, and edge nodes in industrial IoT deployments. Its USB 2.0 host, dual GbE MACs, and four DMA channels enable simultaneous uplink to multiple radios or sensor hubs. The 667 MHz e300 runs TLS 1.2 / DTLS stacks while the Security Engine handles ECC and RSA handshake acceleration - critical for constrained edge devices that cannot terminate TLS themselves. RoHS compliance and the 0-105 °C industrial temperature grade support long-life industrial edge deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8347EVVALFB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8347VVALFB | MPC8349EVVALFB | MPC8349VVALFB | MPC8347CVVAGDB |
|---|---|---|---|---|---|
| Package | 672-TBGA (35 x 35 mm) | 672-TBGA (35 x 35 mm) - same | 672-TBGA (35 x 35 mm) - same | 672-TBGA (35 x 35 mm) - same | 672-TBGA (35 x 35 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 667 MHz | 667 MHz | 667 MHz | 667 MHz | Lower speed bin |
| Memory Controller | DDR1 / DDR2 with ECC | DDR1 / DDR2 with ECC | DDR1 / DDR2 with ECC | DDR1 / DDR2 with ECC | DDR1 / DDR2 |
| Ethernet | 2x 10/100/1 GbE (one SGMII-capable) | 2x 10/100/1 GbE (one SGMII-capable) | 2x 10/100/1 GbE + multi-SGMII | 2x 10/100/1 GbE + multi-SGMII | 2x 10/100/1 GbE |
| PCI | 1 x 32-bit / 66 MHz | 1 x 32-bit / 66 MHz | 2 x 32-bit PCI | 2 x 32-bit PCI | 1 x 32-bit / 66 MHz |
| USB | USB 2.0 host + device | USB 2.0 host + device | USB 2.0 host + device | USB 2.0 host + device | USB 2.0 host + device |
| Series | PowerQUICC II Pro (MPC8347E) | PowerQUICC II Pro (MPC8347) | PowerQUICC II Pro (MPC8349E) | PowerQUICC II Pro (MPC8349) | PowerQUICC II Pro (MPC8347C) |
Principais diferenciais
- Integrated Security Engine (SEC 3.0) (vs MPC8347VVALFB)
- Second PCI controller on pin-compatible variant (vs MPC8349EVVALFB)
- DDR1/DDR2 memory controller with ECC (vs Older PowerQUICC II (non-Pro) members)
Notas de projeto
The MPC8347EVVALFB requires three voltage rails: 1.2 V core, 2.5 V PLL, and 3.3 V I/O. The 1.2 V core rail must be sequenced AFTER the 2.5 V PLL supply and BEFORE the 3.3 V I/O per NXP power-sequencing guidelines. Use a dedicated 1.2 V switching controller with an enable pin tied to a 2.5 V rail-good signal; on the 3.3 V rail use an inrush soft-start of not less than 5 ms to avoid input surge on hot-plug boards. Place 22 µF X5R ceramics within 25 mm of each power pin pair and add a 100 nF Y-cap class decoupling for high-frequency noise.
The 672-LBGA 35 x 35 mm package requires a minimum 4-layer PCB with a solid ground plane under the BGA and matched-power layering. Use 1.0 mm pitch escape routing with 0.10 mm / 0.20 mm trace/space on a 0.6 mm laser-drilled blind via microvia stackup (e.g. 0.062 in 4-layer core/stackup from NXP reference schematic). Implement DDR2 impedance-controlled fly-by routing for address/command and 100 Ω differential for SGMII, with reference plane stitching vias every 1.5 cm and matched lengths within 50 mil.
Estimated: at worst-case industrial 105 °C ambient with full core operation at 667 MHz, compute roughly 4.0 W to 4.5 W dissipation depending on Ethernet activity and CPM duty. The TBGA package thermal pad must be soldered to a 25 cm² minimum copper flood with thermal vias on a 1.0 mm grid, plus a heatsink or airflow to hold junction-to-ambient θJA below 12 °C/W. Without a thermal pad, junction temperatures can exceed 125 °C and trigger thermal shutdown.
Do not enable the DDR2 controller at boot before configuring its mode registers; an unconfigured DDR controller is a top cause of boot failure on early prototypes. Always drive the reset configuration pins from a supervisor/RC circuit tied to the 2.5 V rail: hard-coded cfg_word[0:7] determines boot ROM source, endianness, host-agent, and PCI/PCI-X mode, and incorrect values cause silent failures. Finally, ensure the 32 kHz RTC crystal selected is a 6 pF load type rather than 12 pF, or the system clock will drift beyond IPsec's tolerated window.
Informações de conformidade
RoHS / lead-free inferred from the 'B' tail letter and NOPB flag on NXP product naming convention, plus distributor RoHS badges on DigiKey and Mouser pages. Halogen-free and conflict-minerals status not stated in provided web data - flagged as 'unknown'.
